SPW16N50C3

Final data SPW16N50C3 VDS @ Tjmax RDS(on) ID 560 0.28 16 P-TO247 Cool MOS™ Power Transistor Feature • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • Extreme dv/dt rated • Ultra low effective capacitances • Improved transconductance V Ω A Type SPW16N50C3 Package P-TO247 Ordering Code Q67040-S4584 Marking 16N50C3 Maximum Ratings Parameter Symbol ID Value Unit Continuous drain current TC = 25 °C TC = 100 °C A 16 10 Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse I D = 8 , VDD = 50 V I D puls EAS 48 460 0.64 16 6 ±20 ±30 mJ Avalanche energy, repetitive tAR limited by Tjmax1) EAR I D = 16 A, VDD = 50 V Avalanche current, repetitive tAR limited by Tjmax I AR Reverse diode dv/dt dv/dt IS=16A, VDS=480V, T j=125°C A V/ns V W °C 2003-06-30 Gate source voltage VGS VGS Ptot T j , T stg Page 1 Gate source voltage AC (f >1Hz) Power dissipation, TC = 25°C Operating and storage temperature 160 -55... +150 Final data SPW16N50C3 Maximum Ratings Parameter Drain Source voltage slope V DS = 400 V, ID = 16 A, Tj = 125 °C Symbol dv/dt Value 50 Unit V/ns Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded Soldering temperature, 1.6 mm (0.063 in.) from case for 10s Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS V GS=0V, ID=0.25mA Drain-Source avalanche V(BR)DS V GS=0V, ID=16A breakdown voltage Gate threshold voltage Zero gate voltage drain current 500 2.1 Values typ. 600 3 0.1 0.25 0.68 1.5 max. 3.9 µA 1 100 100 0.28 nA Ω Symbol min. RthJC RthJA - Values typ. max. 0.78 62 260 Unit K/W °C Tsold Unit V VGS(th) I DSS ID=675µΑ, VGS=VDS V DS=500V, VGS=0V, Tj=25°C, Tj=150°C Gate-source leakage current I GSS V GS=20V, VDS=0V V GS=10V, ID=10A, Tj=25°C Tj=150°C Drain-source on-state resistance RDS(on) Gate input resistance RG f=1MHz, open Drain Page 2 2003-06-30 Final data SPW16N50C3 Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance Symbol g fs Ciss Coss Crss Conditions min. V DS≥2*I D*RDS(on)max, ID=10A V GS=0V, V DS=25V, f=1MHz Values typ. 14 1600 800 30 64 124 10 8 50 8 max. - Unit S pF Effective output capacitance, 2) Co(er) energy related Effective output capacitance, 3) Co(tr) time related Turn-on delay time Rise time Turn-off delay time Fall time V GS=0V, V DS=0V to 400V pF td(on) tr td(off) tf V DD=380V, V GS=0/10V, ID=16A, RG =4.3Ω - ns Gate Charge Characteristics Gate to source charge Qgs Gate to drain charge Gate charge total Gate plateau voltage Qgd Qg VDD=380V, ID=16A - 7 36 66 5 - nC VDD=380V, ID=16A, VGS=0 to 10V V(plateau) VDD=380V, ID=16A V 1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f. AV 2C o(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V DSS. 3C o(tr) is a fixed capacitance that gives the same charging time as Coss while V DS is rising from 0 to 80% V DSS. Page 3 2003-06-30 Final data SPW16N50C3 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current Peak rate of fall of reverse recovery current VSD trr Qrr Irrm dirr /dt VGS=0V, IF=IS VR=380V, IF=IS , diF/dt=100A/µs Symbol IS ISM Conditions min. TC=25°C Values typ. 1 420 7 40 tbd max. 16 48 1.2 - Unit A V ns µC A A/µs Typical Transient Thermal Characteristics Symbol Thermal resistance R th1 R th2 R th3 R th4 R th5 R th6 0.012 0.023 0.043 0.149 0.17 0.069 K/W Value typ. Unit Symbol Value typ. Unit Thermal capacitance Cth1 Cth2 Cth3 Cth4 Cth5 Cth6 0.0002495 0.0009406 0.001298 0.00362 0.009484 0.077 Ws/K Tj P tot ( t) R th1 R th,n T case E xternal H eatsink C th1 C th2 C th,n T am b Page 4 2003-06-30 Final data SPW16N50C3 1 Power dissipation Ptot = f (TC) 170 SPW16N50C3 2 Safe operating area ID = f ( V DS ) parameter : D = 0 , T C=25°C 10 2 W 140 A 10 1 120 Ptot 100 10 0 80 60 40 20 0 0 10 -2 0 10 10 -1 ID tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms DC 20 40 60 80 100 120 °C 160 10 1 10 2 TC 10 V VDS 3 3 Transient thermal impedance ZthJC = f (t p) parameter: D = tp/T 10 1 4 Typ. output characteristic ID = f (VDS); Tj=25°C parameter: tp = 10 µs, VGS 60 K/W 10 0 A 20V 7V 6.5V ZthJC 10 -1 ID 40 6V 30 10 -2 5.5V 10 -3 D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse 20 5V 10 4.5V 10 -4 -7 10 10 -6 10 -5 10 -4 10 -3 s tp 10 -1 0 0 5 10 15 V VDS 25 Page 5 2003-06-30 Final data SPW16N50C3 5 Typ. output characteristic ID = f (VDS); Tj=150°C parameter: tp = 10 µs, VGS 35 6 Typ. drain-source on resistance RDS(on)=f(ID) parameter: Tj=150°C, V GS 2 A 20V 7V 6V Ω RDS(on) 4V 4.5V 5V 6V 25 ID 20 5V 1.2 8V 20V 15 4.5V 0.8 10 4V 0.4 5 0 0 5 10 15 V VDS 25 0 0 5 10 15 20 A ID 30 7 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 10 A, VGS = 10 V 1.6 SPW16N50C3 8 Typ. transfer characteristics ID= f ( VGS ); V DS≥ 2 x ID x RDS(on)max parameter: tp = 10 µs 60 Ω 1.2 A 50 Tj = 25°C RDS(on) 45 40 ID 1 35 30 25 Tj = 150°C 0.8 0.6 20 0.4 98% typ 0.2 5 0 -60 -20 20 60 100 °C 15 10 180 0 0 1 2 3 4 5 6 7 8 Tj Page 6 V 10 VGS 2003-06-30 Final data SPW16N50C3 9 Typ. gate charge VGS = f (QGate) parameter: ID = 16 A pulsed 16 V SPW16N50C3 10 Forward characteristics of body diode IF = f (VSD) parameter: Tj , tp = 10 µs 10 2 SPW16N50C3 A 12 VGS 0.8 VDS max 8 6 IF 10 0 Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%) 80 nC 10 -1 0 10 0.2 VDS max 10 1 4 2 0 0 10 20 30 40 50 60 70 100 0.4 0.8 1.2 1.6 2 2.4 V 3 QGate VSD 11 Avalanche SOA IAR = f (tAR) par.: Tj ≤ 150 °C 16 12 Avalanche energy EAS = f (Tj) par.: ID = 8 , V DD = 50 V 0.5 A mJ 12 10 Tj(start) = 25°C EAS µs 10 tAR 4 IAR 0.3 8 0.2 Tj(start) = 125°C 6 4 0.1 2 0 -3 10 10 -2 10 -1 10 0 10 1 10 2 0 20 40 60 80 100 120 160 °C Tj Page 7 2003-06-30 Final data SPW16N50C3 13 Drain-source breakdown voltage V(BR)DSS = f (Tj) 600 SPW16N50C3 14 Avalanche power losses PAR = f (f ) parameter: E AR=0.64mJ 450 V W V(BR)DSS 570 560 350 PAR 550 540 530 520 510 500 490 480 470 460 450 -60 -20 20 60 100 300 250 200 150 100 50 02 10 °C 180 10 3 10 4 10 5 6 Hz 10 Tj f 15 Typ. capacitances C = f (VDS) parameter: V GS=0V, f=1 MHz 10 4 16 Typ. Coss stored energy Eoss=f(VDS) 9 pF Ciss µJ 10 3 7 Eoss 10 2 Coss 6 5 4 3 C 10 1 Crss 2 1 10 0 0 100 200 300 V 500 0 0 100 200 300 V 500 VDS Page 8 VDS 2003-06-30 Final data SPW16N50C3 Definition of diodes switching characteristics Page 9 2003-06-30 Final data SPW16N50C3 P-TO-247-3-1 15.9 6.35 ø3.61 5.03 2.03 4.37 20.9 9.91 6.17 D 7 D 1.75 1.14 0.243 1.2 2 2.92 5.46 16 0.762 MAX. 2.4 +0.05 General tolerance unless otherwise specified: Leadframe parts: ±0.05 Package parts: ±0.12 41.22 2.97 x 0.127 5˚ 5.94 20˚ Page 10 2003-06-30 Final data Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. SPW16N50C3 Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 11 2003-06-30