TC1796

D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8 TC1796 3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r TriCore M i c r o c o n t r o l l e rs Edition 2008-04 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8 TC1796 3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r TriCore M i c r o c o n t r o l l e rs TC1796 TC1796 Data Sheet Revision History: V1.0, 2008-04 Previous Version: V1.0, 2008-04 “Preliminary” Page Subjects (major changes since last revision) “Preliminary” status removed. No changes in content. Changes from V0.7, 2006-03 to V1.0, 2008-04 Preliminary 32 69 80 85 96 107 115 126 131 133 Trademarks TriCore® is a trademark of Infineon Technologies AG. We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com The list of not connected pins (N.C.) improved by adding several formerly as VSS labeled pins. Watchdog timer, double reset detection, description corrected. RTID register updated for the design step BE. The description of the inactive device current improved. ADC parameters sample and conversion time moved to a dedicated table. The description of the power supply sequence improved.. BFCLKO clock, duty cycle description extended. MLI timing, maximum operating frequency limit extended, t31 added. The drawing of the package updated. Green package variant included. Example of a temperature profile corrected. Data Sheet V1.0, 2008-04 TC1796 Table of Contents Table of Contents 1 2 2.1 2.2 2.3 2.4 2.5 2.5.1 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.14.1 3.14.2 3.15 3.16 3.17 3.18 3.19 3.20 3.21 3.22 3.23 3.24 3.25 4 4.1 4.1.1 Data Sheet Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TC1796 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pad Driver and Input Classes Overview . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pull-Up/Pull-Down Behavior of the Pins . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . . On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Bus Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peripheral Control Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . . High-Speed Synchronous Serial Interfaces (SSC0, SSC1) . . . . . . . . . . . . Micro Second Bus Interfaces (MSC0, MSC1) . . . . . . . . . . . . . . . . . . . . . . MultiCAN Controller (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Micro Link Serial Bus Interface (MLI0, MLI1) . . . . . . . . . . . . . . . . . . . . . . . General Purpose Timer Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functionality of GPTA0/GPTA1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functionality of LTCA2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog-to-Digital Converter (ADC0, ADC1) . . . . . . . . . . . . . . . . . . . . . . . . Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . . System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 11 12 13 13 35 36 36 37 39 40 41 42 44 46 48 50 52 54 57 59 60 62 63 65 67 69 70 70 73 74 76 79 80 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 5 V1.0, 2008-04 TC1796 Table of Contents 4.1.2 Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 83 4.1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 4.1.4 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 4.2 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 4.2.1 Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 4.2.2 Analog to Digital Converters (ADC0/ADC1) . . . . . . . . . . . . . . . . . . . . . 92 4.2.3 Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . . 99 4.2.4 Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 4.2.5 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 4.2.6 Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 4.3 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 4.3.1 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 4.3.2 Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 4.3.3 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 4.3.4 Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 4.3.5 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 4.3.6 BFCLKO Output Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 4.3.7 Debug Trace Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 4.3.8 JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 4.3.9 EBU Demultiplexed Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 4.3.9.1 Demultiplexed Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 4.3.9.2 Demultiplexed Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 4.3.10 EBU Burst Mode Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 4.3.11 EBU Arbitration Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 4.3.12 Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 4.3.12.1 Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 126 4.3.12.2 Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 128 4.3.12.3 Synchronous Serial Channel (SSC) Master Mode Timing . . . . . . . . 129 5 5.1 5.2 5.3 5.4 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters (P/PG-BGA-416-4) . . . . . . . . . . . . . . . . . . . . . . . . Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 130 131 132 133 Data Sheet 6 V1.0, 2008-04 TC1796 Summary of Features 1 • Summary of Features High-performance 32-bit super-scalar TriCore V1.3 CPU with 4-stage pipeline – Superior real-time performance – Strong bit handling – Fully integrated DSP capabilities – Single precision Floating Point Unit (FPU) – 150 MHz operation at full temperature range 32-bit Peripheral Control Processor with single cycle instruction (PCP2) – 16 Kbyte Parameter Memory (PRAM) – 32 Kbyte Code Memory (CMEM) Multiple on-chip memories – 2 Mbyte Program Flash Memory (PFLASH) with ECC – 128 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation – 136 Kbyte Data Memory (LDRAM, SRAM, SBRAM) – 8 Kbyte Dual-Ported Memory (DPRAM) – 48 Kbyte Code Scratchpad Memory (SPRAM) – 16 Kbyte Instruction Cache (ICACHE) – 16 Kbyte BootROM (BROM) 16-Channel DMA Controller 32-bit External Bus Interface Unit (EBU) with – 75 dedicated address/data bus, clock, and control lines – Synchronous burst Flash access capability Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels serviced by CPU or PCP2 High performing on-chip bus structure – Two 64-bit Local Memory Buses between EBU, Flash and Data Memory – 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units – 32-bit Remote Peripheral Bus (RPB) for high-speed on-chip peripheral units – Two bus bridges (LFI Bridge, DMA Controller) Peripheral Control Processor with single cycle instruction (PCP2) – 16 Kbyte Parameter Memory (PRAM) – 32 Kbyte Code Memory (CMEM) Versatile On-chip Peripheral Units – Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator, parity, framing and overrun error detection – Two High-Speed Synchronous Serial Channels (SSC) with programmable data length and shift direction – Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external power devices – Two High-Speed Micro Link interfaces (MLI) for serial inter-processor communication • • • • • • • • Data Sheet 7 V1.0, 2008-04 TC1796 Summary of Features – One MultiCAN Module with four CAN nodes and 128 free assignable message objects for high efficiency data handling via FIFO buffering and gateway data transfer (one CAN node supports TTCAN functionality) – Two General Purpose Timer Array Modules (GPTA) with additional Local Timer Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer functionality to realize autonomous and complex Input/Output management – Two 16-channel Analog-to-Digital Converter units (ADC) with selectable 8-bit, 10bit, or 12-bit resolution – One 4-channel Fast Analog-to-Digital Converter unit (FADC) with concatenated comb filters for hardware data reduction: supporting 10-bit resolution, min. conversion time of 280ns 44 analog input lines for ADC and FADC 123 digital general purpose I/O lines, 4 input lines Digital I/O ports with 3.3 V capability On-chip debug support for OCDS Level 1 and 2 (CPU, PCP3, DMA) Dedicated Emulation Device chip for multi-core debugging, tracing, and calibration via USB V1.1 interface available (TC1796ED) Power Management System Clock Generation Unit with PLL Core supply voltage of 1.5 V I/O voltage of 3.3 V Full automotive temperature range: -40° to +125°C P/PG-BGA-416-4 package • • • • • • • • • • • Data Sheet 8 V1.0, 2008-04 TC1796 Summary of Features Ordering Information The ordering code for Infineon microcontrollers provides an exact reference to the required product. This ordering code identifies: • • The derivative itself, i.e. its function set, the temperature range, and the supply voltage The package and the type of delivery. For the available ordering codes for the TC1796 please refer to the “Product Catalog Microcontrollers”, which summarizes all available microcontroller variants. This document describes the derivatives of the device.The Table 1 enumerates these derivatives and summarizes the differences. Table 1 Derivative SAK-TC1796-256F150E TC1796 Derivative Synopsis Ambient Temperature Range TA = -40oC to +125oC Data Sheet 9 V1.0, 2008-04 TC1796 General Device Information 2 2.1 General Device Information TC1796 Block Diagram PMI 48 KB SPRAM 16 KB ICACHE FPU TriCore (TC1M) CPS Program Local Memory Bus DMI 56 KB LDRAM 8 KB DPRAM SPRAM: ICACHE: LDRAM DPRAM: BROM: PFLASH: DFLASH: SBRAM: SRAM: PRAM: CMEM: PLMB: DLMB: RPB: SPB: shaded: Remote Peripheral Bus Scratch-Pad RAM Instruction cache Local data RAM Dual-port RAM Boot ROM Program Flash Memory Data Flash Memory Stand-by Data Memory Data Memory PCP Parameter Memory PCP Code Memory Program Local Memory Bus Data Local Memory Bus Remote Peripheral Bus System Peripheral Bus only available in TC 1796ED Data Local Memory Bus DLMB PBCU P LMB DBCU PMU EBU 16 KB BROM 2 MB PFLASH 128 KB DFLASH Emulation Memory Interface OCDS Debug Interface /JTAG ASC0 F PI-Bus Interface LFI Bridge LMI 16 KB PRAM Interrupts DMU 64 KB SRAM 16 KB SBRAM SSC0 PCP2 Core STM S SC1 Analog Input Assignment MCB05573_mod RP B System Peripheral Bus ASC1 32 KB CMEM SBCU S PB G PTA0 ADC0 GPTA1 S CU PLL fCPU fFPI Ports ADC1 BI0 LTCA2 BI1 DMA SMIF FADC RBCU MultiCAN (with 4 CAN Nodes) MSC 0 MSC 1 MLI 0 MLI 1 MEM CHK Figure 1 TC1796 Block Diagram Data Sheet 10 V1.0, 2008-04 TC1796 General Device Information 2.2 Logic Symbol TSTRES TESTMODE General Control HDRST PORST NMI BYPASS XTAL1 XTAL2 Oscillator 5 13 D[31:0] A[23:0] Chip Select Control BFCLKI BFLCKO 16 16 14 16 16 8 TC1796 12 8 8 9 9 4 6 8 Port 0 Port 1 Port 2 Port 3 GPTA Port 4 Port 5 Port 6 Port 7 Port 8 Port 9 Port 10 ASC0 / ASC1 / MSC0 / MSC1 /MLI0 ASC0 / ASC1 / SSC1 / CAN ADC0 / ADC1 MLI 1 / GPTA MSC0 / MSC1 / GPTA HWCFG Dedicated SSC0 I/O Lines LVDS MSC Outputs ADC Analog Inputs ADC0 /ADC1 Analog Power Supply MCA05583_mod External Bus Unit Interface VD D OSC VD DOSC3 VSSOSC TRST TCK TDI TDO TMS BRKIN BRKOUT TR[15:0] TRCLK Alternate Functions : MLI0 / SCU SSC0 / SSC1 / GPTA JTAG / OCDS Digital Circuitry Power Supply VD DEBU 11 VD D P 13 VD D 2 VD D FL3 VD D SBRAM 62 VSS V FAR EF VFAGN D VD D MF VSSMF VDD AF VSSAF N.C. 10 AN[43:0] 2 2 FADC Analog Power Supply VAR EFx VAGND x VD D M VSSM Figure 2 Data Sheet TC1796 Logic Symbol 11 V1.0, 2008-04 TC1796 General Device Information 2.3 1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF N.C. P2.6 P2.5 P2.4 2 Pin Configuration 3 4 5 6 7 P0.2 P0.4 8 P0.1 9 10 11 12 P3.1 P3.0 P3.4 13 P5.1 P5.0 P3.2 14 P5.2 P5.3 P5.5 15 P5.7 P5.6 P5.4 16 SO N1 SO P1A SO P0A 17 18 19 20 21 22 NMI 23 24 25 26 P2.9 P2.13 P2.15 P0.14 P0.5 P2.7 P2.10 P2.14 P0.9 P0.6 P0.0 P3.14 P3.5 P3.3 FCL V DDFL3 P9.0 P1A FCL V DDFL3 P9.1 N1 FCL N0 SO N0 FCL P0A P9.4 P9.6 P9.5 P9.3 P10.0 HD BY VDDP RST PASS VSS VDD BRK IN BRK OUT A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF P0.3 P3.15 P3.6 P0.7 PO TEST V P9.2 P10.1 RST MODE DDP P9.8 P10.2 N.C. P9.7 P10.3 VDDP VSS VDD TDO TDI P2.8 P2.11 P2.12 P0.12 P0.10 P0.8 P2.3 P2.2 P0.15 P0.13 P0.11 VDDP P6.9 P6.8 P6.5 P3.7 P3.10 P3.9 VDDP VSS VDD VSS VDD TCK VSS VDD P3.8 P3.12 P3.13 P3.11 VDDP VSS VDD P6.12 P6.11 P6.6 P6.14 P6.10 P6.4 P6.15 P6.13 P6.7 P8.1 P8.4 P8.7 P8.0 P8.3 P8.5 N.C. P8.2 P8.6 VDD OSC3 TRST TMS N.C. VSS OSC VDD OSC TST XTAL XTAL RES 2 1 VDD VSS VDDP TR12 TR13 TR15 TR11 TR10 TR14 TR9 TR8 VDDEBU VDDEBU VDDEBU VDDEBU A5 A0 A6 A13 A1 A3 A7 A11 A17 A20 A23 D3 D5 D8 D12 D14 D17 D20 D25 D27 D29 A2 A4 A8 A10 A14 A18 A22 D0 D2 D4 D7 D10 D11 D15 D23 D24 D26 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS A9 P1.15 P1.14 P1.13 P1.11 P1.10 P1.9 P1.3 P1.2 P1.7 P1.1 P7.1 P7.5 P1.8 P1.6 P1.5 P1.4 VSS VSS VSS VSS TR5 TR1 TR0 VDDEBU A12 A15 A16 A19 A21 D1 D9 D13 D16 VSS VSS TR6 TR CLK TR4 VSS VSS TR7 TR3 TR2 P1.0 P1.12 P7.0 P7.4 P7.3 VDD VSS VDDEBU D6 VDD SBRAM VDD VSS P7.2 P7.6 AN23 P7.7 AN22 AN21 AN19 AN16 AN20 AN17 AN13 VDDM AN18 AN14 AN10 VSSM AN15 AN11 AN12 AN8 AN6 AN0 N.C. 1 AN9 AN4 AN1 AN5 AN3 AN2 AN7 VDD VSS VDDEBU D18 D19 D22 D21 D28 D31 D30 VDD VSS P4.0 AN32 AN38 AN42 VAGND1 AN26 AN24 VDDAF AN34 AN40 AN35 VAREF1 AN27 AN25 VSSAF VDD P4.2 P4.3 P4.4 SLSO VDDP P4.8 P4.12 1 VSS VDDEBU VSS VDD CS2 N.C. VDDEBU VSS P4.5 P4.11 P4.15 SLSI0 VDDP SLSO MRST VDDP P4.7 P4.13 0 0 BC1 HLDA CS3 BC0 CS1 BREQ N.C. CS0 RD/ WR 21 N.C. ADV 22 N.C. BAA 23 AN33 AN36 AN41 VAREF0 AN28 AN30 VFAGND VDDMF P4.1 AN37 AN39 AN43 VAGND0 AN29 AN31 VFAREF VSSMF 2 3 4 5 6 7 8 9 P4.6 10 CS BC3 WAIT COMB SCLK MTSR VDDP HOLD BC2 MR/W P4.9 P4.10 P4.14 0 0 11 12 13 14 15 16 17 18 19 RD 20 BF BF CLKI CLKO N.C. 24 25 26 MCA05584 Figure 3 TC1796 Pinning for P/PG-BGA-416-4 Package (Top view) Data Sheet 12 V1.0, 2008-04 TC1796 General Device Information 2.4 Pad Driver and Input Classes Overview The TC1796 provides different types and classes of input and output lines. For understanding of the abbreviations in Table 2 starting at the next page, Table 4 gives an overview on the pad type and class types. 2.5 Pin Definitions and Functions Data Sheet 13 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions Pins I/O Pad Class I/O B1 Power Functions Supply External Bus Interface Lines (EBU) D[31:0] VDDEBU D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 T26 T24 U26 T25 V26 U25 U23 W26 V25 U24 Y26 AA26 W25 V24 Y25 AB26 W24 AA25 Y24 AA23 AB25 AB24 AA24 AC26 AD26 AC25 AE26 AD25 AC24 AE25 AE24 AD24 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O EBU Data Bus Lines The EBU Data Bus Lines D[31:0] serve as external data bus. Data bus line 0 Data bus line 1 Data bus line 2 Data bus line 3 Data bus line 4 Data bus line 5 Data bus line 6 Data bus line 7 Data bus line 8 Data bus line 9 Data bus line 10 Data bus line 11 Data bus line 12 Data bus line 13 Data bus line 14 Data bus line 15 Data bus line 16 Data bus line 17 Data bus line 18 Data bus line 19 Data bus line 20 Data bus line 21 Data bus line 22 Data bus line 23 Data bus line 24 Data bus line 25 Data bus line 26 Data bus line 27 Data bus line 28 Data bus line 29 Data bus line 30 Data bus line 31 Data Sheet 14 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol A[23:0] Pin Definitions and Functions (cont’d) Pins I/O Pad Class O B1 Power Functions Supply VDDEBU A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 CS0 CS1 CS2 CS3 CS COMB J24 J25 J26 K25 K26 J23 K24 L25 L26 K23 M26 M25 M24 L24 N26 N23 N24 N25 P26 P24 P25 R24 R26 R25 AE21 AD21 AD20 AD19 AE19 O O O O O O O O O O O O O O O O O O O O O O O O B1 O O O O O B1 EBU Address Bus Lines A[23:0] The EBU Address Bus Lines serve as external address bus. Address bus line 0 Address bus line 1 Address bus line 2 Address bus line 3 Address bus line 4 Address bus line 5 Address bus line 6 Address bus line 7 Address bus line 8 Address bus line 9 Address bus line 10 Address bus line 11 Address bus line 12 Address bus line 13 Address bus line 14 Address bus line 15 Address bus line 16 Address bus line 17 Address bus line 18 Address bus line 19 Address bus line 20 Address bus line 21 Address bus line 22 Address bus line 23 Chip Select Output Lines Chip select output line 0 Chip select output line 1 Chip select output line 2 Chip select output line 3 Combined Chip Select Output for Global Select / Emulator Memory Region/Emulator Overlay Memory VDDEBU VDDEBU Data Sheet 15 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Class O I O O O O B2 B1 B1 B1 B1 B1 B1 BC0 BC1 BC2 BC3 WAIT BAA HOLD HLDA BREQ AE17 AD17 AF18 AE18 AE20 AF23 AF17 AD18 AD22 O O O O I O I O O B1 B1 B1 B1 B1 Power Functions Supply BFCLKO AF25 BFCLKI RD RD/WR ADV MR/W AF24 AF20 AF21 AF22 AF19 VDDEBU Burst Mode Flash Clock Output (nondifferential) Burst Mode Flash Clock Input (feedback clock) Read Control Line Write Control Line Address Valid Output Motorola-style Read/Write Control Signal Byte Control Lines Byte control line 0 Byte control line 1 Byte control line 2 Byte control line 3 Wait Input for inserting Wait-States Burst Address Advance Output Hold Request Input Hold Acknowledge Output Bus Request Output Data Sheet 16 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1 Power Functions Supply Parallel Ports P0 VDDP Port 0 Port 0 is a 16-bit bidirectional generalpurpose I/O port. Port 0 I/O line 0 Port 0 I/O line 1 Port 0 I/O line 2 Port 0 I/O line 3 Port 0 I/O line 4 Port 0 I/O line 5 Port 0 I/O line 6 Port 0 I/O line 7 Port 0 I/O line 8 Port 0 I/O line 9 Port 0 I/O line 10 Port 0 I/O line 11 Port 0 I/O line 12 Port 0 I/O line 13 Port 0 I/O line 14 Port 0 I/O line 15 The states of the Port 0 pins are latched into the software configuration input register SCU_SCILR at the rising edge of HDRST. Therefore, Port 0 pins can be used for operating mode selections by software. P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P0.8 P0.9 P0.10 P0.11 P0.12 P0.13 P0.14 P0.15 A9 A8 A7 B8 B7 A6 B6 C8 C7 B5 C6 D6 C5 D5 A5 D4 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Data Sheet 17 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P1 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1/A2 Power Functions Supply VDDP Port 1 Port 1 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively used for the MLI0 interface or as external trigger input lines. REQ0 REQ1 REQ2 REQ3 TREADY0B TCLK0 TREADY0A TVALID0A TDATA0 RCLK0A RREADY0A RVALID0A RDATA0A SYSCLK RCLK0B RVALID0B RDATA0B External trigger input 0 External trigger input 1 External trigger input 3 External trigger input 2 MLI0 transmit channel ready input B MLI0 transmit channel clock output MLI0 transmit channel ready input A MLI0 transmit channel valid output A MLI0 transmit channel data output MLI0 receive channel clock input A MLI0 receive channel ready output A MLI0 receive channel valid input A MLI0 receive channel data input A System clock output MLI0 receive channel clock input B MLI0 receive channel valid input B MLI0 receive channel data input B P1.0 P1.1 P1.2 P1.3 P3 P2 P1 N1 I I I I I O I O O I O I I O I I I A1 A1 A1 A1 A1 A2 A1 A2 A2 A1 A2 A1 A1 A2 A1 A1 A1 P1.4 P1.5 P1.6 P1.7 P1.8 P1.9 P1.10 P1.11 P1.12 P1.13 P1.14 P1.15 N4 M4 N3 N2 M3 M2 M1 L4 P4 L3 L2 L1 Data Sheet 18 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P2 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1/A2 Power Functions Supply VDDP Port 2 Port 2 is a 14-bit bi-directional generalpurpose I/O port which can be used alternatively for the six upper SSC slave select outputs or for GPTA I/O lines. SLSO2 SLSO3 SLSO4 SLSO5 SLSO6 SLSO7 Slave select output line 2 Slave select output line 3 Slave select output line 4 Slave select output line 5 Slave select output line 6 Slave select output line 7 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P2.8 P2.9 P2.10 P2.11 P2.12 P2.13 P2.14 P2.15 D3 D2 D1 C1 B1 B2 C2 A2 B3 C3 C4 A3 B4 A4 O O O O O O I/O I/O I/O I/O I/O I/O I/O I/O A2 A2 A2 A2 A2 A2 A1 A1 A1 A1 A1 A1 A1 A1 IN0 / OUT0 line of GPTA IN1 / OUT1 line of GPTA IN2 / OUT2 line of GPTA IN3 / OUT3 line of GPTA IN4 / OUT4 line of GPTA IN5 / OUT5 line of GPTA IN6 / OUT6 line of GPTA IN7 / OUT7 line of GPTA Data Sheet 19 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P3 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1 Power Functions Supply VDDP Port 3 Port 3 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively used for GPTA I/O lines. IN8 / OUT8 line of GPTA IN9 / OUT9 line of GPTA IN10 / OUT10 line of GPTA IN11 / OUT11 line of GPTA IN12 / OUT12 line of GPTA IN13 / OUT13 line of GPTA IN14 / OUT14 line of GPTA IN15 / OUT15 line of GPTA IN16 / OUT16 line of GPTA IN17 / OUT17 line of GPTA IN18 / OUT18 line of GPTA IN19 / OUT19 line of GPTA IN20 / OUT20 line of GPTA IN21 / OUT21 line of GPTA IN22 / OUT22 line of GPTA IN23 / OUT23 line of GPTA P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P3.9 P3.8 P3.10 P3.11 P3.12 P3.13 P3.14 P3.15. B12 A12 C13 B11 C12 A11 B10 C9 D10 C11 C10 D13 D11 D12 A10 B9 Data Sheet 20 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P4 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1/A2 Power Functions Supply VDDP Port 4 Port 4 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively used for GPTA I/O lines. IN24 / OUT24 line of GPTA IN25 / OUT25 line of GPTA IN26 / OUT26 line of GPTA IN27 / OUT27 line of GPTA IN28 / OUT28 line of GPTA IN29 / OUT29 line of GPTA IN30 / OUT30 line of GPTA IN31 / OUT31 line of GPTA IN32 / OUT32 line of GPTA IN33 / OUT33 line of GPTA IN34 / OUT34 line of GPTA IN35 / OUT35 line of GPTA IN36 / OUT36 line of GPTA IN37 / OUT37 line of GPTA IN38 / OUT38 line of GPTA IN39 / OUT39 line of GPTA P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 P4.8 P4.9 P4.10 P4.11 P4.12 P4.13 P4.14 P4.15 AD10 AE10 AD11 AE11 AC12 AD12 AF10 AE12 AC13 AF11 AF12 AD13 AC14 AE13 AF13 AD14 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O A21) A21) A21) A21) A21) A21) A21) A21) A1 A1 A1 A1 A1 A1 A1 A1 Data Sheet 21 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P5 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A2 Power Functions Supply VDDP Port 5 Port 5 is an 8-bit bi-directional generalpurpose I/O port which can be alternatively used for ASC0/1 or MSC0/1 lines. RXD0A TXD0A RXD1A TXD1A ASC0 receiver input / output A ASC0 transmitter output A ASC1 receiver input / output A ASC1 transmitter output A P5.3 is latched with the rising edge of PORST if BYPASS = 1 and stored in inverted state as bit OSC_CON.MOSC. MSC0 device select output 0 MLI0 receive channel ready output B MSC0 serial data input MSC1 device select output 0 MLI0 transmit channel valid output B MSC1 serial data input P5.0 P5.1 P5.2 P5.3 B13 A13 A14 B14 I/O O I/O O P5.4 C15 O O EN00 RREADY0B SDI0 EN10 TVALID0B SDI1 P5.5 P5.6 C14 B15 I O O P5.7 A15 I Data Sheet 22 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P6 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A2 Power Functions Supply VDDP Port 6 Port 6 is a 12-bit bi-directional generalpurpose I/O port which can be alternatively used for SSC1, ASC0/1, and CAN I/O lines. MTSR1 SSC1 master transmit output / SSC1 slave receive input SSC1 master receive input / SSC1 slave transmit output SSC1 clock input / output SSC1 slave select input CAN node 0 receiver input ASC0 receiver input / output B CAN node 0 transmitter output ASC0 transmitter output B CAN node 1 receiver input ASC1 receiver input / output B CAN node 1 transmitter output ASC1 transmitter output B CAN node 2 receiver input CAN node 2 transmitter output CAN node 3 receiver input CAN node 3 transmitter output P6.4 F3 O I I O I/O I I I/O O O I I/O O O I O I O P6.5 P6.6 P6.7 P6.8 G4 E3 G3 F4 MRST1 SCLK1 SLSI1 RXDCAN0 RXD0B TXDCAN0 TXD0B RXDCAN1 RXD1B TXDCAN1 TXD1B RXDCAN2 TXDCAN2 RXDCAN3 TXDCAN3 P6.9 E4 P6.10 F2 P6.11 E2 P6.12 P6.13 P6.14 P6.15 E1 G2 F1 G1 Data Sheet 23 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P7 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1 Power Functions Supply VDDP Port 7 Port 7 is an 8-bit bi-directional generalpurpose I/O port which can be alternatively used as external trigger input lines and for ADC0/1 external multiplexer control. REQ4 REQ5 AD0EMUX2 AD0EMUX0 AD0EMUX2 REQ6 REQ7 AD1EMUX0 AD1EMUX1 External trigger input 4 External trigger input 5 ADC0 external multiplexer control output 2 ADC0 external multiplexer control output 0 ADC0 external multiplexer control output 1 External trigger input 6 External trigger input 7 ADC1 external multiplexer control output 0 ADC1 external multiplexer control output 1 P7.0 P7.1 R3 R2 I I O O O I I O O P7.2 P7.3 P7.4 P7.5 P7.6 P7.7 U4 U3 T3 T2 T1 U2 Data Sheet 24 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P8 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A1/A2 Power Functions Supply VDDP Port 8 Port 8 is an 8-bit bi-directional generalpurpose I/O port which can be alternatively used for the MLI1 interface or as GPTA I/O lines. TCLK1 IN40/OUT40 TREADY1A IN41/OUT41 TVALID1A IN42/OUT42 TDATA1 IN43/OUT43 RCLK1A IN44/OUT44 RREADY1A IN45/OUT45 RVALID1A IN46/OUT46 RDATA1A IN47/OUT47 MLI1 transmit channel clock output I/O line of GPTA MLI1 transmit channel ready input A I/O line of GPTA MLI1 transmit channel valid output A I/O line of GPTA MLI1 transmit channel data output I/O line of GPTA MLI1 receive channel clock input A I/O line of GPTA MLI1 receive channel ready output A I/O line of GPTA MLI1 receive channel validinput A I/O line of GPTA MLI1 receive channel data input A I/O line of GPTA P8.0 H2 O A2 P8.1 H1 I/O A2 I A1 I/O A1 O A2 I/O A2 O A2 I/O A2 I A1 I/O A1 O A2 I/O A2 I A1 I/O A1 I A1 I/O A1 P8.2 J3 P8.3 J2 P8.4 J1 P8.5 K2 P8.6 K3 P8.7 K1 Data Sheet 25 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P9 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I/O A2 Power Functions Supply VDDP Port 9 Port 9 is a 9-bit bi-directional generalpurpose I/O port which can be alternatively used as GPTA or MSC0/1 I/O lines. IN48/OUT48 EN12 IN49/OUT49 EN11 IN50/OUT50 SOP1B IN51/OUT51 FCLP1 IN52/OUT52 EN03 IN53/OUT53 EN02 IN54/OUT54 EN01 IN55/OUT55 SOP0B FCLP0B I/O line of GPTA MSC1 device select output 2 I/O line of GPTA MSC1 device select output 1 I/O line of GPTA MSC1 serial data output I/O line of GPTA MSC1 clock output I/O line of GPTA MSC0 device select output 3 I/O line of GPTA MSC0 device select output 2 I/O line of GPTA MSC0 device select output 1 I/O line of GPTA MSC0 serial data output MSC0 clock output P9.0 A19 I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O O P9.1 B19 P9.2 P9.3 P9.4 B20 A20 D18 P9.5 D19 P9.6 C19 P9.7 P9.8 D20 C20 Data Sheet 26 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol P10 Pin Definitions and Functions (cont’d) Pins I/O Pad Class I A1 Power Functions Supply VDDP P10.0 P10.1 P10.2 P10.3 A21 B21 C21 D21 I I I I Hardware Configuration Inputs / Port 10 These inputs are boot mode (hardware configuration) control inputs. They are latched with the rising edge of HDRST. Port 10 input line 0 / HWCFG0 Port 10 input line 1 / HWCFG1 Port 10 input line 2 / HWCFG2 Port 10 input line 3 / HWCFG3 After reset (HDRST = 1) the state of the Port 10 input pins may be modified from the reset configuration state. There actual state can be read via software (P10_IN register). During normal operation input HWCFG1 serves as emergency shut-off control input for certain I/O lines (e.g. GPTA related outputs). SSC0 Slave Select Output Line 0 SSC0 Slave Select Output Line 1 SSC0 Master Transmit Output / SSC0 Slave Receive Input SSC0 Master Receive Input / SSC0 Slave Transmit Output SSC0 Clock Input/Output SSC0 Slave Select Input Dedicated Peripheral I/Os SLSO0 SLSO1 MTSR0 MRST0 SCLK0 SLSI0 AE14 AC15 AF15 AE15 AF14 AD15 O O O I I O I/O I A2 VDDP Data Sheet 27 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Class C FCLP0A FCLN0 SOP0A SON0 FCLP1A FCLN1 SOP1A SON1 C18 C17 C16 D17 A17 B17 B16 A16 O O O O O O O O Power Functions Supply MSC Outputs VDDP LVDS MSC Clock and Data Outputs2) MSC0 differential driver clock output positive A MSC0 differential driver clock output negative MSC0 differential driver serial data output positive A MSC0 differential driver serial data output negative MSC1 differential driver clock output positive A MSC1 differential driver clock output negative MSC1 differential driver serial data output positive A MSC1 differential driver serial data output negative Data Sheet 28 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Class I D Power Functions Supply – ADC Analog Input Port The ADC Analog Input Port provides 44 analog input lines for the A/D converters ADC0, ADC1, and FADC. Analog input 0 Analog input 1 Analog input 2 Analog input 3 Analog input 4 Analog input 5 Analog input 6 Analog input 7 Analog input 8 Analog input 9 Analog input 10 Analog input 11 Analog input 12 Analog input 13 Analog input 14 Analog input 15 Analog input 16 Analog input 17 Analog input 18 Analog input 19 Analog input 20 Analog input 21 Analog input 22 Analog input 23 Analog input 24 Analog input 25 Analog input 26 Analog input 27 Analog input 28 Analog input 29 Analog input 30 Analog input 31 Analog Inputs AN[43:0] AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 AN16 AN17 AN18 AN19 AN20 AN21 AN22 AN23 AN24 AN25 AN26 AN27 AN28 AN29 AN30 AN31 AE1 AD2 AA4 AB3 AC2 AA3 AD1 AB4 AC1 AB2 Y3 AA2 AB1 W3 Y2 AA1 V4 W2 Y1 V3 W1 V2 V1 U1 AC8 AD8 AC7 AD7 AE6 AF6 AE7 AF7 I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I Data Sheet 29 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Class D AN32 AN33 AN34 AN35 AN36 AN37 AN38 AN39 AN40 AN41 AN42 AN43 TR[15:0] TR0 TR1 TR2 TR3 TR4 TR5 TR6 TR7 TR8 TR9 TR10 TR11 TR12 TR13 TR14 TR15 TRCLK U12 T12 U11 T11 U10 R12 R10 R11 M11 M10 L11 L10 K10 K11 L12 K12 T10 AC3 AE2 AD3 AD5 AE3 AF2 AC4 AF3 AD4 AE4 AC5 AF4 I I I I I I I I I I I I O O O O O O O O O O O O O O O O O O A4 A3 Power Functions Supply – ADC Analog Input Port (cont’d) Analog input 32 Analog input 33 Analog input 34 Analog input 35 Analog input 36 Analog input 37 Analog input 38 Analog input 39 Analog input 40 Analog input 41 Analog input 42 Analog input 43 OCDS Level 2 Debug Trace Lines2) (located on center balls) Trace output line 0 Trace output line 1 Trace output line 2 Trace output line 3 Trace output line 4 Trace output line 5 Trace output line 4 Trace output line 7 Trace output line 8 Trace output line 9 Trace output line 10 Trace output line 11 Trace output line 12 Trace output line 13 Trace output line 14 Trace output line 15 Trace Clock for OCDS Level 2 Debug Trace Lines1) (located on a center ball) VDDP Data Sheet 30 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins I/O Pad Class I I I O I A2 A2 A1 A2 A1 Power Functions Supply System I/O TRST TCK TDI TDO TMS BRKIN BRK OU T NMI HDRST F23 E24 E25 D25 F24 C26 D26 A22 A23 VDDP JTAG Module Reset/Enable Input2) JTAG Module Clock Input2) JTAG Module Serial Data Input JTAG Module Serial Data Output JTAG Module State Machine Control Input OCDS Break Input (Alternate Output)2) OCDS Break Output (Alternate Input)2) Non-Maskable Interrupt Input (input pad with input spike-filter.) Hardware Reset Input / Reset Indication Output (open drain pad with input spike-filter.) Power-on Reset Input (input pad with input spike-filter.) PLL Bypass Select Input This input has to be held stable between to power-on resets. With BYPASS = 1 the spike filters in the HDRST, PORST, and NMI inputs are switched off. Test Mode Select Input For normal operation of the TC1796, this pin should be connected to high level. (input pad, test function only, without input spike-filter.) Test Reset Input For normal operation of the TC1796, this pin should be connected to low level. Otherwise an unpredictable reset behavior may occur. (input pad, test function only, without input spike-filter.) I/O A3 I/O A3 I – I/O A2 PORST B22 I I – A1 BYPASS A24 TEST MODE B23 I – TSTRES G24 I – Data Sheet 31 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol XTAL1 XTAL2 N.C. Pin Definitions and Functions (cont’d) Pins G26 G25 A1 C22 G23 H3 AF1 AF26 AC21 AD23 AE22 AE23 W4 Y4 AE9 AF9 AC9 AD9 AE5 AF5 AD6 AC6 AF8 AE8 F26 E26 F25 A18 B18 I/O Pad Class I O – n.a. – Power Functions Supply VDD – Oscillator / PLL / Clock Generator Input / Output Pins2) Not Connected These pins are reserved for future extension and should not be connected externally. Power Supplies VDDM VSSM VDDMF VSSMF VDDAF VSSAF VAREF0 VAGND0 VAREF1 VAGND1 VFAREF VFAGND VDDOSC3) VDDOSC3 VSSOSC3) VDDFL3 – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – ADC0/1 Analog Part Power Supply (3.3V) ADC0/1 Analog Part Ground for VDDM FADC Analog Part Power Supply (3.3V) VFADC Analog Part Ground for VDDAF FADC Analog Part Log. Pow. Sup. (1.5V) FADC Analog Part Log Ground for VDDAF ADC0 Reference Voltage ADC0 Reference Ground ADC1 Reference Voltage ADC1 Reference Ground FADC Reference Voltage FADC Reference Ground Main Oscillator Power Supply (1.5V) Main Oscillator Power Supply (3.3V) Main Oscillator Ground Power Supply for Flash (3.3V) Power Supply for Stand-by SRAM (1.5V) VDDSBRAM R1 Data Sheet 32 V1.0, 2008-04 TC1796 General Device Information Table 2 Symbol Pin Definitions and Functions (cont’d) Pins H23 H24 H25 H26 M23 T23 Y23 AC18 AC22 B26 C25 D9 D16 D24 E23 H4 P23 R4 V23 AB23 AC11 AC20 A25 B24 C23 D7 D14 D22 K4 AC16 AD16 AE16 AF16 I/O Pad Class – – Power Functions Supply – EBU Power Supply (2.3 - 3.3V) VDDEBU VDD – – – Core Power Supply (1.5V) VDDP – – – Port Power Supply (3.3V) (also for OCDS) VSS See – Table 3 – – Ground 15 VSS lines are located at outer balls. 47 VSS lines are located at center balls. 1) In order to minimize noise coupling to the on-chip A/D converters, it is recommended to use these pins as less as possible in strong driver mode. Data Sheet 33 V1.0, 2008-04 TC1796 General Device Information 2) In case of a power-fail condition (one or more power supply voltages drop below the specified voltage range), an undefined output driving level may occur at these pins. 3) Not bonded externally in the BC and BD steps of TC1796. An option for bonding them in future steps and products is kept open. Table 3 VSS Balls VSS Outer Balls A26, B25, C24, D8, D15, D23, J4, L23, R23, T4, W23, AC10, AC17, AC19, AC23 VSS Center Balls K[17:13], L[17:13], M[17:12], N[17:10], P[17:10], R[17:13], T[17:13], U[17:13] Data Sheet 34 V1.0, 2008-04 TC1796 General Device Information 2.5.1 Table 4 Pins Pull-Up/Pull-Down Behavior of the Pins List of Pull-Up/Pull-Down Reset Behavior of the Pins PORST = 0 PORST = 1 TSTRES, Weak pull-up device active TDI, TMS, TESTMODE, BRKOUT, BRKIN, all GPIOs, RD, RD/WR, ADV, BC[3:0], MR/W, WAIT, BAA, HOLD, HLDA, BREQ, D[31:0], A[23,0], CS[3:0], CSCOMB NMI, PORST BYPASS, SLSO0, SLSO1, MTSR0, MRST0, SCLK0, SLSI0, TDO, BFCLKI BFCLKO HDRST TRST, TCK Weak pull-down device active Weak pull-up device active High-impedance Weak pull-up device active Open-drain device drives 0 (strong pull-down) High-impedance Push-pull driver active Weak pull-up device active Open-drain device active Weak pull-down device active Data Sheet 35 V1.0, 2008-04 TC1796 Functional Description 3 Functional Description The following section gives an overview of the sub systems and the modules of the TC1796 and their connectivity. 3.1 System Architecture and On-Chip Bus Systems The TC1796 has four independent on-chip buses (see also TC1796 block diagram in Figure 1): • • • • Program Local Memory Bus (PLMB) Data Local Memory Bus (DLMB) System Peripheral Bus (SPB) Remote Peripheral Bus (RPB) The two LMB Buses (Program Local Memory Bus PLMB and Data Local Memory Bus DLMB) connect the TriCore CPU to its local resources for data and instruction fetches. The PLMB/DLMB Buses are synchronous and pipelined buses with variable block size transfer support. The protocol supports 8-, 16-, 32-, and 64-bit single transactions and variable length 64-bit block transfers. The System Peripheral Bus (SPB) is accessible by the CPU via the LFI Bridge. The LFI Bridge is a bi-directional bus bridge between the DLMB and the SPB. It supports all transactions types of both buses, DLMB Bus and FPI Bus. It handles address translation and transaction type translation between the two buses. The LFI Bridge further supports the pipelining of both connected buses. Therefore, no additional delay is created except for bus protocol conversions. The Remote Peripheral Bus (RPB) connects the peripherals with high data rates (SSC, ADC, FADC) with the Dual-port memory (DPRAM) in the DMI, relieving the SPB and the PLMB/DLMB Buses from these data transfers. The RPB is controlled by a bus switch which is located in the DMA controller. The two LMB Buses are running at CPU clock speed (clock rate of fCPU) while SPB and RPB are running at system clock speed (clock rate of fSYS). Note that fSYS can be equal to fCPU or half the fCPU frequency. Data Sheet 36 V1.0, 2008-04 TC1796 Functional Description 3.2 On-Chip Memories As shown in the TC1796 block diagram on Page 10, some of the TC1796 units provide on-chip memories that are used as program or data memory. • Program memory in PMU and PMI – 2 Mbyte on-chip Program Flash (PFLASH) – 16 Kbyte Boot ROM (BROM) – 48 Kbyte Scratch-Pad RAM (SPRAM) – 16 Kbyte Instruction Cache (ICACHE) Data memory in DMU, PMU and DMI – 56 Kbyte Local Data RAM (LDRAM) – 8 Kbyte Dual-port RAM (DPRAM) – 64 Kbyte Data Memory (SRAM) – 16 Kbyte data memory (SBRAM) for standby operation during power-down – 128 Kbyte on-chip Data Flash (DFLASH) Memory of the PCP2 – 32 Kbyte Code Memory (CMEM) – 16 Kbyte Parameter Memory (PRAM) On-chip SRAMs with parity error detection • • • Features of the Program Flash • • • • • • • 2 Mbyte on-chip program Flash memory Usable for instruction code execution or constant data storage 256-byte wide program interface – 256 bytes are programmed into PFLASH page in one step/command 256-bit read interface – Transfer from PFLASH to CPU/PMI by four 64-bit single-cycle burst transfers Dynamic correction of single-bit errors during read access Detection of double bit errors Fixed sector architecture – Eight 16 Kbyte, one 128 Kbyte, one 256 Kbyte, and three 512 Kbyte sectors – Each sector separately erasable – Each sector separately write-protectable Configurable read protection for complete PFLASH with sophisticated read access supervision, combined with write protection for complete PFLASH (protection against “Trojan horse” software) Configurable write protection for each sector – Each sector separately write-protectable – With capability to be re-programmed – With capability to be locked forever (OTP) Password mechanism for temporarily disable write or read protection On-chip programming voltage generation PFLASH is delivered in erased state (read all zeros) 37 V1.0, 2008-04 • • • • • Data Sheet TC1796 Functional Description • JEDEC standard based command sequences for PFLASH control – Write state machine controls programming and erase operations – Status and error reporting by status flags and interrupt Margin check for detection of problematic PFLASH bits • Features of the Data Flash • • • • • • • 128 Kbyte on-chip data Flash memory, organized in two 64 Kbyte banks Usable for data storage with EEPROM functionality 128 Byte program interface – 128 bytes are programmed into one DFLASH page by one step/command 64-bit read interface (no burst transfers) Dynamic correction of single-bit errors during read access Detection of double bit errors Fixed sector architecture – Two 64 Kbyte banks/sectors – Each sector separately erasable Configurable read protection (combined with write protection) for complete DFLASH together with PFLASH read protection Password mechanism to temporarily disable write and read protection Erasing/programming of one bank possible while reading data from the other bank Programming of one bank possible while erasing the other bank On-chip generation of programming voltage DFLASH is delivered in erased state (read all zeros) JEDEC-standard based command sequences for DFLASH control – Write state machine controls programming and erase operations – Status and error reporting by status flags and interrupt Margin check for detection of problematic DFLASH bits • • • • • • • • Data Sheet 38 V1.0, 2008-04 TC1796 Functional Description 3.3 Architectural Address Map Table 5 shows the overall architectural address map as defined for the TriCore and implemented in TC1796. Table 5 TC1796 Architectural Address Map Size 8 × 256 Mbyte 256 Mbyte 256 Mbyte 256 Mbyte Description Reserved (MMU space), cached EBU (246 Mbyte), PMU with PFLASH, DFLASH, BROM, memory reserved for Emulation, cached FPI space; cached EBU (246 Mbyte), PMU with PFLASH, DFLASH, BROM, memory reserved for Emulation, noncached FPI space; non-cached DMU, bottom 4 Mbyte visible from FPI Bus in segment 14, cached Local Data Memory RAM, non-cached Local Code Memory RAM, non-cached External Peripheral Space, non-cached External Emulator Range, non-cached Boot ROM space, BROM mirror; non-cached External Peripheral Space non-speculative, no execution, non-cached Non-speculative, no execution, non-cached CSFRs of CPUs[0 ..15]; LMB & Internal Peripheral Space; non-speculative, no execution, non-cached Seg- Contents ment 0-7 8 9 10 Global Global Memory Global Memory Global Memory Global Memory Local LMB Memory DMI PMI EXTPER EXTEMU BOOTROM 14 EXTPER 11 12 13 256 Mbyte 256 Mbyte 64 Mbyte 64 Mbyte 96 Mbyte 16 Mbyte 16 Mbyte 128 Mbyte CPU[0 ..15] 16 × 8 image region Mbyte 15 LMBPER CSFRs INTPER 256 Mbyte Data Sheet 39 V1.0, 2008-04 TC1796 Functional Description 3.4 Memory Protection System The TC1796 memory protection system specifies the addressable range and read/write permissions of memory segments available to the currently executing task. The memory protection system controls the position and range of addressable segments in memory. It also controls the kinds of read and write operations allowed within addressable memory segments. Any illegal memory access is detected by the memory protection hardware, which then invokes the appropriate Trap Service Routine (TSR) to handle the error. Thus, the memory protection system protects critical system functions against both software and hardware errors. The memory protection hardware can also generate signals to the Debug Unit to facilitate tracing illegal memory accesses. There are two Memory Protection Register Sets in the TC1796, numbered 0 and 1, which specify memory protection ranges and permissions for code and data. The PSW.PRS bit field determines which of these is the set currently in use by the CPU. Because the TC1796 uses a Harvard-style memory architecture, each Memory Protection Register Set is broken down into a Data Protection Register Set and a Code Protection Register Set. Each Data Protection Register Set can specify up to four address ranges to receive particular protection modes. Each Code Protection Register Set can specify up to two address ranges to receive particular protection modes. Each of the Data Protection Register Sets and Code Protection Register Sets determines the range and protection modes for a separate memory area. Each contains register pairs which determine the address range (the Data Segment Protection Registers and Code Segment Protection Registers) and one register (Data Protection Mode Register) which determines the memory access modes which apply to the specified range. Data Sheet 40 V1.0, 2008-04 TC1796 Functional Description 3.5 External Bus Unit The External Bus Unit (EBU) of the TC1796 is the units that controls the transactions between external memories or peripheral units with the internal memories and peripheral units. The EBU is a part of the PMU and communicates with CPU and PMI via the Program Local Memory Bus. This configuration allows to get fast access times especially when using external burst FLASH memory devices. Data Bus 32 Data Path Control Asynchronous Access State Machine Burst Access State Machine 64 PLMB Data PLMB Interface Slave Master Control Lines 64 Arbitration Signals 24 External Bus Arbitration Region Selection 32 PLMB Address Program Local Memory Bus Address Bus Address Path Control External Bus Unit EBU MCB05713 Figure 4 • • EBU Block Diagram The following features are supported by the EBU: 64-bit internal Program Local Memory Bus (PLMB) interface 32-bit external demultiplexed bus interface – Asynchronous read/write accesses support Intel-style and Motorola-style interface signals – Synchronous burst FLASH memory read – Five programmable regions associated each to one chip select output – Flexibly programmable access parameters for each chip select region – Little-endian and Big-endian support – Programmable wait state control Scalable external bus frequency – Derived from PLMB frequency (fCPU) divided by 1, 2, 3, or 4 – Max. 75 MHz 41 V1.0, 2008-04 • Data Sheet TC1796 Functional Description • Data buffering supported – Code prefetch buffer – Read/write buffer External bus arbitration control capability for the EBU bus Automatic self-configuration on boot from external memory • • 3.6 Peripheral Control Processor The Peripheral Control Processor (PCP2) in the TC1796 performs tasks that would normally be performed by the combination of a DMA controller and its supporting CPU interrupt service routines in a traditional computer system. It could easily be considered as the host processor’s first line of defence as an interrupt-handling engine. The PCP2 can off-load the CPU from having to service time-critical interrupts. This provides many benefits, including: • • • • Avoiding large interrupt-driven task context-switching latencies in the host processor Reducing the cost of interrupts in terms of processor register and memory overhead Improving the responsiveness of interrupt service routines to data-capture and datatransfer operations Easing the implementation of multitasking operating systems. The PCP2 has an architecture that efficiently supports DMA-type transactions to and from arbitrary devices and memory addresses within the TC1796 and also has reasonable stand-alone computational capabilities. The PCP2 in the TC1796 contains an improved version of the TC1775’s PCP with the following enhancements: • • • • • • • • • • • Optimized context switching Support for nested interrupts Enhanced instruction set Enhanced instruction execution speed Enhanced interrupt queueing PCP2 Processor Core Code Memory (CMEM) Parameter Memory (PRAM) PCP2 Interrupt Control Unit (PICU) PCP2 Service Request Nodes (PSRN) System bus interface to the Flexible Peripheral Interface (FPI Bus) The PCP2 is made up of several modular blocks as follows (see Figure 5): Data Sheet 42 V1.0, 2008-04 TC1796 Functional Description Code Memory CMEM Parameter Memory PRAM PCP2 Processor Core FPI-Interface PCP2 Service Req. Nodes PSRNs PCP2 Interrupt Control Unit PICU FPI Bus CPU Interrupt Arbitration Bus PCP2 Interrupt Arbitration Bus MCB05666a Figure 5 Table 6 PCP2 Block Diagram PCP2 Instruction Set Overview Description Efficient DMA channel implementation Transfer data between PRAM or FPI memory and the general purpose registers, as well as move or exchange values between registers Add, subtract, compare and complement Divide and multiply And, Or, Exclusive Or, Negate Shift right or left, rotate right or left, prioritize Set, clear, insert and test bits Jump conditionally, jump long, exit No operation, Debug Instruction Group DMA primitives Load/Store Arithmetic Divide/Multiply Logical Shift Bit Manipulation Flow Control Miscellaneous Data Sheet 43 V1.0, 2008-04 TC1796 Functional Description 3.7 DMA Controller and Memory Checker The Direct Memory Access (DMA) Controller of the TC1796 transfers data from data source locations to data destination locations without intervention of the CPU or other on-chip devices. One data move operation is controlled by one DMA channel. Sixteen DMA channels are provided in two independent DMA Sub-Blocks with eight DMA channels each. The Bus Switch provides the connection of two DMA Sub-Blocks to the two FPI Bus interfaces and an MLI bus interface. In the TC1796, the FPI Bus interfaces are connected to System Peripheral Bus and the Remote Peripheral Bus. The third specific bus interface provides a connection to Micro Link Interface modules (two MLI modules in the TC1796) and other DMA-related devices (Memory Checker module in the TC1796). Figure 6 shows the implementation details and interconnections of the DMA module. Clock Control fDMA DMA Controller FPI Bus Interface 0 DMA Sub-Block 0 Request Selection/ Arbitration DMA Channels 00-07 Transaction Control Unitl CH0n_OUT DMA Sub-Block 1 Request Selection/ Arbitration DMA Channels 10-17 Transaction Control Unit CH1n_OUT Bus Switch System Peripheral Bus FPI Bus Interface 1 DMA Requests of On-chip Periph. Units Remote Peripheral Bus MLI0 MLI Interface Address Decoder MLI1 Memory Checker Interrupt Request Nodes SR[15:0] DMA Interrupt Control Arbiter/ Switch Control MCB05680 Figure 6 DMA Controller Block Diagram Data Sheet 44 V1.0, 2008-04 TC1796 Functional Description Features • 16 independent DMA channels – 8 DMA channels in each DMA Sub-Block – Up to 8 selectable request inputs per DMA channel – 2-level programmable priority of DMA channels within a DMA Sub-Block – Software and hardware DMA request – Hardware requests by selected on-chip peripherals and external inputs Programmable priority of the DMA Sub-Blocks on the bus interfaces Buffer capability for move actions on the buses (at least 1 move per bus is buffered). Individually programmable operation modes for each DMA channel – Single mode: stops and disables DMA channel after a predefined number of DMA transfers – Continuous mode: DMA channel remains enabled after a predefined number of DMA transfers; DMA transaction can be repeated. – Programmable address modification Full 32-bit addressing capability of each DMA channel – 4 GByte address range – Support of circular buffer addressing mode Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit Micro Link bus interface support Register set for each DMA channel – Source and destination address register – Channel control and status register – Transfer count register Flexible interrupt generation (the service request node logic for the MLI channels is also implemented in the DMA module) All buses connected to the DMA module must work at the same frequency. Read/write requests of the System Bus Side to the Remote Peripherals are bridged to the Remote Peripheral Bus (only the DMA is master on the RPB) • • • • • • • • • • Memory Checker The Memory Checker Module (MEMCHK) makes it possible to check the data consistency of memories. Any SPB bus master may access the memory checker. Preferable the DMA controller does it as described hereafter. It uses 8-bit, 16-bit, or 32bit DMA moves to read from the selected address area and to write the value read in a memory checker input register. With each write operation to the memory checker input register, a polynomial checksum calculation is triggered and the result of the calculation is stored in the memory checker result register. The memory checker uses the standard Ethernet polynomial, which is given by: G32 = x32+ x26+ x23+ x22+ x16+ x12+ x11+ x10+ x8+ x7+ x5+ x4+ x2+ x +1 Data Sheet 45 V1.0, 2008-04 TC1796 Functional Description Note: Although the polynomial above is used for generation, the generation algorithm differs from the one that is used by the Ethernet protocol. 3.8 Interrupt System The TC1796 interrupt system provides a flexible and time-efficient means for processing interrupts. An interrupt request can be serviced either by the CPU or by the Peripheral Control Processor (PCP). These units are called “Service Providers”. Interrupt requests are called “Service Requests” rather than “Interrupt Requests” in this document because they can be serviced by either of the Service Providers. Each peripheral in the TC1796 can generate service requests. Additionally, the Bus Control Units, the Debug Unit, the PCP, and even the CPU itself can generate service requests to either of the two Service Providers. As shown in Figure 7, each TC1796 unit that can generate service requests is connected to one or more Service Request Nodes (SRN). Each SRN contains a Service Request Control Register. Two arbitration buses connect the SRNs with two Interrupt Control Units, which handle interrupt arbitration among competing interrupt service requests, as follows: • • The Interrupt Control Unit (ICU) arbitrates service requests for the CPU and administers the CPU Interrupt Arbitration Bus. The Peripheral Interrupt Control Unit (PICU) arbitrates service requests for the PCP2 and administers the PCP2 Interrupt Arbitration Bus. The PCP2 can make service requests directly to itself (via the PICU), or it can make service requests to the CPU. The Debug Unit can generate service requests to the PCP2 or the CPU. The CPU can make service requests directly to itself (via the ICU), or it can make service requests to the PCP. The CPU Service Request Nodes are activated through software. Depending on the selected system clock frequency fSYS, the number of fSYS clock cycles per arbitration cycle must be selected as follows: • • fSYS < 60MHz: ICR.CONECYC = 1 and PCP_ICR.CONECYC = 1 fSYS > 60MHz: ICR.CONECYC = 0 and PCP_ICR.CONECYC = 0 Data Sheet 46 V1.0, 2008-04 TC1796 Functional Description PCP Interrupt Arbitration Bus Service Requestors MSC0 MSC1 MLI0 MLI1 SSC0 SSC1 ASC0 ASC1 MultiCAN ADC0 ADC1 FADC GPTA0 GPTA1 LTCA2 STM FPU Flash Ext. Int. 2 2 4 2 3 3 4 4 16 4 4 4 38 38 16 2 1 1 2 Service Req. Nodes 2 2 SRNs 2 SRNs 4 SRNs 2 SRNs 3 SRNs 3 SRNs 4 SRNs 4 SRNs 16 SRNs 4 SRNs 4 SRNs 4 SRNs 38 SRNs 38 SRNs 16 SRNs 2 SRNs 1 SRN 1 SRN 2 SRNs 2 2 2 4 4 2 2 3 3 3 3 4 4 4 4 16 16 4 4 4 4 4 4 38 38 38 38 16 16 2 2 1 1 1 1 2 2 1 1 1 1 1 1 1 1 8 8 1 1 1 1 1 SRN 1 SRN 8 SRNs 1 SRN 1 SRN 1 SRN Service Req. Nodes 1 SRN 1 1 1 1 8 1 1 Service Requestors DBCU PBCU SBCU RBCU DMA Cerberus Software MCB05742 CPU Interrupt Arbitration Bus PCP Interrupt Control Unit PICU Int. Req. PIPN Interrupt Service Providers Int. Ack. CCPN Service Req. Nodes 5 5 5 2 5 5 5 SRNs 5 SRNs 5 SRNs 2 SRNs 5 5 2 5 PCP2 CPU Interrupt Control Unit ICU Int. Req. PIPN Software & Breakpoint Interrupts CPU Int. Ack. CCPN Figure 7 Data Sheet Block Diagram of the TC1796 Interrupt System 47 V1.0, 2008-04 TC1796 Functional Description 3.9 Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) Figure 8 shows a global view of the functional blocks and interfaces of the two Asynchronous/Synchronous Serial Interfaces ASC0 and ASC1. Clock Control fASC RXD_I0 P5.0 / A2 RXD0A A2 P5.1 / TXD0A Address Decoder EIR TBIR TIR RIR ASC0 Module (Kernel) RXD_I1 RXD_O TXD_O P6.8 / A2 RXD0B A2 P6.9 / TXD0B Interrupt Control To DMA ASC0_RDR ASC0_TDR Port 5 & Port 6 Control P5.2 / A2 RXD1A RXD_I0 ASC1 Module (Kernel) RXD_I1 RXD_O TXD_O P6.10 / A2 RXD1B A2 P6.11 / TXD1B A2 P5.3 / TXD1A Interrupt Control EIR TBIR TIR RIR To DMA ASC1_RDR ASC1_TDR MCB05773 Figure 8 Block Diagram of the ASC Interfaces The Asynchronous/Synchronous Serial Interfaces provide serial communication between the TC1796 and other microcontrollers, microprocessors, or external peripherals. The ASC supports full-duplex asynchronous communication and half-duplex synchronous communication. In Synchronous Mode, data is transmitted or received synchronous to a shift clock which is generated by the ASC internally. In Asynchronous Data Sheet 48 V1.0, 2008-04 TC1796 Functional Description Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be selected. Parity, framing, and overrun error detection are provided to increase the reliability of data transfers. Transmission and reception of data are double-buffered. For multiprocessor communication, a mechanism is included to distinguish address bytes from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator provides the ASC with a separate serial clock signal which can be very accurately adjusted by a prescaler implemented as a fractional divider. Each ASC module, ASC0 and ASC1, communicates with the external world via two I/O lines. The RXD line is the receive data input signal (in Synchronous Mode also output). TXD is the transmit output signal. In the TC1796, the two I/O lines of each ASC can be alternatively switched to different pairs of GPIO lines. Clock control, address decoding, and interrupt service request control are managed outside the ASC module kernel. Features • Full-duplex asynchronous operating modes – 8-bit or 9-bit data frames, LSB first – Parity bit generation/checking – One or two stop bits – Baud rate from 4.69 Mbit/s to 1.12 Bit/s (@ 75 MHz clock) – Multiprocessor mode for automatic address/data byte detection – Loop-back capability Half-duplex 8-bit synchronous operating mode – Baud rate from 9.38 Mbit/s to 763 Bit/s (@ 75 MHz clock) Double buffered transmitter/receiver Interrupt generation – On a transmit buffer empty condition – On a transmit last bit of a frame condition – On a receive buffer full condition – On an error condition (frame, parity, overrun error) • • • Data Sheet 49 V1.0, 2008-04 TC1796 Functional Description 3.10 High-Speed Synchronous Serial Interfaces (SSC0, SSC1) Figure 9 shows a global view of the functional blocks and interfaces of the two HighSpeed Synchronous Serial interfaces SSC0 and SSC1. MRSTA MRSTB MTSR MTSRA MTSRB MRST SCLKA SCLKB SCLK SLSI1 Slave SLSI[7:2] 1) M/S Selected SSC Enabled Master SLSO[7:2] SLSO0 SLSO1 Port 2 Control ... A2 SLSI0 A2 SLSO0 A2 SLSO1 A2 A2 P2.2 / SLSO2 P2.7 / SLSO7 fSSC0 Clock Control A2 MRST0 Master fCLC0 Slave SSC0 Module (Kernel) EIR TIR RIR 8-Stage RXFIFO 8-Stage TXFIFO A2 MTSR0 Address Decoder A2 SCLK0 Slave Master Interrupt Control To DMA SSC0_RDR SSC0_TDR fSSC1 Clock Control Master SLSO[7:2] MRSTA MRSTB MTSR MTSRA MTSRB MRST SCLKA SCLKB SCLK SLSI1 SLSI[7:2] 1) fCLC1 Master Address Decoder EIR TIR RIR SSC1 Module (Kernel) Slave Interrupt Control Port 6 Control Slave Master Slave P6.4 / MTSR1 P6.5 / A2 MRST1 P6.6 / A2 SCLK1 P6.7 / A2 SLSI1 A2 To DMA SSC1_RDR SSC1_TDR 1) These lines are not connected MCA05791 Figure 9 Block Diagram of the SSC Interfaces The SSC allows full-duplex and half-duplex serial synchronous communication up to 37.5 Mbit/s (@ 75 MHz module clock) with Receive and Transmit FIFO support. (FIFO only in SSC0). The serial clock signal can be generated by the SSC itself (Master Mode) Data Sheet 50 V1.0, 2008-04 TC1796 Functional Description or can be received from an external master (Slave Mode). Data width, shift direction, clock polarity and phase are programmable. This allows communication with SPIcompatible devices. Transmission and reception of data is double-buffered. A shift clock generator provides the SSC with a separate serial clock signal. One slave select input is available for Slave Mode operation. Eight programmable slave select outputs (chip selects) are supported in Master Mode. The I/O lines of the SSC0 module are connected to dedicated device pins while the SSC1 module I/O lines are wired with general purpose I/O port lines. Features • Master and Slave Mode operation – Full-duplex or half-duplex operation – Automatic pad control possible Flexible data format – Programmable number of data bits: 2 to 16 bits – Programmable shift direction: LSB or MSB shift first – Programmable clock polarity: Idle low or high state for the shift clock – Programmable clock/data phase: data shift with leading or trailing edge of the shift clock Baud rate generation from 37.5 Mbit/s to 572.2 Bit/s (@ 75 MHz module clock) Interrupt generation – On a transmitter empty condition – On a receiver full condition – On an error condition (receive, phase, baud rate, transmit error) Flexible SSC pin configuration One slave select input SLSI in slave mode Eight programmable slave select outputs SLSO in Master Mode – Automatic SLSO generation with programmable timing – Programmable active level and enable control SSC0 with 8-stage receive FIFO (RXFIFO) and 8-stage transmit FIFO (TXFIFO) – Independent control of RXFIFO and TXFIFO – 2- to 16-bit FIFO data width – Programmable receive/transmit interrupt trigger level – Receive and Transmit FIFO filling level indication – Overrun error generation – Underflow error generation • • • • • • • Data Sheet 51 V1.0, 2008-04 TC1796 Functional Description 3.11 Micro Second Bus Interfaces (MSC0, MSC1) The Micro Second Channel (MSC) interfaces provides a serial communication link typically used to connect power switches or other peripheral devices. The serial communication link is build up by a fast synchronous downstream channel and a slow asynchronous upstream channel. Figure 10 shows a global view the interface signals of the MSC interface. fMSC0 Clock Control FCLP FCLN SOP Address Decoder SON Downstream Channel C C C C FCLP0A FCLN0 SOP0A SON0 fCLC0 A2 P9.8 / FCLP0B A2 P9.7 / SOP0B EN0 EN1 EN2 EN3 Port 5 & Port 9 Control A2 P5.4 / EN00 A2 P9.6 / EN01 A2 P9.5 / EN02 A2 P9.4 / EN03 A2 P5.5 / SDI0 Interrupt Control To DMA SR[1:0] MSC0 Module (Kernel) SR[3:2] 16 16 Upstr. Channel ALTINL[15:0] (from GPTA) ALTINH[15:0] EMGSTOPMSC (from SCU) SDI[0]1) SR15 (from CAN) FCLP C C C C FCLP1A FCLN1 SOP1A SON1 fMSC1 Clock Control FCLN SOP SON fCLC1 Downstream Channel Address Decoder MSC1 Module (Kernel) A2 P9.3 / FCLP1B A2 P9.2 / SOP1B EN0 EN1 Port 5 & Port 9 Control N.C. 1) Interrupt Control To DMA SR[1:0] A2 P5.6 / EN10 A2 P9.1 / EN11 A2 P9.0 / EN12 SR[3:2] 16 Upstr. Channel EN2 EN3 SDI[0] ALTINL[15:0] (from GPTA) ALTINH[15:0] 16 A2 P5.7 / SDI1 MCA05823 1) SDI[7:1] are connected to high level. Figure 10 Data Sheet Block Diagram of the MSC Interfaces 52 V1.0, 2008-04 TC1796 Functional Description The downstream and upstream channels of the MSC module communicate with the external world via nine I/O lines. Eight output lines are required for the serial communication of the downstream channel (clock, data, and enable signals). One out of eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The source of the serial data to be transmitted by the downstream channel can be MSC register contents or data that is provided at the ALTINL/ALTINH input lines. These input lines are typically connected to other on-chip peripheral units (for example with a timer unit like the GPTA). An emergency stop input signal allows to set bits of the serial data stream to dedicated values in emergency case. Clock control, address decoding, and interrupt service request control are managed outside the MSC module kernel. Service request outputs are able to trigger an interrupt or a DMA request. Features • • Fast synchronous serial interface to connect power switches in particular, or other peripheral devices via serial buses High-speed synchronous serial transmission on downstream channel – Maximum serial output clock frequency: fFCL = fMSC/2 (= 37.5 Mbit/s @ 75 MHz module clock) – Fractional clock divider for precise frequency control of serial clock fMSC – Command, data, and passive frame types – Start of serial frame: Software-controlled, timer-controlled, or free-running – Programmable upstream data frame length (16 or 12 bits) – Transmission with or without SEL bit – Flexible chip select generation indicates status during serial frame transmission – Emergency stop without CPU intervention Low-speed asynchronous serial reception on upstream channel – Baud rate: fMSC divided by 8, 16, 32, 64, 128, 256, or 512 – Standard asynchronous serial frames – Parity error checker – 8-to-1 input multiplexer for SDI lines – Built-in spike filter on SDI lines • Data Sheet 53 V1.0, 2008-04 TC1796 Functional Description 3.12 MultiCAN Controller (CAN) Figure 11 shows a global view of the MultiCAN module with its functional blocks and interfaces. fCAN Clock Control MultiCAN Module Kernel CAN Node 3 Message Object Buffer 128 Objects CAN Node 2 CAN Node 1 CAN Node 0 TXDC3 RXDC3 TXDC2 RXDC2 TXDC1 RXDC1 TXDC0 RXDC0 Port 6 Control fCLC A2 A2 A2 A2 A2 A2 A2 P6.15 / TXDCAN3 P6.14 / RXDCAN3 P6.13 / TXDCAN2 P6.12 / RXDCAN2 P6.11 / TXDCAN1 P6.10 / RXDCAN1 P6.9 / TXDCAN0 P6.8 / RXDCAN0 Address Decoder DMA INT_O [3:0] INT_O [15:4] INT_ O15 Linked List Control Interrupt Control LTCA2 GPTA1 CAN Control A2 Timing Control and Synchronization GPTA0 ECTT3 Scheduler SCU Ext.Req. Unit ECTT4 ECTT5 ScheduleTiming DataMemory Time-Triggered Extension TTCAN MCA05864 ECTT1 ECTT2 A1 A1 P1.3 / REQ3 P7.5 / REQ7 Figure 11 Block Diagram of MultiCAN Module with Time-Triggered Extension The MultiCAN module contains four independently operating CAN nodes with Full-CAN functionality that are able to exchange Data and Remote Frames via a gateway function. Transmission and reception of CAN frames is handled in accordance with CAN specification V2.0 B (active). Each CAN node can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. All four CAN nodes share a common set of message objects. Each message object can be individually allocated to one of the CAN nodes. Besides serving as a storage container for incoming and outgoing frames, message objects can be combined to build gateways between the CAN nodes or to setup a FIFO buffer. The message objects are organized in double-chained linked lists, where each CAN node has it’s own list of message objects. A CAN node stores frames only into message Data Sheet 54 V1.0, 2008-04 TC1796 Functional Description objects that are allocated to the message object list of the CAN node, and it transmits only messages belonging to this message object list. A powerful, command-driven list controller performs all message object list operations. MultiCAN Features • • • • • • • CAN functionality conforms to CAN specification V2.0 B active for each CAN node (compliant to ISO 11898) Four independent CAN nodes 128 independent message objects (shared by the CAN nodes) Dedicated control registers for each CAN node Data transfer rate up to 1Mbit/s, individually programmable for each node Flexible and powerful message transfer control and error handling capabilities Full-CAN functionality: message objects can be individually – Assigned to one of the four CAN nodes – Configured as transmit or receive object – Configured as message buffer with FIFO algorithm – Configured to handle frames with 11-bit or 29-bit identifiers – Provided with programmable acceptance mask register for filtering – Monitored via a frame counter – Configured for Remote Monitoring Mode Automatic Gateway Mode support 16 individually programmable interrupt nodes Analyzer mode for CAN bus monitoring • • • Data Sheet 55 V1.0, 2008-04 TC1796 Functional Description Time-Triggered Extension (TTCAN) In addition to the event-driven CAN functionality, a deterministic behavior can be achieved for CAN node 0 by an extension module that supports time-triggered CAN (TTCAN) functionality. The TTCAN protocol is compliant with the confirmed standardization proposal for ISO 11898-4 and fully conforms to the existing CAN protocol. The time-triggered functionality is added as higher-layer extension (session layer) to the CAN protocol in order to be able to operate in safety critical applications. The new features allow a deterministic behavior of a CAN network and the synchronization of networks. A global time information is available. The time-triggered extension is based on a scheduler mechanism with a timing control unit and a dedicated timing data part. TTCAN Features • • • • • • • • • • • Full support of basic cycle and system matrix functionality Support of reference messages level 1 and level 2 Usable as time master Arbitration windows supported in time-triggered mode Global time information available CAN node 0 can be configured either for event-driven or for time-triggered mode Built-in scheduler mechanism and a timing synchronization unit Write protection for scheduler timing data memory Module-external CAN time trigger inputs (ECTTx lines) can be used as transmit trigger for a reference message Timing-related interrupt functionality Parity protection for scheduler memory Data Sheet 56 V1.0, 2008-04 TC1796 Functional Description 3.13 Micro Link Serial Bus Interface (MLI0, MLI1) The Micro Link Interface (MLI) is a fast synchronous serial interface that allows to exchange data between microcontrollers of the 32-bit AUDO microcontroller family without intervention of a CPU or other bus masters. Figure 12 shows how two microcontrollers are typically connected together via their MLI interfaces. The MLI operates in both microcontrollers as a bus master on the system bus. Controller 1 CPU Controller 2 CPU Peripheral A Peripheral B Peripheral C Peripheral D Memory System Bus MLI MLI System Bus Memory MCA05869 Figure 12 Features • • • • • • • • Typical Micro Link Interface Connection • Synchronous serial communication between MLI transmitters and MLI receivers located on the same or on different microcontroller devices Automatic data transfer/request transactions between local/remote controller Fully transparent read/write access supported (= remote programming) Complete address range of remote controller available Specific frame protocol to transfer commands, addresses and data Error control by parity bit 32-bit, 16-bit, and 8-bit data transfers Programmable baud rate: – MLI transmitter baud rate: max. fMLI/2 (= 37.5 Mbit/s @ 75 MHz module clock) – MLI receiver baud rate: max. fMLI Multiple remote (slave) controllers supported MLI transmitter and MLI receiver communicate with other off-chip MLI receivers and MLI transmitters via a 4-line serial I/O bus each. Several I/O lines of these I/O buses are available outside the MLI module kernel as four-line output or input buses. Figure 13 shows the functional blocks of the two MLI modules with its interfaces. Data Sheet 57 V1.0, 2008-04 TC1796 Functional Description TCLK TREADYA Transmitter TREADYB TREADYD TVALIDA TVALIDB TVALIDD TDATA RCLKA RCLKB Interrupt Control SR[3:0] MLI0 Module (Kernel) Receiver RCLKD RREADYA RREADYB SR[7:4] To DMA BRKOUT RREADYD RVALIDA RVALIDB RVALIDD RDATAA RDATAB RDATAD Port 5 Control Port 1 Control A1 P1.3 / TREADY0B A2 P1.4 / TCLK0 A1 P1.5 / TREADY0A A2 P1.6 / TVALID0A A2 P1.7 / TDATA0 A1 P1.8 / RCLK0A A2 P1.9 / RREADY0A A1 P1.10 / RVALID0A A1 P1.11 / RDATA0A A1 P1.13 / RCLK0B A1 P1.14 / RVALID0B A1 P1.15 / RDATA0B fMLI0 Clock Control fDMA Address Decoder Cerberus A2 P5.4 / RREADY0B A2 P5.6 / TVALID0B MCA05906 fMLI1 Transmitter Clock Control TCLK TREADYA TREADYD TVALIDA TVALIDD TDATA RCLKA RCLKD RREADYA Receiver RREADYD RVALIDA RVALIDD RDATAA RDATAD MCA05907 fDMA A2 P8.0 / TCLK1 A1 P8.1 / TREADY1A A2 P8.2 / TVALID1A A2 P8.3 / TDATA1 Port 8 Control A1 P8.4 / RCLK1A A2 P8.5 / RREADY1A A1 P8.6 / RVALID1A A1 P8.7 / RDATA1A Address Decoder MLI1 Module (Kernel) Interrupt Control Not Connected To DMA Cerberus SR[1:0] SR[3:2] SR[7:4] BRKOUT Figure 13 Data Sheet Block Diagram of the MLI Modules 58 V1.0, 2008-04 TC1796 Functional Description 3.14 General Purpose Timer Array The GPTA provides a set of timer, compare and capture functionalities that can be flexibly combined to form signal measurement and signal generation units. They are optimized for tasks typical of engine, gearbox, and electrical motor control applications, but can also be used to generate simple and complex signal waveforms needed in other industrial applications. The TC1796 contains two General Purpose Timer Arrays (GPTA0 and GPTA1) with identical functionality, plus an additional Local Timer Cell Array (LTCA2). Figure 14 shows a global view of the GPTA modules. GPTA0 Clock Generation Unit FPC0 FPC1 FPC2 FPC3 FPC4 FPC5 PDL1 DCM3 PDL0 DCM1 DCM2 DIGITAL PLL DCM0 FPC0 FPC1 FPC2 FPC3 FPC4 FPC5 GPTA1 Clock Generation Unit DCM0 PDL0 DCM1 DCM2 PDL1 DCM3 DIGITAL PLL fGPTA Clock Distribution Unit Clock Conn. fGPTA Clock Distribution Unit Clock Bus GT0 GT1 GTC00 GTC01 GTC02 GTC03 Global Timer Cell Array GTC30 GTC31 GT0 GT1 Clock Bus Signal Generation Unit Signal Generation Unit LTCA2 LTC00 LTC01 LTC02 LTC03 Local Timer Cell Array LTC62 LTC63 LTC00 LTC01 LTC02 LTC03 Local Timer Cell Array LTC62 LTC63 I/O Line Sharing Unit Interrupt Sharing Unit MCB05910 LTC00 LTC01 LTC02 LTC03 Local Timer Cell Array LTC62 LTC63 GTC00 GTC01 GTC02 GTC03 Global Timer Cell Array GTC30 GTC31 I/O Line Sharing Unit Interrupt Sharing Unit I/O Line Sharing Unit Interrupt Sharing Unit Figure 14 Data Sheet Block Diagram of the GPTA Modules 59 V1.0, 2008-04 TC1796 Functional Description 3.14.1 Functionality of GPTA0/GPTA1 Each of the General Purpose Timer Arrays (GPTA0 and GPTA1) provides a set of hardware modules required for high speed digital signal processing: • • • • • • Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation. Phase Discrimination Logic units (PDL) decode the direction information output by a rotation tracking system. Duty Cycle Measurement Cells (DCM) provide pulse-width measurement capabilities. A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA module clock ticks during an input signal’s period. Global Timer units (GT) driven by various clock sources are implemented to operate as a time base for the associated Global Timer Cells. Global Timer Cells (GTC) can be programmed to capture the contents of a Global Timer on an external or internal event. A GTC may be also used to control an external port pin depending on the result of an internal compare operation. GTCs can be logically concatenated to provide a common external port pin with a complex signal waveform. Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may be also logically tied together to drive a common external port pin with a complex signal waveform. LTCs — enabled in Timer Mode or Capture Mode — can be clocked or triggered by various external or internal events. • Input lines can be shared by an LTC and a GTC to trigger their programmed operation simultaneously. The following sections summarize the specific features of the GPTA units. The clock signal fGPTA is the input clock of the GPTA modules (max. 75 MHz in TC1796). Clock Generation Unit • Filter and Prescaler Cell (FPC) – Six independent units – Three basic operating modes: Prescaler, Delayed Debounce Filter, Immediate Debounce Filter – Selectable input sources: Port lines, GPTA module clock, FPC output of preceding FPC cell – Selectable input clocks: GPTA module clock, prescaled GPTA module clock, DCM clock, compensated or uncompensated PLL clock. – fGPTA/2 maximum input signal frequency in Filter Modes Phase Discriminator Logic (PDL) – Two independent units – Two operating modes (2 and 3 sensor signals) • Data Sheet 60 V1.0, 2008-04 TC1796 Functional Description – fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input signal frequency in 3-sensor Mode. Duty Cycle Measurement (DCM) – Four independent units – 0 - 100% margin and time-out handling – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Digital Phase Locked Loop (PLL) – One unit – Arbitrary multiplication factor between 1 and 65535 – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Clock Distribution Unit (CDU) – One unit – Provides nine clock output signals: fGPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock • • • Signal Generation Unit • Global Timers (GT) – Two independent units – Two operating modes (Free Running Timer and Reload Timer) – 24-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Global Timer Cell (GTC) – 32 units related to the Global Timers – Two operating modes (Capture, Compare and Capture after Compare) – 24-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Local Timer Cell (LTC) – 64 independent units – Three basic operating modes (Timer, Capture and Compare) for 63 units – Special compare modes for one unit – 16-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency • • Interrupt Sharing Unit • 286 interrupt sources, generating up to 92 service requests Data Sheet 61 V1.0, 2008-04 TC1796 Functional Description I/O Sharing Unit • Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and MSC interface. 3.14.2 • Functionality of LTCA2 One Local Timer Cells Area provides a set of Local Timer Cells. 64 Local Timer Cells (LTCs) – Three basic operating modes (Timer, Capture and Compare) for 63 units. – Special compare modes for one unit – 16-bit data width – fGPTA maximum resolution – fGPTA/2 maximum input signal frequency Data Sheet 62 V1.0, 2008-04 TC1796 Functional Description 3.15 Analog-to-Digital Converter (ADC0, ADC1) The two ADC modules of the TC1796 are analog to digital converters with 8-bit, 10-bit, or 12-bit resolution including sample & hold functionality. VDD VDDM VAGND0 VSS VSSM VAREF0 fADC Clock Control GRPS EMUX0 EMUX1 Port 7 Control P7.1 / A1 AD0EMUX2 P7.2 / A1 AD0EMUX0 P7.3 / A1 AD0EMUX1 8 2 9 From Ports From MSC0/1 From GPTA D AN0 D AN1 Analog Input Sharing Crossbar fCLC Address Decoder SR [3:0] ADC0 Module Kernel Analog Multiplexer Interrupt Control ASGT SW0TR, SW0GT External ETR, EGT Request Unit QTR, QGT (SCU) TTR, TGT AIN0 Group 0 AIN15 AIN16 Group 1 AIN31 To DMA SR[7:4] D AN2 Synchronization Bridge AIN0 Analog Multiplexer Group 0 AIN16 AIN30 AIN31 AIN15 Not Used Die Temp. Sensor D AN41 D AN42 D AN43 8 2 9 A1 From Ports From MSC0/1 From GPTA P7.6 / AD1EMUX0 P7.7 / A1 AD1EMUX1 Address Decoder ADC1 Module Kernel Interrupt Control SR[3:0] ASGT SW0TR, SW0GT External ETR, EGT Request Unit QTR, QGT (SCU) TTR, TGT EMUX0 SR[7:4] To DMA EMUX1 Port 7 Control VAGND1 VSS VSSM VAREF1 VDD VDDM MCA06033 Figure 15 Data Sheet Block Diagram of the ADC Module 63 V1.0, 2008-04 TC1796 Functional Description The A/D converters operate by the method of the successive approximation. A multiplexer selects between up to 32 analog inputs that can be connected with the 16 conversion channels in each ADC module. An automatic self-calibration adjusts the ADC modules to changing temperatures or process variations. External Clock control, address decoding, and service request (interrupt) control is managed outside the ADC module kernel. A synchronization bridge is used for synchronization of two ADC modules. External trigger conditions are controlled by an External Request Unit. This unit generates the control signals for auto-scan control (ASGT), software trigger control (SW0TR, SW0GT), the event trigger control (ETR, EGT), queue control (QTR, QGT), and timer trigger control (TTR, TGT). Features • • 8-bit, 10-bit, 12-bit A/D conversion Minimum conversion times (without sample time, @ 75 MHz module clock): – 1.05 µs @ 8-bit resolution – 1.25 µs @ 10-bit resolution – 1.45 µs @ 12-bit resolution Extended channel status information on request source Successive approximation conversion method Total Unadjusted Error (TUE) of ±2 LSB @ 10-bit resolution Integrated sample & hold functionality Direct control of up to 16(32) analog input channels per ADC Dedicated control and status registers for each analog channel Powerful conversion request sources Selectable reference voltages for each channel Programmable sample and conversion timing schemes Limit checking Flexible ADC module service request control unit Synchronization of the two on-chip A/D converters Automatic control of external analog multiplexers Equidistant samples initiated by timer External trigger and gating inputs for conversion requests Power reduction and clock control feature On-chip die temperature sensor output voltage measurement via ADC1 • • • • • • • • • • • • • • • • • Data Sheet 64 V1.0, 2008-04 TC1796 Functional Description 3.16 Fast Analog-to-Digital Converter Unit (FADC) The FADC module of the TC1796 basically is a 4-channel A/D converter with 10-bit resolution that operates by the method of the successive approximation. The main FADC functional blocks shown in Figure 16 are: • • • • The Input Stage contains the differential inputs and the programmable amplifier. The A/D Converter is responsible for the analog-to-digital conversion. The Data Reduction Unit contains programmable anti aliasing and data reduction filters. The Channel Trigger Control block defines the trigger and gating conditions for the four FADC channels. The gating source inputs GS[7:0] and trigger source inputs TS[7:0] are connected with GPTA0 module outputs, with GPIO port lines, and external request unit outputs. The Channel Timers can independently trigger the conversion of each FADC channel. The A/D control block is responsible for the overall FADC functionality. • • • • • The FADC module is supplied by the following power supply and reference voltage lines: VDDMF/VDDMF: FADC Analog Part Power Supply (3.3V) VDDAF/VDDAF: FADC Analog Part Logic Power Supply (1.5V) VFAREF/VFAGND: FADC Reference Voltage/FADC Reference Ground Data Sheet 65 V1.0, 2008-04 TC1796 Functional Description VFAREF VDDAF VDDMF VFAGND VSSAF VSSMF fFADC Clock Control fCLC FAIN0P FAIN0N D AN24 D AN25 D AN26 D AN27 D AN28 D AN29 D AN30 D AN31 A1 P1.0 / REQ0 A1 P1.1 / REQ1 GS[7:0] A1 P7.0 / REQ4 TS[7:0] A1 P7.1 / REQ5 PDOUT2 Address Decoder FADC Module Kernel FAIN1P FAIN1N FAIN2P FAIN2N Interrupt Control To DMA SR[3:0] FAIN3P OUT1 OUT9 OUT18 OUT26 OUT2 OUT10 OUT19 OUT27 FAIN3N GPTA0 External Request Unit (SCU) PDOUT3 MCA06053 Figure 16 Features • • • • • • • • • • • Block Diagram of the FADC Module Extreme fast conversion: 21 cycles of fFADC (= 280ns @ fFADC = 75 MHz) 10-bit A/D conversion – Higher resolution by averaging of consecutive conversions is supported Successive approximation conversion method Four differential input channels Offset and gain calibration support for each channel Differential input amplifier with programmable gain of 1, 2, 4 and 8 for each channel Free-running (Channel Timers) or triggered conversion modes Trigger and gating control for external signals Built-in Channel Timers for internal triggering Channel timer request periods independently selectable for each channel Selectable, programmable anti aliasing and data reduction filter block 66 V1.0, 2008-04 Data Sheet TC1796 Functional Description 3.17 System Timer The TC1796’s STM is designed for global system timing applications requiring both high precision and long range. Features • • • • • • • Free-running 56-bit counter All 56 bits can be read synchronously Different 32-bit portions of the 56-bit counter can be read synchronously Flexible interrupt generation based on compare match with partial STM content Driven by max. 75 MHz (= fSYS, default after reset = fSYS/2) Counting starts automatically after a reset operation STM is reset by: – Watchdog reset – Software reset (RST_REQ.RRSTM must be set) – Power-on reset STM is not reset at a hardware reset STM can be halted in debug/suspend mode • • The STM is an upward counter, running either at the system clock frequency fSYS or at a fraction of it. In case of a power-on reset, a watchdog reset, or a software reset, the STM is reset. After one of these reset conditions, the STM is enabled and immediately starts counting up. It is not possible to affect the contents of the timer during normal operation of the TC1796. The timer registers can only be read but not written to. The STM can be optionally disabled or suspended for power-saving and debugging purposes via its clock control register. In suspend mode of the TC1796, the STM clock is stopped but all registers are still readable. The System Timer can be read in sections from seven registers, STM_TIM0 through STM_TIM6, which select increasingly higher-order 32-bit ranges of the System Timer. These can be viewed as individual 32-bit timers, each with a different resolution and timing range. For getting a synchronous and consistent reading of the complete STM contents, a capture register (STM_CAP), is implemented. It latches the contents of the high part of the STM each time when one of the registers STM_TIM0 to STM_TIM5 is read. Thus, it holds the upper value of the timer at exactly the same time when the lower part is read. The second read operation would then read the contents of the STM_CAP to get the complete timer value. The content of the 56-bit System Timer can be compared against the content of two compare values stored in the compare registers. Interrupts can be generated on a compare match of the STM with the STM_CMP0 or STM_CMP1 registers. The maximum clock period is 256 × fSTM. At fSTM = 75 MHz, for example, the STM counts 30.47 years before overflowing. Thus, it is capable of continuously timing the entire expected product life-time of a system without overflowing. Data Sheet 67 V1.0, 2008-04 TC1796 Functional Description Figure 17 shows an overview on the System Timer with the options for reading parts of STM contents. STM Module 31 23 15 7 0 STM_CMP0 Compare Register 0 31 23 15 7 0 STM_CMP1 STMIR1 Interrupt Control 55 47 39 31 Compare Register1 23 15 7 0 STMIR0 56-Bit System Timer Enable / Disable Clock Control 00H 00H STM_TIM5 STM_CAP STM_TIM6 fSTM Address Decoder STM_TIM4 STM_TIM3 PORST STM_TIM2 STM_TIM1 STM_TIM0 MCB05746 Figure 17 General Block Diagram of the STM Module Registers Data Sheet 68 V1.0, 2008-04 TC1796 Functional Description 3.18 Watchdog Timer The Watchdog Timer (WDT) provides a highly reliable and secure way to detect and recover from software or hardware failure. The WDT helps to abort an accidental malfunction of the TC1796 in a user-specified time period. When enabled, the WDT will cause the TC1796 system to be reset if the WDT is not serviced within a userprogrammable time period. The CPU must service the WDT within this time interval to prevent the WDT from causing a TC1796 system reset. Hence, routine service of the WDT confirms that the system is functioning properly. In addition to this standard “Watchdog” function, the WDT incorporates the EndInit feature and monitors its modifications. A system-wide line is connected to the End-ofInitialization (Endinit) feature and monitors its modifications. A system-wide line is connected to the WDT_CON0.ENDINIT bit, serving as an additional write-protection for critical registers (besides Supervisor Mode protection) A further enhancement in the TC1796’s WDT is its reset pre-warning operation. Instead of immediately resetting the device on the detection of an error (the way that standard Watchdogs do), the WDT first issues an Non-Maskable Interrupt (NMI) to the CPU before finally resetting the device at a specified time period later. This gives the CPU a chance to save system state to memory for later examination of the cause of the malfunction, an important aid in debugging. Features • • • • • • • • • • 16-bit Watchdog counter Selectable input frequency: fSYS/256 or fSYS/16384 16-bit user-definable reload value for normal Watchdog operation, fixed reload value for Time-Out and Pre-warning Modes Incorporation of the ENDINIT bit and monitoring of its modifications Sophisticated password access mechanism with fixed and user-definable password fields Proper access always requires two write accesses. The time between the two accesses is monitored by the WDT and limited. Access Error Detection: Invalid password (during first access) or invalid guard bits (during second access) trigger the Watchdog reset generation. Overflow Error Detection: An overflow of the counter triggers the Watchdog reset generation. Watchdog function can be disabled; access protection and ENDINIT monitor function remain enabled. Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system malfunction is assumed and the TC1796 is held in reset until a power-on reset. This prevents the device from being periodically reset if, for instance, connection to the external memory has been lost such that even system initialization could not be performed 69 V1.0, 2008-04 Data Sheet TC1796 Functional Description • Important debugging support is provided through the reset pre-warning operation by first issuing an NMI to the CPU before finally resetting the device after a certain period of time. 3.19 System Control Unit The System Control Unit (SCU) of the TC1796 handles several system control tasks. These system control tasks of the SCU are: • • • • • • • • • • • • • • • • • Clock system selection and control Reset and boot operation control Power management control Configuration input sampling External Request Unit System clock output control Chip select generation for EBU EBU pull devices control On-chip SRAM Parity Control Pad driver temperature compensation control Emergency stop input control for GPTA outputs Die Temperature Sensor GPTA1 input IN0 control Pad Test Mode control for dedicated pins ODCS level 2 trace control NMI control Miscellaneous SCU control 3.20 Boot Options The TC1796 booting schemes provide a number of different boot options for the start of code execution. Table 7 shows the boot options available in the TC1796. Data Sheet 70 V1.0, 2008-04 TC1796 Functional Description Table 7 BRKIN TC1796 Boot Selections HWCFG Type of Boot [3:0] 0000B 0001B 0010B 0011B Enter bootstrap loader mode 1: Serial ASC0 boot via ASC0 pins Enter bootstrap loader mode 2: Serial CAN boot via CAN pins Start from internal PFLASH A000 0000H Alternate boot mode (ABM): start from internal As defined in PFLASH after CRC check is correctly executed; ABM header or enter a serial bootstrap loader mode1) if CRC D400 0000H check fails. Start from external memory with EBU as master, A100 0000H using CS0; automatic EBU configuration2); Alternate boot mode (ABM): start from external As defined in memory with CRC check and EBU as master, ABM header or using CS0; enter a serial bootstrap loader D400 0000H 2) mode if CRC checks fails; automatic EBU configuration2); Start from external memory with EBU as participant, using CS0; automatic EBU configuration2); A100 0000H Boot ROM Exit Jump Address D400 0000H Normal Boot Options 1 0100B 0101B 0110B 0111B Alternate boot mode (ABM): start from external As defined in memory with CRC check and EBU as ABM header or participant, using CS0; enter a serial bootstrap D400 0000H loader mode2) if CRC checks fails; automatic EBU configuration2); Start from emulation memory if emulation device TC1796ED is available; in case of TC1796: Execute stop loop; Enter bootstrap loader mode 3: Serial ASC0 boot via CAN pins Reserved; execute stop loop; If TC1796ED: AFF0 0000H D400 0000H – 1000B 1111B Others Data Sheet 71 V1.0, 2008-04 TC1796 Functional Description Table 7 BRKIN TC1796 Boot Selections (cont’d) HWCFG Type of Boot [3:0] 0000B 1000B Others Tri-state chip Go to external emulator space with EBU as master, using CSEMU/CSCOMB Reserved; execute stop loop; Boot ROM Exit Jump Address – DE00 0000H – Debug Boot Options 0 1) The type of the alternate bootstrap loader mode is selected by the value of the SCU_SCLIR.SWOPT[2:0] bit field, which contains the levels of the P0.[2:0] latched in with the rising edge of the HDRST. For more details on ABM, see the User’s Manual. 2) The EBU fetches the boot configuration from address offset 4 using CS0. Data Sheet 72 V1.0, 2008-04 TC1796 Functional Description 3.21 Power Management System The TC1796 power management system allows software to configure the various processing units so that they automatically adjust to draw the minimum necessary power for the application. There are three power management modes: • • • Run Mode Idle Mode Sleep Mode The operation of each system component in each of these states can be configured by software. The power-management modes provide flexible reduction of power consumption through a combination of techniques, including stopping the CPU clock, stopping the clocks of other system components individually, and individually clockspeed reduction of some peripheral components. Besides these explicit software-controlled power-saving modes, in the TC1796 special attention has been paid for automatic power-saving in those operating units which are currently not required or idle. In that case they are shut off automatically until their operation is required again. Table 8 describes the features of the power management modes. Table 8 Mode Run Idle Power Management Mode Summary Description The system is fully operational. All clocks and peripherals are enabled, as determined by software. The CPU clock is disabled, waiting for a condition to return it to Run Mode. Idle Mode can be entered by software when the processor has no active tasks to perform. All peripherals remain powered and clocked. Processor memory is accessible to peripherals. A reset, Watchdog Timer event, a falling edge on the NMI pin, or any enabled interrupt event will return the system to Run Mode. The system clock signal is distributed only to those peripherals programmed to operate in Sleep Mode. The other peripheral module will be shut down by the suspend signal. Interrupts from operating peripherals, the Watchdog Timer, a falling edge on the NMI pin, or a reset event will return the system to Run Mode. Entering this state requires an orderly shut-down controlled by the Power Management State Machine. Sleep In typical operation, Idle Mode and Sleep Mode may be entered and exited frequently during the run time of an application. For example, system software will typically cause the CPU to enter Idle Mode each time it has to wait for an interrupt before continuing its tasks. In Sleep Mode and Idle Mode, wake-up is performed automatically when any enabled interrupt signal is detected, or if the Watchdog Timer signals the CPU with an NMI trap. Data Sheet 73 V1.0, 2008-04 TC1796 Functional Description 3.22 On-Chip Debug Support Figure 18 shows a block diagram of the TC1796 OCDS system. TriCore CPU SBCU RBCU PCP2 TR[15:0] M U X Cerberus TRCLK OCDS System Control Unit (OSCU) Enable, Control, R eset Signals Watchdog Timer (WDT) DMA Controller Break & Suspend Signals (Bus Bridge) Remote Peripheral Bus System Peripheral Bus SPB Peripheral Unit 1 SPB Peripheral Unit m RPB Peripheral Unit 1 RPB Peripheral Unit n MCB05756_mod TDI TDO TMS TCK TRST Multi Core Break Switch (MCBS) JTAG Controller JTAG Debug Interface (JDI) BRKIN BRKOUT Figure 18 • • • OCDS System Block Diagram The TC1796 basically supports three levels of debug operation: OCDS Level 1 debug support OCDS Level 2 debug support OCDS Level 3 debug support Data Sheet 74 V1.0, 2008-04 TC1796 Functional Description OCDS Level 1 Debug Support The OCDS Level 1 debug support is mainly assigned for real-time software debugging purposes which have a demand for low-cost standard debugger hardware. The OCDS Level 1 debug support is based on a JTAG interface which can be used by the external debug hardware to communicate with the system. The on-chip Cerberus module controls the interactions between the JTAG interface and the on-chip modules. The external debug hardware may become master of the internal buses and read or write the on-chip register/memory resources. The Cerberus also allows to define breakpoint and trigger conditions as well as to control user program execution (run/stop, break, single-step). OCDS Level 2 Debug Support The OCDS Level 2 debug support allows to implement program tracing capabilities for enhanced debuggers by extending the OCDS Level 1 debug functionality with an additional 16-bit wide trace port with trace clock. With the trace extension the following four trace capabilities are provided (only one of the four trace capabilities can be selected at a time): • • • • Trace capability of the CPU program flow Trace capability of the PCP2 program flow Trace capability of the DMA Controller transaction requests Trace capability of the DMA Controller move engine status information OCDS Level 3 Debug Support The OCDS Level 3 debug support is based on a special emulation device, the TC1796ED, which provides additional features required for high-end emulation purposes. The TC1796ED is a device which includes the TC1796 product chip and additional emulation extension hardware in a package with the same footprint as the TC1796. Data Sheet 75 V1.0, 2008-04 TC1796 Functional Description 3.23 • • • • • • Clock Generation and PLL The TC1796 clock system performs the following functions: Acquires and buffers incoming clock signals to create a master clock frequency Distributes in-phase synchronized clock signals throughout the TC1796’s entire clock tree Divides a system master clock frequency into lower frequencies required by the different modules for operation. Dynamically reduces power consumption during operation of functional units Statically reduces power consumption through programmable power-saving modes Reduces electromagnetic interference (EMI) by switching off unused modules The clock system must be operational before the TC1796 is able to run. Therefore, it also contains special logic to handle power-up and reset operations. Its services are fundamental to the operation of the entire system, so it contains special fail-safe logic. Features • • • • PLL operation for multiplying clock source by different factors Direct drive capability for direct clocking Comfortable state machine for secure switching between basic PLL, direct or prescaler operation Sleep and Power-Down Mode support The TC1796 Clock Generation Unit (CGU) as shown in Figure 19 allows a very flexible clock generation. It basically consists of an main oscillator circuit and a Phase- Locked Loop (PLL). The PLL can converts a low-frequency external clock signal from the oscillator circuit to a high-speed internal clock for maximum performance. The system clock fSYS is generated from an oscillator clock fOSC in either of four hardware/software selectable ways: • Direct Drive Mode (PLL Bypass): In Direct Drive Mode, the PLL is bypassed and the CGU clock outputs are directly fed from the clock signal fOSC, i.e. fCPU = fOSC and fSYS = fOSC/2 or fOSC. This allows operation of the TC1796 with a reasonably small fundamental mode crystal. VCO Bypass Mode (Prescaler Mode): In VCO Bypass Mode, fCPU and fSYS are derived from fOSC by the two divider stages, P-Divider and K-Divider. The system clock fSYS can be equal to fCPU or fCPU/2. PLL Mode: In PLL Mode, the PLL is running. The VCO clock fVCO is derived from fOSC, divided by the P factor, multiplied by the PLL (N-Divider). The clock signals fCPU and fSYS are derived from fVCO by the K-Divider. The system clock fSYS can be equal to fCPU or fCPU/2. PLL Base Mode: In PLL Base Mode, the PLL is running at its VCO base frequency and fCPU and fSYS 76 V1.0, 2008-04 • • • Data Sheet TC1796 Functional Description are derived from fVCO only by the K-Divider. In this mode, the system clock fSYS can be equal to fCPU or fCPU/2. XTAL1 Main Osc. Circuit XTAL2 fOSC Clock Generation Unit (CGU) Clock Output Control ≥1 fCPU fSYS PDivider fP fN Phase Detect. VCO fVCO M U X KDivider NDivider Osc. Run Detect. OSCDSIC ORDRES MOSC OSCR PLL Lock Detect. LOCK PLL VCOBYP VCOSEL BYPPIN BYPASS Oscillator Control Register OSC_CON P5.3 / TXD1A PLL Clock Control and Status Register PLL_CLC System Control Unit (SCU) MCB05600 Figure 19 Clock Generation Unit Recommended Oscillator Circuits The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal oscillator or an external stable clock source. It basically consists of an inverting amplifier and a feedback element with XTAL1 as input, and XTAL2 as output. When using a crystal, a proper external oscillator circuitry must be connected to both pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz to 25 MHz. Additionally are necessary, two load capacitances CX1 and CX2, and depending on the crystal type a series resistor RX2 to limit the current. A test resistor RQ may be temporarily inserted to measure the oscillation allowance (negative resistance) of the oscillator circuitry. RQ values are typically specified by the crystal vendor. The CX1 and CX2 values shown in Figure 20 can be used as starting points for the negative resistance evaluation and for non-productive systems. The exact values and related operating range are dependent on the crystal frequency and have to be determined and Data Sheet 77 V1.0, 2008-04 SYSFS NDIV PDIV KDIV OGC TC1796 Functional Description optimized together with the crystal vendor using the negative resistance method. Oscillation measurement with the final target system is strongly recommended to verify the input amplitude at XTAL1 and to determine the actual oscillation allowance (margin negative resistance) for the oscillator-crystal system. When using an external clock signal, it must be connected to XTAL1. XTAL2 is left open (unconnected). The external clock frequency can be in the range of 0 - 40 MHz if the PLL is bypassed and 4 - 40 MHz if the PLL is used. The oscillator can also be used in combination with a ceramic resonator. The final circuitry must be also verified by the resonator vendor. Figure 20 shows the recommended external oscillator circuitries for both operating modes, external crystal mode and external input clock mode. VDDOSC VDDOSC3 VDDOSC VDDOSC3 XTAL1 4 - 25 MHz TC1796 Oscillator fOSC External Clock Signal 41) - 40 MHz XTAL1 TC1796 Oscillator XTAL2 fOSC RQ RX2 XTAL2 CX1 CX2 VSSOSC 1) Fundamental Mode Crystal VSSOSC 1) in case of PLL bypass 0 MHz Crystal Frequency CX1, CX2 4 MHz 8 MHz 12 MHz 16 - 25 MHz 33 pF 18 pF 12 pF 10 pF RX2 0 0 0 0 1) 1) Note that these are evaluation start values! MCS05601 Figure 20 Oscillator Circuitries A block capacitor between VDDOSC1)/VDDOSC3 and VSSOSC is recommended, too. Note: For crystal operation, it is strongly recommended to measure the negative resistance in the final target system (layout) to determine the optimum parameters 1) VDDOSC and VSSOSC are not bonded externally in the BC and BD steps of TC1796. An option for bonding them in future steps and products is kept open. Data Sheet 78 V1.0, 2008-04 TC1796 Functional Description for the oscillator operation. Please refer to the minimum and maximum values of the negative resistance specified by the crystal supplier. 3.24 • • • Power Supply The TC1796 has several power supply lines for different voltage classes: 1.5 V: Core logic and memory, oscillator, and A/D converter supply 3.3 V: I/O ports, Flash memories, oscillator, and A/D converter supply with reference voltages 2.3 V to 3.3 V: External bus interface supply Figure 21 shows the power supply concept of the TC1796 with the power supply pins and its connections to the functional units. VAREF0 VSS 62 TC1796 ADC0 ADC1 FADC (3.3 V) (3.3 V) VDDM (3.3 V) VAREF1 VAGND1 2 (1.5 V) VDDAF VFAREF (3.3 V) (3.3 V) VDDMF VAGND0 2 VSSM 2 VSSAF 2 VFAGND VSSMF 2 2 Ports Core PLL EBU PMI/PMU DMI/DMU Memories Stand-by SBRAM FLASH Memories OSC 11 (3.3 V) 9 (2.3 - 3.3 V) 13 (1.5 V) 1 2 (3.3 V) 3 VDDP VDDEBU VDD VDDSBRAM (1.5 V) VDDFL3 VDDOSC (1.5 V) VDDOSC3 (3.3 V) VSSOSC tc1 7 9 6 _ Pw rSu p p ly Figure 21 Data Sheet Power Supply Concept of TC1796 79 V1.0, 2008-04 TC1796 Functional Description 3.25 Identification Register Values The Identification Registers uniquely identify a module or the whole device. Table 9 Short Name SCU_ID MANID CHIPID RTID TC1796 Identification Registers Address F000 0008H F000 0070H F000 0074H F000 0078H Value 002C C002H 0000 1820H 0000 8A02H 0000 0000H 0000 0001H 0000 0100H 0000 0101H 0000 0300H SBCU_ID STM_ID CBS_JPDID MSC0_ID MSC1_ID ASC0_ID ASC1_ID GPTA0_ID GPTA1_ID LTCA2_ID DMA_ID CAN_ID PCP_ID RBCU_ID SSC0_ID SSC1_ID FADC_ID Data Sheet Stepping – – – BA-Step BB-Step BC-Step BD-Step BE-Step – – – – – – – BA-, BB-Step BC-, BD-, BE-Step BA-, BB-Step BC-, BD-, BE-Step BA-, BB-Step BC-, BD-, BE-Step – – – – – – – V1.0, 2008-04 F000 0108H F000 0208H F000 0408H F000 0808H F000 0908H F000 0A08H F000 0B08H F000 1808H F000 2008H F000 2808H F000 3C08H F000 4008H F004 3F08H F010 0008H F010 0108H F010 0208H F010 0308H 0000 6A0AH 0000 C006H 0000 6307H 0028 C002H 0028 C002H 0000 4402H 0000 4402H 0029 C003H 0029 C004H 0029 C003H 0029 C004H 002A C003H 002A C004H 001A C002H 002B C002H 0020 C003H 0000 6A0AH 0000 4530H 0000 4510H 0027 C002H 80 TC1796 Functional Description Table 9 Short Name ADC0_ID MLI0_ID MLI1_ID MCHK_ID CPS_ID CPU_ID EBU_ID PMU_ID FLASH_ID DMU_ID DBCU_ID DMI_ID PMI_ID LFI_ID PBCU_ID TC1796 Identification Registers (cont’d) Address F010 0408H F010 C008H F010 C108H F010 C208H F7E0 FF08H F7E1 FE18H F800 0008H F800 0508H F800 2008H F801 0108H F87F FA08H F87F FC08H F87F FD08H F87F FF08H F87F FE08H Value 0030 C002H 0025 C005H 0025 C005H 001B C001H 0015 C006H 000A C005H 0014 C005H 002E C002H 0031 C002H 002D C002H 000F C005H 0008 C004H 000B C004H 000C C005H 000F C005H Stepping – – – – – – – – – – – – – – – Data Sheet 81 V1.0, 2008-04 TC1796 Electrical Parameters 4 4.1 4.1.1 Electrical Parameters General Parameters Parameter Interpretation The parameters listed in this section partly represent the characteristics of the TC1796 and partly its requirements on the system. To aid interpreting the parameters easily when evaluating them for a design, they are marked with an two-letter abbreviation in column “Symbol”: • CC Such parameters indicate Controller Characteristics which are a distinctive feature of the TC1796 and must be regarded for a system design. SR Such parameters indicate System Requirements which must provided by the microcontroller system in which the TC1796 designed in. • Data Sheet 82 V1.0, 2008-04 TC1796 Electrical Parameters 4.1.2 Pad Driver and Pad Classes Summary This section gives an overview on the different pad driver classes and its basic characteristics. More details (mainly DC parameters) are defined in the Section 4.2.1. Table 10 Pad Driver and Pad Classes Overview Sub Class A1 (e.g. GPIO) A2 (e.g. serial I/Os) Speed Load Grade Leakage Termination 1) Class Power Type Supply A 3.3V LVTTL I/O, LVTTL output 6 MHz 100 pF 500 nA 40 MHz 50 pF 6 µA No Series termination recommended Series termination recommended (for f > 25 MHz) Series termination recommended No A3 75 MHz (e.g. Trace Outputs, serial I/Os) A4 (e.g. Trace Clock) B 2.375 3.6V2) LVTTL B1 I/O (e.g. External Bus Interface) B2 (e.g. Bus Clock) C 3.3V LVDS – 150 MHz 40 MHz 50 pF 6 µA 25 pF 6 µA 50 pF 6 µA 75 MHz 35 pF Series termination recommended (for f > 25 MHz) – Parallel termination3), 100 Ω ± 10% 50 MHz D – Analog inputs, reference voltage inputs 1) Values are for TJmax = 150 °C. 2) AC characteristics for EBU pins are valid for 2.5 V ± 5% and 3.3 V ± 5%. 3) In applications where the LVDS pins are not used (disabled), these pins must be either left unconnected, or properly terminated with the differential parallel termination of 100 Ω ± 10%. Data Sheet 83 V1.0, 2008-04 TC1796 Electrical Parameters 4.1.3 Absolute Maximum Ratings Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions (VIN > related VDD or VIN < VSS) the voltage on the related VDD pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Table 11 Parameter Absolute Maximum Rating Parameters Symbol Values Min. Typ. Max. Unit Note / Test Con dition °C °C °C V V V Under bias – Under bias – – Whatever is lower Whatever is lower Whatever is lower Whatever is lower TA SR Storage temperature TST SR Junction temperature TJ SR Voltage at 1.5 V power supply VDD pins with respect to VSS1) SR Voltage at 3.3 V power supply VDDEBU pins with respect to VSS2) VDDP SR Voltage on any Class A input VIN SR Ambient temperature pin and dedicated input pins with respect to VSS Voltage on any Class B input VIN pin with respect to VSS Voltage on any Class D analog input pin with respect to VAGND Voltage on any Class D analog input pin with respect to VSSAF CPU & LMB Bus Frequency FPI Bus Frequency -40 -65 -40 – – – – – – – 125 150 150 2.25 3.75 -0.5 – VDDP + 0.5 or max. 3.7 SR -0.5 – -0.5 – SR -0.5 – SR SR – SR – – – VDDEBU + 0.5 V or max. 3.7 VAIN VAREFx VAINF VFAREF fCPU fSYS VDDM + 0.5 or max. 3.7 or max. 3.7 1503) 75 3) V VDDMF + 0.5 V MHz – MHz – 1) Applicable for VDD, VDDSBRAM, VDDOSC, VDDPLL, and VDDAF. 2) Applicable for VDDP, VDDEBU, VDDFL3, VDDM, and VDDMF. 3) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter parameters. Data Sheet 84 V1.0, 2008-04 TC1796 Electrical Parameters 4.1.4 Operating Conditions The following operating conditions must not be exceeded in order to ensure correct operation of the TC1796. All parameters specified in the following table refer to these operating conditions, unless otherwise noticed. The following operating conditions must not be exceeded in order to ensure correct operation of the TC1796. All parameters specified in the following table refer to these operating conditions, unless otherwise noted. Table 12 Parameter Digital supply voltage1) Operating Condition Parameters Symbol Min. Values Typ. Max. Unit Note / Test Condition – For Class A pins (3.3V ± 5%) For Class B (EBU) pins – – 6) VDD SR 1.42 – 2) VDDOSC SR VDDP SR 3.13 – VDDOSC3 SR VDDEBU SR 2.375 – VDDFL3 SR 3.13 VDDSBRAM5) 1.42 SR – – – 1.583) V 3.474) V 3.474) V 3.474) V 1.58 – 3) V V Voltage on VDDSBRAM power supply pin to ensure data retention Digital ground voltage Ambient temperature under bias VDR VSS TA SR 1.0 SR 0 SR – – – -40 – – +125 – V °C – – – See separate specification Page 92, Page 99 9) Analog supply voltages – CPU clock Short circuit current Absolute sum of short circuit currents of a pin group (see Table 13) Inactive device pin current fCPU ISC Σ|ISC| IID SR –7) SR -5 SR – – – – 1508) +5 20 MHz – mA mA See note10) SR -1 – 1 mA Voltage on all power supply pins VDDx = 0 V1.0, 2008-04 Data Sheet 85 TC1796 Electrical Parameters Table 12 Parameter Absolute sum of short circuit currents of the device External load capacitance Operating Condition Parameters Symbol Min. Σ|ISC| SR – Values Typ. Max. – 100 Unit Note / Test Condition mA See note10) CL SR – – – pF Depending on pin class. See DC characteristics 1) Digital supply voltages applied to the TC1796 must be static regulated voltages which allow a typical voltage swing of ±5%. 2) VDDOSC and VSSOSC are not bonded externally in the BC and BD steps of TC1796. An option for bonding them in future steps and products is kept open. 3) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less than 100 µs and the cumulated summary of the pulses does not exceed 1 h. 4) Voltage overshoot to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less than 100 µs and the cumulated summary of the pulses does not exceed 1 h 5) The VDDSB must be properly connected and supplied with power. If not, the TC1796 will not operate. In case of a stand-by operation, the core voltage must not float, but must be pulled low, in order to avoid internal crosscurrents. 6) This applies only during power down state. During normal SRAM operation regular VDD has to be applied. 7) The TC1796 uses a static design, so the minimum operation frequency is 0 MHz. Due to test time restriction no lower frequency boundary is tested, however. 8) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter parameters. 9) Applicable for digital outputs. 10) See additional document “TC1796 Pin Reliability in Overload“ for overload current definitions. Table 13 Group 1 2 3 4 5 6 7 8 Pin Groups for Overload/Short-Circuit Current Sum Parameter Pins P4.[7:0] P4.[14:8] P4.15, SLSO[1:0], SCLK0, MTSR0, MRST0, SLSI0 WAIT, HOLD, BC[3:0], HLDA, MR/W, BAA, CSCOMB CS[3:0], RD, RD/WR, BREQ, ADV, BFCLKO BFCLKI, D[31:24] D[23:16] D[15:8] Data Sheet 86 V1.0, 2008-04 TC1796 Electrical Parameters Table 13 Group 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Pin Groups for Overload/Short-Circuit Current Sum Parameter Pins D[7:0] A[23:16] A[15:8] A[7:0] TSTRES, TDI, TMS, TCK, TRST, TDO, BRKOUT, BRKIN, TESTMODE P10.[3:0], BYPASS, NMI, PORST, HDRST P9.[8:0] FCLP[1:0]A, FCLN[1:0], SOP[1:0]A, SON[1:0] P5.[7:0] P3.[7:0] P3.[15:8] P0.[7:0] P0.[15:8] P2.[15:7] P2.[6:2], P6.9, P6.8, P6.6, P6.11 P6.[15:12], P6.10, P6.7, P6.[5:4] P8.[7:0] P1.[15:13], P1.[11:8], P1.5 P1.12, P1.[7:6], P1.[4:0] TR[15:8] TR[7:1], TRCLK TR0, P7.[7:0] Data Sheet 87 V1.0, 2008-04 TC1796 Electrical Parameters 4.2 4.2.1 Table 14 Parameter DC Parameters Input/Output Pins Input/Output DC-Characteristics (Operating Conditions apply) Symbol Min. Values Typ. Max. – – – – 100 200 85 150 µA µA µA µA Unit Note / Test Condition General Parameters Pull-up current1) |IPUH| 10 CC 20 5 Pull-down current1) |IPDL| 10 CC VIN < VIHAmin; VIN VILAmax; class B1/B2 pads. class A1/A2/Input pads. VIN > VILBmax; class B1/B2 pads 20 Pin capacitance (Digital I/O) 1) – – 200 10 µA pF VIN > VILAmax; class A3/A4 pads. CIO – CC -0.3 SR f = 1 MHzTA = 25 °C Input only Pads (VDDP = 3.13 to 3.47 V = 3.3 V ± 5%) Input low voltage Class A1/A2 pins VILA – – 0.34 × V V – Whatever is lower Input high voltage VIHA 0.64 × Class A1/A2 pins SR VDDP VDDP VDDP+ 0.3 or max. 3.6 Ratio VIL/VIH Input hysteresis Input leakage current CC 0.53 HYSA 0.1 × CC VDDP – – – – – ±3000 ±6000 – V nA – 5)2) IOZI – CC VDDP/2-1 < VIN < VDDP/2+1 Otherwise3) Data Sheet 88 V1.0, 2008-04 TC1796 Electrical Parameters Table 14 Parameter Input/Output DC-Characteristics (cont’d)(Operating Conditions apply) Symbol Min. Output low voltage4) Values Typ. Max. – 0.4 V Unit Note / Test Condition Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ± 5%) VOLA – CC IOL = 2 mA for strong driver mode, IOL = 1.8 mA for medium driver mode, A2 pads IOL = 1.4 mA for medium driver mode, A1 pads IOL = 370 µA for weak driver mode 2.4 – – V Output high voltage3) VOHA CC IOH = -2 mA for strong driver mode, IOH = -1.8 mA for medium driver mode, A1/A2 pads IOH = -370 µA for weak driver mode VDDP - – 0.4 – V IOH = -1.4 mA for strong driver mode, IOH = -1 mA for medium driver mode, A1/A2 pads IOH = -280 µA for weak driver mode 0.34 × V V – Whatever is lower Input low voltage Class A1/2 pins VILA -0.3 SR – – Input high voltage VIHA 0.64 × Class A1/2 pins SR VDDP Ratio VIL/VIH Input hysteresis Input leakage current Class A2/3/4 pins Input leakage current Class A1 pins CC 0.53 HYSA 0.1 × CC VDDP VDDP VDDP + 0.3 or 3.6 – – – – – ±3000 ±6000 ±500 – V nA – 5)2) IOZA24 IOZA1 – VDDP/2-1 < VIN < VDDP/2+1 Otherwise3) 0 V < VIN < VDDP – CC – nA Data Sheet 89 V1.0, 2008-04 TC1796 Electrical Parameters Table 14 Parameter Input/Output DC-Characteristics (cont’d)(Operating Conditions apply) Symbol Min. Output low voltage VOLB CC – Output high voltage Input low voltage Values Typ. Max. – 0.4 – 0.34 × V V V V Unit Note / Test Condition Class B Pads (VDDEBU = 2.375 to 3.47 V) VOHB VILB CC - 0.4 – SR VDDEBU – -0.3 – IOL = 2 mA IOL = 2 mA – Whatever is lower Input high voltage VIHB 0.64 × SR VDDEBU CC 0.53 VDDEBU VDDEBU +0.3 or 3.6 – – – ±3000 ±6000 – – – – – – 1545 600 1325 140 – mV mV mV mV Ω – – V nA – 5) Ratio VIL/VIH Input hysteresis Input leakage current Class B pins HYSB 0.1 × – CC VDDEBU IOZB – CC – VDDEBU/2-0.6 < VIN < VDDEBU/2+0.66) Otherwise3) Class C Pads (VDDP = 3.13 to 3.47 V = 3.3V ± 5%) Output low voltage VOL CC 815 Output high voltage Parallel termination 100 Ω ± 1% Parallel termination 100 Ω ± 1% Parallel termination 100 Ω ± 1% Parallel termination 100 Ω ± 1% – – VOH CC Output differential VOD CC 150 voltage Output offset voltage Class D Pads See ADC Characteristics – VOS CC 1075 CC 40 Output impedance R0 1) Not subject to production test, verified by design / characterization. 2) The pads that have spike-filter function in the input path: PORST, HDRST, NMI, do not have hysteresis. 3) Only one of these parameters is tested, the other is verified by design characterization 4) Max. resistance between pin and next power supply pin 25 Ω for strong driver mode (verified by design characterization). Data Sheet 90 V1.0, 2008-04 TC1796 Electrical Parameters 5) Function verified by design, value verified by design characterization. Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses switching due to external system noise. 6) VDDEBU = 2.5 V ± 5%. For VDDEBU = 3.3 ± 5% see class A2 pads. Data Sheet 91 V1.0, 2008-04 TC1796 Electrical Parameters 4.2.2 Table 15 Parameter Analog to Digital Converters (ADC0/ADC1) ADC Characteristics (Operating Conditions apply) Symbol Min. Values Typ. 3.3 1.5 Max. 3.471) 1.58 2) Unit V V Note / Test Condition – Power supply for ADC digital part, internal supply – – Analog supply voltage VDDM VDD VSSM SR 3.13 SR 1.42 Analog ground voltage Analog reference voltage17) Analog reference ground17) Analog input voltage range Analog reference voltage range5)17) VDDM supply current Power-up calibration time Internal ADC clocks Total unadjusted error5) SR -0.1 – 0.1 V V VAREFx SR VAGNDx VDDM +1V VDDM+ 1)3)4) 0.05 VAGNDx SR VSSMx - 0 0.05V VAREF - V 1V – – – For each module6) – VAIN SR VAGNDx – VAREFx VDDM + 0.05 4 3840 40 10 ±1 ±2 ±4 ±8 ±3.0 ±3.0 V V mA rms VAREFxVDDM/2 – VAGNDx SR IDDM SR – 2.5 tPUC fBC fANA CC – CC 2 CC 0.5 – – – – – – – – – – ±1.5 ±1.5 fADC CLK MHz fBC = fANA × 4 MHz fANA = fBC / 4 LSB LSB LSB LSB LSB LSB 8-bit conversion. 10-bit conversion 12-bit conversion 8)9) TUE7) CC – 12-bit conversion 10)9) DNL error11) 5) INL error11)5) TUEDNL – CC TUEINL – CC 12-bit conversion 12)9) 12-bit conversion 12)9) Data Sheet 92 V1.0, 2008-04 TC1796 Electrical Parameters Table 15 Parameter Gain error 11)5) ADC Characteristics (cont’d) (Operating Conditions apply) Symbol Min. TUEGAIN – CC TUEOFF – CC Values Typ. ±0.5 ±1.0 – – – – – – – – – Max. ±3.5 ±4.0 300 400 1000 3000 200 300 1000 3000 ±1 LSB LSB nA nA nA nA nA nA nA nA µA Unit Note / Test Condition 12-bit conversion 12)9) Offset error11)5) Input leakage current at analog inputs AN0, AN1, AN4 to AN7, AN24 to AN31. see Figure 24 13) 14) 12-bit conversion 12)9) IOZ1 CC -1000 -200 -200 -200 (0% VDDM) < VIN < (2% VDDM) (2% VDDM) < VIN < (95% VDDM) (95% VDDM) < VIN < (98% VDDM) (98% VDDM) < VIN < (100% VDDM) (0% VDDM) < VIN < (2% VDDM) (2% VDDM) < VIN < (95% VDDM) (95% VDDM) < VIN < (98% VDDM) (98% VDDM) < VIN < (100% VDDM) 0 V < VAREF < VDDM, no conversion running 0 V < VAREF < Input leakage current at the other analog inputs, that is AN2, AN3, AN8 to AN23, AN32 to AN43 see Figure 24 14) IOZ1 CC -1000 -200 -200 -200 Input leakage current at VAREF IOZ2 CC – Input current at VAREF0/1 17) IAREF CC – – 35 – 75 25 µA rms pF VDDM15) 9) Total capacitance of the voltage reference inputs16)17) CAREFTOT CC Switched CAREFSW – capacitance at the CC positive reference voltage input17) 15 20 pF 9)18) Data Sheet 93 V1.0, 2008-04 TC1796 Electrical Parameters Table 15 Parameter Resistance of the reference voltage input path16) Total capacitance of the analog inputs16) ADC Characteristics (cont’d) (Operating Conditions apply) Symbol Min. Values Typ. 1 Max. 1.5 kΩ – CC Unit Note / Test Condition 500 Ohm increased for AN[1:0] used as reference input9) 6)9) RAREF CAINTOT – CC – 25 pF Switched CAINSW – capacitance at the CC analog voltage inputs ON resistance of the transmission gates in the analog voltage path – 7 pF 9)19) RAIN CC – 1 1.5 kΩ 9) ON resistance for RAIN7T CC 200 the ADC test (pulldown for AIN7) Current through resistance for the ADC test (pulldown for AIN7) 300 1000 Ω Test feature available only for AIN79) Test feature available only for AIN79) IAIN7T CC – 15 rms 30 peak mA 1) Voltage overshoot to 4 V are permissible, provided the pulse duration is less than 100 µs and the cumulated summary of the pulses does not exceed 1 h. 2) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated summary of the pulses does not exceed 1 h. 3) A running conversion may become inexact in case of violating the normal operating conditions (voltage overshoot). the reference voltage VAREF increases or the VDDM decreases, so that VAREF = (VDDM + 0.05V to VDDM + 0.07V), then the accuracy of the ADC decreases by 4LSB12. 5) If a reduced reference voltage in a range of VDDM/2 to VDDM is used, then the ADC converter errors increase. 4) If If the reference voltage is reduced with the factor k (k V1.5 - 0.5V VDDP (3.3V) PORST Time Time PowerSeq 2 Figure 29 VDDP / VDDEBU / VDD Power Up Sequence All ground pins VSS must be externally connected to one single star point in the system. The difference voltage between the ground pins must not exceed 200 mV. The PORST signal must be activated at latest before any power supply voltage falls below the levels shown on the figure below. In this case, only the memory row of a Flash memory that was a target of a write at the moment of the power loss will contain unreliable content. Additionally, the PORST signal should be activated as soon as possible. The sooner the PORST signal is activated, the less time the system operates outside of the normal operating power supply range. Data Sheet 107 V1.0, 2008-04 TC1796 Electrical Parameters VDDP, VDDEBU, VDDFL3 VPORST3.3 VDDPmin Power Supply Voltage 3.3V 3.13V VDDP 2.9V -5% -12% t PORST t VPORST1.5min VDDmin VDD 1.5V 1.42V VDD 1.32V -5% -12% t PORST PowerDown3.3_1.5_reset_only.vsd t Figure 30 Power Down / Power Loss Sequence Data Sheet 108 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.4 Table 23 Parameter Power, Pad and Reset Timing Power, Pad and Reset Timing Parameters Symbol Min. Values Typ. – – – Max. – 10 – Unit Note / Test Con dition V ms ms – – – Min. VDDP voltage to ensure defined pad states1) Oscillator start-up time2) Minimum PORST active time after power supplies are stable at operating levels HDRST pulse width VDDPPA CC 0.6 tOSCS tPOA tHD tPOR tPOS tPOH tHDS tHDH tPIP tPI CC – SR 10 CC 1024 – clock cycles3)6) SR – SR 0 SR 100 SR 0 SR 100 + (2 × 1/ fSYS)6) CC – CC – – – – – – – fSYS – PORST rise time Setup time to PORST rising edge4) Hold time from PORST rising edge4) Setup time to HDRST rising edge5) Hold time from HDRST rising edge5) Ports inactive after PORST reset active7)8) Ports inactive after HDRST reset active Minimum VDDP PORST activation threshold9) Minimum VDD PORST activation threshold9) Power on Reset Boot Time9) Hardware/Software Reset Boot Time at fCPU=150MHz10) Data Sheet 50 – – – – ms ns ns ns ns – – – – – – – 150 ns – – 150 + ns 5 × 1/ fSYS VPORST3.3 VPORST1.5 tBP tB – – – – – – 2.9 1.32 2 350 V V ms µs – – – – SR SR CC – CC 150 109 V1.0, 2008-04 TC1796 Electrical Parameters 1) This parameter is valid under assumption that PORST signal is constantly at low level during the powerup/power-down of the VDDP. 2) tOSCS is defined from the moment when VDDOSC3 = 3.13V until the oscillations reach an amplitude at XTAL1 of 0,3*VDDOSC3. This parameter is verified by device characterization. The external oscillator circuitry must be optimized by the customer and checked for negative resistance as recommended and specified by crystal suppliers. 3) Any HDRST activation is internally prolonged to 1024 FPI bus clock (fSYS) cycles. 4) Applicable for input pins TESTMODE, TRST, BRKIN, and TXD1A with noise suppression filter of PORST switched-on (BYPASS = 0). 5) The setup/hold values are applicable for Port 0 and Port 10 input pins with noise suppression filter of HDRST switched-on (BYPASS = 0), independently whether HDRST is used as input or output. 6) fSYS = fCPU/2 7) Not subject to production test, verified by design / characterization. 8) This parameter includes the delay of the analog spike filter in the PORST pad. 9) The duration of the boot-time is defined between the rising edge of the PORST and the moment when the first user instruction has entered the CPU and its processing starts. 10) The duration of the boot time is defined between the following events: 1. Hardware reset: the falling edge of a short HDRST pulse and the moment when the first user instruction has entered the CPU and its processing starts, if the HDRST pulse is shorter than 1024 × TSYS. If the HDRST pulse is longer than 1024 × TSYS, only the time beyond the 1024 × TSYS should be added to the boot time (HDRST falling edge to first user instruction). 2. Software reset: the moment of starting the software reset and the moment when the first user instruction has entered the CPU and its processing starts Data Sheet 110 V1.0, 2008-04 TC1796 Electrical Parameters V DDPPA VDDP VDDPPA VDD toscs V DDPR OSC tPOA tPOA PORST thd HDRST Pads Padstate undefined 2) 1) thd 2) 1) 2) Padstate undefined re se t_ b e h 1 tpi 1) as programmed 2) Tri-state, pull device active Figure 31 Power, Pad and Reset Timing Data Sheet 111 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.5 Phase Locked Loop (PLL) Note: All PLL characteristics defined on this and the next page are verified by design characterization. Table 24 Parameter PLL Parameters (Operating Conditions apply) Symbol Min. Accumulated jitter Values Typ. Max. – Unit Note / Test Con dition – – DP fVCO See – Figure 3 2 400 600 500 – – – – – – – VCO frequency range 500 700 600 320 400 480 200 MHz – MHz – MHz – MHz – MHz – MHz – µs – PLL base frequency1) fPLLBASE 140 150 200 PLL lock-in time tL – 1) The CPU base frequency which is selected after reset is calculated by dividing the limit values by 16 (this is the K factor after reset). Phase Locked Loop Operation When PLL operation is enabled and configured, the PLL clock fVCO (and with it the CPU clock fCPU) is constantly adjusted to the selected frequency. The relation between fVCO and fSYS is defined by: fVCO = K × fCPU. The PLL causes a jitter of fCPU and affects the clock outputs BFCLKO, TRCLK, and SYSCLK (P1.12) which are derived from the PLL clock fVCO. There will be defined two formulas that define the (absolute) approximate maximum value of jitter DP in ns dependent on the K-factor, the CPU clock frequency fCPU in MHz, and the number P of consecutive fCPU clock periods. P × K < 385 D p [ ns ] = ------------------------------------------ + 0, 535 2 f cpu [ MHz ] × K 7000 × P (1) P × K ≥ 385 D p [ ns ] = -------------------------------------------- + 0, 535 2 f cpu [ MHz ] × K 2 2700000 (2) Data Sheet 112 V1.0, 2008-04 TC1796 Electrical Parameters Note: The frequency of system clock fSYS can be selected to be either fCPU or fCPU/2. With rising number P of clock cycles the maximum jitter increases linearly up to a value of P that is defined by the K-factor of the PLL. Beyond this value of P the maximum accumulated jitter remains at a constant value. Further, a lower CPU clock frequency fCPU results in a higher absolute maximum jitter value. Figure 32 gives the jitter curves for several K/fCPU combinations. ±20.0 DP ns ±16.0 fCPU = 50 MHz (K = 8) fCPU = 100 MHz (K = 4) fCPU = 120 MHz (K = 4) ±12.0 fCPU = 150 MHz (K = 4) ±8.0 ±4.0 fCPU = 100 MHz (K = 7) fCPU = 50 MHz (K = 14) 0 20 40 60 80 100 120 oo ±0.0 DP = Max. jitter P = Number of consecutive fCPU periods K = K-divider of PLL P TC1976_PLL_JITT Figure 32 Approximated Maximum Accumulated PLL Jitter for Typical CPU Clock Frequencies fCPU (overview) Data Sheet 113 V1.0, 2008-04 TC1796 Electrical Parameters DP ±4.0 ns ±3.5 ±3.0 fCPU = 50 MHz (K = 8) fCPU = 50 MHz (K = 14) fCPU = 100 MHz (K = 4) ±2.5 ±2.0 ±1.5 fCPU = 100 MHz (K = 7) fCPU = 150 MHz (K = 4) ±1.0 ±0.5 ±0.0 0 2 4 6 8 10 12 14 16 18 20 DP = Max. jitter P = Number of consecutive fCPU periods K = K-divider of PLL P TC1976_PLL_DETAIL Figure 33 Approximated Maximum Accumulated PLL Jitter for Typical CPU Clock Frequencies fCPU (detail) Note: The specified PLL jitter values are valid if the capacitive load at the External Bus Unit (EBU) is limited to CL=20pF. Note: The maximum peak-to-peak noise on the Core Supply Voltage (measured between VDD at pin E23 and VSS at pin D23, or adjacent supply pairs) is limited to a peak-to-peak voltage of VPP = 30mV. This condition can be achieved by appropriate blocking of the Core Supply Voltage as near as possible to the supply pins and using PCB supply and ground planes.=20pF. Data Sheet 114 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.6 BFCLKO Output Clock Timing VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%; TA = -40 °C to +125 °C; CL = 35 pF Table 25 Parameter BFCLK0 Output Clock Timing Parameters1) Symbol Min. BFCLKO clock period BFCLKO high time BFCLKO low time BFCLKO rise time BFCLKO fall time BFCLKO duty cycle t5/(t5 + t6)3) Values Typ. Max. – – – 3 3 55 Unit Note / Test Con dition ns ns ns ns ns % % ns – – – – – divider of 2, 4, ...4) divider of 3 4) CL = 20pF tBFCLKO CC t5 CC t6 CC t7 CC t8 CC DC24 CC 13.332) – 3 3 – – 45 – – – – 50 BFCLKO duty cycle t5/(t5 + t6)3) DC3 BFCLKO high time reduction5) dt5 CC 30 CC – 33.33 36 – 1.1 1) Not subject to production test, verified by design/characterization. 2) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter parameters. 3) The PLL jitter is not included in this parameter. If the BFCLKO frequency is equal to fCPU, the K-divider setting determines the duty cycle. 4) The division ratio between LMB and BFCLKO frequency is set by EBU_BFCON.EXTCLOCK. 5) Due to asymmetry of the delays and slopes of the rising and falling edge of the pad. The influence of the PLL jitter is included in this parameter. This parameter should be applied taking the typical value of the duty cycle in the account, not the minimum or maximum value. tBFCLKO BFCLKO 0.5 VDDP05 t5 t6 t8 t7 0.9 VDD 0.1 VDD MCT04883_mod Figure 34 BFCLKO Output Clock Timing Data Sheet 115 V1.0, 2008-04 TC1796 Electrical Parameters BFCLK Timing and PLL Jitter The BFCLK timing is important for calculating the timing of an external flash memory. In principle BFCLK timing can be derived from the PLL jitter formulas. In case of only EBU synchronous read access to the flash device the worst case jitter is partially lower. For one BFCLK with a cycle time of 13,33 ns the maximum jitter is tJPP = |+/-620 ps| For two BFCLKs with an accumulated cycle time of 26,66 ns the maximum jitter is tJPACC = |+/- 660 ps| Data Sheet 116 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.7 Debug Trace Timing VSS = 0 V; VDDP = 3.13 to 3.47 V (Class A); TA = -40 °C to +125 °C; CL (TRCLK) = 25 pF; CL (TR[15:0]) = 50 pF; Table 26 Parameter Debug Trace Timing Parameter1) Symbol Min. TR[15:0] new state from TRCLK rising edge Values Typ. – Max. 4 Unit Note / Test Con dition ns – t9 CC -1 1) Not subject to production test, verified by design/characterization. TRCLK t9 TR[15:0] Old State New State Trace_Tmg Figure 35 Debug Trace Timing Data Sheet 117 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.8 JTAG Interface Timing Operating Conditions apply, CL = 50 pF Table 27 Parameter TCK Clock Timing Parameter Symbol Min. TCK clock period1) TCK high time TCK low time TCK clock rise time TCK clock fall time Values Typ. – – – – – Max. – – – 4 4 Unit Note / Test Con dition ns ns ns ns ns – – – – – tTCK t1 t2 t3 t4 SR 25 SR 10 SR 10 SR – SR – 1) fTCK should be lower or equal to fSYS. tTCK TCK 0.5 VDDP t1 t2 t4 t3 0.9 VDD 0.1 VDD JTAG_TCK Figure 36 TCK Clock Timing Data Sheet 118 V1.0, 2008-04 TC1796 Electrical Parameters Table 28 Parameter JTAG Timing Parameters1) Symbol Min. TMS setup to TCK rising edge TMS hold to TCK rising edge TDI setup to TCK rising edge TDI hold to TCK rising edge TDO valid output from TCK falling edge2) TDO high impedance to valid output from TCK falling edge2) TDO valid output to high impedance from TCK falling edge2) 1) fTCK should be lower or equal to fSYS. 2) The falling edge on TCK is used to capture the TDO timing. Values Typ. – – – – – – – – Max. – – – – 13 – 14 13.5 Unit Note / Test Con dition – – – – C L = 50 pF C L = 20 pF C L = 50 pF C L = 50 pF t1 t2 t1 t2 t3 t3 t4 t5 SR 6.0 SR 6.0 SR 6.0 SR 6.0 CC – CC 3.0 CC – CC – ns ns ns ns ns ns ns ns TCK t1 TMS t2 t1 TDI t2 t4 TDO t3 t5 Jtag Figure 37 JTAG Timing Note: The JTAG module is fully compliant with IEEE1149.1-2000 with JTAG clock at 20 MHz. The JTAG clock at 40MHz is possible with the modified timing diagram shown in Figure 37. Data Sheet 119 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.9 EBU Demultiplexed Timing VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins; TA = -40 °C to +125 °C; CL = 35 pF; Table 29 Parameter EBU Demultiplexed Timing Parameters1) Symbol Min. Output delay from BFCLKO rising edge2) RD active/inactive after BFCLKO rising edge2) Data setup to BFCLKO rising edge2) Values Typ. – – – – – – – Max. 5 3 – – – – – ns ns ns ns ns ns ns Unit Note / Test Con dition – – – – – – – t10 t12 t13 CC 0 CC 0 SR 8.5 SR 0 SR 3 SR 2 SR 0 Data hold from BFCLKO rising t14 edge2) WAIT setup (low or high) to BFCLKO rising edge2) WAIT hold (low or high) from BFCLKO rising edge2) Data hold after RD/WR rising edge 2) Valid for BFCON.EXTCLOCK = 00B. t15 t16 t17 1) Not subject to production test, verified by design/characterization. Data Sheet 120 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.9.1 Demultiplexed Read Timing Address Phase BFCLKO Command Del. Phase (opt.) Command Phase Recovery New Addr. Phase (opt.) Phase t10 A[23:0] Valid Address t10 t10 Inval. Address Next Addr. t10 ADV t10 t10 t10 CS[3:0] CSCOMB t10 t10 t12 RD t12 RD/WR MR/W t13 D[31:0] t14 Valid Data t10 BC[3:0] t10 t16 t10 t15 WAIT DemuxRD_1.vsd Figure 38 EBU Demultiplexed Read Timing Data Sheet 121 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.9.2 Demultiplexed Write Timing Address Phase BFCLKO Command Del. Phase (opt.) Command Phase Data Hold Phase Recovery New Addr. Phase (opt.) Phase t10 A[23:0] Valid Address t10 t10 Inval. Address Next Addr. t10 ADV t10 t10 t10 CS[3:0] CSCOMB t10 t10 RD t10 RD/WR t10 t17 t10 MR/W t10 t10 D[31:0] Data Out t10 t10 BC[3:0] t10 t16 t10 t10 t15 WAIT DemuxWR_1.vsd Figure 39 EBU Demultiplexed Write Timing Data Sheet 122 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.10 EBU Burst Mode Read Timing VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins; TA = -40 °C to +125 °C; CL = 35 pF; Table 30 Parameter EBU Burst Mode Read Timing Parameters1) Symbol Min. Output delay from BFCLKO rising edge RD active/inactive after BFCLKO rising edge CSx output delay from BFCLKO rising edge Values Typ. – – – – – – – – Max. 5 5 4 4 – – – – ns ns ns ns ns ns ns ns Unit Note / Test Con dition – – – – – – – – t10 t12 t21 CC 0 CC 0 CC 0 CC 0 SR 3 SR 0 SR 3 SR 2 ADV/BAA active/inactive after t22 BFCLKO rising edge2) Data setup to BFCLKI rising edge Data hold from BFCLKI rising edge WAIT setup (low or high) to BFCLKI rising edge WAIT hold (low or high) from BFCLKI rising edge t23 t24 t25 t26 1) Not subject to production test, verified by design/characterization. 2) This parameter is valid for BFCON.EBSE0 = 1 (or BFCON.EBSE1 = 1). Note that t22 is increased by: 1/2 of the LMB bus clock period TCPU = 1/fCPU when BFCON.EBSE0 = 0 (or BFCON.EBSE1 = 0). Data Sheet 123 V1.0, 2008-04 TC1796 Electrical Parameters Address Phase(s) BFCLKI BFCLKO 1) Command Phase(s) Burst Phase(s) Burst Phase(s) Recovery Phase(s) Next Addr. Phase(s) t10 A[23:0] Burst Start Address t10 Next Addr. t22 ADV t22 t22 t10 CS[3:0] CSCOMB t10 t10 t12 RD t12 t22 BAA t22 t23 D[31:0] (32-Bit) t24 t23 t24 Data (Addr+0) Data (Addr+4) D[15:0] (16-Bit) Data (Addr+0) Data (Addr+2) t25 WAIT 1) t26 Output delays are always referenced to BCLKO. The reference clock for input characteristics depends on bit EBU_BFCON.FDBKEN. EBU_BFCON.FDBKEN = 0:BFCLKO is the input reference clock. EBU_BFCON.FDBKEN = 1:BFCLKI is the input reference clock (EBU clock feedback enabled). BurstRD_4.vsd Figure 40 EBU Burst Mode Read Timing Data Sheet 124 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.11 EBU Arbitration Signal Timing VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins; TA = -40°C to +125 °C; CL = 35 pF; Table 31 Parameter EBU Arbitration Signal Timing Parameters1) Symbol Min. Output delay from CLKOUT rising edge Data setup to CLKOUT falling edge Data hold from CLKOUT falling edge Values Typ. – – – Max. 3 – – Unit Note / Test Con dition ns ns ns – – – t27 t28 t29 CC – SR 8 SR 2 1) Not subject to production test, verified by design/characterization. BFCLKO t27 HLDA Output t27 t27 t27 BREQ Output BFCLKO t28 HOLD Input HLDA Input t28 t29 t29 EBUArb_1 Figure 41 EBU Arbitration Signal Timing Data Sheet 125 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.12 Peripheral Timings Note: Peripheral timing parameters are not subject to production test. They are verified by design/characterization. 4.3.12.1 Micro Link Interface (MLI) Timing Table 32 Parameter MLI Timing Parameters (Operating Conditions apply), CL = 50 pF Symbol Min. TCLK clock period1)2) RCLK clock period MLI outputs delay from TCLK rising edge MLI inputs setup to RCLK falling edge MLI inputs hold to RCLK falling edge Values Typ. – – – – – – Max. – – 8 – – 8 1 / fSYS 1 / fSYS ns ns ns ns Unit Note / Test Con dition – – – – – – t30 t31 t35 t36 t37 CC 23) SR 1 CC 0 SR 4 SR 4 CC 0 RREADY output delay from t38 RCLK falling edge 1) TCLK signal rise/fall times are the same as the A2 Pads rise/fall times. 2) TCLK high and low times can be minimum 1 × TMLI. 3) When fSYS = 75 MHz, t30 = 26,67ns Data Sheet 126 V1.0, 2008-04 TC1796 Electrical Parameters t30 TCLKx 0.9 VDDP 0.1 VDDP t35 TDATAx TVALIDx t35 TREADYx t31 RCLKx t36 RDATAx RVALIDx t37 t38 RREADYx t38 MLI_Tmg_2.vsd Figure 42 MLI Interface Timing Note: The generation of RREADYx is in the input clock domain of the receiver. The reception of TREADYx is asynchronous to TCLKx. Data Sheet 127 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.12.2 Micro Second Channel (MSC) Interface Timing Table 33 Parameter MSC Interface Timing (Operating Conditions apply), CL = 50 pF Symbol Min. FCLP clock period1)2) SOP/ENx outputs delay from FCLP rising edge SDI bit time SDI rise time SDI fall time Values Typ. Max. – 10 – 100 100 ns ns ns ns ns Unit Note / Test Con dition – – – – – t40 t45 t46 t48 t49 CC 2 × TMSC3) – CC -10 CC 8 × TMSC SR SR 1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times. 2) FCLP signal high and low can be minimum 1 × TMSC. 3) TMSCmin = TSYS = 1/fSYS. When fSYS = 75 MHz, t40 = 26,67ns t40 FCLP 0.9 VDDP 0.1 VDDP t45 SOP EN t45 t48 SDI t49 0.9 VDDP 0.1 VDDP t46 t46 MSC_Tmg_1.vsd Figure 43 MSC Interface Timing Note: The data at SOP should be sampled with the falling edge of FCLP in the target device. Data Sheet 128 V1.0, 2008-04 TC1796 Electrical Parameters 4.3.12.3 Synchronous Serial Channel (SSC) Master Mode Timing Table 34 Parameter SSC Master Mode Timing (Operating Conditions apply), CL = 50 pF Symbol Min. SCLK clock period1)2) MTSR/SLSOx delay from SCLK rising edge MRST setup to SCLK falling edge MRST hold from SCLK falling edge Values Typ. Max. – 8 – – ns ns ns ns Unit Note / Test Con dition – – – – t50 t51 t52 t53 CC 2 × TSSC3) – CC 0 SR 10 SR 5 – – – 1) SCLK signal rise/fall times are the same as the A2 Pads rise/fall times. 2) SCLK signal high and low times can be minimum 1 × TSSC. 3) TSSCmin = TSYS = 1/fSYS. When fSYS = 75 MHz, t50 = 26,67ns t50 SCLK1)2) t51 MTSR1) t51 t52 t53 Data valid MRST1) t51 SLSOx2) 1) This timing is based on the following setup: CON.PH = CON.PO = 0. 2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0 and the first SCLK high pulse is in the first one of a transmission. SSC_Tmg_1.vsd Figure 44 SSC Master Mode Timing Data Sheet 129 V1.0, 2008-04 TC1796 Package and Reliability 5 5.1 Table 35 Parameter Package and Reliability Package Parameters (P/PG-BGA-416-4) Thermal Characteristics of the Package Symbol Min. Values Typ. Max. 8 15 Unit Note / Test Condi tion K/W – K/W – Thermal resistance junction RTJCT CC – case top1) Thermal resistance junction RTJCB CC – case bottom1) 1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are under user responsibility. The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA is the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA can be obtained from the upper four partial thermal resistances. Data Sheet 130 V1.0, 2008-04 TC1796 Package and Reliability 5.2 Package Outline 25 x 1 = 25 A26 A1 25 x 1 = 25 1 AF1 1 (0.56) 0.5 ±0.1 ø0.63 +0.07 -0.13 416x ø0.25 M A B C ø0.1 M C 0.15 2.5 MAX. C A (1.17) 20 ±0.2 20 ±0.2 24 ±0.5 27 ±0.2 B 24 ±0.5 Index Marking Index Marking (sharp edge) Figure 45 P/PG-BGA-416-4, Plastic Low Profile Pitch Ball Grid Array You can find our packages, sorts of packing and others in our Infineon Internet Web Site. Data Sheet 131 V1.0, 2008-04 27 ±0.2 GPA09537 TC1796 Package and Reliability 5.3 Flash Memory Parameters The data retention time of the TC1796’s Flash memory (i.e. the time after which stored data can still be retrieved) depends on the number of times the Flash memory has been erased and programmed. Table 36 Parameter Flash Parameters Symbol Min. Program / Data Flash tRET CC 20 Retention Time, Physical Sector1)2) Program / Data Flash tRETL CC 20 Retention Time Logical Sector1)2) Data Flash Endurance (128 KB) Data Flash Endurance, EEPROM Emulation (8 × 16 KB) Programming Time per Page3) Program Flash Erase Time per 256-KB Sector Data Flash Erase Time per 64-KB Sector Wake-up time Values Typ. – Max. – Unit Note / Test Condition years Max. 1000 erase/program cycles years Max. 100 erase/program cycles – Max. data retention time 5 years Max. data retention time 5 years – – NE CC 15 000 – – NE8 CC 120 000 – – – tPR CC – tERP CC – tERD CC – tWU CC 4300 × 1/fCPU – – 5 5 ms s – fCPU = 150 MHz fCPU = 150 MHz – 2.5 s – – – – + 40µs 1) Storage and inactive time included. 2) At average weighted junction temperature Tj = 100oC, or the retention time at average weighted temperature of Tj = 110oC is minimum 10 years, or the retention time at average weighted temperature of Tj = 150oC is minimum 0.7 years. 3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The reprogramming takes additional 5 ms. Data Sheet 132 V1.0, 2008-04 TC1796 Package and Reliability 5.4 Table 37 Parameter Operation Lifetime1)2) Quality Declarations Quality Parameters Symbol Values Min. Typ. Max. – – – – – – – Unit Note / Test Condition tOP 24000 hours at average weighted junction temperature Tj = 127oC 66000 hours at average weighted junction temperature Tj = 100oC 20 2000 years at average weighted junction temperature Tj = 85oC V Conforming to EIA/JESD22-A114-B ESD susceptibility VHBM according to Human Body Model (HBM) ESD susceptibility VHBM1 of the LVDS pins ESD susceptibility VCDM according to Charged Device Model (CDM) Moisture Sensitivity Level MSL – – – – – 500 500 V V – Conforming to JESD22-C101-C – – 3 – Conforming to Jedec J-STD-020C for 240°C 1) This lifetime refers only to the time when the device is powered on. 2) One example of a detailed temperature profile is: 2000 hours at Tj = 150oC 16000 hours at Tj = 125oC 6000 hours at Tj = 110oC This example is equivalent to the operation lifetime and average temperatures given in the table. Data Sheet 133 V1.0, 2008-04 www.infineon.com Published by Infineon Technologies AG