SPA06N60C3

SPA06N60C3 CoolMOSTM Power Transistor Features • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • High peak current capability • Ultra low effective capacitances • Extreme dv /dt rated • Improved transconductance • Fully isolated package (2500 V AC; 1 minute) Product Summary V DS @ T j,max R DS(on),max I D1) 650 0.75 6.2 V Ω A P-TO220-3-31 Type SPA06N60C3 Package PG-TO220-3-31 Ordering Code Q67040-S4631 Marking 06N60C3 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current 1) Symbol Conditions ID T C=25 °C T C=100 °C Pulsed drain current1) Avalanche energy, single pulse Avalanche energy, repetitive t AR1),2) Avalanche current, repetitive t AR1) Drain source voltage slope I D,pulse E AS E AR I AR I D=6.2 A, V DS=480 V, T j=125 °C static AC (f >1 Hz) T C=25 °C T C=25 °C I D=3.1 A, V DD=50 V I D=6.2 A, V DD=50 V Value 6.2 3.9 18.6 200 0.5 6.2 A mJ Unit A dv /dt 50 V/ns Gate source voltage V GS V GS ±20 ±30 32 -55 ... 150 V Power dissipation Operating and storage temperature P tot T j, T stg W °C Rev. 1.3 page 1 2010-12-21 SPA06N60C3 Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient R thJC R thJA leaded 3.92 80 K/W Values typ. max. Unit Soldering temperature T sold 1.6 mm (0.063 in.) from case for 10 s - - 260 °C Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Avalanche breakdown voltage Gate threshold voltage V (BR)DSS V GS=0 V, I D=250 µA V (BR)DS V GS(th) V GS=0 V, I D=6.2 A V DS=V GS, I D=0.26 mA V DS=600 V, V GS=0 V, T j=25 °C V DS=600 V, V GS=0 V, T j=150 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=3.9 A, T j=25 °C V GS=10 V, I D=3.9 A, T j=150 °C Gate resistance Transconductance RG g fs f =1 MHz, open drain |V DS|>2|I D|R DS(on)max, I D=3.9 A 600 2.1 700 3 3.9 V Zero gate voltage drain current I DSS - 0.1 1 µA - 0.68 100 100 0.75 nA Ω - 1.82 1 5.6 S Rev. 1.3 page 2 2010-12-21 SPA06N60C3 Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Effective output capacitance, energy related3) Effective output capacitance, time related4) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage 1) Values typ. max. Unit C iss C oss C rss C o(er) V GS=0 V, V DS=0 V to 480 V C o(tr) t d(on) tr t d(off) tf V DD=480 V, V GS=10 V, I D=6.2 A, R G=12 Ω V GS=0 V, V DS=25 V, f =1 MHz - 620 200 17 28 - pF - 47 7 12 52 10 ns Q gs Q gd Qg V plateau V DD=480 V, I D=6.2 A, V GS=0 to 10 V - 3.3 12 24 5.5 31 - nC V Pulse width limited by maximum temperature T j,max only Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 80% V DSS. C o(tr) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS. 2) 3) 4) Rev. 1.3 page 3 2010-12-21 SPA06N60C3 Parameter Symbol Conditions min. Reverse Diode Diode continuous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current IS T C=25 °C I S,pulse V SD t rr Q rr I rrm V R=480 V, I F=I S, di F/dt =100 A/µs V GS=0 V, I F=6.2 A, T j=25 °C 0.97 400 3.5 25 18.6 1.2 V ns µC A 6.2 A Values typ. max. Unit Typical Transient Thermal Characteristics Symbol Value typ. R th1 R th2 R th3 R th4 R th5 0.034 0.15 0.388 0.713 1.6 K/W C th1 C th2 C th3 C th4 C th5 Unit Symbol Value typ. 0.0000507 0.00045 0.00117 0.0114 0.939 Ws/K Unit Rev. 1.3 page 4 2010-12-21 SPA06N60C3 1 Power dissipation P tot=f(T C) 2 Safe operating area I D=f(V DS); T C=25 °C; D =0 parameter: t p 40 102 limited by on-state resistance 1 µs 30 10 1 10 µs 100 µs P tot [W] I D [A] 20 100 1 ms DC 10 ms 10 10-1 0 0 40 80 120 160 10-2 100 101 102 103 T C [°C] V DS [V] 3 Max. transient thermal impedance I D=f(V DS); T j=25 °C parameter: D=t p/T 101 4 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 20 20 V 7V 16 0.5 6.5 V 100 0.2 Z thJC [K/W] 12 0.05 I D [A] 0.1 6V 8 10 -1 0.02 0.01 single pulse 5.5 V 4 5V 4.5 V 4V 10-2 10-6 10-5 10-4 10-3 10-2 10-1 100 101 0 0 5 10 15 20 t p [s] V DS [V] Rev. 1.3 page 5 2010-12-21 SPA06N60C3 5 Typ. output characteristics I D=f(V DS); T j=150 °C parameter: V GS 8 20 V V4 7V 6.5 V 5.5 V V 4.5 V5 V 5.5 6V 6 Typ. drain-source on-state resistance R DS(on)=f(I D); T j=150 °C parameter: V GS 4 6 3 V6 5V R DS(on) [Ω ] I D [A] V 20 4 2 4.5 V 2 4V 1 0 0 5 10 15 20 0 0 2 4 6 8 10 V DS [V] I D [A] 7 Drain-source on-state resistance R DS(on)=f(T j); I D=3.9 A; V GS=10 V 8 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 2 25 C °25 1.6 20 R DS(on) [Ω ] 1.2 15 98 % 0.8 I D [A] typ 10 C °150 0.4 5 0 -60 -20 20 60 100 140 180 0 0 2 4 6 8 10 T j [°C] V GS [V] Rev. 1.3 page 6 2010-12-21 SPA06N60C3 9 Typ. gate charge V GS=f(Q gate); I D=6.2 A pulsed parameter: V DD 12 10 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 102 10 25 °C V 120 V 480 25 °C, 98% 150 °C, 98% 8 101 150 °C V GS [V] 6 I F [A] 100 10-1 0 10 20 30 0 0.5 1 1.5 2 2.5 4 2 0 Q gate [nC] V SD [V] 11 Avalanche SOA I AR=f(t AR) parameter: T j(start) 8 12 Avalanche energy E AS=f(T j); I D=3.1 A; V DD=50 V 250 200 6 150 4 E AS [mJ] 100 125 °C 25 °C I AV [A] 2 50 0 10-3 10-2 10-1 100 101 102 103 0 20 60 100 140 180 t AR [µs] T j [°C] Rev. 1.3 page 7 2010-12-21 SPA06N60C3 13 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=0.25 mA 14 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 700 104 660 103 Ciss V BR(DSS) [V] C [pF] 620 102 Coss 580 101 Crss 540 -60 -20 20 60 100 140 180 100 0 100 200 300 400 500 T j [°C] V DS [V] 15 Typ. C oss stored energy E oss= f(V DS) 5 4 3 E oss [µJ] 2 1 0 0 100 200 300 400 500 600 V DS [V] Rev. 1.3 page 8 2010-12-21 SPA06N60C3 Definition of diode switching characteristics Rev. 1.3 page 9 2010-12-21 SPA06N60C3 PG-TO-220-3-31 (FullPAK) Rev. 1.3 page 10 2010-12-21 SPA06N60C3 Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.3 page 11 2010-12-21