SPB80N06S2L-H5

SPP80N06S2L-H5 SPB80N06S2L-H5 OptiMOS® Power-Transistor Feature • N-Channel Product Summary VDS R DS(on) ID P- TO263 -3-2 55 5 80 P- TO220 -3-1 V mΩ A • Enhancement mode • 175°C operating temperature • dv/dt rated Type SPP80N06S2L-H5 SPB80N06S2L-H5 Package P- TO220 -3-1 P- TO263 -3-2 Ordering Code Q67060-S6054 Q67060-S6055 Marking 2N06LH5 2N06LH5 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) TC=25°C Value 80 80 Unit A ID Pulsed drain current TC=25°C ID puls EAS dv/dt VGS Ptot T j , Tstg 320 700 6 ±20 300 -55... +175 55/175/56 mJ kV/µs V W °C Avalanche energy, single pulse ID=80 A , V DD=25V, RGS=25Ω Reverse diode d v/dt IS=80A, VDS=44V, di/dt=200A/µs, T jmax=175°C Gate source voltage Power dissipation TC=25°C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 2) Symbol min. RthJC RthJA RthJA - Values typ. 0.34 max. 0.5 62 62 40 Unit K/W Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage V GS=0V, ID=1mA Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) 55 1.2 Values typ. 1.6 max. 2 Unit V Gate threshold voltage, VGS = V DS ID=230µA Zero gate voltage drain current V DS=55V, VGS=0V, Tj=25°C V DS=55V, VGS=0V, Tj=125°C µA 0.01 1 1 5 4 1 100 100 6.5 5 nA mΩ Gate-source leakage current V GS=20V, VDS=0V Drain-source on-state resistance V GS=4.5V, I D=80A Drain-source on-state resistance V GS=10V, I D=80A 1Current limited by bondwire ; with an RthJC = 0.5K/W the chip is able to carry ID= 170A at 25°C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg VDD =44V, ID =80A, VGS =0 to 10V VDD =44V, ID =80A Symbol Conditions min. Values typ. 157 4996 1063 276 19 23 75 22 max. - Unit gfs Ciss Coss Crss td(on) tr td(off) tf VDS ≥2*ID *RDS(on)max, ID =80A VGS =0V, VDS =25V, f=1MHz 79 - S 6640 pF 1410 410 28 35 110 33 ns VDD =30V, VGS =10V, ID =80A, RG =1.2Ω - 14 53 145 3 18 80 190 - nC V(plateau) VDD =44V, ID =80A V Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr VGS =0V, IF =80A VR =30V, IF =lS , diF /dt=100A/µs IS TC=25°C - 0.9 76 169 80 320 1.3 95 210 A V ns nC Page 3 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 1 Power dissipation Ptot = f (TC) parameter: VGS≥ 4 V 320 SPP80N06S2L-H5 2 Drain current ID = f (T C) parameter: VGS≥ 10 V 90 SPP80N06S2L-H5 W A 70 240 P tot 60 200 ID 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 °C 190 160 120 80 40 0 0 20 40 60 80 100 120 140 160 °C 190 TC TC 3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 °C 10 3 SPP80N06S2L-H5 4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T 10 1 SPP80N06S2L-H5 K/W A /I D t = 10.0µs p 10 0 = V DS ID DS (on ) 10 2 100 µs Z thJC 10 R -1 1 ms D = 0.50 10 -2 0.20 0.10 0.05 10 1 10 -3 single pulse 0.02 0.01 10 0 10 -1 10 0 10 1 V 10 2 10 -4 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Page 4 tp 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 5 Typ. output characteristic ID = f (V DS); T j=25°C parameter: tp = 80 µs 190 SPP80N06S2L-H5 6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS 16 SPP80N06S2L-H5 Ptot = 300W h i g f e VGS [V] a b 3.0 3.2 3.5 3.8 4.0 4.2 5.0 6.0 7.0 A 160 140 d e f mΩ c d ID 120 100 80 c de f g h i R DS(on) 12 10 8 g 6 h 60 4 40 20 0 0 1 2 3 4 b i 2 VGS [V] = a d 3.8 e 4.0 f 4.2 g 5.0 h 6.0 i 7.0 V 0 5.5 0 20 40 60 80 100 120 140 A 180 VDS ID 7 Typ. transfer characteristics ID= f ( V GS ); V DS≥ 2 x ID x RDS(on)max parameter: tp = 80 µs 160 8 Typ. forward transconductance g fs = f(I D); T j=25°C parameter: g fs 200 A S 160 120 140 100 gfs V VGS Page 5 ID 120 100 80 60 80 60 40 40 20 20 0 4 0 20 40 60 80 100 120 0 0 1 2 A ID 160 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 80 A, VGS = 10 V 17 SPP80N06S2L-H5 10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS 3 mΩ V 14 R DS(on) 12 V GS(th) 2 10 8 6 4 2 98% 1.15mA 1.5 230µA 1 typ 0.5 0 -60 -20 20 60 100 140 °C 200 0 -60 -20 20 60 100 °C Tj 180 Tj 11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz 10 5 12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 µs 10 3 SPP80N06S2L-H5 pF A 10 4 10 2 C Coss 10 3 IF 10 1 Ciss T j = 25 °C typ Crss T j = 175 °C typ T j = 25 °C (98%) T j = 175 °C (98%) 10 2 10 5 10 15 20 0 0 V VDS 30 0 0.4 0.8 1.2 1.6 2 2.4 V 3 VSD Page 6 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 13 Typ. avalanche energy E AS = f (T j) par.: I D = 80 A , V DD = 25 V, R GS = 25 Ω 700 14 Typ. gate charge VGS = f (QGate) parameter: ID = 80 A pulsed 16 SPP80N06S2L-H5 mJ V 12 500 VGS EAS 10 0,2 VDS max 8 0,8 VDS max 400 300 6 200 4 100 2 0 25 50 75 100 125 °C Tj 0 175 0 20 40 60 80 100 120 140 160 180 nC 210 QGate 15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA 66 SPP80N06S2L-H5 V V(BR)DSS 62 60 58 56 54 52 50 -60 -20 20 60 100 140 °C 200 Tj Page 7 2003-05-09 SPP80N06S2L-H5 SPB80N06S2L-H5 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPP80N06S2L-H5 and BSPB80N06S2L-H5, for simplicity the device is referred to by the term SPP80N06S2L-H5 and SPB80N06S2L-H5 throughout this documentation. Page 8 2003-05-09