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TLE4274GV85

TLE4274GV85

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    TLE4274GV85 - Low Drop Voltage Regulator Output voltage 5 V, 8.5 V or 10 V - Infineon Technologies A...

  • 数据手册
  • 价格&库存
TLE4274GV85 数据手册
Low Drop Voltage Regulator TLE 4274 Features • • • • • • • • • • Output voltage 5 V, 8.5 V or 10 V Output voltage tolerance ≤ ±4% Current capability 400 mA Low-drop voltage Very low current consumption Short-circuit proof Reverse polarity proof Suitable for use in automotive electronics Green Product (RoHS compliant) version of TLE 4274 AEC qualified P-TO220-3-1 PG-TO220-3-1 ^ Functional Description The TLE 4274 is a low drop voltage regulator available in a TO220, TO252 and TO263 package. The IC regulates an input voltage up to 40 V to VQrated = 5.0 V (V50), 8.5 V (V85) and 10 V (V10). The maximum output current is 400 mA. The IC is short-circuit proof and incorporates temperature protection that disables the IC at overtemperature. A 3.3 V and 2.5 V version is also available. For information about the low output voltage types please refer to the data sheet TLE 4274 / 3.3 V; 2.5 V. P-TO252-3-11 PG-TO252-3-11 P-TO263-3-1 PG-TO263-3-1 Type TLE 4274 V10 TLE 4274 V50 TLE 4274 V85 TLE 4274 DV50 TLE 4274 GV10 TLE 4274 GV50 TLE 4274 GV85 Data Sheet Package PG-TO220-3-1 (RoHS compliant) PG-TO220-3-1 (RoHS compliant) PG-TO220-3-1 (RoHS compliant) PG-TO252-3-11 (RoHS compliant) PG-TO263-3-1 (RoHS compliant) PG-TO263-3-1 (RoHS compliant) PG-TO263-3-1 (RoHS compliant) 1 Rev. 1.6, 2007-01-23 TLE 4274 Dimensioning Information on External Components The input capacitor CI is necessary for compensating line influences. Using a resistor of approx. 1 Ω in series with CI, the oscillating of input inductivity and input capacitance can be damped. The output capacitor CQ is necessary for the stability of the regulation circuit. Stability is guaranteed at values CQ ≥ 22 µF and an ESR of ≤ 3 Ω within the operating temperature range. Circuit Description The control amplifier compares a reference voltage to a voltage that is proportional to the output voltage and drives the base of the series transistor via a buffer. Saturation control as a function of the load current prevents any oversaturation of the power element. The IC also includes a number of internal circuits for protection against: • • • Overload Overtemperature Reverse polarity Data Sheet 2 Rev. 1.6, 2007-01-23 TLE 4274 PG-TO220-3-1 PG-TO252-3-11 PG-TO263-3-1 GND Ι Q AEP02512 Ι GND Q AEP02281 Ι GND Q AEP01957 Figure 1 Table 1 Pin No. 1 2 3 I Pin Configuration (top view) Pin Definitions and Functions Symbol GND Q Function Input; block to ground directly at the IC with a ceramic capacitor. Ground Output; block to ground with a ≥ 22 µF capacitor, ESR ≤ 3 Ω. Data Sheet 3 Rev. 1.6, 2007-01-23 TLE 4274 Temperature Sensor Saturation Control and Protection Circuit 3 Control Amplifier Q Ι 1 Buffer Bandgap Reference 2 GND AEB01959 Figure 2 Block Diagram Data Sheet 4 Rev. 1.6, 2007-01-23 TLE 4274 Table 2 Parameter Input Voltage Current Output Voltage Current Ground Current Temperature Absolute Maximum Ratings Symbol Limit Values Min. Max. 45 – 40 – 100 150 150 V – V – mA °C °C – Internally limited – Internally limited – – – Unit Test Condition Tj = -40 to 150 °C VI II VQ IQ IGND Tj Tstg -42 – -1.0 – – – -50 Junction temperature Storage temperature Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. Table 3 Parameter Operating Range Symbol Limit Values Min. Input voltage; V50, DV50, VI GV50 Input voltage, V85, GV85 Input voltage, V10, GV10 Junction temperature Thermal Resistance Junction ambient Junction ambient Junction ambient Junction case 5.5 9.0 10.5 -40 – – – – Max. 40 40 40 150 65 78 52 4 V V V °C K/W K/W K/W K/W – – – – TO2201) TO2521) TO2631) – Unit Remarks VI VI Tj Rthja Rthja Rthja Rthjc 1) Worst case; regarding peak temperature, zero airflow mounted on PCB 80 × 80 × 1.5 mm3, 300 mm2 heat sink area. Data Sheet 5 Rev. 1.6, 2007-01-23 TLE 4274 Table 4 Parameter Characteristics Symbol Limit Values Min. Typ. 5 5 8.5 8.5 10 10 600 100 Max. 5.2 5.2 8.84 8.84 10.4 10.4 – 220 V V V V V V mA µA 5 mA < IQ < 400 mA 6 V < VI < 28 V 5 mA < IQ < 200 mA 6 V < VI < 40 V 5 mA < IQ < 400 mA 9.5 V < VI < 28 V 5 mA < IQ < 200 mA 9.5 V < VI < 40 V 5 mA < IQ < 400 mA 11 V < VI < 28 V 5 mA < IQ < 200 mA 11 V < VI < 40 V – 4.8 4.8 8.16 8.16 9.6 9.6 400 – Unit Measuring Conditions VI = 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified) Output voltage V50-Version Output voltage V50-Version Output voltage V85-Version Output voltage V85-Version Output voltage V10-Version Output voltage V10-Version Output current limitation1) Current consumption; Iq = II - IQ Current consumption; Iq = II - IQ Drop voltage1) Load regulation Line regulation Power supply ripple rejection VQ VQ VQ VQ VQ VQ IQ Iq Iq Iq Vdr ∆VQ ∆VQ IQ = 1 m A IQ = 250 mA IQ = 400 mA IQ = 250 mA Vdr = VI - VQ IQ = 5 mA to 400 mA ∆Vl = 12 V to 32 V IQ = 5 m A fr = 100 Hz; Vr = 0.5 Vpp – – – – – – – 8 20 250 20 10 60 0.5 15 30 500 50 25 – – mA mA mV mV mV dB PSRR Temperature dVQ/dT output voltage drift mV/K – 1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V. Data Sheet 6 Rev. 1.6, 2007-01-23 TLE 4274 ΙΙ Input 100 µ F CΙ 100 nF 1 3 ΙQ CQ 22 µF Output TLE 4274 VΙ VQ RL 2 AES01960 Figure 3 Measuring Circuit Input 1 3 Output TLE 4274 CΙ 2 AES01961 CQ Figure 4 Application Circuit Data Sheet 7 Rev. 1.6, 2007-01-23 TLE 4274 Typical Performance Characteristics (V50, V85 and V10) Drop Voltage Vdr versus Output Current IQ Vdr 600 mV 500 600 400 AED01962 Output Current IQ versus Input Voltage VI IQ 800 mA AED01963 T j = 125 ˚C 300 400 T j = 25 ˚C VQ = 0 V 200 T j = 25 ˚C 100 200 0 0 100 200 300 mA 400 0 0 10 20 30 40 V 50 IQ VI Current Consumption Iq versus Output Current IQ (high load) 60 AED02267 Current Consumption Iq versus Output Current IQ (low load) 0.6 AED02268 Iq mA 50 Iq mA 0.5 40 0.4 T j = 25 ˚C VI = 13.5 V 30 T j = 25 ˚C VI = 13.5 V 0.3 20 0.2 10 0.1 0 0 100 200 300 400 mA 600 0 0 10 20 30 40 mA 60 IQ IQ Data Sheet 8 Rev. 1.6, 2007-01-23 TLE 4274 Typical Performance Characteristics (V50) Output Voltage VQ versus Junction Temperature Tj 5.2 AED01966 Current Consumption Iq versus Input Voltage VI 30 mA AED02269 VQ V Ιq 5.1 VI = 13.5 V 5.0 20 T j = 25 C R L = 20 Ω 10 4.9 4.8 -40 0 40 80 120 ˚C 160 0 0 10 20 30 Tj V VΙ 50 Output Voltage VQ versus Input Voltage VI 6 AED01968 Input Current II versus Input Voltage VI 3.5 mA II 3.0 2.5 AED01977 VQ V 5 VQ 4 2.0 VI = VQ 3 1.5 T j = 25 ˚C R L = 20 Ω 2 T j = 25 ˚C 6.8k Ω R L = 8.2 kΩ 1.0 0.5 1 0 -2 -50 0 0 2 4 6 8 V 10 -25 0 25 V 50 VI Data Sheet 9 VI Rev. 1.6, 2007-01-23 TLE 4274 Typical Performance Characteristics for V85 Output Voltage VQ versus Junction Temperature Tj 8.8 AED01970 Current Consumption Iq versus Input Voltage VI 30 mA AED02270 VQ V 8.7 Ιq 8.6 20 VI = 13.5 V 8.5 T j = 25 C R L = 20 Ω 10 8.4 8.3 8.2 -40 0 40 80 120 ˚C 160 0 0 10 20 30 Tj V VΙ 50 Output Voltage VQ versus Input Voltage VI 12 VQ V 10 VQ 8 VΙ =VQ 6 T j = 25 C R L = 34 Ω 4 AED01972 Input Current II versus Input Voltage VI 3.5 mA II 3.0 2.5 2.0 1.5 1.0 0.5 AED03051 T j = 25 ˚C R L = 12 kΩ 2 0 -2 -50 0 0 4 8 12 16 V 20 VΙ -25 0 25 V 50 VI Data Sheet 10 Rev. 1.6, 2007-01-23 TLE 4274 Typical Performance Characteristics for V10 Output Voltage VQ versus Junction Temperature Tj 10.3 AED01974 Current Consumption Iq versus Input Voltage VI 30 mA AED02270 VQ V 10.2 Ιq 10.1 20 VI = 13.5 V 10.0 T j = 25 C R L = 20 Ω 10 9.9 9.8 9.7 -40 0 40 80 120 ˚C 160 0 0 10 20 30 Tj V VΙ 50 Output Voltage VQ versus Input Voltage VI 12 AED01976 Input Current II versus Input Voltage VI 3.5 mA II 3.0 2.5 AED03048 VQ V 10 VQ 8 2.0 VI = VQ 6 1.5 T j = 25 ˚C R L = 34 Ω 4 T j = 25 ˚C R L = 15 kΩ 1.0 0.5 2 0 0 0 4 8 12 16 V 20 -2 -50 -25 0 25 V 50 VI VI Data Sheet 11 Rev. 1.6, 2007-01-23 TLE 4274 Package Outlines 10 ±0.2 9.9 ±0.2 2.8 ±0.2 A B 4.4 1.27±0.1 8.5 1) 3.7 -0.15 0...0.3 1) 15.65 ±0.3 17±0.3 12.95 2.4 13.5 ±0.5 C 0...0.15 4.55 ±0.2 3x 0.75 ±0.1 1.05 0.5 ±0.1 2.4 2x 2.54 1) 0.25 M ABC Typical All metal surfaces tin plated, except area of cut. Metal surface min. x=7.25, y=12.3 GPT09361 Figure 5 PG-TO220-3-1 (Plastic Transistor Single Outline) Green Product (RoHS-Compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. SMD = Surface Mounted Device Data Sheet 12 Dimensions in mm Rev. 1.6, 2007-01-23 9.25 ±0.2 0.05 TLE 4274 6.5 +0.15 -0.05 5.4 ±0.1 (4.24) 1 ±0.1 A B 0.9 +0.20 -0.01 0...0.15 0.51 MIN. 2.3 +0.05 -0.10 0.5 +0.08 -0.04 (5) 9.98 ±0.5 6.22 -0.2 0.15 MAX. per side 0.8 ±0.15 3x 0.75 ±0.1 2.28 0.5 +0.08 -0.04 0.1 B 4.57 0.25 M AB All metal surfaces tin plated, except area of cut. GPT09277 Figure 6 PG-TO252-3-11 (Plastic Transistor Single Outline) Green Product (RoHS-Compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. SMD = Surface Mounted Device Data Sheet 13 Dimensions in mm Rev. 1.6, 2007-01-23 TLE 4274 4.4 10 ±0.2 0...0.3 8.5 1) A 1.27 ±0.1 B 0.1 2.4 1 ±0.3 0.05 (15) 9.25 ±0.2 7.55 1) 0...0.15 0.75 ±0.1 1.05 2.54 5.08 1) 4.7 ±0.5 2.7 ±0.3 0.5 ±0.1 8 ˚ MAX. 0.25 M AB 0.1 B Typical All metal surfaces: tin plated, except area of cut. Metal surface min. x=7.25, y=6.9 GPT09362 Figure 7 PG-TO263-3-1 (Plastic Transistor Single Outline) Green Product (RoHS-Compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. SMD = Surface Mounted Device Data Sheet 14 Dimensions in mm Rev. 1.6, 2007-01-23 TLE 4274 TLE 4274 Revision History: Previous Version: Page general #1 #1 #1 general #12, #13, #14 #16 2007-01-23 1.5 Rev. 1.6 Subjects (major changes since last revision) Updated Infineon logo Added “AEC” and “Green” logo Added “Green Product” and “AEC qualified” to the feature list Updated Package Names to “PG-xxx” Removed leadframe variant “P-TO-252-1” Added “Green Product” remark Disclaimer Update Data Sheet 15 Rev. 1.6, 2007-01-23 Edition 2007-01-23 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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