SPS01N60C3 Cool MOS™ Power Transistor
Feature • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • Extreme dv/dt rated • Ultra low effective capacitances • Improved transconductance
VDS @ Tjmax RDS(on) ID
650 6 0.8
V Ω A
PG-TO251-3-11
Type SPS01N60C3
Package
Ordering Code
Marking 01N60C3
PG-TO251-3-11 -
Maximum Ratings Parameter Continuous drain current TC = 25 °C TC = 100 °C Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse I D = 0.6 A, VDD = 50 V Avalanche energy, repetitive tAR limited by Tjmax1) EAR I D = 0.8 A, VDD = 50 V Avalanche current, repetitive tAR limited by Tjmax I AR Gate source voltage static VGS Gate source voltage AC (f >1Hz)
Power dissipation, T C = 25°C
Symbol ID
Value 0.8 0.5
Unit A
I D puls EAS
1.6 20 0.01 0.8 ±20 ±30 11 -55... +150 15 W °C V/ns A V mJ
VGS Ptot T j , T stg dv/dt
Operating and storage temperature Reverse diode dv/dt 3)
Rev. 2.1
Page 1
2008-04-07
SPS01N60C3
Maximum Ratings Parameter Drain Source voltage slope
V DS = 480 V, I D = 0.8 A, Tj = 125 °C
Symbol dv/dt
Value 50
Unit V/ns
Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 2) Soldering temperature, wavesoldering 1.6 mm (0.063 in.) from case for 10s Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS V GS=0V, ID=0.25mA Drain-Source avalanche V(BR)DS V GS=0V, ID=0.8A breakdown voltage Gate threshold voltage Zero gate voltage drain current VGS(th) I DSS
ID=250µΑ, VGS=V DS V DS=600V, VGS=0V, Tj=25°C, Tj=150°C
Symbol min. RthJC RthJA RthJA Tsold -
Values typ. max. 11 75 75 50 260
Unit K/W
°C
Values typ. 700 3 0.1 5.6 15.1 max. 3.9 600 2.1 -
Unit V
µA 1 50 100 6 nA Ω
Gate-source leakage current
I GSS
V GS=30V, VDS=0V V GS=10V, ID=0.5A, Tj=25°C Tj=150°C
Drain-source on-state resistance RDS(on)
Rev. 2.1
Page 2
2008-04-07
SPS01N60C3
Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg
V DD=350V, ID=0.8A, V GS=0 to 10V V DD=350V, ID=0.8A
Symbol g fs Ciss Coss Crss td(on) tr td(off) tf
Conditions min.
V DS≥2*I D*RDS(on)max, ID=0.5A V GS=0V, V DS=25V, f=1MHz
Values typ. 0.75 100 40 2.5 30 25 55 30 max. 82 45 -
Unit S pF
V DD=350V, V GS=0/10V, ID=0.8A, RG=100Ω
ns
-
0.9 2.2 3.9 5.5
5 -
nC
V(plateau) V DD=350V, ID=0.8A
V
1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f. AV 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air.
3I
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