SPU02N60C3

Final data SPD02N60C3 SPU02N60C3 VDS @ Tjmax RDS(on) ID P-TO251 Cool MOS™ Power Transistor Feature • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • Extreme dv/dt rated • Ultra low effective capacitances 650 3 1.8 P-TO252 V Ω A Type SPD02N60C3 SPU02N60C3 Package P-TO252 P-TO251 Ordering Code Q67040-S4420 - Marking 02N60C3 02N60C3 Maximum Ratings Parameter Symbol ID Value Unit Continuous drain current TC = 25 °C TC = 100 °C A 1.8 1.1 Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse I D = 1.35 A, VDD = 50 V I D puls EAS 5.4 50 0.07 1.8 ±20 ±30 mJ Avalanche energy, repetitive tAR limited by Tjmax1) EAR I D = 1.8 A, VDD = 50 V Avalanche current, repetitive tAR limited by Tjmax I AR Gate source voltage static VGS Gate source voltage AC (f >1Hz) Power dissipation, TC = 25°C Operating and storage temperature VGS Ptot T j , T stg A V W °C 25 -55... +150 Page 1 2003-10-02 Final data SPD02N60C3 SPU02N60C3 Symbol dv/dt Value 50 Unit V/ns Maximum Ratings Parameter Drain Source voltage slope V DS = 480 V, ID = 1.8 A, Tj = 125 °C Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 2) Symbol min. RthJC RthJA Values typ. max. 5 75 75 50 - Unit K/W RthJA Soldering temperature, 1.6 mm (0.063 in.) from case for 10s Tsold - - 260 °C Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA Drain-Source avalanche breakdown voltage Gate threshold voltage Zero gate voltage drain current VGS(th) IDSS ID=80µΑ, VGS=VDS VDS=600V, VGS=0V, Tj=25°C, Tj=150°C Values typ. 700 3 0.5 2.7 7.3 9 max. 3.9 600 2.1 - Unit V V(BR)DS VGS=0V, ID=0.25A µA 1 50 100 3 nA Ω Gate-source leakage current IGSS VGS=30V, VDS=0V VGS=10V, ID=1.1A, Tj=25°C Tj=150°C Drain-source on-state resistance RDS(on) Gate input resistance RG f=1MHz, open Drain Page 2 2003-10-02 Final data SPD02N60C3 SPU02N60C3 Values min. typ. 1.75 200 90 4 8.1 15.7 6 3 68 12 max. 70 30 ns pF S pF Unit Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance Symbol g fs Ciss Coss Crss Conditions V DS≥2*I D*RDS(on)max, ID=1.1A V GS=0V, V DS=25V, f=1MHz Effective output capacitance, 3) Co(er) energy related Effective output capacitance, 4) Co(tr) time related Turn-on delay time Rise time Turn-off delay time Fall time V GS=0V, V DS=0V to 480V td(on) tr td(off) tf V DD=350V, V GS=0/10V, ID=1.8A, RG=25Ω - Gate Charge Characteristics Gate to source charge Qgs Gate to drain charge Gate charge total Gate plateau voltage Qgd Qg VDD=420V, ID=1.8A - 1.6 3.8 9.5 5.5 12.5 - nC VDD=420V, ID=1.8A, VGS=0 to 10V V(plateau) VDD=420V, ID=1.8A V 1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f. AV 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 3C is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V o(er) DSS. 4C o(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Page 3 2003-10-02 Final data SPD02N60C3 SPU02N60C3 Values min. typ. 1 200 1.3 9 max. 1.8 5.4 1.2 350 200 V ns µC A A/µs A Unit Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current Peak rate of fall of reverse recovery current Typical Transient Thermal Characteristics Symbol Value typ. Unit Symbol Value typ. Unit VSD trr Qrr Irrm dirr /dt VGS=0V, IF=IS VR=420V, IF=IS , diF/dt=100A/µs Symbol IS ISM Conditions TC=25°C - Thermal resistance R th1 R th2 R th3 R th4 R th5 R th6 0.1 0.184 0.306 1.207 0.974 0.251 K/W Thermal capacitance Cth1 Cth2 Cth3 Cth4 Cth5 Cth6 0.00002806 0.0001113 0.0001679 0.000547 0.001388 0.019 Ws/K Tj P tot ( t) R th1 R th,n T case E xternal H eatsink C th1 C th2 C th,n T am b Page 4 2003-10-02 Final data SPD02N60C3 SPU02N60C3 1 Power dissipation 2 Safe operating area Ptot = f (TC) 28 SPD02N60C3 ID = f ( V DS ) parameter : D = 0 , T C=25°C 10 1 W 24 22 20 A Ptot 16 14 12 10 8 6 4 2 0 0 20 40 60 80 100 120 10 -1 ID 18 10 0 tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ,ms DC °C 160 10 -2 0 10 10 1 10 2 TC 10 V VDS 3 3 Transient thermal impedance 4 Typ. output characteristic ZthJC = f (t p) parameter: D = tp/T 10 1 ID = f (VDS); Tj=25°C parameter: tp = 10 µs, VGS 5.5 K/W A 4.5 V20 V10 V7 V6.5 V6 10 0 4 ZthJC ID 10 -1 3.5 3 2.5 2 1.5 1 V4.5 V5 10 -2 D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse V5.5 0.5 10 -3 -7 10 10 -6 V4 10 -5 10 -4 10 -3 s tp 10 -1 0 0 2 4 6 8 10 12 14 16 V 20 VDS Page 5 2003-10-02 Final data SPD02N60C3 SPU02N60C3 5 Typ. output characteristic 6 Typ. drain-source on resistance ID = f (VDS); Tj=150°C parameter: tp = 10 µs, VGS 3 RDS(on)=f(ID) parameter: Tj=150°C, V GS 20 A 2.4 2.1 20V 8V 7V 6.5V Ω 6V 4V 4.5V 5V 5,5V 16 RDS(on) 5.5V ID 14 12 10 6V 1.8 1.5 1.2 0.9 0.6 0.3 0 0 5V 8 4.5V 4V 6 4 2 0 6.5V 7V 8V 20V 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 5 10 15 V VDS 25 A ID 3 7 Drain-source on-state resistance 8 Typ. transfer characteristics RDS(on) = f (Tj) parameter : ID = 1.1 A, VGS = 10 V 17 SPD02N60C3 ID= f ( VGS ); V DS≥ 2 x ID x RDS(on)max parameter: tp = 10 µs 5.5 Ω 14 A 25°C 4.5 4 RDS(on) 12 10 ID 3.5 3 150°C 8 6 4 2 0 -60 98% typ 2.5 2 1.5 1 0.5 -20 20 60 100 °C 180 0 0 2 4 6 8 10 12 14 16 Tj Page 6 V 20 VGS 2003-10-02 Final data SPD02N60C3 SPU02N60C3 9 Typ. gate charge VGS = f (QGate) parameter: ID = 1.8 A pulsed 16 V SPD02N60C3 10 Forward characteristics of body diode IF = f (VSD) parameter: Tj , tp = 10 µs 10 1 SPD02N60C3 A 12 VGS 0.2 VDS max 0.8 VDS max 10 0 8 6 IF 10 -1 Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%) 12 nC 10 -2 0 10 4 2 0 0 2 4 6 8 10 15 0.4 0.8 1.2 1.6 2 2.4 V 3 QGate VSD 11 Typ. drain current slope di/dt = f(R G), inductive load, Tj = 125°C 12 Typ. switching time t = f (RG), inductive load, T j=125°C par.: V DS=380V, VGS=0/+13V, ID=1.8 A 400 par.: VDS=380V, VGS=0/+13V, ID=1.8A 1000 ns A/µs di/dt(on) 300 di/dt 600 t 250 td(off) 200 400 150 100 200 50 di/dt(off) tf td(on) tr 0 0 40 80 120 160 200 Ω RG 280 0 0 40 80 120 160 200 Ω 260 RG Page 7 2003-10-02 Final data SPD02N60C3 SPU02N60C3 13 Typ. switching time 14 Typ. drain source voltage slope dv/dt = f(RG), inductive load, Tj = 125°C t = f (ID), inductive load, T j=125°C par.: VDS=380V, VGS=0/+13V, RG =25Ω 90 par.: V DS=380V, VGS=0/+13V, ID=1.8A 85000 ns tdoff 70 60 V/ns dv/dt 45000 t 50 40 dv/dt(on) 30 20 10 0 0.25 tf 25000 tdon tr dv/dt(off) 0.5 0.75 1 1.25 1.5 A ID 2 5000 0 40 80 120 160 200 Ω RG 280 15 Typ. switching losses 16 Typ. switching losses E = f (ID), inductive load, Tj=125°C par.: VDS=380V, VGS=0/+13V, RG =25Ω 0.01 E = f(RG), inductive load, Tj=125°C par.: V DS=380V, VGS=0/+13V, ID=1.8A 0.0425 mWs mWs 0.008 0.0325 E E 0.007 Eon 0.0275 Eon 0.006 0.0225 0.005 0.0175 0.004 Eoff 0.0125 Eoff 0.003 0.0075 0.002 0.25 0.5 0.75 1 1.25 1.5 A ID 2 0.0025 0 40 80 120 160 200 Ω RG 280 Page 8 2003-10-02 Final data SPD02N60C3 SPU02N60C3 17 Avalanche SOA 18 Avalanche energy IAR = f (tAR) par.: Tj ≤ 150 °C 2 EAS = f (Tj) par.: ID = 1.35 A, VDD = 50 V 50 A 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -3 10 -2 -1 0 1 2 4 mJ Tj(START) =25°C EAS Tj(START) =125°C IAR 30 20 10 10 10 10 10 10 µs 10 tAR 0 20 40 60 80 100 120 °C 160 Tj 19 Drain-source breakdown voltage V(BR)DSS = f (Tj) 720 SPD02N60C3 20 Avalanche power losses PAR = f (f ) parameter: E AR=0.07mJ 70 V W V(BR)DSS 680 50 660 640 620 600 20 580 560 540 -60 10 PAR 40 30 04 10 -20 20 60 100 °C 180 10 5 Hz f 10 6 Tj Page 9 2003-10-02 Final data SPD02N60C3 SPU02N60C3 21 Typ. capacitances 22 Typ. Coss stored energy C = f (VDS) parameter: V GS=0V, f=1 MHz 10 4 Eoss=f(VDS) 1.8 pF µJ 10 3 1.4 Eoss V Ciss 1.2 1 C 10 2 0.8 0.6 0.4 Crss 10 1 Coss 0.2 0 0 10 0 0 100 200 300 400 600 100 200 300 400 V 600 VDS VDS Definition of diodes switching characteristics Page 10 2003-10-02 Final data SPD02N60C3 SPU02N60C3 P-TO-252-3-1 (D-PAK) P-TO-251-3-1 (I-PAK) 6.5 +0.15 -0.10 A 1 ±0.1 2.3 +0.05 -0.10 B 0.9 +0.08 -0.04 5.4 ±0.1 C 6.22 -0.2 0.15 max per side 9.3 ±0.4 3 x 0.75 ±0.1 2.28 4.56 0.25 M 0.5 +0.08 -0.04 1.0 ABC GPT09050 All metal surfaces tin plated, except area of cut. Page 11 2003-10-02 Final data Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. SPD02N60C3 SPU02N60C3 Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 12 2003-10-02