SP0002-04966

SIGC42T120CQ IGBT Chip in Fieldstop -technology FEATURES: • 1200V Fieldstop technology 120µm chip • low turn-off losses • short tail current • positive temperature coefficient This chip is used for: • IGBT Modules Applications: • welding, SMPS, resonant applications C G E Chip Type SIGC42T120CQ VCE 1200V ICn 25A Die Size 6.59 x 6.49 mm2 Package sawn on foil Ordering Code SP0002-04966 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 6.59 x 6.49 2 x (2.18 x 1.58) 1.06 x 0.65 42.8 / 33.5 120 150 90 332 pcs Photoimide 3200 nm Al Si Cu 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al,