0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
SP000084279

SP000084279

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    SP000084279 - CoolMOS Power Transistor - Infineon Technologies AG

  • 数据手册
  • 价格&库存
SP000084279 数据手册
IPP60R165CP CoolMOSTM Power Transistor Features • Lowest figure-of-merit R ONxQg • Ultra low gate charge • Extreme dv/dt rated • High peak current capability • Qualified according to JEDEC1) for target applications • Pb-free lead plating; RoHS compliant Product Summary V DS @ Tj,max R DS(on),max Q g,typ 650 V 0.165 Ω 39 nC PG-TO220 CoolMOS CP is specially designed for: • Hard switching topologies for Server and Telecom Type IPP60R165CP Package PG-TO220 Ordering Code SP000084279 Marking 6R165P Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 °C T C=100 °C Pulsed drain current2) Avalanche energy, single pulse Avalanche energy, repetitive t AR2),3) Avalanche current, repetitive t AR2),3) MOSFET dv /dt ruggedness Gate source voltage I D,pulse E AS E AR I AR dv /dt V GS V DS=0...480 V static AC (f >1 Hz) Power dissipation Operating and storage temperature Mounting torque P tot T j, T stg M3 and M3.5 screws T C=25 °C T C=25 °C I D=7.9 A, V DD=50 V I D=7.9 A, V DD=50 V Value 21 13 61 522 0.79 7.9 50 ±20 ±30 192 -55 ... 150 60 W °C Ncm A V/ns V mJ Unit A Rev. 2.0 page 1 2006-06-19 IPP60R165CP Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous diode forward current Diode pulse current 2) Reverse diode d v /dt 4) Symbol Conditions IS I S,pulse dv /dt T C=25 °C Value 12 61 15 V/ns Unit A Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient Soldering temperature, wavesoldering only allowed at leads R thJC R thJA leaded 1.6 mm (0.063 in.) from case for 10 s 0.65 62 K/W T sold - - 260 °C Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage V (BR)DSS V GS=0 V, I D=250 µA V GS(th) V DS=V GS, I D=0.79 mA V DS=600 V, V GS=0 V, T j=25 °C V DS=600 V, V GS=0 V, T j=150 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=12 A, T j=25 °C V GS=10 V, I D=12 A, T j=150 °C Gate resistance RG f =1 MHz, open drain 600 2.5 3 3.5 V Zero gate voltage drain current I DSS - - 1 µA - 10 0.15 100 0.165 nA Ω - 0.40 1.9 Ω Rev. 2.0 page 2 2006-06-19 IPP60R165CP Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Effective output capacitance, energy related4) Effective output capacitance, time related5) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current 1) Values typ. max. Unit C iss C oss C o(er) V GS=0 V, V DS=100 V, f =1 MHz - 2000 100 83 - pF V GS=0 V, V DS=0 V to 480 V C o(tr) t d(on) tr t d(off) tf V DD=400 V, V GS=10 V, I D=12 A, R G=3.3 Ω 220 12 5 50 5 ns Q gs Q gd Qg V plateau V DD=400 V, I D=12 A, V GS=0 to 10 V - 9 13.0 39 5.0 52 - nC V V SD t rr Q rr I rrm V GS=0 V, I F=12 A, T j=25 °C - 0.9 390 7.5 38 1.2 - V ns µC A V R=400 V, I F=I S, di F/dt =100 A/µs - J-STD20 and JESD22 Pulse width t p limited by T j,max Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. ISD=ID, di/dtV(BR)DSS, Tj2|I D|R DS(on)max parameter: T j 0.5 100 0.4 80 C °25 R DS(on) [Ω ] 0.3 60 98% I D [A] typ 0.2 40 C °150 0.1 20 0 -60 -20 20 60 100 140 180 0 0 2 4 6 8 10 T j [°C] V GS [V] Rev. 2.0 page 5 2006-06-19 IPP60R165CP 9 Typ. gate charge V GS=f(Q gate); I D=12 A pulsed parameter: V DD 10 10 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 102 25 °C, 98% 8 120 V 25 °C 400 V 150 °C 150 °C, 98% 101 6 V GS [V] 4 100 2 I F [A] 0 0 10 20 30 40 10-1 0 0.5 1 1.5 2 Q gate [nC] V SD [V] 11 Avalanche energy E AS=f(T j); I D=7.9 A; V DD=50 V 12 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=0.25 mA 600 700 660 400 V BR(DSS) [V] 200 0 20 60 100 140 180 E AS [mJ] 620 580 540 -60 -20 20 60 100 140 180 T j [°C] T j [°C] Rev. 2.0 page 6 2006-06-19 IPP60R165CP 13 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 14 Typ. Coss stored energy E oss= f(V DS) 105 14 12 104 Ciss 10 103 E oss [µJ] 200 300 400 500 C [pF] 8 102 Coss 6 4 10 1 Crss 2 100 0 100 0 0 100 200 300 400 500 600 V DS [V] V DS [V] Rev. 2.0 page 7 2006-06-19 IPP60R165CP Definition of diode switching characteristics Rev. 2.0 page 8 2006-06-19 IPP60R165CP PG-TO220-3-1/TO-220-3-21: Outlines Dimensions in mm/inches Rev. 2.0 page 9 2006-06-19 IPP60R165CP Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties o non-infringement of intellectual property rights of any third party Information For further information on technology, delivery terms and conditions and prices please contact your neares Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 page 10 2006-06-19
SP000084279 价格&库存

很抱歉,暂时无法提供与“SP000084279”相匹配的价格&库存,您可以联系我们找货

免费人工找货