SPA15N60C3

Final data SPP15N60C3, SPI15N60C3 SPA15N60C3 VDS @ Tjmax RDS(on) ID 650 0.28 15 V Ω A Cool MOS™ Power Transistor Feature • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • Extreme dv/dt rated • Ultra low effective capacitances • Improved transconductance P-TO220-3-31 1 2 3 P-TO220-3-31 P-TO262-3-1 P-TO220-3-1 • P-TO-220-3-31: Fully isolated package (2500 VAC; 1 minute) Type SPP15N60C3 SPI15N60C3 SPA15N60C3 Package P-TO220-3-1 P-TO262-3-1 Ordering Code Q67040-S4600 Q67040-S4601 Marking 15N60C3 15N60C3 15N60C3 P-TO220-3-31 Q67040-S4603 Maximum Ratings Parameter Continuous drain current TC = 25 °C TC = 100 °C Symbol ID 15 9.4 ID puls EAS EAR IAR VGS VGS Ptot Tj , Tstg 45 460 0.8 15 ±20 ±30 156 Value SPP_I SPA Unit A 151) 9.41) 45 460 0.8 15 ±20 ±30 34 W °C A V A mJ Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse ID=7.5A, VDD=50V Avalanche energy, repetitive tAR limited by Tjmax2) ID=15A, VDD=50V Avalanche current, repetitive tAR limited by Tjmax Gate source voltage static Gate source voltage AC (f >1Hz) Power dissipation, TC = 25°C Operating and storage temperature -55...+150 Page 1 2003-07-01 Final data Maximum Ratings Parameter Drain Source voltage slope VDS = 480 V, ID = 15 A, Tj = 125 °C SPP15N60C3, SPI15N60C3 SPA15N60C3 Symbol dv/dt Value 50 Unit V/ns Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - case, FullPAK Thermal resistance, junction - ambient, leaded Thermal resistance, junction - ambient, FullPAK Soldering temperature, 1.6 mm (0.063 in.) from case for 10s 3) Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA Drain-Source avalanche breakdown voltage Gate threshold voltage Zero gate voltage drain current VGS(th) I DSS ID=675µA, VGS =VDS VDS=600V, V GS=0V, Tj=25°C Tj=150°C Symbol min. RthJC RthJC_FP RthJA RthJA_FP Tsold - Values typ. max. 0.8 3.7 62 80 260 Unit K/W °C Values typ. 700 3 0.1 0.25 0.68 1.23 max. 3.9 600 2.1 - Unit V V(BR)DS VGS=0V, ID=15A µA 1 100 100 0.28 nA Ω Gate-source leakage current I GSS VGS=30V, V DS=0V VGS=10V, ID=9.4A Tj=25°C Tj=150°C Drain-source on-state resistance RDS(on) Gate input resistance RG f=1MHz, open drain Page 2 2003-07-01 Final data Electrical Characteristics Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance energy related Effective output capacitance,5) Co(tr) time related Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg VDD=480V, ID=15A SPP15N60C3, SPI15N60C3 SPA15N60C3 Symbol gfs Ciss Coss Crss Conditions min. VDS≥2*ID*R DS(on)max, ID=9.4A VGS=0V, VDS=25V, f=1MHz Values typ. 11.9 1660 540 40 80 127 10 5 50 5 max. 80 10 - Unit S pF Effective output capacitance,4) Co(er) VGS=0V, VDS=0V to 480V td(on) tr td(off) tf VDD=480V, VGS=0/10V, ID=15A, RG =4.3Ω - ns - 7 29 63 5 - nC VDD=480V, ID=15A, VGS=0 to 10V V(plateau) VDD=480V, ID=15A V 1Limited only by maximum temperature 2Repetitve avalanche causes additional power losses that can be calculated as P =E *f. AR AV 3Soldering temperature for TO-263: 220°C, reflow 4C 5C o(er) o(tr) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Page 3 2003-07-01 Final data Electrical Characteristics Parameter Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current Peak rate of fall of reverse recovery current Typical Transient Thermal Characteristics Symbol SPP_B Rth1 Rth2 Rth3 Rth4 Rth5 Rth6 0.012 0.023 0.043 0.156 0.178 0.072 Tj P tot ( t) C th1 C th2 C th,n T am b SPP15N60C3, SPI15N60C3 SPA15N60C3 Symbol IS I SM VSD t rr Q rr I rrm dirr /dt Conditions min. TC=25°C Values typ. 1 460 27 55 1300 max. 15 45 1.2 - Unit A VGS =0V, IF=IS VR =480V, IF =IS , diF/dt=100A/µs - V ns µC A A/µs Tj=25°C Value SPA 0.012 0.023 0.043 0.176 0.371 2.522 R th1 Unit K/W Symbol Cth1 Cth2 Cth3 Cth4 Cth5 Cth6 R th,n T case Value SPP_B 0.0002495 0.0009406 0.001298 0.00362 0.009046 0.412 SPA 0.0002495 0.0009406 0.001298 0.00362 0.008025 0.412 Unit Ws/K E xternal H eatsink Page 4 2003-07-01 Final data 1 Power dissipation Ptot = f (TC) 170 SPP15N60C3 SPP15N60C3, SPI15N60C3 SPA15N60C3 2 Power dissipation FullPAK Ptot = f (TC) 35 W W 140 120 25 Ptot 100 80 Ptot 20 15 60 10 40 20 0 0 5 20 40 60 80 100 120 °C 160 0 0 20 40 60 80 100 120 TC °C 160 Tj 3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC=25°C 10 2 4 Safe operating area FullPAK ID = f (VDS) parameter: D = 0, TC = 25°C 10 2 A A 10 1 10 1 ID 10 0 ID 10 0 10 -1 tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms DC 10 -1 tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms tp = 10 ms DC 10 -2 0 10 10 1 10 2 V VDS 10 3 10 -2 0 10 10 1 10 2 10 V VDS 3 Page 5 2003-07-01 Final data 5 Transient thermal impedance ZthJC = f (tp) parameter: D = tp/T 10 1 SPP15N60C3, SPI15N60C3 SPA15N60C3 6 Transient thermal impedance FullPAK ZthJC = f (tp) parameter: D = tp/t 10 1 K/W 10 0 K/W 10 0 ZthJC 10 -1 ZthJC D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse 10 -1 10 -2 10 -2 10 -3 10 -3 D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse 10 -4 -7 10 10 -6 10 -5 10 -4 10 -3 s tp 10 -1 10 -4 -7 -6 -5 -4 -3 -2 -1 10 10 10 10 10 10 10 1 s 10 tp 7 Typ. output characteristic ID = f (VDS); Tj =25°C parameter: tp = 10 µs, VGS Vgs = 20V Vgs = 7V A Vgs = 6.5V Vgs = 6V Vgs = 5.5V Vgs = 5V Vgs = 4.5V 40 Vgs = 4V 60 8 Typ. output characteristic ID = f (VDS); Tj =150°C parameter: tp = 10 µs, VGS 30 A ID 30 ID 20 Vgs = 20V Vgs = 7V Vgs = 6V Vgs = 5.5V Vgs = 5V Vgs = 4.5V Vgs = 4V 15 20 10 10 5 0 0 4 8 12 16 20 V 28 0 0 4 8 12 16 20 V 28 VDS VDS Page 6 2003-07-01 Final data 9 Typ. drain-source on resistance RDS(on)=f(ID) parameter: Tj=150°C, VGS 1.8 SPP15N60C3, SPI15N60C3 SPA15N60C3 10 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 9.4 A, VGS = 10 V 1.6 SPP15N60C3 Ω 1.4 RDS(on) RDS(on) Vgs = 4V Vgs = 4.5V Vgs = 5V Vgs = 5.5V Vgs = 6V Vgs = 7V Vgs = 20V Ω 1.2 1 1.2 0.8 1 0.6 0.8 0.4 98% typ 0.6 0.2 0.4 0 5 10 15 20 A ID 30 0 -60 -20 20 60 100 °C 180 Tj 11 Typ. transfer characteristics ID = f ( VGS ); VDS≥ 2 x ID x RDS(on)max parameter: tp = 10 µs 60 12 Typ. gate charge VGS = f (Q Gate) parameter: ID = 15 A pulsed 16 SPP15N60C3 A V 25°C 12 VGS ID 40 150°C 10 0,2 VDS max 0,8 VDS max 30 8 6 20 4 10 2 0 0 2 4 6 V 10 0 0 10 20 30 40 50 60 70 80 nC 100 VGS QGate Page 7 2003-07-01 Final data 13 Forward characteristics of body diode IF = f (VSD) parameter: Tj , tp = 10 µs 10 2 SPP15N60C3 SPP15N60C3, SPI15N60C3 SPA15N60C3 14 Avalanche SOA IAR = f (tAR) par.: Tj ≤ 150 °C 15 A A IF IAR 10 1 9 Tj(START)=25°C 6 10 0 Tj(START)=125°C Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%) 10 -1 0 0.4 0.8 1.2 1.6 2 2.4 V 3 0 -3 10 10 -2 3 10 -1 10 0 10 1 10 2 VSD µs 10 tAR 4 15 Avalanche energy EAS = f (Tj) par.: ID = 7.5 A, VDD = 50 V 0.5 16 Drain-source breakdown voltage V(BR)DSS = f (Tj) 720 SPP15N60C3 V mJ V(BR)DSS 680 660 640 620 E AS 0.3 0.2 600 580 560 0 20 540 -60 0.1 40 60 80 100 120 160 °C Tj -20 20 60 100 °C 180 Tj Page 8 2003-07-01 Final data 17 Avalanche power losses PAR = f (f ) parameter: EAR =0.8mJ 900 SPP15N60C3, SPI15N60C3 SPA15N60C3 18 Typ. capacitances C = f (VDS) parameter: VGS =0V, f=1 MHz 10 4 W pF Ciss 700 10 3 PAR 600 C 500 10 400 300 200 100 04 10 5 6 2 Coss 10 1 Crss 10 Hz f 10 10 0 0 100 200 300 400 V 600 VDS 19 Typ. Coss stored energy Eoss=f(VDS) 15 µJ E oss 9 6 3 0 0 100 200 300 400 V 600 VDS Page 9 2003-07-01 Final data SPP15N60C3, SPI15N60C3 SPA15N60C3 Definition of diodes switching characteristics Page 10 2003-07-01 Final data P-TO-220-3-1 B 10 ±0.4 3.7 ±0.2 A 1.27±0.13 4.44 SPP15N60C3, SPI15N60C3 SPA15N60C3 15.38 ±0.6 2.8 ±0.2 C 5.23 ±0.9 13.5 ±0.5 3x 0.75 ±0.1 1.17 ±0.22 2x 2.54 0.25 M 0.5 ±0.1 2.51±0.2 ABC All metal surfaces tin plated, except area of cut. Metal surface min. x=7.25, y=12.3 9.98 ±0.48 0.05 Page 11 2003-07-01 Final data P-TO-262-3-1 (I2-PAK) 10 ±0.2 0...0.3 8.5 1) 1) SPP15N60C3, SPI15N60C3 SPA15N60C3 A B 4.4 1.27 1 ±0.3 11.6 ±0.3 2.4 C 4.55 ±0.2 13.5 ±0.5 0...0.15 1.05 3 x 0.75 ±0.1 2 x 2.54 1) 0.5 ±0.1 2.4 0.25 M ABC Typical Metal surface min. X = 7.25, Y = 6.9 All metal surfaces tin plated, except area of cut. P-TO-220-3-31 (FullPAK) Please refer to mounting instructions (application note AN-TO220-3-31-01) 9.25 ±0.2 7.55 0.05 Page 12 2003-07-01 Final data Published by Infineon Technologies AG , Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. SPP15N60C3, SPI15N60C3 SPA15N60C3 Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 13 2003-07-01