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TC1166

TC1166

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    TC1166 - 32-Bit Single-Chip Microcontroller TriCore - Infineon Technologies AG

  • 数据手册
  • 价格&库存
TC1166 数据手册
D a t a S h e e t , V 1 . 0 , A p r . 2 008 TC1165/TC1166 32-Bit Single-Chip Microcontroller TriCore Microcontrollers Edition 2008-04 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. D a t a S h e e t , V 1 . 0 , A p r . 2 008 TC1165/TC1166 32-Bit Single-Chip Microcontroller TriCore Microcontrollers TC1165/TC1166 Preliminary TC1165/TC1166 Data Sheet Revision History: V1.0, 2008-04 Previous Version: V0.3 2007-03 Page 7 8, 10 Subjects (major changes since last revision) VSSOSC3 is deleted from the TC1165/TC1166 Logic Symbol. TDATA0 of Pin 17, TCLK0 of Pin 20, TCLK0 of Pin 74 and TDATA0 of Pin 77 are updated in the Pinning Diagram and Pin Definition and Functions Table. Transmit DMA request in Block Diagram of ASC Interfaces is updated. Alternate output functions in block diagram of SSC interfaces are updated. Programmable baud rate of the MLI is updated. TDATA0 and TCLK0 of the block diagram of MLI interfaces are updated. The description for WDT double reset detection is updated. The power sequencing details is updated. MLI timing, maximum operating frequency limit is extended, t31 is added. Thermal resistance junction leads is updated. 51 53 59 61 73 110 121 125 Trademarks TriCore® is a trademark of Infineon Technologies AG. We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com Data Sheet V1.0, 2008-04 TC1165/TC1166 Preliminary Table of Contents Table of Contents 1 2 2.1 2.2 2.3 2.4 2.5 3 3.1 3.2 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.3.4.1 3.3.4.2 3.3.5 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.13.1 3.14 3.15 3.16 3.17 3.18 3.19 3.20 3.21 3.22 3.23 3.24 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pad Driver and Input Classes Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . . On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . How to Read the Address Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents of the Segments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Address Map of the FPI Bus System . . . . . . . . . . . . . . . . . . . . . . . . . . . Segments 0 to 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Segment 15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Address Map of the Local Memory Bus (LMB) . . . . . . . . . . . . . . . . . . . Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peripheral Control Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . . High-Speed Synchronous Serial Interfaces (SSC0 and SSC1) . . . . . . . . . Micro Second Bus Interface (MSC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MultiCAN Controller (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Micro Link Serial Bus Interface (MLI0, MLI1) . . . . . . . . . . . . . . . . . . . . . . . General Purpose Timer Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functionality of GPTA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog-to-Digital Converter (ADC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . . System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 24 24 25 27 27 29 30 32 32 35 40 44 44 47 49 51 53 55 57 59 62 63 66 68 70 73 74 75 76 77 79 82 83 Data Sheet V1.0, 2008-04 TC1165/TC1166 Preliminary 4 4.1 4.1.1 4.1.2 4.1.3 4.1.4 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.3 4.3.1 4.3.2 4.3.3 4.3.4 4.3.5 4.3.6 4.3.7 4.3.8 4.3.8.1 4.3.8.2 4.3.8.3 5 5.1 5.2 5.3 5.4 Table of Contents Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 86 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Analog to Digital Converter (ADC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . 101 Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Debug Trace Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Timing for JTAG Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 121 Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 123 Synchronous Serial Channel (SSC) Master Mode Timing . . . . . . . . 124 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters (PG-LQFP-176-2) . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 125 126 127 128 Data Sheet 2 V1.0, 2008-04 TC1165/TC1166 Preliminary Summary of Features 1 • Summary of Features High-performance 32-bit super-scaler TriCore v1.3 CPU with 4-stage pipeline – Superior real-time performance – Strong bit handling – Fully integrated DSP capabilities – Single precision Floating Point Unit (FPU) – 80 MHz operation at full temperature range Peripheral Control Processor with single cycle instruction (PCP2) – 8 Kbyte Parameter Memory (PRAM) – 12 Kbyte Code Memory (CMEM) Multiple on-chip memories – 56 Kbyte Local Data Memory (SRAM) – 8 Kbyte Overlay Memory – 16 Kbyte Scratch-Pad RAM (SPRAM) – 8 Kbyte Instruction Cache (ICACHE) – 1504 Kbyte Program Flash (for instruction code and constant data) – 32 Kbyte Data Flash (e.g. 4 Kbyte EEPROM emulation) – 16 Kbyte Boot ROM 8-channel DMA Controller Fast-response interrupt system with 2 x 255 hardware priority arbitration levels serviced by CPU or PCP2 High-performance on-chip bus structure – 64-bit Local Memory Bus (LMB) to Flash memory – System Peripheral Bus (SPB) for interconnections of functional units Versatile on-chip Peripheral Units – Two Asynchronous/Synchronous Serial Channels (ASCs) with baudrate generator, parity, framing and overrun error detection – Two High Speed Synchronous Serial Channels (SSCs) with programmable data length and shift direction – One Micro Second Bus (MSC) interface for serial port expansion to external power devices – Two high-speed Micro Link Interfaces (MLIs) for serial inter-processor communication – One MultiCAN Module with two CAN nodes and 64 free assignable message objects for high efficiency data handling via FIFO buffering and gateway data transfer1) The TC1165/TC1166 has the following features: • • • • • • 1) Not applicable to TC1165 Data Sheet 3 V1.0, 2008-04 TC1165/TC1166 Preliminary Summary of Features • • • • • • • • • • – One General Purpose Timer Array Module (GPTA) with a powerful set of digital signal filtering and timer functionality to realize autonomous and complex Input/Output management – One 16-channel Analog-to-Digital Converter unit (ADC) with selectable 8-bit, 10bit, or 12-bit, supporting 32 input channels – One 2-channel Fast Analog-to-Digital Converter unit (FADC) with concatenated comb filters for hardware data reduction: supporting 10-bit resolution, with minimum conversion time of 262.5ns 32 analog input lines for ADC and FADC 81 digital general purpose I/O lines Digital I/O ports with 3.3 V capability On-chip debug support for OCDS Level 1 and 2 (CPU, PCP, DMA) Power Management System Clock Generation Unit with PLL Core supply voltage of 1.5 V I/O voltage of 3.3 V Full Industrial and Multi-Market temperature range: -40° to +85°C PG-LQFP-176-2 package Data Sheet 4 V1.0, 2008-04 TC1165/TC1166 Preliminary Ordering Information The ordering code for Infineon microcontrollers provides an exact reference to the required product. This ordering code identifies: • • The derivative itself, i.e. its function set, the temperature range, and the supply voltage The package and the type of delivery Summary of Features For the available ordering codes for the TC1165/TC1166, please refer to the “Product Catalog Microcontrollers” that summarizes all available microcontroller variants. This document describes the derivatives of the device.The Table 1-1 enumerates these derivatives and summarizes the differences. Table 1-1 Derivative SAF-TC1165-192F80HL SAF-TC1166-192F80HL TC1165/TC1166 Derivative Synopsis Ambient Temperature Range TA = -40oC to +85oC TA = -40oC to +85oC Data Sheet 5 V1.0, 2008-04 TC1165/TC1166 Preliminary General Device Information 2 General Device Information Chapter 2 provides the general information for the TC1165/TC1166. 2.1 Block Diagram Figure 2-1 shows the TC1165/TC1166 block diagram. PMI 1 6 KB SPRAM 8 KB ICACHE FPU TriCore (TC1.3M) CPS DMI 56 KB LDRAM Local Memory Bus (LMB) PMU 16 KB BROM 1504 KB Pflash 32 KB DFlash 8 KB OVRAM Overl ay Me chan ism LBCU LFI Bridge Abbreviations: ICACHE: SPRAM: LDRAM: OVRAM: BROM: PFlash: DFlash: PRAM: CMEM: Instruction Cache Scratch-Pad RAM Local Data RAM Overlay RAM Boot ROM Program Flash Data Flash Parameter Memory in PCP Code Memory in PCP 8 KB PRAM Interru pts OCDS Debug Interface/JTAG System Peri phe ral Bus (SPB) FPI-Bus Interface PCP2 Core STM ASC0 SBCU DMA Bus 12 KB CMEM Ports SSC0 ASC1 SCU PLL PLL f FPI f CPU SSC1 8 ch. SMIF Ext. Request Unit Multi CAN (2 Nodes, 64 Buffer) 1) FADC 2 ch. MSC0 Mem Check MLI1 MLI0 1) Not applicable to TC1165 TC1165/TC1166 Block Diagram Figure 2-1 TC1165/TC1166 Block Diagram Data Sheet 6 Ana log Inp ut Assi gnme nt GPTA DMA BI0 BI1 ADC0 32 ch. V1.0, 2008-04 TC1165/TC1166 Preliminary General Device Information 2.2 Logic Symbol Figure 2-2 shows the TC1165/TC1166 logic symbol. Alternate Functions PORST HDRST General Control NMI BYPASS TESTMODE FCLP 0A FCLN0 MSC0 Control SOP0A SON0 AN[35:0] VDDM VSSM V DDMF ADC/FADC Analog Power Supply VSSMF V DDAF VSSAF V AREF0 VAGND0 VFAREF VFAGND VDDFL3 Digital Circuitry Power Supply VDD VDDP V SS TC1165/ TC1166 Port 0 16-bit Port 1 15-bit Port 2 14-bit Port 3 16-bit Port 4 4-bit Port 5 16-bit TRST TCK TDI TDO TMS BRKIN BRKOUT TRCLK XTAL1 XTAL2 VDDOSC3 GPTA, SCU GPTA, SSC1, ADC SSC0/1, MLI0, GPTA, MSC0 ASC0/1, SSC0/1, SCU, CAN GPTA, SCU GPTA, OCDS L 2, MLI0/1 1) ADC Analog Inputs OCDS / JTAG Control 7 8 9 VDDOSC VSSOSC Oscillator TC1165/TC1166 Logic Symbol 1) Alternate functions for CAN module is not applicable for TC 1165. Figure 2-2 TC1165/TC1166 Logic Symbol Data Sheet 7 V1.0, 2008-04 TC1165/TC1166 Preliminary General Device Information 2.3 Pin Configuration Figure 2-3 shows the TC1165/TC1166 pin configuration. P0.15/IN15/SWCFG15/REQ5/OUT15/OUT71 P0.14/IN14/SWCFG14/REQ4/OUT14/OUT70 P0.7/IN7/SWCFG7/REQ3/OUT7/OUT63 P0.6/IN6/SWCFG6/REQ2/OUT6/OUT62 VSS VDDP VDD P0.13/IN13/SWCFG13/OUT13/OUT69 P0.12/IN12/SWCFG12/OUT12/OUT68 P0.5/IN5/SWCFG5/OUT5/OUT61 P0.4/IN4/SWCFG4/OUT4/OUT60 P2.13/SLSI1/SDI0 P2.8/SLSO04/SLSO14/EN00 P2.12/MTSR1A/SOP0B P2.11/SCLK1A/FCLP0B P2.10/MRST1A P2.9/SLSO05/SLSO15/EN01 SOP0A SON0 FCLP0A FCLN0 VSS VDDP VDD P0.11/IN11/SWCFG11/OUT11/OUT67 P0.10/IN10/SWCFG10/OUT10/OUT66 P0.9/IN9/SWCFG9/OUT9/OUT65 P0.8/IN8/SWCFG8/OUT8/OUT64 P0.3/IN3/SWCFG3/OUT3/OUT59 P0.2/IN2/SWCFG2/OUT2/OUT58 P0.1/IN1/SWCFG1/OUT1/OUT57 P0.0/IN0/SWCFG0/OUT0/OUT56 P3.11/REQ1 P3.12/RXDCAN01)/RXD0B P3.13/TXDCAN01)/TXD0B VDDFL3 VSS VDDP P3.9/RXD1A P3.10/REQ0 P3.0/RXD0A P3.1/TXD0A P3.14/RXDCAN11)/RXD1B P3.15/TXDCAN11)/TXD1B 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 OCDSDBG0/OUT40/IN40/P5.0 OCDSDBG1/OUT41/IN41/P5.1 OCDSDBG2/OUT42/IN42/P5.2 OCDSDBG3/OUT43/IN43/P5.3 OCDSDBG4/OUT44/IN44/P5.4 OCDSDBG5/OUT45/IN45/P5.5 OCDSDBG6/OUT46/IN46/P5.6 OCDSDBG7/OUT47/IN47/P5.7 TRCLK VDD VDDP VSS OCDSDBG8/TDATA1/RDATA0B/P5.8 OCDSDBG9/TVALID1/RVALID0B/P5.9 OCDSDBG10/RREADY0B/TREADY1/P5.10 OCDSDBG11/TCLK1/RCLK0B/P5.11 OCDSDBG12/TDATA0/RDATA1/P5.12 OCDSDBG13/TVALID0B/RVALID1/P5.13 OCDSDBG14/RREADY1/TREADY0B/P5.14 OCDSDBG15/TCLK0/RCLK1/P5.15 N.C. VSSAF VDDAF VDDMF VSSMF VFAREF VFAGND AN35 AN34 AN33 AN32 AN31 AN30 AN29 AN28 AN7 AN27 AN26 AN25 AN24 AN23 AN22 AN21 AN20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 TC1165/TC1166 P3.4/MTSR0 P3.7/SLSI0/SLSO02/SLSO12 P3.3/MRST0 P3.2/SCLK0 P3.8/SLSO06/TXD1A P3.6/SLSO01/SLSO11/SLSO01&SLSO11 P3.5/SLSO00/SLSO10/SLSO00&SLSO10 VSS VDDP VDD HDRST PORST NMI BYPASS TESTMODE BRKIN BRKOUT TCK TRST TDO TMS TDI P1.7/IN23/OUT23/OUT79 P1.6/IN22/OUT22/OUT78 P1.5/IN21/OUT21/OUT77 P1.4/IN20/EMG_IN/OUT20/OUT76 VDDOSC3 VDDOSC VSSOSC XTAL2 XTAL1 VSS VDDP VDD P1.3/IN19/OUT19/OUT75 P1.11/IN27/IN51/SCLK1B/OUT27/OUT51 P1.10/IN26/IN50/OUT26/OUT50/SLSO17 P1.9/IN25/IN49/MRST1B/OUT25/OUT49 P1.8/IN24/IN48/MTSR1B/OUT24/OUT48 P1.2/IN18/OUT18/OUT74 P1.1/IN17/OUT17/OUT73 P1.0/IN16/OUT16/OUT72 P4.3/IN31/IN55/OUT31/OUT55/SYSCLK N.C. 1) Not applicable to TC1165 AN19 AN18 AN17 AN16 AN15 AN14 VAGND0 VAREF0 VSSM VDDM AN13 AN12 AN11 AN10 AN9 AN8 AN6 AN5 AN4 AN3 AN2 AN1 AN0 VDD VDDP VSS AD0EMUX2/P1.14 AD0EMUX1/P1.13 AD0EMUX0/P1.12 TCLK0/OUT32/IN32/P2.0 SLSO13/SLSO03/OUT33/TREADY0A/IN33/P2.1 TVALID0A/OUT34/IN34/P2.2 TDATA0/OUT35/IN35/P2.3 OUT36/RCLK0A/IN36/P2.4 RREADY0A/OUT37/IN37/P2.5 OUT38/RVALID0A/IN38/P2.6 OUT39/RDATA0A/IN39/P2.7 VSS VDDP VDD VSS OUT52/OUT28/HWCFG0/IN52/IN28/P4.0 OUT53/OUT29/HWCFG1/IN53/IN29/P4.1 OUT54/OUT30/HWCFG2/IN54/IN30/P4.2 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 TC1165/TC1166 Pinning Figure 2-3 TC1165/TC1166 Pinning for PG-LQFP-176-2 Package Data Sheet 8 V1.0, 2008-04 TC1165/TC1166 Preliminary General Device Information 2.4 Pad Driver and Input Classes Overview The TC1165/TC1166 provides different types and classes of input and output lines. For understanding of the abbreviations in Table 2-1 starting at the next page, Table 4-1 gives an overview on the pad type and class types. Data Sheet 9 V1.0, 2008-04 TC1165/TC1166 Preliminary General Device Information 2.5 Pin Definitions and Functions Table 2-1 shows the TC1165/TC1166 pin definitions and functions. Table 2-1 Symbol Pin Definitions and Functions Pins I/O Pad Driver Class I/O A1 Power Functions Supply Parallel Ports P0 VDDP Port 0 Port 0 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively used for GPTA I/O lines or external trigger inputs. IN0 / OUT0 / IN1 / OUT1 / IN2 / OUT2 / IN3 / OUT3 / IN4 / OUT4 / IN5 / OUT5 / IN6 / OUT6 / REQ2 IN7 / OUT7 / REQ3 IN8 / OUT8 / IN9 / OUT9 / IN10 / OUT10 / IN11 / OUT11 / IN12 / OUT12 / IN13 / OUT13 / IN14 / OUT14 / REQ4 IN15 / OUT15 / REQ5 OUT56 line of GPTA OUT57 line of GPTA OUT58 line of GPTA OUT59 line of GPTA OUT60 line of GPTA OUT61 line of GPTA OUT62 line of GPTA External trigger input 2 OUT63 line of GPTA External trigger input 3 OUT64 line of GPTA OUT65 line of GPTA OUT66 line of GPTA OUT67 line of GPTA OUT68 line of GPTA OUT69 line of GPTA OUT70 line of GPTA External trigger input 4 OUT71 line of GPTA External trigger input 5 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P0.8 P0.9 P0.10 P0.11 P0.12 P0.13 P0.14 P0.15 145 146 147 148 166 167 173 174 149 150 151 152 168 169 175 176 In addition, the state of the port pins are latched into the software configuration input register SCU_SCLIR at the rising edge of HDRST. Therefore, Port 0 pins can be used for operating mode selections by software. Data Sheet 10 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class I/O Power Functions Supply General Device Information P1 VDDP Port 1 Port 1 is a 15-bit bi-directional general purpose I/O port which can be alternatively used for GPTA I/O lines, SSC1 and ADC0 interface. IN16 / OUT16 / IN17 / OUT17 / IN18 / OUT18 / IN19 / OUT19 / IN20 / OUT20 / IN21 / OUT21 / IN22 / OUT22 / IN23 / OUT23 / IN24 / OUT24 / MTSR1B OUT72 line of GPTA OUT73 line of GPTA OUT74 line of GPTA OUT75 line of GPTA OUT76 line of GPTA OUT77 line of GPTA OUT78 line of GPTA OUT79 line of GPTA IN48 / OUT48 line of GPTA SSC1 master transmit output / slave rec. input B IN25 / OUT25 / IN49 / OUT49 line of GPTA MRST1B SSC1 master receive input / slave transmit output B IN26 / OUT26 / IN50 / OUT50 line of GPTA SLSO17 SSC1 slave select output 7 IN27 / OUT27 / IN51 / OUT51 line of GPTA SCLK1B SSC1 clock input / output B AD0EMUX0 ADC0 external multiplexer control output 0 AD0EMUX1 ADC0 external multiplexer control output 1 AD0EMUX2 ADC0 external multiplexer control output 2 In addition, P1.4 also serves as emergency shut-off input for certain I/O lines (e.g. GPTA related outputs). P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P1.8 91 92 93 98 107 108 109 110 94 A1 A1 A1 A1 A1 A1 A1 A1 A2 P1.9 95 A2 P1.10 P1.11 P1.12 P1.13 P1.14 96 97 73 72 71 A2 A2 A1 A1 A1 Data Sheet 11 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class I/O Power Functions Supply General Device Information P2 VDDP Port 2 Port 2 is a 14-bit bi-directional generalpurpose I/O port which can be alternatively used for GPTA I/O, and interface for MLI0, MSC0 or SSC0/1. TCLK0 IN32 / OUT32 TREADY0A IN33 / OUT33 SLSO03 SLSO13 TVALID0A IN34 / OUT34 TDATA0 IN35 / OUT35 RCLK0A IN36 / OUT36 RREADY0A IN37 / OUT37 RVALID0A IN38 / OUT38 RDATA0A IN39 / OUT39 MLI0 transmit channel clock output A line of GPTA MLI0 transmit channel ready input A line of GPTA SSC0 slave select output 3 SSC1 slave select output 3 MLI0 transmit channel valid output A line of GPTA MLI0 transmit channel data output A line of GPTA MLI0 receive channel clock input A line of GPTA MLI0 receive channel ready output A line of GPTA MLI0 receive channel valid input A line of GPTA MLI0 receive channel data input A line of GPTA P2.0 74 A2 P2.1 75 A2 P2.2 76 A2 P2.3 77 A2 P2.4 78 A1 P2.5 79 A2 P2.6 80 A1 P2.7 81 A1 Data Sheet 12 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class 164 A2 Power Functions Supply SLSO04 SLSO14 EN00 SLSO05 SLSO15 EN01 MRST1A SCLK1A FCLP0B MTSR1A SOP0B SLSI1 SDI0 SSC0 Slave Select output 4 SSC1 Slave Select output 4 MSC0 enable output 0 SSC0 Slave Select output 5 SSC1 Slave Select output 5 MSC0 enable output 1 SSC1 master receive input / slave transmit output A SSC1 clock input/output A MSC0 clock output B SSC1 master transmit out / slave receive input A MSC0 serial data output B SSC1 slave select input MSC0 serial data input General Device Information P2.8 P2.9 160 A2 P2.10 P2.11 P2.12 161 162 163 A2 A2 A2 P2.13 165 A1 Data Sheet 13 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class I/O Power Functions Supply General Device Information P3 VDDP Port 3 Port 3 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively used for ASC0/1, SSC0/1 and CAN lines. RXD0A TXD0A ASC0 receiver inp./outp. A ASC0 transmitter output A P3.0 P3.1 136 135 A2 A2 This pin is sampled at the rising edge of PORST. If this pin and the BYPASS input pin are both active, then oscillator bypass mode is entered. P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 129 130 132 126 127 131 A2 A2 A2 A2 A2 A2 SCLK0 MRST0 MTSR0 SLSO00 SLSO10 SLSO01 SLSO11 SLSI0 SLSO02 SLSO12 SLSO06 TXD1A RXD1A REQ0 REQ1 RXDCAN01) RXD0B TXDCAN01) TXD0B RXDCAN11) RXD1B TXDCAN11) TXD1B SSC0 clock input/output SSC0 master receive input/ slave transmit output SSC0 master transmit output/slave receive input SSC0 slave select output 0 SSC1 slave select output 0 2) SSC0 slave select output 1 SSC1 slave select output 12) SSC0 slave select input SSC0 slave select output 2 SSC1 slave select output 2 SSC0 slave select output 6 ASC1 transmitter output A ASC1 receiver inp./outp. A External trigger input 0 External trigger input 1 CAN node 0 receiver input ASC0 receiver inp./outp. B CAN node 0 transm. output ASC0 transmitter output B CAN node 1 receiver input ASC1 receiver inp./outp. B CAN node 1 transm. output ASC1 transmitter output B P3.8 P3.9 P3.10 P3.11 P3.12 P3.13 P3.14 P3.15 128 138 137 144 143 142 134 133 A2 A2 A1 A1 A2 A2 A2 A2 Data Sheet 14 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class I/O Power Functions Supply General Device Information P4 P4.[3:0] VDDP Port 4 / Hardware Configuration Inputs HWCFG[3:0] Boot mode and boot location inputs; inputs are latched with the rising edge of HDRST. During normal operation, Port 4 pins may be used as alternate functions for GPTA or system clock output. P4.0 P4.1 P4.2 P4.3 86 87 88 90 A1 A1 A2 A2 IN28 / OUT28 / IN29 / OUT29 / IN30 / OUT30 / IN31 / OUT31 / SYSCLK IN52 / OUT52 line of GPTA IN53 / OUT53 line of GPTA IN54 / OUT54 line of GPTA IN55 / OUT55 line of GPTA System Clock Output Data Sheet 15 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class I/O A2 Power Functions Supply General Device Information P5 VDDP Port 5 Port 5 is a 16-bit bi-directional generalpurpose I/O port. In emulation, it is used as a trace port for OCDS Level 2 debug lines. In normal operation, it is used for GPTA I/O or the MLI0/1 interface. OCDSDBG0 IN40 / OUT40 OCDSDBG1 IN41 / OUT41 OCDSDBG2 IN42 / OUT42 OCDSDBG3 IN43 / OUT43 OCDSDBG4 IN44 / OUT44 OCDSDBG5 OCDS L2 Debug Line 0 (Pipeline Status Sig. PS0) line of GPTA OCDS L2 Debug Line 1 (Pipeline Status Sig. PS1) line of GPTA OCDS L2 Debug Line 2 (Pipeline Status Sig. PS2) line of GPTA OCDS L2 Debug Line 3 (Pipeline Status Sig. PS3) line of GPTA OCDS L2 Debug Line 4 (Pipeline Status Sig. PS4) line of GPTA OCDS L2 Debug Line 5 (Break Qualification Line BRK0) line of GPTA OCDS L2 Debug Line 6 (Break Qualification Line BRK1) line of GPTA OCDS L2 Debug Line 7 (Break Qualification Line BRK2) line of GPTA P5.0 1 P5.1 2 P5.2 3 P5.3 4 P5.4 5 P5.5 6 P5.6 7 IN45 / OUT45 OCDSDBG6 P5.7 8 IN46 / OUT46 OCDSDBG7 IN47 / OUT47 Data Sheet 16 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class 13 Power Functions Supply OCDSDBG8 TDATA1 RDATA0B P5.9 14 OCDSDBG9 TVALID1 RVALID0B P5.10 15 OCDSDBG10 TREADY1 RREADY0B P5.11 16 OCDSDBG11 TCLK1 RCLK0B P5.12 17 OCDSDBG12 RDATA1 TDATA0 P5.13 18 OCDSDBG13 RVALID1 TVALID0B OCDS L2 Debug Line 8 (Indirect PC Addr. PC0) MLI1 transmit channel data output MLI0 receive channel data input B OCDS L2 Debug Line 9 (Indirect PC Addr. PC1) MLI1 transmit channel valid output MLI0 receive channel valid input B OCDS L2 Debug Line 10 (Indirect PC Addr. PC2) MLI1 transmit channel ready input MLI0 receive channel ready output B OCDS L2 Debug Line 11 (Indirect PC Addr. PC3) MLI1 transmit channel clock output MLI0 receive channel clock input B OCDS L2 Debug Line 12 (Indirect PC Addr. PC04) MLI1 receive channel data input MLI0 transmit channel data output B OCDS L2 Debug Line 13 (Indirect PC Addr. PC05) MLI1 receive channel valid input MLI0 transmit channel valid output B General Device Information P5.8 Data Sheet 17 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class 19 Power Functions Supply OCDSDBG14 RREADY1 TREADY0B P5.15 20 OCDSDBG15 RCLK1 TCLK0 MSC0 Outputs C FCLP0A 157 FCLN0 SOP0A SON0 156 159 158 O O O O OCDS L2 Debug Line 14 (Indirect PC Address PC6) MLI1 receive channel ready output MLI0 transmit channel ready input B OCDS L2 Debug Line 15 (Indirect PC Address PC7) MLI1 receive channel clock input MLI0 transmit channel clock output B General Device Information P5.14 VDDP LVDS MSC Clock and Data Outputs4) MSC0 Differential Driver Clock Output Positive A MSC0 Differential Driver Clock Output Negative MSC0 Differential Driver Serial Data Output Positive A MSC0 Differential Driver Serial Data Output Negative Data Sheet 18 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class I D Power Functions Supply General Device Information Analog Inputs AN[35:0] – Analog Input Port The Analog Input Port provides altogether 36 analog input lines to ADC0 and FADC. AN[31:0]: ADC0 analog inputs [31:0] AN[35:32]: FADC analog differential inputs Analog input 0 Analog input 1 Analog input 2 Analog input 3 Analog input 4 Analog input 5 Analog input 6 Analog input 7 Analog input 8 Analog input 9 Analog input 10 Analog input 11 Analog input 12 Analog input 13 Analog input 14 Analog input 15 Analog input 16 Analog input 17 Analog input 18 Analog input 19 Analog input 20 Analog input 21 Analog input 22 Analog input 23 Analog input 24 Analog input 25 Analog input 26 Analog input 27 Analog input 28 Analog input 29 Analog input 30 AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 AN16 AN17 AN18 AN19 AN20 AN21 AN22 AN23 AN24 AN25 AN26 AN27 AN28 AN29 AN30 67 66 65 64 63 62 61 36 60 59 58 57 56 55 50 49 48 47 46 45 44 43 42 41 40 39 38 37 35 34 33 Data Sheet 19 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class 32 31 30 29 28 114 115 111 113 112 117 116 9 120 122 121 I D Power Functions Supply – Analog input 31 Analog input 32 Analog input 33 Analog input 34 Analog input 35 JTAG Module Reset/Enable Input JTAG Module Clock Input JTAG Module Serial Data Input JTAG Module Serial Data Output JTAG Module State Machine Control Input OCDS Break Input (Alternate Output)4)5) OCDS Break Output (Alternate Input)4)5) Trace Clock for OCDS_L2 Lines4) Non-Maskable Interrupt Input Hardware Reset Input / Reset Indication Output Power-on Reset Input PLL Clock Bypass Select Input This input has to be held stable during poweron resets. With BYPASS = 1, the spike filters in the HDRST, PORST and NMI inputs are switched off. Test Mode Select Input For normal operation of the TC1165/TC1166, this pin should be connected to high level. Input/Output Pins General Device Information AN31 AN32 AN33 AN34 AN35 TRST TCK TDI TDO TMS BRKIN BRK OUT TRCLK NMI HDRST PORST 9) System I/O I I I O I A23) A23) A13) A2 A2 3) I/O A3 I/O A3 O I A4 A26)7) VDDP VDDP VDDP VDDP VDDP VDDP VDDP VDDP VDDP VDDP VDDP VDDP I/O A28) I I A26)7) A13) BYPASS 119 TEST MODE XTAL1 XTAL2 118 I A26)10) VDDP 102 103 I O n.a. VDDOSC Oscillator/PLL/Clock Generator Data Sheet 20 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class 21, 89 – – Power Functions Supply – Not Connected These pins are reserved for future extension and must not be connected externally. General Device Information N.C. Power Supplies VDDM VSSM VDDMF VSSMF VDDAF VSSAF VAREF0 VAGND0 VFAREF VFAGND VDDOSC VDDOSC3 VSSOSC VDDFL3 VDD 54 53 24 25 23 22 52 51 26 27 105 106 104 141 – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – ADC Analog Part Power Supply (3.3 V) ADC Analog Part Ground for VDDM FADC Analog Part Power Supply (3.3 V) FADC Analog Part Ground for VDDMF FADC Analog Part Logic Power Supply (1.5 V) FADC Analog Part Logic Ground for VDDAF ADC Reference Voltage ADC Reference Ground FADC Reference Voltage FADC Reference Ground Main Oscillator and PLL Power Supply (1.5 V) Main Oscillator Power Supply (3.3 V) Main Oscillator and PLL Ground Power Supply for Flash (3.3 V) Core Power Supply (1.5 V) 10, – 68, 84, 99, 123, 153, 170 Data Sheet 21 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Driver Class 11, – 69, 83, 100, 124, 154, 171, 139 12, – 70, 85, 101, 125, 155, 172, 140, 82 – Power Functions Supply – Port Power Supply (3.3 V) General Device Information VDDP VSS – – Ground 1) Not applicable to TC1165 2) The logical AND function of the two slave select outputs is available as a third alternate output function. 3) These pads are I/O pads with input only function. Its input characteristics are identical with the input characteristics as defined for class A pads. 4) In case of a power-fail condition (one or more power supply voltages drop below the specified voltage range), an undefined output driving level may occur at these pins. 5) Programmed by software as either break input or break output. 6) These pads are input only pads with input characteristics. 7) Input only pads with input spike filter. 8) Open drain pad with input spike filter. 9) The dual input reset system of TC1165/TC1166 assumes that the PORST reset pin is used for power on reset only. 10) Input only pads without input spike filter. Data Sheet 22 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 2-2 Pins All GPIOs, TDI, TMS, TDO HDRST BYPASS TRST, TCK TRCLK NMI, PORST General Device Information List of Pull-up/Pull-down Reset Behavior of the Pins PORST = 0 Pull-up Drive-low Pull-up High-impedance High-impedance Pull-down Pull-up High-impedance Pull-down PORST = 1 BRKIN, BRKOUT, TESTMODE Pull-up Data Sheet 23 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3 Functional Description Chapter 3 provides an overview of the TC1165/TC1166 functional description. 3.1 System Architecture and On-Chip Bus Systems The TC1165/TC1166 has two independent on-chip buses (see also TC1165/TC1166 block diagram on Page 2-6): • • Local Memory Bus (LMB) System Peripheral Bus (SPB) The LMB Bus connects the CPU local resources for data and instruction fetch. The Local Memory Bus interconnects the memory units and functional units, such as CPU and PMU. The main target of the LMB bus is to support devices with fast response times, optimized for speed. This allows the DMI and PMI fast access to local memory and reduces load on the FPI bus. The Tricore system itself is located on LMB bus. The Local Memory Bus is a synchronous, pipelined, split bus with variable block size transfer support. It supports 8-, 16-, 32- and 64-bit single transactions and variable length 64-bit block transfers. The SPB Bus is mainly governed by the PCP and is accessible to the CPU via the LMB Bus bridge. The System Peripheral Bus (SPB Bus) in TC1165/TC1166 is an on-chip FPI Bus. The FPI Bus interconnects the functional units of the TC1165/TC1166, such as the DMA and on-chip peripheral components. The FPI Bus is designed to be quick to be acquired by on-chip functional units, and quick to transfer data. The low setup overhead of the FPI Bus access protocol guarantees fast FPI Bus acquisition, which is required for time-critical applications.The FPI Bus is designed to sustain high transfer rates. For example, a peak transfer rate of up to 320 Mbyte/s can be achieved with a 80 MHz bus clock and 32-bit data bus. Multiple data transfers per bus arbitration cycle allow the FPI Bus to operate at close to its peak bandwidth. Both the LMB Bus and the SPB Bus runs at full CPU speed. The maximum CPU speed is 80 MHz. Additionally, two simplified bus interfaces are connected to and controlled by the DMA Controller: • • DMA Bus SMIF Interface Data Sheet 24 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.2 On-Chip Memories As shown in the TC1165/TC1166 block diagram on Page 2-6, some of the TC1165/TC1166 units provide on-chip memories that are used as program or data memory. • Program memory in PMU – 16 Kbyte Boot ROM (BROM) – 1504 Kbyte Program Flash (PFlash) Program memory in PMI – 16 Kbyte Scratch-Pad RAM (SPRAM) – 8 Kbyte Instruction Cache (ICACHE) Data memory in PMU – 32 Kbyte Data Flash (DFlash) – 8 Kbyte Overlay RAM (OVRAM) Data memory in DMI – 56 Kbyte Local Data RAM (LDRAM) Memory of PCP2 – 12 Kbyte Code Memory (CMEM) with parity error protection – 8 Kbyte Parameter RAM (PRAM) with parity error protection On-chip SRAM with parity error protection • • • • • Features of Program Flash • • • • • • • 1504 Kbyte on-chip program Flash memory Usable for instruction code or constant data storage 256-byte program interface – 256 bytes are programmed into PFLASH page in one step/command 256-bit read interface – Transfer from PFLASH to CPU/PMI by four 64-bit single cycle burst transfers Dynamic correction of single-bit errors during read access Detection of double-bit errors Fixed sector architecture – Eight 16 Kbyte, one 128 Kbyte, one 256 Kbyte, one 512 Kbyte and one 480 Kbyte sectors – Each sector separately erasable – Each sector separately write-protectable Configurable read protection for complete PFLASH with sophisticated read access supervision, combined with write protection for complete PFLASH (protection against “Trojan horse” software) Configurable write protection for each sector – Each sector separately write-protectable – With capability to be re-programmed – With capability to be locked forever (OTP) Password mechanism for temporary disabling of write and read protection 25 V1.0, 2008-04 • • • Data Sheet TC1165/TC1166 Preliminary • • Functional Description • On-chip generation of programming voltage JEDEC-standard based command sequences for PFLASH control – Write state machine controls programming and erase operations – Status and error reporting by status flags and interrupt Margin check for detection of problematic PFLASH bits Features of Data Flash • • • • • • • 32 Kbyte on-chip data Flash memory, organized in two 16 Kbyte banks Usable for data storage with EEPROM functionality 128 Byte of program interface – 128 bytes are programmed into one DFLASH page by one step/command 64-bit read interface (no burst transfers) Dynamic correction of single-bit errors during read access Detection of double-bit errors Fixed sector architecture – Two 16 Kbyte banks/sectors – Each sector separately erasable Configurable read protection (combined with write protection) for complete DFLASH together with PFLASH read protection Password mechanism for temporary disabling of write and read protection Erasing/programming of one bank possible while reading data from the other bank Programming of one bank while erasing the other bank possible On-chip generation of programming voltage JEDEC-standard based command sequences for DFLASH control – Write state machine controls programming and erase operations – Status and error reporting by status flags and interrupt Margin check for detection of problematic DFLASH bits • • • • • • • Data Sheet 26 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.3 Memory Maps This chapter gives an overview of the TC1165/TC1166 memory map and describes the address locations and access possibilities for the units, memories, and reserved areas as “seen” from different on-chip buses’ (SPB and LMB) point of view. 3.3.1 Architectural Address Map Table 3-1 shows the overall architectural address map as defined for the TriCore and as implemented in TC1165/TC1166. Table 3-1 Segment 0-7 8 9 10 11 12 13 TC1165/TC1166 Architectural Address Map Size 8 x 256 Mbyte 256 Mbyte 256 Mbyte 256 Mbyte 256 Mbyte 256 Mbyte 64 Mbyte 64 Mbyte 96 Mbyte 16 Mbyte 16 Mbyte Description Reserved (MMU space); cached Reserved (246 Mbyte); PMU, Boot ROM; cached FPI space; cached Reserved (246 Mbyte), PMU, Boot ROM; noncached FPI space; non-cached Reserved; bottom 4 Mbyte visible from FPI bus in segment 14; cached Local Data Memory RAM; non-cached Local Code Memory RAM; non-cached Reserved; non-cached Reserved; non-cached Boot ROM space, Boot ROM mirror; non-cached Contents Global Global Memory Global Memory Global Memory Global Memory Local LMB Memory DMI PMI EXT_PER EXT_EMU BOOTROM Data Sheet 27 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-1 Segment 14 Functional Description TC1165/TC1166 Architectural Address Map (cont’d) Size 128 Mbyte 16 x 8 Mbyte 256 Mbyte Description Reserved; non-speculative; non-cached; no execution Non-speculative; non-cached; no execution CSFRs of CPUs[0 ..15]; LMB & FPI Peripheral Space; non-speculative; non-cached; no execution Contents EXTPER CPU[0 ..15] image region 15 LMB_PER CSFRs INT_PER Data Sheet 28 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.3.2 How to Read the Address Maps The bus-specific address maps describe how the different bus master devices react on accesses to on-chip memories and modules, and which address ranges are valid or invalid for the corresponding buses. The FPI Bus address map shows the system addresses from the point of view of the SPB master agents. SPB master agents are PCP2 and OCDS, and DMA. The LMB address map shows the system addresses from the point of view of the LMB master agents. LMB master agents are PMI and DMI. Table 3-2 defines the acronyms and other terms that are used in the address maps (Table 3-3 to Table 3-5). Table 3-2 Term …BE …BET SPBBE SPBBET LMBBE LMBBET access ignore trap 32 nE Definition of Acronyms and Terms Description Means “Bus error” generation. Means “Bus error & trap” generation. A bus access is terminated with a bus error on the SPB. A bus access is terminated with a bus error on the SPB and a DSE trap (read access) or DAE trap (write access). A bus access is terminated with a bus error on the LMB. A bus access is terminated with a bus error on the LMB and a DSE trap (read access) or DAE trap (write access). A bus access is allowed and is executed. A bus access is ignored and is not executed. No bus error is generated. A DSE trap (read access) or DAE trap (write access) is generated. Only 32-bit word bus accesses are permitted to that register/address range. A bus access generates no bus error, although the bus access points to an undefined address or address range. This is valid e.g. for CPU accesses (MTCR/MFCR) to undefined addresses in the CSFR range. Data Sheet 29 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.3.3 Contents of the Segments This section summarizes the contents of the segments. Segments 0-7 These segments are reserved segments in the TC1165/TC1166. Segment 8 From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM). From the CPU point of view (PMI and DMI), this memory segment allows cached accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM). Segment 9 This memory segment is reserved in the TC1165/TC1166. Segment 10 From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM). From the CPU point of view (PMI and DMI), this memory segment allows non-cached accesses to all PMU memories (PFLASH, DFLASH, BROM, and TROM). Segment 11 This memory segment is reserved in the TC1165/TC1166. Segment 12 From the SPB point of view (PCP, DMA, and Cerberus), this memory segment is reserved in the TC1165/TC1166. From the CPU point of view (PMI and DMI), this memory segment allows cached accesses to the PMU memory, OVRAM. Segment 13 From the SPB point of view (PCP, DMA and Cerberus), this memory segment is reserved in the TC1165/TC1166. From the CPU point of view (PMI and DMI), this memory segment allows non-cached accesses to the PMI scratch-pad RAM, read access to the boot ROM and test ROM (BROM and TROM) and the DMI memories (LDRAM). Data Sheet 30 V1.0, 2008-04 TC1165/TC1166 Preliminary Segment 14 From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows accesses to the PMU Overlay memory (OVRAM), the DMI Local Data RAM (LDRAM), and the PMI scratch-pad RAM (SPRAM). From the CPU point of view (PMI and DMI), this memory segment is reserved in the TC1165/TC1166. Segment 15 From the SPB point of view (PCP, DMA and Cerberus), this memory segment allows accesses to all SFRs and CSFRs, the PCP memories, and the MLI transfer windows. From the CPU point of view (PMI and DMI), this memory segment allows accesses to all SFRs and CSFRs, the PCP memories, and the MLI transfer windows. Functional Description Data Sheet 31 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.3.4 Address Map of the FPI Bus System Table 3-3 and Table 3-4 shows the address maps of the FPI Bus System. 3.3.4.1 Segments 0 to 14 Table 3-3 shows the address maps of segments 0 to 14 as it is seen from the SPB bus masters PCP, DMA and OCDS. Table 3-3 SPB Address Map of Segment 0 to 14 Size 8 byte 8 × 256 Mbyte 1.5 Mbyte Program Flash (PFLASH) 6.5 Mbyte Reserved 246 Mbyte 16 Kbyte 48 Kbyte 16 Kbyte 1 Mbyte 256 Kbyte 624 Kbyte Reserved Data Flash (DFLASH) Bank 0 Reserved Data Flash (DFLASH) Bank 1 Reserved Reserved Reserved Boot ROM (BROM) Reserved access SPBBE SPBBE Description Reserved (virtual address space) Access Type Read MPN trap SPBBE access LMBBE & SPBBE LMBBE & SPBBE access LMBBE & SPBBE access LMBBE & SPBBE Write MPN trap SPBBE access1) LMBBE LMBBE access1) LMBBE access1) LMBBE Seg- Address ment Range 0-7 0000 0000H 0000 0007H 0000 0008H 7FFF FFFFH 8 8000 0000H 8017 7FFFH 8017 8000H 807F FFFFH 8080 0000H 8FDF FFFFH 8FE0 0000H 8FE0 3FFFH 8FE0 4000H 8FE0 FFFFH 8FE1 0000H 8FE1 3FFFH 8FE1 4000H 8FF1 FFFFH 8FF2 0000H 8FF5 FFFFH 8FF6 0000H 8FFF BFFFH 8FFF C000H - 16 Kbyte 8FFF FFFFH 9 9000 0000H 9FFF FFFFH 256 Mbyte Data Sheet 32 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-3 Functional Description SPB Address Map of Segment 0 to 14 (cont’d) Size Description Access Type Read 1.5 Mbyte Program Flash (PFLASH) 6.5 Mbyte Reserved 246 Mbyte 16 Kbyte 48 Kbyte 16 Kbyte 1 Mbyte 256 Kbyte 624 Kbyte Reserved Data Flash (DFLASH) Bank 0 Reserved Data Flash (DFLASH) Bank 1 Reserved Reserved Reserved Boot ROM (BROM) Reserved Overlay memory (OVRAM) Reserved access SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE access LMBBE & SPBBE LMBBE & SPBBE access LMBBE & SPBBE access LMBBE & SPBBE Write access1) LMBBE LMBBE access1) LMBBE access1) ignore Seg- Address ment Range 10 A000 0000H A017 FFFFH A017 8000H A07F FFFFH A080 0000H AFDF FFFFH AFE0 0000H AFE0 3FFFH AFE0 4000H AFE0 FFFFH AFE1 0000H AFE1 3FFFH AFE1 4000H AFF1 FFFFH AFF2 0000H AFF5 FFFFH AFF6 0000H AFFF BFFFH AFFF C000H - 16 Kbyte AFFF FFFFH 11 12 B000 0000H BFFF FFFFH C000 0000H C000 1FFFH C000 2000H CFFF FFFFH 256 Mbyte 8 Kbyte ≈ 256 Mbyte Data Sheet 33 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-3 Functional Description SPB Address Map of Segment 0 to 14 (cont’d) Size 56 Kbyte Description DMI Local Data RAM (LDRAM) Access Type Read SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE LMBBE access LMBBE access LMBBE access LMBBE LMBBE Write SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE LMBBE access LMBBE access LMBBE access LMBBE LMBBE Seg- Address ment Range 13 D000 0000H D000 DFFFH D000 E000H D3FF FFFFH D400 0000H D400 3FFFH D400 4000H D7FF FFFFH D800 0000H DEFF FFFFH DF00 0000H DFFF FFEFH 64 Mbyte Reserved 16 Kbyte PMI Scratch-Pad RAM (SPRAM) 64 Mbyte Reserved 112 Mbyte ≈ 16 Mbyte Reserved Reserved (for Boot Rom) microROM Reserved Overlay memory (OVRAM) Reserved DMI Local Data RAM (LDRAM) DFFF FFF0H - 16 byte DFFF FFFFH 14 E000 0000H E7FF FFFFH E800 0000H E800 1FFFH E800 2000H E83F FFFFH E840 0000H E840 DFFFH E840 E000H E84F FFFFH E850 0000H E850 3FFFH E850 4000H E85F FFFFH E860 C000H EFFF FFFFH 15 F000 0000H FFFF FFFFH 128 MB 8 Kbyte ≈4 Mbyte 56 Kbyte ≈ 1 Mbyte Reserved 16 Kbyte PMI Scratch-Pad RAM (SPRAM) ≈ 1 Mbyte Reserved ≈ 122 Mbyte 256 Mbyte Reserved see Table 3-4 1) Only applicable when writing Flash command sequences. Data Sheet 34 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.3.4.2 Segment 15 Table 3-4 shows the address map of segment 15 as seen from the SPB bus masters PCP, DMA and OCDS. Please note that access in Table 3-4 means only that an access to an address within the defined address range is not automatically incorrect or ignored. If an access is really addressing a correct address, it can be found in the detailed tables in the TC116x User’s Manual, Register Overview’s chapter. Table 3-4 Unit System Control Unit (SCU) and Watchdog Timer (WDT) SPB Address Map of Segment 15 Address Range F000 0000H F000 00FFH Size 256 byte 256 byte 256 byte – 256 byte – 256 byte – 256 byte 256 byte 256 byte 256 byte 256 byte Access Type Read access access access SPBBE access SPBBE access SPBBE access access access access access Write access access access SPBBE access SPBBE access SPBBE access access access access access System Peripheral Bus Control Unit F000 0100H (SBCU) F000 01FFH System Timer (STM) Reserved F000 0200H F000 02FFH F000 0300H F000 03FFH On-Chip Debug Support (Cerberus) F000 0400H F000 04FFH Reserved MicroSecond Bus Controller 0 (MSC0) Reserved Async./Sync. Serial Interface 0 (ASC0) Async./Sync. Serial Interface 1 (ASC1) Port 0 Port 1 Port 2 F000 0500H F000 07FFH F000 0800H F000 08FFH F000 0900H F000 09FFH F000 0A00H F000 0AFFH F000 0B00H F000 0BFFH F000 0C00H F000 0CFFH F000 0D00H F000 0DFFH F000 0E00H F000 0EFFH Data Sheet 35 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-4 Unit Port 3 Port 4 Port 5 Reserved Reserved Reserved Reserved Reserved Reserved General Purpose Timer Array 0 (GPTA0) Reserved Reserved Reserved Direct Memory Access Controller (DMA) Reserved MultiCAN Controller (CAN) SPB Address Map of Segment 15 (cont’d) Address Range F000 0F00H F000 0FFFH F000 1000H F000 10FFH F000 1100H F000 11FFH F000 1200H F000 12FFH F000 1300H F000 13FFH F000 1400H F000 14FFH F000 1500H F000 15FFH F000 1600H F000 16FFH F000 1700H F000 17FFH F000 1800H F000 1FFFH F000 2000H F000 27FFH F000 2800H F000 2FFFH F000 3000H F000 3BFFH F000 3C00H F000 3EFFH F000 3F00H F000 3FFFH F000 4000H F000 5FFFH Size 256 byte 256 byte 256 byte – – – – – – 8 × 256 byte – – – 3 × 256 byte – Access Type Read access access access SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE access SPBBE SPBBE SPBBE access SPBBE Write access access access SPBBE SPBBE SPBBE SPBBE SPBBE SPBBE access SPBBE SPBBE SPBBE access SPBBE access1) Functional Description 8 Kbyte access1) Data Sheet 36 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-4 Unit Reserved Reserved PCP Registers Reserved PCP Data Memory (PRAM) Reserved PCP Code Memory (PCODE) Reserved Reserved Reserved Synchronous Serial Interface 0 (SSC0) Synchronous Serial Interface 1 (SSC1) Fast Analog-to-Digital Converter (FADC) Analog-to-Digital Converter 0 (ADC0) Reserved Reserved SPB Address Map of Segment 15 (cont’d) Address Range F000 6000H F003 FFFFH F004 0000H F004 3EFFH F004 3F00H F004 3FFFH F004 4000H F004 FFFFH F005 0000H F005 1FFFH F005 2000H F005 FFFFH F006 0000H F006 2FFFH F006 3000H F007 FFFFH F008 0000H F00F FFFFH F010 0000H F010 00FFH F010 0100H F010 01FFH F010 0200H F010 02FFH F010 0300H F010 03FFH F010 0400H F010 05FFH F010 0600H F010 07FFH F010 0800H F010 9FFFH Size – – 256 byte – Access Type Read SPBBE SPBBE access SPBBE Write SPBBE SPBBE access SPBBE nE, 32 SPBBE nE, 32 SPBBE SPBBE SPBBE access access access access SPBBE SPBBE Functional Description 8 Kbyte nE, 32 – 12 Kbyte – – – 256 byte 256 byte 256 byte 2 × 256 byte – – SPBBE nE, 32 SPBBE SPBBE SPBBE access access access access SPBBE SPBBE Data Sheet 37 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-4 Unit Reserved Micro Link Interface 0 (MLI0) Micro Link Interface 1(MLI1) Memory Checker (MCHK) Reserved MLI0 Small Transfer Windows MLI1 Small Transfer Windows Reserved MLI0 Large Transfer Windows MLI1 Large Transfer Windows Reserved CPU CPU Slave Interface Registers (CPS) CPU Core SFRs & GPRs Reserved Reserved Reserved SPB Address Map of Segment 15 (cont’d) Address Range F010 A000H F010 BFFFH F010 C000H F010 C0FFH F010 C100H F010 C1FFH F010 C200H F010 C2FFH F010 C300H F01D FFFFH F01E 0000H F01E 7FFFH F01E 8000H F01E FFFFH F01F 0000H F01F FFFFH F020 0000H F023FFFFH F024 0000H F027 FFFFH F028 0000H F7E0 FEFFH F7E0 FF00H F7E0 FFFFH F7E1 0000H F7E1 FFFFH F7E2 0000H F7FF FFFFH F800 0000H F800 03FFH F800 0400H F800 04FFH Size – 256 byte 256 byte 256 byte – 4×8 Kbyte 4×8 Kbyte – 4 × 64 Kbyte 4 × 64 Kbyte – 256 byte 64 Kbyte – – – Access Type Read SPBBE access access access SPBBE access access SPBBE access access SPBBE access access SPBBE SPBBE LMBBE & SPBBE Write SPBBE access access access SPBBE access access SPBBE access access SPBBE access access SPBBE SPBBE LMBBE Functional Description Data Sheet 38 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-4 Unit Program Memory Unit (PMU) Reserved Flash Register Reserved Reserved Reserved Reserved Reserved CPU DMI Registers PMI Registers Local Memory Bus Control Unit (LBCU) LFI Bridge Reserved SPB Address Map of Segment 15 (cont’d) Address Range F800 0500H F800 05FFH F800 0600H F800 0FFFH F800 1000H F800 23FFH F800 2400H F801 00FFH F801 0100H F801 01FFH F801 0200H F87F F9FFH F87F FA00H F87F FAFFH F87F FB00H F87F FBFFH Size 256 byte – Access Type Read access LMBBE & SPBBE Write access LMBBE access LMBBE LMBBE LMBBE LMBBE LMBBE access access access access LMBBE Functional Description 5 Kbyte access – – – – – LMBBE & SPBBE LMBBE & SPBBE LMBBE & SPBBE LMBBE & SPBBE LMBBE & SPBBE access access access access LMBBE & SPBBE F87F FC00H - 256 F87F FCFFH byte F87F FD00H - 256 F87F FDFFH byte F87F FE00H F87F FEFFH F87F FF00H F87F FFFFH F880 0000H FFFF FFFFH 256 byte 256 byte – 1) For TC1165, read and write accesses to this address range will not generate any traps. Data Sheet 39 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.3.5 Address Map of the Local Memory Bus (LMB) Table 3-5 shows the address map as seen from the LMB bus masters (PMI and DMI). Table 3-5 LMB Address Map Size 8 byte 8 × 256 Mbyte Description Read Reserved (virtual address MPN trap space) SPBBET Action Write MPN trap SPBBE access2) LMBBET LMBBET access2) LMBBET access2) LMBBET Seg- Address ment Range 0-71) 0000 0000H 0000 0007H 0000 0008H 7FFF FFFFH 81) 8000 0000H 8017 7FFFH 8017 8000H 807F FFFFH 8080 0000H 8FDF FFFFH 8FE0 0000H 8FE0 3FFFH 8FE0 4000H 8FE0 FFFFH 8FE1 0000H 8FE1 3FFFH 8FE1 4000H 8FF1 FFFFH 8FF2 0000H 8FF5 FFFFH 8FF6 0000H 8FFF BFFFH 1.5 Mbyte Program Flash (PFLASH) access 6.5 Mbyte Reserved 246 Mbyte 16 Kbyte 48 Kbyte 16 Kbyte 1 Mbyte Reserved Data Flash (DFLASH) Bank 0 Reserved Data Flash (DFLASH) Bank 1 Reserved LMBBET LMBBET access LMBBET access LMBBET 256 Kbyte Reserved 624 Kbyte Reserved Boot ROM (BROM) Reserved access SPBBET SPBBE 8FFF C000H - 16 Kbyte 8FFF FFFFH 91) 9000 0000H 9FFF FFFFH 256 Mbyte Data Sheet 40 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-5 LMB Address Map (cont’d) Size Description Read 1.5 Mbyte Program Flash (PFLASH) access 6.5 Mbyte Reserved 246 Mbyte Reserved Data Flash (DFLASH) Bank 0 Reserved Data Flash (DFLASH) Bank 1 Reserved LMBBET LMBBET access LMBBET access LMBBET Action Write access2) LMBBET LMBBET access2) LMBBET access2) LMBBET Functional Description Seg- Address ment Range 10 3) A000 0000H A017 FFFFH A017 8000H A07F FFFFH A080 0000H AFDF FFFFH AFE0 0000H - 16 Kbyte AFE0 3FFFH AFE0 4000H - 48 Kbyte AFE0 FFFFH AFE1 0000H - 16 Kbyte AFE1 3FFFH AFE1 4000H - 1 Mbyte AFF1 FFFFH AFF2 0000H AFF5 FFFFH AFF6 0000H AFFF BFFFH 256 Kbyte Reserved 624 Kbyte Reserved Boot ROM (BROM) Reserved Overlay memory (OVRAM) Reserved access SPBBET access LMBBET SPBBE access LMBBET AFFF C000H - 16 Kbyte AFFF FFFFH 113) 121) B000 0000H BFFF FFFFH C000 0000H C000 1FFFH C000 2000H CFFF FFFFH 256 Mbyte 8 Kbyte 256 Mbyte Data Sheet 41 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-5 LMB Address Map (cont’d) Size 56 Kbyte 64 Mbyte 16 Kbyte ≈ 64 Mbyte 112 Mbyte 16 Mbyte 128 Mbyte 128 Mbyte Description Read DMI Local Data RAM (LDRAM) Reserved PMI Scratch-Pad RAM (SPRAM) Reserved Reserved Reserved (for Boot Rom) Reserved Reserved LMBBET LMBBET LMBBET LMBBET access SPBBE LMBBET access LMBBET Action Write access SPBBE LMBBET access LMBBET Functional Description Seg- Address ment Range 13 3) D000 0000H D000 DFFFH D000 E000H D3FF FFFFH D400 0000H D400 3FFFH D400 4000H D7FF FFFFH D800 0000H DEFF FFFFH DF00 0000H DFFF FFEFH 143) E000 0000H E7FF FFFFH E800 0000H EFFF FFFFH Data Sheet 42 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-5 LMB Address Map (cont’d) Size 128 Mbyte Description Read Address map is identical to FPI Bus segment 15 address map (see Table 3-5) Reserved areas give an bus error. Reserved Reserved Program Memory Unit (PMU) SPBBET Action Write SPBBE Functional Description Seg- Address ment Range 15 F000 0000H F7FF FFFFH F800 0000H F800 03FFH F800 0400H F800 04FFH F800 0500H F800 05FFH F800 0600H F800 0FFFH F800 1000H F800 23FFH F800 2400H F87F FBFFH 1 Kbyte 256 byte 256 byte LMBBET LMBBET access LMBBET access LMBBET access access access access LMBBET LMBBET LMBBET access LMBBET access LMBBET access access access access LMBBET ≈ 2 Kbyte Reserved 5 Kbyte Flash Registers ≈ 8 Mbyte Reserved Data Memory Interface Unit Program Memory Interface Unit LBCU register space LFI Bus Bridge Reserved F87F FC00H - 256 byte F87F FCFFH F87F FD00H - 256 byte F87F FDFFH F87F FE00H - 256 byte F87F FEFFH F87F FF00H F87F FFFFH F880 0000H FFFF FFFFH 1) Cached area 256 byte ≈ 119 Mbyte 2) Only applicable when writing Flash command sequences 3) Non-cached area Data Sheet 43 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.4 Memory Protection System The TC1165/TC1166 memory protection system specifies the addressable range and read/write permissions of memory segments available to the current executing task. The memory protection system controls the position and range of addressable segments in memory. It also controls the types of read and write operations allowed within addressable memory segments. Any illegal memory access is detected by the memory protection hardware, which then invokes the appropriate Trap Service Routine (TSR) to handle the error. Thus, the memory protection system protects critical system functions against both software and hardware errors. The memory protection hardware can also generate signals to the Debug Unit to facilitate tracing illegal memory accesses. There are two Memory Protection Register Sets in the TC1165/TC1166, numbered 0 and 1, which specify memory protection ranges and permissions for code and data. The PSW.PRS bit field determines which of these is the set currently in use by the CPU. As the TC1165/TC1166 uses a Harvard-style memory architecture, each Memory Protection Register Set is broken down into a Data Protection Register Set and a Code Protection Register Set. Each Data Protection Register Set can specify up to four address ranges to receive a particular protection modes. Each Code Protection Register Set can specify up to two address ranges to receive a particular protection modes. Each Data Protection Register Sets and Code Protection Register Sets determines the range and protection modes for a separate memory area. Each set contains a pair of registers which determine the address range (the Data Segment Protection Registers and Code Segment Protection Registers) and one register (Data Protection Mode Register) which determines the memory access modes that applies to the specified range. 3.5 Peripheral Control Processor The Peripheral Control Processor (PCP2) in the TC1165/TC1166 performs tasks that would normally be performed by the combination of a DMA controller and its supporting CPU interrupt service routines in a traditional computer system. It could easily be considered as the host processor’s first line of defence as an interrupt-handling engine. The PCP can unload the CPU from having to service time-critical interrupts. This provides many benefits, including: • • • • Avoiding large interrupt-driven task context-switching latencies in the host processor Reducing the cost of interrupts in terms of processor register and memory overhead Improving the responsiveness of interrupt service routines to data-capture and datatransfer operations Easing the implementation of multitasking operating systems The PCP2 has an architecture that efficiently supports DMA-type transactions to and from arbitrary devices and memory addresses within the TC1165/TC1166 and also has reasonable stand-alone computational capabilities. Data Sheet 44 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description The PCP2 in the TC1165/TC1166 contains an improved version of the TC1775’s PCP with the following enhancements: • • • • • • • • • • • Optimized context switching Support for nested interrupts Enhanced instruction set Enhanced instruction execution speed Enhanced interrupt queueing PCP Processor Core Code Memory (CMEM) Parameter Memory (PRAM) PCP Interrupt Control Unit (PICU) PCP Service Request Nodes (PSRN) System bus interface to the Flexible Peripheral Interface (FPI Bus) The PCP2 is made up of several modular blocks as follows (see Figure 3-1): Code Memory CMEM Parameter Memory PRAM PCP Processor Core FPI-Interface PCP Service Req. Nodes PSRNs PCP Interrupt Control Unit PICU FPI Bus PCP Interrupt Arbitration Bus CPU Interrupt Arbitration Bus MCB06135 Figure 3-1 PCP2 Block Diagram Data Sheet 45 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 3-6 PCP2 Instruction Set Overview Description Efficient DMA channel implementation Transfer data between PRAM or FPI memory and the general purpose registers, as well as move or exchange values between registers Add, subtract, compare and complement Divide and multiply And, Or, Exclusive Or, Negate Shift right or left, rotate right or left, prioritize Set, clear, insert and test bits Jump conditionally, jump long, exit No operation, Debug Functional Description Instruction Group DMA primitives Load/Store Arithmetic Divide/Multiply Logical Shift Bit Manipulation Flow Control Miscellaneous Data Sheet 46 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.6 DMA Controller and Memory Checker The DMA Controller of the TC1165/TC1166 transfers data from data source locations to data destination locations without intervention of the CPU or other on-chip devices. One data move operation is controlled by one DMA channel. Eight DMA channels are provided in one DMA Sub-Block. The Bus Switch provides the connection of the DMA Sub-Block to the two FPI Bus interfaces and an MLI bus interface. In the TC1165/TC1166, the FPI Bus interfaces are connected to the System Peripheral Bus and the DMA Bus. The third specific bus interface provides a connection to Micro Link Interface modules (two MLI modules in the TC1165/TC1166) and other DMA-related devices (Memory Checker module in the TC1165/TC1166). Clock control, address decoding, DMA request wiring, and DMA interrupt service request control are implementation-specific and managed outside the DMA controller kernel. Figure 3-2 shows the implementation details and interconnections of the DMA module. Clock Control fDMA DMA Controller FPI Bus Int erface 0 System Periphera Bus DMA Sub-Block 0 DMA Requests of On-chip Periph. Units Request Selection/ CH0n_OUT Arbitration DMA Channels 00-07 Transaction Control Unit Bus Switch FPI Bus Interface 1 DMA Bus MLI0 MLI Interfac e Address Decoder MLI1 Memory Checker Interrupt Request Nodes SR[15:0] DMA Interrupt Control Arbiter/ Switch Control MCB06149 Figure 3-2 DMA Controller Block Diagram Data Sheet 47 V1.0, 2008-04 TC1165/TC1166 Preliminary Features • 8 independent DMA channels – 8 DMA channels in the DMA Sub-Block – Up to 8 selectable request inputs per DMA channel – 2-level programmable priority of DMA channels within the DMA Sub-Block – Software and hardware DMA request – Hardware requests by selected on-chip peripherals and external inputs Programmable priority of the DMA Sub-Blocks on the bus interfaces Buffer capability for move actions on the buses (at least 1 move per bus is buffered). Individually programmable operation modes for each DMA channel – Single Mode: stops and disables DMA channel after a predefined number of DMA transfers – Continuous Mode: DMA channel remains enabled after a predefined number of DMA transfers; DMA transaction can be repeated. – Programmable address modification Full 32-bit addressing capability of each DMA channel – 4 Gbyte address range – Support of circular buffer addressing mode Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit Micro Link bus interface support Register set for each DMA channel – Source and destination address register – Channel control and status register – Transfer count register Flexible interrupt generation (the service request node logic for the MLI channels is also implemented in the DMA module) All buses connected to the DMA module must work at the same frequency. Read/write requests of the System Bus side to the peripherals on DMA Bus are bridged to the DMA Bus (only the DMA is the master on the DMA bus), allowing easy access to these peripherals by PCP and CPU Functional Description • • • • • • • • • • Memory Checker The Memory Checker Module (MCHK) makes it possible to check the data consistency of memories. Any SPB bus master may access the memory checker. It is preferable the DMA does it as described hereafter. It uses DMA 8-bit, 16-bit, or 32-bit moves to read from the selected address area and to write the value read in a memory checker input register. With each write operation to the memory checker input register, a polynomial checksum calculation is triggered and the result of the calculation is stored in the memory checker result register. The memory checker uses the standard Ethernet polynomial, which is given by: G32 = x32+ x26+ x23+ x22+ x16+ x12+ x11+ x10+ x8+ x7+ x5+ x4+ x2+ x +1 Data Sheet 48 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description Note: Although the polynomial above is used for generation, the generation algorithm differs from the one that is used by the Ethernet protocol. 3.7 Interrupt System The TC1165/TC1166 interrupt system provides a flexible and time-efficient means of processing interrupts. An interrupt request can be serviced either by the CPU or by the Peripheral Control Processor (PCP). These units are called “Service Providers”. Interrupt requests are called “Service Requests” rather than “Interrupt Requests” in this document because they can be serviced by either Service Providers. Each peripheral in the TC1165/TC1166 can generate service requests. Additionally, the Bus Control Units, the Debug Unit, the PCP, and even the CPU itself can generate service requests to either of the two Service Providers. As shown in Figure 3-3, each TC1165/TC1166 unit that can generate service requests is connected to one or multiple Service Request Nodes (SRN). Each SRN contains a Service Request Control Register mod_SRCx, where “mod” is the identifier of the service requesting unit and “x” an optional index. Two arbitration buses connect the SRNs with two Interrupt Control Units, which handle interrupt arbitration among competing interrupt service requests, as follows: • • The Interrupt Control Unit (ICU) arbitrates service requests for the CPU and administers the CPU Interrupt Arbitration Bus. The Peripheral Interrupt Control Unit (PICU) arbitrates service requests for the PCP and administers the PCP Interrupt Arbitration Bus. The PCP can make service requests directly to itself (via the PICU), or it can make service requests to the CPU. The Debug Unit can generate service requests to the PCP or the CPU. The CPU can make service requests directly to itself (via the ICU), or it can make service requests to the PCP. The CPU Service Request Nodes are activated through software. Depending on the selected system clock frequency fSYS, the number of fSYS clock cycles per arbitration cycle must be selected as follows: • • fSYS < 60 MHz: ICR.CONECYC = 1 and PCP_ICR.CONECYC = 1 fSYS > 60 MHz: ICR.CONECYC = 0 and PCP_ICR.CONECYC = 0 Data Sheet 49 V1.0, 2008-04 TC1165/TC1166 Preliminary PCP Interrupt Arbitration Bus Service Requestors Service Req. Nodes CPU Interrupt Arbitration Bus P CP Interrupt Control Unit PICU 2 4 2 3 3 4 4 6 4 2 38 2 1 1 2 2 2 SRNs 4 SRNs 2 SRNs 3 SRNs 3 SRNs 4 SRNs 4 SRNs 6 S RNs 4 SRNs 2 SRNs 38 SRNs 2 SRNs 1 SRN 1 S RN 2 SRNs 2 4 4 2 2 3 3 3 3 4 4 4 4 6 6 4 4 2 2 38 38 2 2 1 1 1 1 2 2 1 1 1 1 4 4 1 1 1 1 1 SRN 1 SRN 4 SRNs 1 SRN Service Req. Nodes 1 SRN 1 1 4 1 1 Service Requestors LBCU SBCU DMA Cerberus DMA Bus CPU Interrupt Control Unit ICU Int. Req. PIPN 5 5 5 2 5 5 5 SRNs 5 SRNs 2 SRNs Service Req. Nodes 5 SRNs 5 5 2 5 PCP2 Int. Req. PIPN Int. Ack. CCPN Interrupt Service Providers Functional Description MSC0 MLI0 MLI1 SSC0 SSC1 ASC0 ASC1 MultiCAN1) ADC0 FADC GPTA0 STM FPU Flash Ext. Int Software and Breakpoint Interrupts CPU Int. Ack. CCPN 1) MultiCAN module and the 6 SRNs are not applicable to TC1165. TC1165/TC1166 Interrupt System Figure 3-3 Block Diagram of the TC1165/TC1166 Interrupt System Data Sheet 50 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.8 Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) Figure 3-4 shows a global view of the functional blocks and interfaces of the two Asynchronous/Synchronous Serial Interfaces, ASC0 and ASC1. Clock Control fASC A2 RXD_I0 RXD_I1 RXD_O TXD_O A2 A2 P3.12 / RXD0B P3.13 / TXD0B A2 P3.0 / RXD0A P3.1 / TXD0A Address Decoder EIR TBIR TIR RIR ASC0 Module (Kernel) Interrupt Control ASC0_RDR To DMA ASC0_TDR Port 3 Control RXD_I0 ASC1 Module (Kernel) EIR TBIR TIR RIR RXD_I1 RXD_O TXD_O Interrupt Control P3.9 / A2 RXD1A A2 P3.8 / TXD1A P3.14 / A2 RXD1B A2 P3.15 / TXD1B To DMA ASC1_RDR ASC1_TDR MCB06211c Figure 3-4 Block Diagram of the ASC Interfaces The ASC provides serial communication between the TC1165/TC1166 and other microcontrollers, microprocessors, or external peripherals. The ASC supports full-duplex asynchronous communication and half-duplex synchronous communication. In Synchronous Mode, data is transmitted or received synchronous to a shift clock that is generated by the ASC internally. In Asynchronous Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be Data Sheet 51 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description selected. Parity, framing, and overrun error detection are provided to increase the reliability of data transfers. Transmission and reception of data is double-buffered. For multiprocessor communication, a mechanism is included to distinguish address bytes from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator provides the ASC with a separate serial clock signal, which can be accurately adjusted by a prescaler implemented as fractional divider. Features • Full-duplex asynchronous operating modes – 8-bit or 9-bit data frames, LSB first – Parity-bit generation/checking – One or two stop bits – Baud rate from 5.0 Mbit/s to 1.19 bit/s (@ 80 MHz module clock) – Multiprocessor mode for automatic address/data byte detection – Loop-back capability Half-duplex 8-bit synchronous operating mode – Baud rate from 10.0 Mbit/s to 813.8 bit/s (@ 80 MHz module clock) Double-buffered transmitter/receiver Interrupt generation – On a transmit buffer empty condition – On a transmit last bit of a frame condition – On a receive buffer full condition – On an error condition (frame, parity, overrun error) • • • Data Sheet 52 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.9 High-Speed Synchronous Serial Interfaces (SSC0 and SSC1) Figure 3-5 shows a global view of the functional blocks and interfaces of the two highspeed Synchronous Serial Interfaces, SSC0 and SSC1. MRSTA MRSTB MTSR MTSRA MTSRB MRST SCLKA SCLKB SCLK SLSI1 Slave SLSI[7:2] 1 ) SLSO[2:0] SSC0_RDR To DMA SSC0_TDR M/S Select 1) fSSC 0 Clock Control A2 P3.4 /MTSR0 Master fC L C0 Slave A2 P3.3 /MRST0 Address Decoder SSC0 Module (Kernel) A2 P3.2 /SCLK0 Slave Master Interrupt Control EIR TIR RIR Port 3 Control A2 P3.7 /SLSI0 P3.5 /SLSO00 / A2 SLSO10 / SLSO00 AND SLSO10 A2 P3.6 /SLSO01 / SLSO11 / SLSO01 AND SLSO11 P3.7 /SLSO02 / A2 SLSO12 A2 P3.8 /SLSO06 Master SLSO[5:3] SLSO6 SLSO7 1) Enable 1 ) fSSC 1 Clock Control SLSO[2:0] SLSO[5:3] Master SLSO6 1) SLSO7 A2 P2.1 /SLSO03 / SLSO13 A2 P2.8 /SLSO04 / SLSO14 fC L C1 A2 P2.9 /SLSO05 / SLSO15 Address Decoder SLSI1 Slave EIR TIR RIR SSC1 Module (Kernel) SLSI[7:2] MRSTA MRSTB MTSR MTSRA MTSRB MRST 1) Port 2 Control A1 P2.13 /SLSI1 A2 P2.12 /MTSR1A Interrupt Control Master A2 P2.10 /MRST1A A2 P2.11 /SCLK1A A2 P1.10 /SLSO17 To DMA SSC1_RDR SSC1_TDR M/S Select 1) Slave Enable 1 ) Slave Master 1) These lines are not connected SCLKA SCLKB SCLK Port 1 Control A2 P1.8 /MTSR1B A2 P1.9 /MRST1B A2 P1.11 /SCLK1B MCB06225_c Figure 3-5 Data Sheet Block Diagram of the SSC Interfaces 53 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description The SSC supports full-duplex and half-duplex serial synchronous communication up to 40.0 MBaud (@ 80 MHz module clock). The serial clock signal can be generated by the SSC itself (Master Mode) or can be received from an external master (Slave Mode). Data width, shift direction, clock polarity and phase are programmable. This allows communication with SPI-compatible devices. Transmission and reception of data is double-buffered. A shift clock generator provides the SSC with a separate serial clock signal. Seven slave select inputs are available for Slave Mode operation. Eight programmable slave select outputs (chip selects) are supported in Master Mode. Features • Master and Slave Mode operation – Full-duplex or half-duplex operation – Automatic pad control possible Flexible data format – Programmable number of data bits: 2 to 16 bits – Programmable shift direction: LSB or MSB shift first – Programmable clock polarity: Idle low or idle high state for the shift clock – Programmable clock/data phase: Data shift with leading or trailing edge of the shift clock Baud rate generation from 40.0 Mbit/s to 610.36 bit/s (@ 80 MHz module clock) Interrupt generation – On a transmitter empty condition – On a receiver full condition – On an error condition (receive, phase, baud rate, transmit error) Flexible SSC pin configuration Seven slave select inputs SLSI[7:1] in Slave Mode Eight programmable slave select outputs SLSO[7:0] in Master Mode – Automatic SLSO generation with programmable timing – Programmable active level and enable control • • • • • • Data Sheet 54 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.10 Micro Second Bus Interface (MSC0) The MSC interface provides a serial communication link typically used to connect power switches or other peripheral devices. The serial communication link includes a fast synchronous downstream channel and a slow asynchronous upstream channel. Figure 3-6 shows a global view of the MSC interface signals. SR15 (from CAN) fMSC0 Clock Control FCLP FCLN Downstream Channel SOP SON fCLC0 C FCLP0A C FCLN0 C SOP0A C SON0 A2 P2.11 / FCLP0B A2 P2.12 / SOP0B Address Decoder Interrupt Control To DMA SR[1:0] MSC0 Module (Kernel) EN0 EN1 Port 2 Control A2 P2.8 / EN00 A2 P2.9 / EN01 SR[3:2] 16 Upstream Channel 16 ALTINL[15:0] (from GPTA) ALTINH[15:0] EMGSTOPMSC (from SCU) SDI[0]1) A1 P2.13 / SDI0 1) SDI[7:1] are connected to high level MCA06255 Figure 3-6 Block Diagram of the MSC Interface The downstream and upstream channels of the MSC module communicate with the external world via nine I/O lines. Eight output lines are required for the serial communication of the downstream channel (clock, data, and enable signals). One out of eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The source of the serial data to be transmitted by the downstream channel can be MSC register contents or data that is provided at the ALTINL/ALTINH input lines. These input lines are typically connected to other on-chip peripheral units (for example with a timer unit like the GPTA). An emergency stop input signal makes it possible to set bits of the serial data stream to dedicated values in emergency cases. Data Sheet 55 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description Clock control, address decoding, and interrupt service request control are managed outside the MSC module kernel. Service request outputs are able to trigger an interrupt or a DMA request. Features • • Fast synchronous serial interface to connect power switches in particular, or other peripheral devices via serial buses High-speed synchronous serial transmission on downstream channel – Serial output clock frequency: fFCL = fMSC/2 – Fractional clock divider for precise frequency control of serial clock fMSC – Command, data, and passive frame types – Start of serial frame: Software-controlled, timer-controlled, or free-running – Programmable upstream data frame length (16 or 12 bits) – Transmission with or without SEL bit – Flexible chip select generation indicates status during serial frame transmission – Emergency stop without CPU intervention Low-speed asynchronous serial reception on upstream channel – Baud rate: fMSC divided by 4, 8, 16, 32, 64, 128, or 256 – Standard asynchronous serial frames – Parity error checker – 8-to-1 input multiplexer for SDI lines – Built-in spike filter on SDI lines • Data Sheet 56 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.11 MultiCAN Controller (CAN) Note: Section 3.11 is not applicable to TC1165. Figure 3-7 shows a global view of the MultiCAN module with its functional blocks and interfaces. fCAN Clock Control MultiCAN Module Kernel fCLC Address Decoder Message Object Buffer 64 Objects DMA INT_O [1:0] INT_O [5:2] INT_O15 Linked List Control CAN Node 1 CAN Node 0 TXDC1 RXDC1 TXDC0 RXDC0 Port 3 Control P3.15 / TXDCAN1 P3.14 / A2 RXDCAN1 A2 P3.13 / TXDCAN0 P3.12 / A2 RXDCAN0 A2 Interrupt Control CAN Control MCA06281 Figure 3-7 Block Diagram of MultiCAN Module The MultiCAN module contains two independently-operating CAN nodes with Full-CAN functionality that are able to exchange Data and Remote Frames via a gateway function. Transmission and reception of CAN frames is handled in accordance with CAN specification V2.0 B (active). Each CAN node can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. Both CAN nodes share a common set of message objects. Each message object can be individually allocated to one of the CAN nodes. Besides serving as a storage container for incoming and outgoing frames, message objects can be combined to build gateways between the CAN nodes or to setup a FIFO buffer. The message objects are organized in double-chained linked lists, where each CAN node has its own list of message objects. A CAN node stores frames only into message objects that are allocated to the message object list of the CAN node, and it transmits only messages belonging to this message object list. A powerful, command-driven list controller performs all message object list operations. Data Sheet 57 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description The bit timings for the CAN nodes are derived from the module timer clock (fCAN), and are programmable up to a data rate of 1 Mbit/s. External bus transceivers are connected to a CAN node via a pair of receive and transmit pins. MultiCAN Features • • • • • • • CAN functionality conforms to CAN specification V2.0 B active for each CAN node (compliant to ISO 11898) Two independent CAN nodes 64 independent message objects (shared by the CAN nodes) Dedicated control registers for each CAN node Data transfer rate up to 1Mbit/s, individually programmable for each node Flexible and powerful message transfer control and error handling capabilities Full-CAN functionality: message objects can be individually – assigned to one of the two CAN nodes – configured as transmit or receive object – configured as message buffer with FIFO algorithm – configured to handle frames with 11-bit or 29-bit identifiers – provided with programmable acceptance mask register for filtering – monitored via a frame counter – configured for Remote Monitoring Mode Automatic Gateway Mode support 6 individually programmable interrupt nodes CAN analyzer mode for bus monitoring • • • Data Sheet 58 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.12 Micro Link Serial Bus Interface (MLI0, MLI1) The Micro Link Interface is a fast synchronous serial interface that allows data exchange between microcontrollers of the 32-bit AUDO microcontroller family without intervention of a CPU or other bus masters. Figure 3-8 shows how two microcontrollers are typically connected together via their MLI interfaces. The MLI operates in both microcontrollers as a bus master on the system bus. Controller 1 CPU Controller 2 CPU Peripheral A Peripheral B Peripheral C Peripheral D Memory System Bus MLI MLI System Bus Memory MCA06061 Figure 3-8 Features • • • • • • • • Typical Micro Link Interface Connection • Synchronous serial communication between MLI transmitters and MLI receivers located on the same or on different microcontroller devices Automatic data transfer/request transactions between local/remote controller Fully transparent read/write access supported (= remote programming) Complete address range of remote controller available Specific frame protocol to transfer commands, addresses and data Error control by parity bit 32-bit, 16-bit, and 8-bit data transfers Programmable baud rates – MLI transmitter baud rate: max. fMLI/2 (= 40 Mbit/s @ 80 MHz module clock) – MLI receiver baud rate: max. fMLI Multiple remote (slave) controllers are supported MLI transmitter and MLI receiver communicate with other off-chip MLI receivers and MLI transmitters via a 4-line serial I/O bus each. Several I/O lines of these I/O buses are available outside the MLI module kernel as four-line output or input buses. Data Sheet 59 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description Figure 3-9 shows a global view of the functional blocks of the two MLI modules with its interfaces. Data Sheet 60 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description P2.0 / TCLK 0 TCLK TREADYA TREADYB TREADYD TVALIDA TVALIDB TVALIDD TDATA Port 2 Control P2.1 / TREADY0A P2.2 / TVALID0A P2.3 / TDATA0 P2.4 / RCLK 0A P2.5 / RREADY0A P2.6 / RVALID0A RCLKA RCLKB RCLKD SR[4:7] Receiver RREADYA RREADYB RREADYD RVALIDA RVALIDB RVALIDD RDATAA RDATAB RDATAD Port 5 Control P5.15 / TCLK0 P5.14 / TREADY0B P5.13 / TVALID0B P5.12 / TDATA0 P5.11 / RCLK0B P5.10 / RREADY0B P5.9 / RVALID0B P5.8 / RDATA0B P2.7 / RDATA0A Clock Control fML I0 Address Decoder MLI 0 Module (Kernel ) Interrupt Control SR[3:0] To DMA Cerberus BRKOUT Clock Control fML I1 Transmitter Transmitter TCLK TREADYA TREADYD TVALIDA TVALIDD TDATA RCLKA RCLKD RREADYA Receiver RREADYD RVALIDA RVALIDD RDATAA RDATAD MCB06322_MCB06323 P5.11 / TCLK1 P5.10 / TREADY1 P5.9 / TVALID1 P5.8 / TDATA1 Port 5 Control P5.15 / RCLK1 P5.14 / RREADY1 P5.13 / RVALID1 P5.12 / RDATA1 Address Decoder MLI1 Module (Kernel) Interrupt Control N.C. To DMA SR[1:0] SR[3:2] SR[4:7] Cerberus BRKOUT Figure 3-9 Data Sheet Block Diagram of the MLI Modules 61 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.13 General Purpose Timer Array The GPTA provides a set of timer, compare, and capture functionalities that can be flexibly combined to form signal measurement and signal generation units. They are optimized for tasks typical of electrical motor control applications, but can also be used to generate simple and complex signal waveforms needed in other industrial applications. The TC1165/TC1166 contains one General Purpose Timer Array (GPTA0). Figure 3-10 shows a global view of the GPTA module. GPTA Clock Generation Unit FPC0 FPC1 FPC2 FPC3 FPC4 FPC5 PDL1 DCM3 Clock Conn. PDL0 DCM1 DCM2 DIGITAL PLL DCM0 fGPTA Clock Distribution Unit GT0 GT1 GTC00 GTC01 GTC02 GTC03 Global Timer Cell Array GTC30 GTC31 Clock Bus Signal Generation Unit LTC00 LTC01 LTC02 LTC03 Local Timer Cell Array LTC62 LTC63 I/O Line Sharing Unit Interrupt Sharing Unit MCB06063 Figure 3-10 Block Diagram of the GPTA Module Data Sheet 62 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.13.1 Functionality of GPTA0 The General Purpose Timer Array GPTA0 provides a set of hardware modules required for high-speed digital signal processing: • • • • • • Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation. Phase Discrimination Logic units (PDL) decode the direction information output by a rotation tracking system. Duty Cycle Measurement Cells (DCM) provide pulse-width measurement capabilities. A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA module clock ticks during an input signal’s period. Global Timer units (GT) driven by various clock sources are implemented to operate as a time base for the associated Global Timer Cells. Global Timer Cells (GTC) can be programmed to capture the contents of a Global Timer on an external or internal event. A GTC may also be used to control an external port pin depending on the result of an internal compare operation. GTCs can be logically concatenated to provide a common external port pin with a complex signal waveform. Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may also be logically tied together to drive a common external port pin with a complex signal waveform. LTCs — enabled in Timer Mode or Capture Mode — can be clocked or triggered by various external or internal events. • Input lines can be shared by an LTC and a GTC to trigger their programmed operation simultaneously. The following list summarizes the specific features of the GPTA unit. Clock Generation Unit • Filter and Prescaler Cell (FPC) – Six independent units – Three basic operating modes: Prescaler, Delayed Debounce Filter, Immediate Debounce Filter – Selectable input sources: Port lines, GPTA module clock, FPC output of preceding FPC cell – Selectable input clocks: GPTA module clock, prescaled GPTA module clock, DCM clock, compensated or uncompensated PLL clock – fGPTA/2 maximum input signal frequency in Filter Modes Phase Discriminator Logic (PDL) – Two independent units – Two operating modes (2- and 3-sensor signals) – fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input signal frequency in 3-sensor Mode 63 V1.0, 2008-04 • Data Sheet TC1165/TC1166 Preliminary • Functional Description • • Duty Cycle Measurement (DCM) – Four independent units – 0 - 100% margin and time-out handling – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Digital Phase Locked Loop (PLL) – One unit – Arbitrary multiplication factor between 1 and 65535 – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Clock Distribution Unit (CDU) – One unit – Provides nine clock output signals: fGPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock Signal Generation Unit • Global Timers (GT) – Two independent units – Two operating modes (Free-Running Timer and Reload Timer) – 24-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Global Timer Cell (GTC) – 32 units related to the Global Timers – Two operating modes (Capture, Compare and Capture after Compare) – 24-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Local Timer Cell (LTC) – 64 independent units – Three basic operating modes (Timer, Capture and Compare) for 63 units – Special compare modes for one unit – 16-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency • • Interrupt Control Unit • 111 interrupt sources, generating up to 38 service requests Data Sheet 64 V1.0, 2008-04 TC1165/TC1166 Preliminary I/O Sharing Unit • Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and MSC interface Functional Description Data Sheet 65 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.14 Analog-to-Digital Converter (ADC0) Section 3.14 shows the global view of the ADC module with its functional blocks and interfaces and the features which are provided by the module. VDDM VDD VAGND0 VSS VSSM VAREF0 fADC Clock Control GPRS EMUX0 EMUX1 ASGT SW0TR, SW0GT External ETR, EGT Request Unit QTR, QGT (SCU) TTR, TGT ADC0 Module Kernel AIN0 Group 0 AIN15 AIN16 Group 1 AIN30 AIN31 Die Temperature Measurement SCU_CON.DTSON MCA06427 A1 Port 1 Control fCLC P1.14 / AD0EMUX2 (GRPS) A1 P1.13 /AD0EMUX1 A1 P1.12 /AD0EMUX0 8 2 6 D D D D D From Ports From MSC0 From GPTA AN0 AN15 AN16 AN30 AN31 Address Decoder To DMA SR[7:4] Analog Multiplexer Interrupt Control SR[3:0] 0 1 Figure 3-11 Block Diagram of the ADC Module The ADC module has 16 analog input channels. An analog multiplexer selects the input line for the analog input channels from among 32 analog inputs. Additionally, an external analog multiplexer can be used for analog input extension. External Clock control, address decoding, and service request (interrupt) control are managed outside the ADC module kernel. External trigger conditions are controlled by an External Request Unit. This unit generates the control signals for auto-scan control (ASGT), software trigger control (SW0TR, SW0GT), the event trigger control (ETR, EGT), queue control (QTR, QGT), and timer trigger control (TTR, TGT). An automatic self-calibration adjusts the ADC module to changing temperatures or process variations. Figure 3-11 shows the global view of the ADC module with its functional blocks and interfaces. Data Sheet 66 V1.0, 2008-04 TC1165/TC1166 Preliminary Features • • • • • • • • • • • • • • • • • • 8-bit, 10-bit, 12-bit A/D conversion Conversion time below 2.5µs @ 10-bit resolution Extended channel status information on request source Successive approximation conversion method Total Unadjusted Error (TUE) of ±2 LSB @ 10-bit resolution Integrated sample & hold functionality Direct control of up to 16 analog input channels Dedicated control and status registers for each analog channel Powerful conversion request sources Selectable reference voltages for each channel Programmable sample and conversion timing schemes Limit checking Flexible ADC module service request control unit Automatic control of external analog multiplexers Equidistant samples initiated by timer External trigger and gating inputs for conversion requests Power reduction and clock control feature On-chip die temperature sensor output voltage measurement Functional Description Data Sheet 67 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.15 Fast Analog-to-Digital Converter Unit (FADC) The on-chip FADC module of the TC1165/TC1166 basically is a 2-channel A/D converter with 10-bit resolution that operates by the method of the successive approximation. As shown in Figure 3-12, the main FADC functional blocks are: • • • • • • • • • The Input Stage — contains the differential inputs and the programmable amplifier The A/D Converter — is responsible for the analog-to-digital conversion The Data Reduction Unit — contains programmable antialiasing and data reduction filters The Channel Trigger Control block — determines the trigger and gating conditions for the two FADC channels The Channel Timers — can independently trigger the conversion of each FADC channel The A/D Control block is responsible for the overall FADC functionality The FADC module is supplied by the following power supply and reference voltage lines: VDDMF/VDDMF:FADC Analog Part Power Supply (3.3 V) VDDAF/VDDAF:FADC Analog Part Logic Power Supply (1.5 V) VFAREF/VFAGND:FADC Reference Voltage (3.3 V)/FADC Reference Ground Data Sheet 68 V1.0, 2008-04 TC1165/TC1166 Preliminary VFAREF VDDAF VDDMF VFAGND VSSAF VSSMF fFADC Clock Control Address Decoder Interrupt Control SR[1:0] FADC Module Kernel Functional Description fCLC FAIN0P FAIN0N FAIN1P FAIN1N D AN32 D AN33 D AN34 D AN35 SR[3:2] DMA GPTA0 OUT1 OUT9 OUT18 OUT26 OUT2 OUT10 OUT19 OUT27 PDOUT2 A1 P3.10 / REQ0 A1 P3.11 / REQ1 GS[7:0] TS[7:0] A1 P0.14 / REQ4 A1 P0.15 / REQ5 External Request Unit (SCU) PDOUT3 MCA06445 Figure 3-12 Block Diagram of the FADC Module Features • • • • • • • • • • • Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz) 10-bit A/D conversion – Higher resolution by averaging of consecutive conversions is supported Successive approximation conversion method Two differential input channels Offset and gain calibration support for each channel Differential input amplifier with programmable gain of 1, 2, 4 and 8 for each channel Free-running (Channel Timers) or triggered conversion modes Trigger and gating control for external signals Built-in Channel Timers for internal triggering Channel timer request periods independently selectable for each channel Selectable, programmable anti-aliasing and data reduction filter block 69 V1.0, 2008-04 Data Sheet TC1165/TC1166 Preliminary Functional Description 3.16 System Timer The TC1165/TC1166’s STM is designed for global system timing applications requiring both high precision and long period. Features • • • • • • • Free-running 56-bit counter All 56 bits can be read synchronously Different 32-bit portions of the 56-bit counter can be read synchronously Flexible interrupt generation based on compare match with partial STM content Driven by maximum 80 MHz (= fSYS, default after reset = fSYS/2) Counting starts automatically after a reset operation STM is reset by: – Watchdog reset – Software reset (RST_REQ.RRSTM must be set) – Power-on reset STM (and clock divider STM_CLC.RMC) is not reset at a hardware reset (HDRST = 0) STM can be halted in debug/suspend mode (via STM_CLC register) • • The STM is an upward counter, running either at the system clock frequency fSYS or at a fraction of it. The STM clock frequency is fSTM = fSYS/RMC with RMC = 0-7 (default after reset is fSTM = fSYS/2, selected by RMC = 010B). RMC is a bit field in register STM_CLC. In case of a power-on reset, a watchdog reset, or a software reset, the STM is reset. After one of these reset conditions, the STM is enabled and immediately starts counting up. It is not possible to affect the content of the timer during normal operation of the TC1165/TC1166. The timer registers can only be read but not written to. The STM can be optionally disabled for power-saving purposes, or suspended for debugging purposes via its clock control register. In suspend mode of the TC1165/TC1166 (initiated by writing an appropriate value to STM_CLC register), the STM clock is stopped but all registers are still readable. Due to the 56-bit width of the STM, it is not possible to read its entire content with one instruction. It needs to be read with two load instructions. Since the timer would continue to count between the two load operations, there is a chance that the two values read are not consistent (due to possible overflow from the low part of the timer to the high part between the two read operations). To enable a synchronous and consistent reading operation of the STM content, a capture register (STM_CAP) is implemented. It latches the content of the high part of the STM each time when one of the registers STM_TIM0 to STM_TIM5 is read. Thus, STM_CAP holds the upper value of the timer at exactly the same time when the lower part is read. The second read operation would then read the content of the STM_CAP to get the complete timer value. Data Sheet 70 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description The STM can also be read in sections from seven registers, STM_TIM0 through STM_TIM6, that select increasingly higher-order 32-bit ranges of the STM. These can be viewed as individual 32-bit timers, each with a different resolution and timing range. The content of the 56-bit System Timer can be compared with the content of two compare values stored in the STM_CMP0 and STM_CMP1 registers. Interrupts can be generated on a compare match of the STM with the STM_CMP0 or STM_CMP1 registers. The maximum clock period is 256 × fSTM. At fSTM = 80 MHz, for example, the STM counts 28.56 years before overflowing. Thus, it is capable of timing the entire expected product life-time of a system without overflowing continuously. Figure 3-13 shows an overview on the System Timer with the options for reading parts of the STM contents. Data Sheet 71 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description STM Module 31 23 15 7 0 STM_CMP0 Compare Register 0 31 23 15 7 0 STM_CMP1 STMIR1 Interrupt Control 55 47 39 31 Compare Register1 23 15 7 0 STMIR0 56-Bit System Timer Enable / Disable Clock Control 00H 00H STM_TIM5 STM_CAP STM_TIM6 fSTM Address Decoder STM_TIM4 STM_TIM3 PORST STM_TIM2 STM_TIM1 STM_TIM0 MCB06185 Figure 3-13 General Block Diagram of the STM Module Registers Data Sheet 72 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.17 Watchdog Timer The WDT provides a highly reliable and secure way to detect and recover from software or hardware failure. The WDT helps to abort an accidental malfunction of the TC1165/TC1166 in a user-specified time period. When enabled, the WDT will cause the TC1165/TC1166 system to be reset if the WDT is not serviced within a userprogrammable time period. The CPU must service the WDT within this time interval to prevent the WDT from causing a TC1165/TC1166 system reset. Hence, routine service of the WDT confirms that the system is functioning as expected. In addition to this standard “Watchdog” function, the WDT incorporates the End-ofInitialization (Endinit) feature and monitors its modifications. A system-wide line is connected to the WDT_CON0.ENDINIT bit, serving as an additional write-protection for critical registers (besides Supervisor Mode protection). Registers protected via this line can only be modified when Supervisor Mode is active and bit ENDINIT = 0. A further enhancement in the TC1165/TC1166’s WDT is its reset prewarning operation. Instead of resetting the device upon the detection of an error immediately (the way that standard Watchdogs do), the WDT first issues a Non-Maskable Interrupt (NMI) to the CPU before resetting the device at a specified time period later. This step gives the CPU a chance to save the system state to the memory for later investigation of the cause of the malfunction; an important aid in debugging. Features • • • • • • • • • • 16-bit Watchdog counter Selectable input frequency: fSYS/256 or fSYS/16384 16-bit user-definable reload value for normal Watchdog operation, fixed reload value for Time-Out and Prewarning Modes Incorporation of the ENDINIT bit and monitoring of its modifications Sophisticated Password Access mechanism with fixed and user-definable password fields Proper access always requires two write accesses. The time between the two accesses is monitored by the WDT and is limited. Access Error Detection: Invalid password (during first access) or invalid guard bits (during second access) trigger the Watchdog reset generation Overflow Error Detection: An overflow of the counter triggers the Watchdog reset generation. Watchdog function can be disabled; access protection and ENDINIT monitor function remain enabled. Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system malfunction is assumed and the TC1165/TC1166 is held in reset until a power-on or hardware reset occurs. This prevents the device from being periodically reset if, for instance, connection to the external memory has been lost such that system initialization could not even be performed. 73 V1.0, 2008-04 Data Sheet TC1165/TC1166 Preliminary • Functional Description Important debugging support is provided through the reset prewarning operation by first issuing an NMI to the CPU before finally resetting the device after a certain period of time. 3.18 System Control Unit The System Control Unit (SCU) of the TC1165/TC1166 handles several system control tasks. The system control tasks of the SCU are: • • • • • • • • • • • • • • Clock system selection and control Reset and boot operation control Power management control Configuration input sampling External Request Unit System clock output control On-chip SRAM parity control Pad driver temperature compensation control Emergency stop input control for GPTA outputs GPTA input IN1 control Pad test mode control for dedicated pins ODCS level 2 trace control NMI control Miscellaneous SCU control Data Sheet 74 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.19 Boot Options The TC1165/TC1166 booting schemes provide a number of different boot options for the start of code execution. Table 3-7 shows the boot options available in the TC1165/TC1166. Table 3-7 BRKIN TC1165/TC1166 Boot Selections HWCFG [3:0] TESTMODE Type of Boot BootROM Exit Jump Address D400 0000H Normal Boot Options 1 0000B 0001B1) 1 Enter bootstrap loader mode 1: Serial ASC0 boot via ASC0 pins Enter bootstrap loader mode 2: Serial CAN boot via P3.12 and P3.13 pins Start from internal PFLASH A000 0000H Alternate boot mode (ABM): Start Defined in from internal PFLASH after CRC ABM header check is correctly executed; enter or D400 0000H a serial bootstrap loader mode2) if CRC check fails Enter bootstrap loader mode 3: Serial ASC0 boot via P3.12 and P3.13 pins Reserved; execute stop loop 1 irrel. Tri-state chip Reserved; execute stop loop D400 0000H 0010B 0011B 1111B others Debug Boot Options 0 0000B others – – – 1) This option is not applicable to TC1165. 2) The type of the alternate bootstrap loader mode is selected by the value of the SCU_SCLIR.SWOPT[2:0] bit field, which contains the levels of the P0.[2:0] latched in with the rising edge of the HDRST. Data Sheet 75 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.20 Power Management System The TC1165/TC1166 power management system allows software to configure the various processing units so that they automatically adjust to draw the minimum necessary power for the application. There are three power management modes: • • • Run Mode Idle Mode Sleep Mode The operation of each system component in each of these states can be configured by software. The power-management modes provide flexible reduction of power consumption through a combination of techniques, including stopping the CPU clock, stopping the clocks of other system components individually, and individually clockspeed reduction of some peripheral components. Besides these explicit software-controlled power-saving modes, special attention has been paid to automatic power-saving in those operating units which are not required at a certain point of time, or idle in the TC1165/TC1166. In that case, they are shut off automatically until their operation is required again. Table 3-8 describes the features of the power management modes. Table 3-8 Mode Run Idle Power Management Mode Summary Description The system is fully operational. All clocks and peripherals are enabled, as determined by software. The CPU clock is disabled, waiting for a condition to return it to Run Mode. Idle Mode can be entered by software when the processor has no active tasks to perform. All peripherals remain powered and clocked. Processor memory is accessible to peripherals. A reset, Watchdog Timer event, a falling edge on the NMI pin, or any enabled interrupt event will return the system to Run Mode. The system clock signal is distributed only to those peripherals programmed to operate in Sleep Mode. The other peripheral module will be shut down by the suspend signal. Interrupts from operating peripherals, the Watchdog Timer, a falling edge on the NMI pin, or a reset event will return the system to Run Mode. Entering this state requires an orderly shut-down controlled by the Power Management State Machine. Sleep In typical operation, Idle Mode and Sleep Mode may be entered and exited frequently during the run time of an application. For example, system software will typically cause the CPU to enter Idle Mode each time it has to wait for an interrupt before continuing its tasks. In Sleep Mode and Idle Mode, wake-up is performed automatically when any Data Sheet 76 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description enabled interrupt signal is detected, or when the count value (WDT_SR.WDTTIM) changes from 7FFFH to 8000H. 3.21 On-Chip Debug Support Figure 3-14 shows a block diagram of the TC1165/TC1166 OCDS system. OCDS L1 BCU OCDS L2 PCP OCDS L1 SPB Peripheral Unit 1 Multiplexer DMA L2 OCDS2[15:0] 16 OCDS OCDS TriCore L2 L1 Watchdog Timer Enable, Control and Reset SPB Peripheral Unit n Break and Suspend Signals TDI TMS TCK TRST BRKIN BRKOUT JTAG Controller Cerberus TDO DMA OSCU JDI Debug I/F MCBS Break Switch System Peripheral Bus MCB06195 Figure 3-14 OCDS System Block Diagram The TC1165/TC1166 basically supports two levels of debug operation: • • OCDS Level 1 debug support OCDS Level 2 debug support Data Sheet 77 V1.0, 2008-04 TC1165/TC1166 Preliminary OCDS Level 1 Debug Support The OCDS Level 1 debug support is mainly assigned for real-time software debugging purposes which have a demand for low-cost standard debugger hardware. The OCDS Level 1 is based on a JTAG interface that is used by the external debug hardware to communicate with the system. The on-chip Cerberus module controls the interactions between the JTAG interface and the on-chip modules. The external debug hardware may become master of the internal buses, and read or write the on-chip register/memory resources. The Cerberus also makes it possible to define breakpoint and trigger conditions as well as to control user program execution (run/stop, break, single-step). OCDS Level 2 Debug Support The OCDS Level 2 debug support makes it possible to implement program tracing capabilities for enhanced debuggers by extending the OCDS Level 1 debug functionality with an additional 16-bit wide trace output port with trace clock. With the trace extension, the following four trace capabilities are provided (only one of the four trace capabilities can be selected at a time): • • • • Trace of the CPU program flow Trace of the PCP2 program flow Trace of the DMA Controller transaction requests Trace of the DMA Controller Move Engine status information Functional Description Data Sheet 78 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.22 • • • • • • Clock Generation and PLL The TC1165/TC1166 clock system performs the following functions: Acquires and buffers incoming clock signals to create a master clock frequency Distributes in-phase synchronized clock signals throughout the TC1165/TC1166’s entire clock tree Divides a system master clock frequency into lower frequencies required by the different modules for operation. Dynamically reduces power consumption during operation of functional units Statically reduces power consumption through programmable power-saving modes Reduces electromagnetic interference (EMI) by switching off unused modules The clock system must be operational before the TC1165/TC1166 can function, so it contains special logic to handle power-up and reset operations. Its services are fundamental to the operation of the entire system, so it contains special fail-safe logic. Features • • • • PLL operation for multiplying clock source by different factors Direct drive capability for direct clocking Comfortable state machine for secure switching between basic PLL, direct or prescaler operation Sleep and Power-Down Mode support The TC1165/TC1166 Clock Generation Unit (CGU) as shown in Figure 3-15 allows a very flexible clock generation. It basically consists of an main oscillator circuit and a Phase- Locked Loop (PLL). The PLL can converts a low-frequency external clock signal from the oscillator circuit to a high-speed internal clock for maximum performance. The system clock fSYS is generated from an oscillator clock fOSC in either one of the four hardware/software selectable ways: • Direct Drive Mode (PLL Bypass): In Direct Drive Mode, the TC1165/TC1166 clock system is directly driven by an external clock signal. input, i.e. fCPU = fOSC and fSYS = fOSC. This allows operation of the TC1165/TC1166 with a reasonably small fundamental mode crystal. VCO Bypass Mode (Prescaler Mode): In VCO Bypass Mode, fCPU and fSYS are derived from fOSC by the two divider stages, P-Divider and K-Divider. The system clock fSYS is equal to fCPU. PLL Mode: In PLL Mode, the PLL is running. The VCO clock fVCO is derived from fOSC, divided by the P factor, multiplied by the PLL (N-Divider). The clock signals fCPU and fSYS are derived from fVCO by the K-Divider. The system clock fSYS is equal to fCPU. PLL Base Mode: In PLL Base Mode, the PLL is running at its VCO base frequency and fCPU and fSYS • • • Data Sheet 79 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description are derived from fVCO only by the K-Divider. In this mode, the system clock fSYS is equal to fCPU. XTAL1 Oscillator Circuit XTAL2 Osc. Run Detect. fOSC Clock Generation Unit (CGU) 1:1 Divider 1 P Divider ≥1 Phase Detect. fVCO VCO 0 M U X K:1 Divider M U X fSYS fCPU N Divider PLL Lock Detector BYPASS OGC MOSC OSCR PDIV OSC [2:0] DISC PLL_ LOCK NDIV VCO_ VCO_ KDIV SYS PLL_ [6:0] SEL[1:0] BYPASS [3:0] FSL BYPASS Register OSC_CON OSC_ BYPASS Register PLL_CLC System Control Unit (SCU) MCA06083 Figure 3-15 Clock Generation Unit Recommended Oscillator Circuits The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal oscillator or an external stable clock source. It basically consists of an inverting amplifier and a feedback element with XTAL1 as input, and XTAL2 as output. When using a crystal, a proper external oscillator circuitry must be connected to both pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz to 25 MHz. Additionally, it is necessary to have two load capacitances CX1 and CX2, and depending on the crystal type, a series resistor RX2, to limit the current. A test resistor RQ may be temporarily inserted to measure the oscillation allowance (negative resistance) of the oscillator circuitry. RQ values are typically specified by the crystal vendor. The CX1 and CX2 values shown in Figure 3-16 can be used as starting points for the negative resistance evaluation and for non-productive systems. The exact values and related operating range are dependent on the crystal frequency and have to be determined and optimized together with the crystal vendor using the negative resistance method. Data Sheet 80 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description Oscillation measurement with the final target system is strongly recommended to verify the input amplitude at XTAL1 and to determine the actual oscillation allowance (margin negative resistance) for the oscillator-crystal system. When using an external clock signal, the signal must be connected to XTAL1. XTAL2 is left open (unconnected). The external clock frequency can be in the range of 0 - 40 MHz if the PLL is bypassed, and 4 - 40 MHz if the PLL is used. The oscillator can also be used in combination with a ceramic resonator. The final circuitry must also be verified by the resonator vendor. Figure 3-16 shows the recommended external oscillator circuitries for both operating modes, external crystal mode and external input clock mode. A block capacitor is recommended to be placed between VDDOSC/VDDOSC3 and VSSOSC. V DDOSC VDDOSC3 VDDOSC V DDOSC3 XTAL1 4 - 25 MHz TC1165/TC1166 Oscillator f OSC External Clock Signal 4 - 40 MHz XTAL1 TC1165/TC1166 Oscillator XTAL2 fOSC RQ R X2 XTAL2 CX1 CX2 Fundamental Mode Crystal VSSOSC R X2 1) 0 0 0 0 V SSOSC Crystal Frequency CX1, CX2 1) 4 MHz 8 MHz 12 MHz 16 - 25 MHz 33 18 12 10 pF pF pF pF 1) Note that these are evaluation start values! TC1165/TC1166 Oscillator Circuitry Figure 3-16 Oscillator Circuitries Note: For crystal operation, it is strongly recommended to measure the negative resistance in the final target system (layout) to determine the optimum parameters for the oscillator operation. Please refer to the minimum and maximum values of the negative resistance specified by the crystal supplier. Data Sheet 81 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.23 • • Power Supply The TC1165/TC1166 has several power supply lines for different voltage classes: 1.5 V: Core logic, oscillator and A/D converter supply 3.3 V: I/O ports, Flash memories, oscillator, and A/D converter supply with reference voltages Figure 3-17 shows the power supply concept of the TC1165/TC1166 with the power supply pins and its connections to the functional units. VDDM (3.3V) VAREF (3.3V) VDDAF (1.5V) V DDMF (3.3V) VFAREF (3.3V) V SSM 2 V AGND 2 VSSAF 2 VSSMF 2 V FAGND 2 TC1165/TC1166 ADC FADC V SSA 1 (1.5 V) 1 V DDA PLL Core Ports Flash Memories OSC 9 7 8 1 3 V SS V DD (1.5 V) V DDP (3.3 V) V DDFL3 3.3 V V DDOSC3 (3.3 V) V DDOSC (1.5 V) V SSOSC TC1165/TC1166 PwrSupply Figure 3-17 Power Supply Concept of TC1165/TC1166 Data Sheet 82 V1.0, 2008-04 TC1165/TC1166 Preliminary Functional Description 3.24 Identification Register Values Table 3-9 shows the address map and reset values of the TC1165/TC1166 Identification Registers. Table 3-9 Short Name SCU_ ID MANID CHIPID RTID SBCU_ID STM_ID CBS_ JDPID MSC0_ ID ASC0_ ID ASC1_ ID GPTA0_ ID DMA_ID CAN_ID 1) TC1165/TC1166 Identification Registers Address F000 0008H F000 0070H F000 0074H F000 0078H F000 0108H F000 0208H F000 0408H F000 0808H F000 0A08H F000 0B08H F000 1808H F000 3C08H F000 4008H F010 0108H F010 0308H F010 0408H F010 C008H F010 C208H F7E0 FF08H F7E1 FE18H F800 0508H F800 2008H F87F FC08H F87F FD08H F87F FE08H F87F FF08H Reset Value 002C C002H 0000 1820H 0000 8B02H 0000 0001H 0000 0007H 0000 6A0AH 0000 C006H 0000 6307H 0028 C001H 0000 4402H 0000 4402H 0029 C004H 001A C012H 002B C012H 0000 4510H 0027 C012H 0030 C001H 0025 C006H 001B C001H 0015 C006H 000A C005H 002E C012H 0041 C002H 0008 C004H 000B C004H 000F C005H 000C C005H 83 Stepping – – – AA-Step AB-Step – – – – – – – – – – – – – – – – – – – – – – V1.0, 2008-04 SSC0_ ID FADC_ ID ADC0_ID MLI0_ ID MCHK_ ID CPS_ID CPU_ID PMU_ID FLASH_ID DMI_ID PMI_ID LBCU_ID LFI_ID Data Sheet TC1165/TC1166 Preliminary 1) The address and reset value of CAN_ID is not applicable to TC1165. Functional Description Data Sheet 84 V1.0, 2008-04 TC1165/TC1166 Preliminary Electrical Parameters 4 Electrical Parameters Chapter 4 provides the characteristics of the electrical parameters which are implementation-specific for the TC1165/TC1166. 4.1 General Parameters The general parameters are described here to aid the users in interpreting the parameters mainly in Section 4.2 and Section 4.3. The absolute maximum ratings and its operating conditions are provided for the appropriate setting in the TC1165/TC1166. 4.1.1 Parameter Interpretation The parameters listed in this section partly represent the characteristics of the TC1165/TC1166 and partly its requirements on the system. To aid interpreting the parameters easily when evaluating them for a design, they are marked with an two-letter abbreviation in column “Symbol”: • CC Such parameters indicate Controller Characteristics which are a distinctive feature of the TC1165/TC1166 and must be regarded for a system design. SR Such parameters indicate System Requirements which must provided by the microcontroller system in which the TC1165/TC1166 designed in. • Data Sheet 85 V1.0, 2008-04 TC1165/TC1166 Preliminary Electrical Parameters 4.1.2 Pad Driver and Pad Classes Summary This section gives an overview on the different pad driver classes and its basic characteristics. More details (mainly DC parameters) are defined in Section 4.2.1. Table 4-1 Pad Driver and Pad Classes Overview Sub Class A1 (e.g. GPIO) A2 (e.g. serial I/Os) Speed Load Grade 6 MHz 40 MHz Leakage1) Termination No Series termination recommended Series termination recommended (for f > 25 MHz) Series termination recommended Parallel termination2), 100Ω ± 10% Class Power Type Supply A 3.3V LVTTL I/O, LVTTL outputs 100 pF 500 nA 50 pF 6 µA A3 80 (e.g. BRKIN, MHz/ BRKOUT) A4 (e.g. Trace Clock) C 3.3V LVDS – 80 MHz 50 MHz 50 pF 6 µA 25 pF 6 µA – D – Analog inputs, reference voltage inputs 1) Values are for TJmax = 125 °C. 2) In applications where the LVDS pins are not used (disabled), these pins must be either left unconnected, or properly terminated with the differential parallel termination of 100Ω ± 10%. Data Sheet 86 V1.0, 2008-04 TC1165/TC1166 Preliminary Electrical Parameters 4.1.3 Absolute Maximum Ratings Table 4-2 shows the absolute maximum ratings of the TC1165/TC1166 parameters. Table 4-2 Parameter Ambient temperature Absolute Maximum Rating Parameters Symbol Limit Values Min. Max. 85 150 125 2.25 3.75 °C °C °C V V V Under bias – Under bias – – Whatever is lower Whatever is lower Whatever is lower SR -40 SR -65 SR -40 SR – SR – SR -0.5 Unit Notes TA Storage temperature TST Junction temperature TJ Voltage at 1.5 V power supply VDD pins with respect to VSS1) Voltage at 3.3 V power supply VDDP pins with respect to VSS2) Voltage on any Class A input VIN pin and dedicated input pins with respect to VSS Voltage on any Class D analog input pin with respect to VAGND Voltage on any Class D analog input pin with respect to VSSAF CPU & LMB Bus Frequency FPI Bus Frequency VDDP + 0.5 or max. 3.7 VAIN, VAREFx VAINF, VFAREF fCPU fSYS SR -0.5 VDDM + 0.5 or max. 3.7 V SR -0.5 VDDMF + 0.5 V or max. 3.7 803) 803) SR – SR – MHz – MHz 4) 1) Applicable for VDD, VDDOSC, VDDPLL, and VDDAF. 2) Applicable for VDDP, VDDFL3, VDDM, and VDDMF. 3) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter parameters. 4) The ratio between fCPU and fSYS is fixed at 1:1. Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions (VIN > related VDD or VIN < VSS) the voltage on the related VDD pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Data Sheet 87 V1.0, 2008-04 TC1165/TC1166 Preliminary Electrical Parameters 4.1.4 Operating Conditions The following operating conditions must not be exceeded in order to ensure correct operation of the TC1165/TC1166. All parameters specified in the following table refer to these operating conditions, unless otherwise noted. Table 4-3 Parameter Operating Condition Parameters Symbol Limit Values Min. Digital supply voltage1) Max. 1.582) V 3.473) V – For Class A pins (3.3V ± 5%) – – – See separate specification Page 4-94, Page 4-101 6) Unit Notes Conditions VDD VDDOSC VDDP VDDOSC3 VDDFL3 VSS TA – SR SR 1.42 3.13 SR SR SR 3.13 0 -40 – 3.473) V V +85 – °C – Digital ground voltage Ambient temperature under bias Analog supply voltages fCPU Short circuit current ISC Absolute sum of short circuit Σ|ISC| CPU clock currents of a pin group (see Table 4-4) Absolute sum of short circuit currents of the device Inactive device pin current Σ|ISC| SR SR SR –4) -5 – 805) +5 20 MHz – mA mA See note7) SR SR – -1 100 1 mA mA See note 7) Voltage on all power supply pins VDDx = 0 Depending on pin class IID External load capacitance CL SR – See pF DC chara cterist ics Data Sheet 88 V1.0, 2008-04 TC1165/TC1166 Preliminary Electrical Parameters 1) Digital supply voltages applied to the TC1165/TC1166 must be static regulated voltages which allow a typical voltage swing of ±5%. 2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less than 100 µs and the cumulated summary of the pulses does not exceed 1 h. 3) Voltage overshoot to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less than 100 µs and the cumulated summary of the pulses does not exceed 1 h. 4) The TC1165/TC1166 uses a static design, so the minimum operation frequency is 0 MHz. Due to test time restriction no lower frequency boundary is tested, however. 5) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter parameters. 6) Applicable for digital outputs. 7) See additional document “TC1796 Pin Reliability in Overload“ for overload current definitions. Data Sheet 89 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 4-4 Group 1 2 3 4 5 6 7 8 Electrical Parameters Pin Groups for Overload/Short-Circuit Current Sum Parameter Pins TRCLK, P5.[7:0], P0.[7:6], P0.[15:14] P0.[13:12], P0.[5:4], P2.[13:8], SOP0A, SON0, FCLP0A, FCLN0 P0.[11:8], P0.[3:0], P3.[13:11] P3[10:0], P3.[15:14] HDRST, PORST, NMI, TESTMODE, BRKIN, BRKOUT, BYPASS, TCK, TRST, TDO, TMS, TDI, P1.[7:4] P1.[3:0], P1.[11:8], P4.[3:0] P2.[7:0], P1.[14:12] P5.[15:8] Data Sheet 90 V1.0, 2008-04 TC1165/TC1166 Preliminary Electrical Parameters 4.2 DC Parameters The electrical characteristics of the DC Parameters are detailed in this section. 4.2.1 Input/Output Pins Table 4-5 provides the characteristics of the input/output pins of the TC1165/TC1166. Table 4-5 Parameter Input/Output DC-Characteristics (Operating Conditions apply) Symbol Limit Values Min. General Parameters Pull-up current1) |IPUH| CC 10 20 Pull-down current1) |IPDL| CC 10 20 Pin capacitance1) (Digital I/O) Input low voltage class A1/A2 pins 100 200 150 200 10 µA µA µA µA pF Max. Unit Test Conditions VIN < VIHAmin; class A1/A2/Input pads. VIN < VIHAmin; class A3/A4 pads. VIN > VILAmax; class A1/A2/Input pads. VIN > VILAmax; class A3/A4 pads. CIO CC – f = 1 MHz TA = 25 °C – Whatever is lower Input only Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%) VILA SR SR -0.3 0.64 × 0.34 × V V Input high voltage VIHA class A1/A2 pins Ratio VIL/VIH Input low voltage class A3 pins VDDP VDDP+ 0.3 or max. 3.6 – 0.8 – – ±3000 ±6000 VDDP CC 0.53 – V V V nA – – – 2)5) VILA3 SR SR – 2.0 Input high voltage VIHA3 class A3 pins Input hysteresis Input leakage current HYSA CC 0.1 × VDDP IOZI CC – ((VDDP/2)-1) < VIN < ((VDDP/2)+1) otherwise3) Data Sheet 91 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 4-5 Parameter Electrical Parameters Input/Output DC-Characteristics (cont’d)(Operating Conditions Symbol Limit Values Min. Output low voltage4) Max. 0.4 V Unit Test Conditions Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%) VOLA CC – IOL = 2 mA for strong driver mode, (Not applicable to Class A1 pins) IOL = 1.8 mA for medium driver mode, A2 pads IOL = 1.4 mA for medium driver mode, A1 pads IOL = 370 µA for weak driver mode Output high voltage3) VOHA CC 2.4 – V IOH = -2 mA for strong driver mode, (Not applicable to Class A1 pins) IOH = -1.8 mA for medium driver mode, A1/A2 pads IOH = -370 µA for weak driver mode VDDP 0.4 – V IOH = -1.4 mA for strong driver mode, (Not applicable to Class A1 pins) IOH = -1 mA for medium driver mode, A1/A2 pads IOH = -280 µA for weak driver mode Input low voltage class A1/2 pins VILA SR SR -0.3 0.64 × 0.34 × V V – Whatever is lower Input high voltage VIHA class A1/2 pins Ratio VIL/VIH Input hysteresis VDDP VDDP + 0.3 or 3.6 – – VDDP CC 0.53 – V – 2)5) HYSA CC 0.1 × VDDP Data Sheet 92 V1.0, 2008-04 TC1165/TC1166 Preliminary Table 4-5 Parameter Input leakage current Class A2/3/4 pins Input leakage current Class A1 pins Electrical Parameters Input/Output DC-Characteristics (cont’d)(Operating Conditions Symbol Limit Values Min. Max. ±3000 ±6000 nA ((VDDP/2)-1) < VIN
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