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SPD18P06P

SPD18P06P

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    SPD18P06P - SIPMOS Power-Transistor - Infineon Technologies AG

  • 数据手册
  • 价格&库存
SPD18P06P 数据手册
Preliminary data SPD18P06P SPU18P06P SIPMOS ® Power-Transistor Features · Product Summary Drain source voltage Drain-source on-state resistance Continuous drain current P-Channel Enhancement mode Avalanche rated dv/dt rated 175°C operating temperature VDS RDS(on) ID -60 0.13 -18.6 V W · · · · A Type SPD18P06P SPU18P06P Package P-TO252 P-TO251 Ordering Code Q67040-S4189 Q67040-S4192 Pin 1 G PIN 2/4 D PIN 3 S Maximum Ratings,at T j = 25 °C, unless otherwise specified Parameter Symbol Continuous drain current Value -18.6 -13.2 Unit A ID T C = 25 °C T C = 100 °C Pulsed drain current ID puls EAS EAR dv/dt -74.4 150 8 6 kV/µs mJ T C = 25 °C Avalanche energy, single pulse I D = -18.6 A , V DD = -25 V, RGS = 25 W Avalanche energy, periodic limited by Tjmax Reverse diode dv/dt I S = -18.6 A, V DS = -48 V, di/dt = 200 A/µs, T jmax = 175 °C Gate source voltage Power dissipation VGS Ptot Tj , Tstg ±20 80 -55...+175 55/175/56 V W °C T C = 25 °C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 1999-11-22 Preliminary data Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 1) Symbol min. Values typ. - SPD18P06P SPU18P06P Unit max. 1.85 100 75 50 K/W RthJC RthJA RthJA - Electrical Characteristics , at T j = 25 °C, unless otherwise specified Parameter Static Characteristics Drain- source breakdown voltage Symbol min. Values typ. -3 max. -4 µA -0.1 -10 -10 0.1 -1 -100 -100 0.13 nA V Unit V(BR)DSS VGS(th) IDSS -60 -2.1 VGS = 0 V, I D = -250 µA Gate threshold voltage, VGS = VDS I D = -1 mA Zero gate voltage drain current VDS = -60 V, V GS = 0 V, T j = 25 °C VDS = -60 V, V GS = 0 V, T j = 150 °C Gate-source leakage current IGSS RDS(on) - VGS = -20 V, VDS = 0 V Drain-source on-state resistance W VGS = -10 V, I D = -13.2 A 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Page 2 1999-11-22 Preliminary data Electrical Characteristics, at T j = 25 °C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. SPD18P06P SPU18P06P Unit max. gfs Ciss Coss Crss td(on) 4 - 8 690 230 95 12 860 290 120 18 S pF VDS³2*I D*RDS(on)max , ID = -13.2 A Input capacitance VGS = 0 V, V DS = -25 V, f = 1 MHz Output capacitance VGS = 0 V, V DS = -25 V, f = 1 MHz Reverse transfer capacitance VGS = 0 V, V DS = -25 V, f = 1 MHz Turn-on delay time ns VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Rise time tr - 5.8 8.7 VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Turn-off delay time td(off) - 24.5 37 VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Fall time tf - 11 16.5 VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Page 3 1999-11-22 Preliminary data Electrical Characteristics, at T j = 25 °C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Gate to source charge Values typ. SPD18P06P SPU18P06P Unit max. Qgs Qgd Qg V(plateau) - 4.4 9.3 22 -5.56 6.6 14 33 - nC VDD = -48 , ID = -18.6 A Gate to drain charge VDD = -48 V, ID = -18.6 A Gate charge total VDD = -48 V, ID = -18.6 , V GS = 0 to -10 V Gate plateau voltage V VDD = -48 , I D = -18.6 A Parameter Reverse Diode Inverse diode continuous forward current Symbol min. Values typ. -1 70 139 max. -18.6 -74.4 -1.33 105 208 Unit IS ISM VSD trr Qrr - A T C = 25 °C Inverse diode direct current,pulsed T C = 25 °C Inverse diode forward voltage V ns nC VGS = 0 V, I F = -18.6 A Reverse recovery time VR = -30 V, IF=I S , di F/dt = 100 A/µs Reverse recovery charge VR = -30 V, IF=l S , diF/dt = 100 A/µs Page 4 1999-11-22 Preliminary data Power dissipation Drain current SPD18P06P SPU18P06P Ptot = f (TC) SPD18P06P ID = f (TC ) parameter: VGS ³ 10 V SPD18P06P 90 -20 W 70 60 A -16 -14 Ptot ID 50 40 30 20 10 0 0 100 120 140 160 °C 190 -12 -10 -8 -6 -4 -2 0 0 20 40 60 80 20 40 60 80 100 120 140 160 °C 190 TC TC Safe operating area Transient thermal impedance I D = f ( VDS ) parameter : D = 0 , T C = 25 °C -10 2 ZthJC = f (tp ) parameter : D = tp /T tp = 29.0 µs SPD18P06P 10 1 SPD18P06P K/W 10 0 A Z thJC 100 µs ID 10 -1 -10 1 D = 0.50 10 1 ms DS /I -2 D 0.20 0.10 0.05 DS (on ) =V R 10 -3 10 ms 0.02 0.01 single pulse DC -10 0 -1 -10 -10 0 -10 1 V -10 2 10 -4 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Page 5 tp 1999-11-22 Preliminary data Typ. output characteristic SPD18P06P SPU18P06P Typ. drain-source-on-resistance I D = f (VDS); T j=25°C parameter: tp = 80 µs SPD18P06P RDS(on) = f (ID ) parameter: VGS SPD18P06P -50 Ptot = 80.00W VGS [V] a 0.42 A -40 -35 h l -4.0 -4.5 W a b c d e f g h 0.36 0.32 jk i b c d e -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -9.0 -10.0 -20.0 RDS(on) -5.0 0.28 0.24 0.20 0.16 i ID -30 -25 -20 -15 -10 -5 0 0 g f g fh e i j k d c l 0.12 0.08 k l j b a VGS [V] = 0.04 a b c d e f -4.0 -4.5 -5.0 -5.5 -6.0 -6.5 g h i j k l -7.0 -7.5 -8.0 -9.0 -10.0 -20.0 -1 -2 -3 -4 -5 -6 -7 -8 V -10 0.00 0 -4 -8 -12 -16 -20 -24 -28 -32 A -38 VDS ID Typ. transfer characteristics I D= f ( V GS ) Typ. forward transconductance VDS³ 2 x I D x RDS(on)max parameter: tp = 80 µs -40 A gfs = f(ID); Tj=25°C parameter: gfs 10 S 8 -30 7 ID -25 gfs V 6 5 4 3 -20 -15 -10 2 -5 1 0 0 0 0 -1 -2 -3 -4 -5 -6 -7 -8 -10 -5 -10 -15 -20 A -30 VGS ID Page 6 1999-11-22 Preliminary data Drain-source on-state resistance Gate threshold voltage SPD18P06P SPU18P06P RDS(on) = f (Tj) parameter : I D = -13.2 A, VGS = -10 V SPD18P06P VGS(th) = f (Tj) parameter: VGS = VDS , ID = -1 mA -5.0 V -4.4 -4.0 W RDS(on) 0.38 0.32 0.28 0.24 0.20 V GS(th) -3.6 -3.2 -2.8 98% 0.16 -2.4 -2.0 -1.6 -1.2 -0.8 max typ 0.12 0.08 0.04 0.00 -60 typ -0.4 -20 20 60 100 140 °C 200 0.0 -60 -20 20 60 100 140 V min 200 Tj Tj Typ. capacitances Forward characteristics of reverse diode C = f (VDS) parameter: VGS=0V, f=1 MHz 10 4 IF = f (VSD ) parameter: Tj , tp = 80 µs -10 2 SPD18P06P pF A 10 3 -10 1 C Coss 10 2 IF -10 0 Ciss Crss Tj = 25 °C typ Tj = 175 °C typ Tj = 25 °C (98%) Tj = 175 °C (98%) 10 1 0 -5 -10 -15 -20 -25 V -35 -10 -1 0.0 -0.4 -0.8 -1.2 -1.6 -2.0 -2.4 V -3.0 VDS VSD Page 7 1999-11-22 Preliminary data Avalanche energy Typ. gate charge SPD18P06P SPU18P06P EAS = f (Tj) para.: I D = -18.6 A , VDD = -25 V, RGS = 25 160 VGS = f (QGate ) parameter: ID = -18.6 A pulsed SPD18P06P -16 mJ V 120 -12 E AS 100 VGS -10 0,2 VDS max 0,8 VDS max 80 -8 60 -6 40 -4 20 -2 0 25 45 65 85 105 125 145 °C 185 Tj 0 0 4 8 12 16 20 24 28 nC 34 QGate Drain-source breakdown voltage V(BR)DSS = f (Tj) SPD18P06P -72 V -68 -66 -64 -62 -60 -58 -56 -54 -60 V(BR)DSS -20 20 60 100 140 °C 200 Tj Page 8 1999-11-22 Preliminary data Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. SPD18P06P SPU18P06P Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 9 1999-11-22
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