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TLE6225

TLE6225

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    TLE6225 - Smart Quad Low-Side Switch  - Infineon Technologies AG

  • 数据手册
  • 价格&库存
TLE6225 数据手册
Data Sheet TLE 6225 G Smart Quad Low-Side Switch Features • Shorted circuit protection • Overtemperature protection • Overvoltage protection • Open Load Detection • Direct parallel control of the inputs • Inputs high or low active programmable • General fault flag • Very low standby quiescent current • Compatible with 3V microcontrollers • Electostatic discharge (ESD) protection Product Summary Supply voltage Drain source voltage On resistance Output current(each) (individ.) VS VDS(AZ)max RON ID(NOM) 4.5 – 32 V 60 V 1.7 Ω 350 mA 500 mA Application • µC compatible power switch for 12 V applications • Switch for automotive and industrial systems • Line, relay or lamp driver P-DSO 20-6 Ordering Code: Q 67006 A9373 General description Quad channel Low-Side Switch in Smart Power Technology (SPT) with four separate inputs and four open drain DMOS output stages. The TLE 6225 G is protected by embedded protection functions and designed for automotive and industrial applications, to drive lines, lamps and relays. Block Diagram PRG GND VS ENA VS FAULT Diagnostic, Protection Vbb IN1 as Ch. 1 Over Temp. Logic Open Load as Ch. 1 Output Stage IN4 as Ch. 1 OUT1 1 4 4 OUT4 Output Control Buffer GND V2.1 Page 1 26.Aug. 2002 Data Sheet TLE 6225 G Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol IN1 IN2 FAULT Pin Configuration (Top view) Function Input Channel 1 Input Channel 2 General Fault Flag Ground Ground Ground Ground Supply Voltage Input Channel 3 Input Channel 4 Enable for all channels/Standby Power Output channel 4 Power Output channel 3 Ground Ground Ground Ground Power Output channel 2 Power Output channel 1 Program (inputs high or low active) IN1 IN2 FAULT GND GND GND GND VS IN3 IN4 ENA OUT4 OUT3 GND GND GND GND OUT2 OUT1 PRG GND GND GND GND VS IN3 IN4 1• 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 PRG OUT1 OUT2 GND GND GND GND OUT3 OUT4 ENA P-DSO-20-6 V2.1 Page 2 26.Aug. 2002 Data Sheet TLE 6225 G Maximum Ratings for Tj = – 40°C to 150°C Parameter Supply Voltage Continuous Drain Source Voltage (OUT1...OUT4) Input Voltage, IN1 - IN4 Input Voltage, PRG, ENA Output Load Dump Protection VLoad Dump=UP+US; UP=13.5 V With Automotive Relay Load RL = 70 Ω RI1)=2 Ω; td=400ms; IN = low or high FAULT Output Voltage Symbol VS VDS VIN VIN VLoad Dump 2) Values -0.3 ... +40 -0.7 ... +45 - 0.3 ... + 7 - 0.3 ... + 40 75 Unit V V V V V VFault Tj Tstg ID(lim) EAS 2 - 0.3 ... + 40 - 40 ... + 150 - 55 ... + 150 ID(lim) min 10 2.5 2000 V °C A mJ W V Operating Temperature Range Storage Temperature Range Output Current per Channel (see electrical characteristics) Output Clamping Energy ID= 0.2 A Power Dissipation (DC) @ TA = 25 °C (on PCB 6 cm cooling area) Electrostatic Discharge Voltage (Human Body Model) according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993 DIN Humidity Category, DIN 40 040 IEC Climatic Category, DIN IEC 68-1 Thermal Resistance junction - pin junction - ambient @ min. footprint junction - ambient @ 6 cm2 cooling area Ptot VESD E 40/150/56 RthJP RthJA RthJA 23 80 45 K/W 1) 2) RI=internal resistance of the load dump test pulse generator LD200 VLoadDump is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839. V2.1 Page 3 26.Aug. 2002 Data Sheet TLE 6225 G Electrical Characteristics Parameter and Conditions VS = 4.5 to 32 V ; Tj = - 40 °C to + 150 °C (unless otherwise specified) 1. Power Supply Symbol Values min typ Unit max Supply Voltage Supply Current (ENA = H, Outputs ON) Supply Current in Standby Mode (ENA = L) 2. Power Outputs ON Resistance VS ≥ 6 V; ID = 300 mA TJ = 25°C TJ = 150°C VS IS(ON) IS(stby) RDS(ON) 4.5 1 32 2 10 1.7 3 2 3.6 60 1000 5 5 5 10 10 1 0.8 100 100 50 50 50 100 100 100 200 0.4 V mA µA Ω V mA µA µs µs V V V mV mV µA µA µA µA V V µA µs °C K Output Clamping Voltage Current Limit Output Leakage Current Turn-On Time Turn-Off Time Output OFF VENA = L VDS(AZ) ID(lim) ID(lkg) tON tOFF VINL VINL VINH VINHys VINHys IIN(1..4)PU IIN(1..4)PD IIN(PRG,ENA) IIN(PRG,ENA) VFAULTL VDS(OL) IPD(OL) td(fault) Tth(sd) Thys 45 500 50 750 ID = 200 mA, resistive load ID = 200 mA, resistive load 3. Digital Inputs (IN1 – IN4, ENA, PRG) Input Low Voltage (IN1 – IN4, PRG) Input Low Voltage (ENA) Input High Voltage Input Voltage Hysteresis (IN1 – IN4, PRG) Input Voltage Hysteresis (ENA) Input Pull Up Current (IN1...IN4) @ PRG = L, VIN = 0V Input Pull Down Current (IN1...IN4) @ PRG = H, VIN < VS; VIN < 6 PRG, ENA Pull Down Current PRG, ENA Pull Down Current 4. Digital Output ( FAULT ) FAULT Output Low Voltage - 0.3 - 0.3 2.0 50 20 20 20 20 VIN = 5 V VIN = 14 V IFAULT = 1.6 mA 5. Diagnostic Functions Open Load/Short to Ground Detection Voltage Output Pull Down Current Fault Delay Time; VS = 12V Overtemperature Shutdown Threshold Hysteresis 0.4*VS 0.5*VS 0.6*VS 20 50 170 10 50 100 200 200 200 V2.1 Page 4 26.Aug. 2002 Data Sheet TLE 6225 G Functional Description The TLE 6225 G is a quad channel low-side switch with four power DMOS stages. The power transistors are protected against short to VBB, overload, overtemperature and against overvoltage by zenerclamp. The diagnostic logic recognises a fault condition which is indicated by a fault flag. Circuit Description Output Stage Control Each output is independently controlled by an input pin and a common enable line, which enables/disables all four outputs. The parallel inputs are high or low active depending on the PRG pin. If the parallel input pins are not connected (independent of high or low activity) it is guaranteed that the outputs 1 to 4 are switched OFF. ENA - and PRG - pin itself are internally pulled down when they are not connected. ENA - Enable pin. ENA = High: Active mode. Channels are enabled ENA = Low (GND): Sleep mode. Channels are switched off. Less than 1 µA current consumption. PRG = High: Parallel inputs Channel 1 to 4 are high active PRG = Low (GND): Parallel inputs Channel 1 to 4 are low active. PRG - Program pin. Power Transistors Each of the four output stages has its own zenerclamp. This causes a voltage limitation at the power transistors when inductive loads are switched off. The outputs are provided with a current limitation set to a minimum of 500 mA. Each output is protected by embedded protection functions3). In the event of an overload or short to supply, the current is internally limited. If this operation leads to an overtemperature condition, a second protection level (about 170 °C) will turn the effected output into a PWMmode (selective thermal shutdown with restart) to prevent critical chip temperatures. The temperature hysteresis is typically 10K. Diagnostic The FAULT pin is an open drain output. The logic status depends on the programming pin PRG. FAULT - pin. FAULT = High FAULT = Low no fault @ PRG = High no fault @ PRG = Low 3) The integrated protection functions prevent an IC destruction under fault conditions and may not be used in normal operation or permanently V2.1 Page 5 26.Aug. 2002 Data Sheet TLE 6225 G Diagnostic Table Enable Input Program Input Control Input Power Output Diagnostic Output Operating Condition Standby Normal function ENA L H H H H H H H H H H PRG X L L H H L H L L H H IN X L H L H L H L H L H OUT OFF ON OFF OFF ON OFF * OFF * ON OFF OFF ON FAULT H L L H H H L L H L H Overtemperature Open load or short to ground X = not relevant *selective thermal shutdown for each channel at overtemperature Fault Distinction Open load/short to ground is recognised in OFF-state. Overtemperature as a result of an overload or short to battery can only arise in ON-state. If there is only one fault at a time, it is possible to distinguish which channel is affected with which fault. V2.1 Page 6 26.Aug. 2002 Data Sheet TLE 6225 G Typical electrical Characteristics Drain-Source on-resistance RDS(ON) = f (Tj) ; Vs = 5V 3,5 Typical Drain- Source ON-Resistance Channel 1-4 3 RDS(ON) [Ohm] 2,5 2 1,5 1 -50 -25 0 25 50 Tj[°C] 75 100 125 150 175 Figure 6 : Typical ON Resistance versus Junction-Temperature Channel 1-4 Output Clamping Voltage VDS(AZ) = f (Tj) ; Vs = 5V Typical Clamping Voltage 55 54 53 Channel 1-4 VDS (AZ) [V] 52 51 50 49 48 -50 -25 0 25 50 Tj[°C] 75 100 125 150 175 Figure 7 : Typical Clamp Voltage versus Junction-Temperature Channel 1-4 Page 7 26.Aug. 2002 V2.1 Data Sheet TLE 6225 G Timing Diagrams Power Outputs VIN t VDS 80% tON tOFF 20% t Application Circuit VBB +5V VS VCC PRG TLE 6225 G OUT1 OUT2 OUT3 OUT4 Py.1 Px.1 Px.2 µC e.g. C166 Px.3 Px.4 INT +5V ENA IN1 IN2 IN3 IN4 FAULT Line GND V2.1 Page 8 26.Aug. 2002 Data Sheet TLE 6225 G Package and ordering code all dimensions in mm P - DSO - 20 - 6 TLE 6225 G Ordering code Q 67006 A9373 2.65 max 0.35 x 45˚ +0.09 GPS05094 2.45 -0.2 0.2 -0.1 7.6 -0.21) 1.27 0.35 +0.15 2) 0.4 +0.8 0.2 24x 20 11 0.1 10.3 ±0.3 1 12.8 1) 10 -0.2 Index Marking 1) Does not include plastic or metal protrusions of 0.15 max per side 2) Does not include dambar protrusion of 0.05 max per side Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 76, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. V2.1 Page 8˚ ma 0 .2 3 x 9 26.Aug. 2002
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