TLE6251-2G

TLE6251-2G High Speed CAN-Transceiver with Wake and Failure Detection Data Sheet Rev. 1.0, 2009-05-07 Automotive Power TLE6251-2G Table of Contents Table of Contents 1 2 3 3.1 3.2 4 4.1 5 5.1 5.2 5.3 5.4 5.5 6 6.1 6.2 6.3 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.3 7.3.1 7.3.2 7.4 7.5 8 9 9.1 9.2 9.3 10 10.1 10.2 11 11.1 11.2 11.3 11.4 12 13 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 High Speed CAN Physical Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Normal Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Receive - Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Stand - By Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Go - To - Sleep Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Wake - Up Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Remote Wake - Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Local Wake - Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mode Change via the EN and NSTB pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fail Safe Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAN Bus Failure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Local Failures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TxD Time - Out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TxD to RxD Short Circuit Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RxD Permanent Recessive Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Over - Temperature Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Under - Voltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Under - Voltage event on VCC and VIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Under - Voltage Event on VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Adaptation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Split Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 15 16 17 17 18 18 19 19 19 20 20 20 21 22 22 24 24 25 25 Diagnosis-Flags at NERR and RxD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Functional Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Robustness according to IEC61000-4-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Drop over the INH Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 31 32 32 32 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2 Rev. 1.0, 2009-05-07 Data Sheet High Speed CAN-Transceiver with Wake and Failure Detection TLE6251-2G 1 Features • • • • • • • • • • • • • • • • • • • • • • Overview HS CAN Transceiver with data transmission rates up to 1 MBaud Compliant to ISO 11898-5 Very low power consumption in Sleep Mode Bus Wake - Up and local Wake - Up Inhibit output to control external circuitry Split termination to stabilize the recessive level Separate VIO input to adapt different micro controller supply voltages Separate output for failure diagnosis Optimized for low electromagnetic emission (EME) Optimized for a high immunity against electromagnetic interference (EMI) Very high ESD robustness, ± 9 kV according to IEC 61000-4-2 Protected against automotive transients Receive - Only Mode for node failure analysis TxD Time - Out function and RxD recessive clamping with failure indication TxD to RxD short circuit recognition with failure indication CANH and CANL short circuit recognition with failure indication Bus dominant clamping diagnosis Under - voltage detection at VCC, VIO and VS Power - Up and Wake - Up source recognition Short circuit proof and Over - Temperature protection Green Product (RoHS compliant) AEC Qualified PG-DSO-14 Description As a successor of the TLE6251G, the TLE6251-2G is designed to provide an excellent passive behavior in Power Down mode. This feature makes the TLE6251-2G extremely suitable for mixed supply CAN networks. The TLE6251-2G provides different operation modes with a very low quiescent current in Sleep Mode. Based on the high symmetry of the CANH and CANL signals, the TLE6251-2G provides a very low level of electromagnetic emission (EME) within a broad frequency range. The TLE6251-2G is integrated in a RoHS compliant PG-DSO-14 package and fulfills or exceeds the requirements of the ISO11898-5. The TLE6251G and the TLE6251-2G are fully pin compatible and function compatible. Based on the Infineon Smart Power Technology SPT®, the TLE6251-2G provides industry leading ESD robustness together with a very high electromagnetic immunity (EMI). The Infineon Smart Power Technology SPT® allows bipolar and CMOS control circuitry in accordance with DMOS power devices to exist on the same monolithic circuit. The TLE6251-2G and the Infineon SPT® technology are AEC qualified and tailored to withstand the harsh conditions of the Automotive Environment. Type TLE6251-2G Data Sheet Package PG-DSO-14 3 Marking TLE6251-2G Rev. 1.0, 2009-05-07 TLE6251-2G Block Diagram 2 Block Diagram Figure 1 Data Sheet Block Diagram 4 Rev. 1.0, 2009-05-07 TLE6251-2G Pin Configuration 3 3.1 Pin Configuration Pin Assignment TxD GND VCC RxD VIO EN INH 1 2 3 4 5 6 7 14 13 12 11 10 9 8 NSTB CANH CANL SPLIT VS WK NERR Figure 2 Pin Configuration 3.2 9 Pin Definitions and Functions Symbol TxD GND Function Transmit Data Input; integrated pull-up resistor to VIO, “Low” for dominant state. Ground Transceiver Supply Voltage; 100 nF decoupling capacitor to GND recommend. Receive Data Output; “Low” in dominant state. Output voltage level dependent on the VIO supply Logic Supply Voltage; Digital Supply Voltage for the logic pins TxD, RxD, EN, NERR and NSTB; Usually connected to the supply voltage of the external microcontroller; 100 nF decoupling capacitor to GND recommend. Mode Control Input; Integrated pull-down resistor; “High” for Normal operation mode. Inhibit Output; Open drain output to control external circuitry; High Impedance in Sleep Mode Pin 1 2 3 4 VCC RxD 5 VIO 6 EN 7 INH Data Sheet 5 Rev. 1.0, 2009-05-07 TLE6251-2G Pin Configuration Pin 8 Symbol NERR Function Error Flag Output; Failure and Wake - Up indication output, active “Low” Output voltage level depends on the VIO supply Wake - Up Input; Local Wake - Up input; Wake - Up input sensitive to a level change in both directions, “High” to “Low” and vice versa. Battery Voltage Supply; 100 nF decoupling capacitor to GND recommend. Split Termination Output; Stabilization output to support the recessive voltage level of the CAN bus lines. CAN Bus Low Level I/O; “Low” in dominant state CAN Bus High Level I/O; “High” in dominant state Stand-By Control input; Integrated pull-down resistor; “Low” for Stand-By or Sleep Mode 9 WK 10 11 12 13 14 VS SPLIT CANL CANH NSTB Data Sheet 6 Rev. 1.0, 2009-05-07 TLE6251-2G Functional Description 4 Functional Description CAN is a serial bus system that connects microcontrollers, sensor and actuators for real-time control applications. The usage of the Control Area Network (abbreviated CAN) within road vehicles is described by the international standard ISO 11898. According to the 7 layer OSI reference model the physical layer of a CAN bus system specifies the data transmission from one CAN node to all other available CAN nodes inside the network. The physical layer specification of a CAN bus system includes all electrical and mechanical specifications of a CAN network. The CAN transceiver is part of the physical layer specification. Several different physical layer standards of CAN networks have been developed over the last years. The TLE6251-2G is a High Speed CAN transceiver with dedicated Wake - Up functions. High Speed CAN Transceivers with Wake - Up functions are defined by the international standard ISO 11898-5. 4.1 TxD High Speed CAN Physical Layer VIO t VCC VIO VCC TxD = Logic Power Supply = CAN Power Supply = Input from the Microcontroller RxD = Output to the Microcontroller CANH = Voltage on the CANH Input/Output CANL = Voltage on the CANL Input/Output VDIFF = Differential Voltage between CANH and CANL VDIFF = VCANH – VCANL CAN_H CAN_L t VDIFF Dominant VDIFF = ISO Level Dominant VDIFF = ISO Level Recessive Recessive t RxD VIO t Figure 3 High Speed CAN Bus Signals and Logic Signals Data Sheet 7 Rev. 1.0, 2009-05-07 TLE6251-2G Functional Description The TLE6251-2G is a High Speed CAN transceiver, operating as an interface between the CAN controller and the physical bus medium. A High Speed CAN network (abbreviated HS CAN) is a two wire differential network which allows data transmission rates up to 1 MBaud. Characteristic for a HS CAN network are the two CAN bus states “Dominant” and “Recessive” (see Figure 3). A HS CAN network is a Carrier Sense Multiple Access network with Collision Detection. This means, every participant of the CAN network is allowed to place its message on the same bus media simultaneously. This can cause data collisions on the bus, which might corrupt the information content of the data stream. In order avoid the loss of any information and to prioritize the messages, it is essential that the “Dominant” bus signal overrules the “Recessive” bus signal. The input TxD and the output RxD are connected to the microcontroller of the ECU. As shown in Figure 1, the HS CAN transceiver TLE6251-2G has a receive unit and a output driver stage, allowing the transceiver to send data to the bus medium and monitor the data from the bus medium at the same time. The HS CAN transceiver TLE6251-2G converts the serial data stream available on the transmit data input TxD into a differential output signal on CAN bus. The differential output signal is provided by the pins CANH and CANL. The receiver stage of the TLE6251-2G monitors the data on the CAN bus and converts them to a serial data stream on the RxD pin. A logical “Low” signal on the TxD pin creates a “Dominant” signal on the CAN bus, followed by a logical “Low” signal on the RxD pin (see Figure 3). The feature, broadcasting data to the CAN bus and listening to the data traffic on the CAN bus simultaneous is essential to support the bit to bit arbitration on CAN networks. The voltage levels for a HS CAN on the bus medium are defined by the ISO 11898-2/-5 standards. If a data bit is “Dominant” or “Recessive”, this depends on the voltage difference between CANH and CANL: VDIFF = VCANH VCANL. To transmit a “Dominant” signal to the CAN bus the differential signal VDIFF is larger or equal to 1.5 V. To receive a “Recessive” signal from the CAN bus the differential signal VDIFF is smaller or equal to 0.5 V. The voltage level on the digital input TxD and the digital output RxD is determined by the power supply level at the pin VIO. Depending on voltage level at the VIO pin, the signal levels on the logic pins (EN, NERR, NSTB, TxD and RxD) are compatible to microcontrollers with 5 V or 3.3 V I/O supply. Usually the VIO power supply of the transceiver is connected to same power supply as I/O power supply of the microcontroller. Partially supplied CAN networks are networks where the participants have a different power supply status. Some nodes are powered up, other nodes are not powered, or some other nodes are in a Low - Power Mode, like Sleep Mode for example. Regardless on the supply status of the HS CAN node, each participant which is connected to the common bus, shall not disturb the communication on the bus media. The TLE6251-2G is designed to support partially supplied networks. In power down status, the resistors of the Normal Receiver are switched off and the bus input on the pins CANH and CANL is high resistive. Data Sheet 8 Rev. 1.0, 2009-05-07 TLE6251-2G Operation Modes 5 Operation Modes Five different operation modes are available on TLE6251-2G. Each mode with specific characteristics in terms of quiescent current, data transmission or failure diagnostic. For the mode selection the digital input pins EN and NSTB are used. Figure 4 illustrates the different mode changes depending on the status of the EN and NSTB pins. A mode change via the mode selections pins EN and NSTB is only possible if the power supplies VCC, VIO and VS are activated. Figure 4 Operation Modes Data Sheet 9 Rev. 1.0, 2009-05-07 TLE6251-2G Operation Modes In Sleep mode the power supply VCC and the logic power supply VIO are usually turned off. A Wake - Up event, via the CAN bus or the local Wake - Up pin, shifts the device from Sleep Mode into Stand - By Mode. The following operations mode are available on the TLE6251-2G: • • • • • Normal Operation Mode Receive - Only Mode Stand - By Mode Sleep Mode Go - To - Sleep Command Depending on the operation mode, the output driver stage, the receiver stage, the split termination and the bus biasing are active or inactive. Table 1 shows the different operation modes depending on the logic signal on the pins EN and NSTB with the related status of the INH pin, the SPLIT pin and the bus biasing. Table 1 Overview Operation Modes EN 1 0 0 1 0 0 NSTB 1 1 0 0 0 0 INH Bus Bias SPLIT Operation Mode Normal Operation Receive - Only Stand - By Go - To - Sleep Sleep All Power Supplies off VS VS VS VS Floating Floating VCC/2 VCC/2 GND GND GND Floating VCC/2 VCC/2 Floating Floating Floating Floating 5.1 Normal Operation Mode In Normal Operation Mode the HS CAN transceiver TLE6251-2G sends the serial data stream on the TxD pin to the CAN bus while at the same time the data available on the CAN bus is monitored on the RxD output pin. In Normal Operation Mode all functions of the TLE6251-2G are active: • • • • • • • • • • The output driver stage is active and drives data from the TxD to the CAN bus. The normal receiver unit is active and provides the data from the CAN bus to the RxD pin. The low power receiver and the bus Wake - Up function is inactive. The local Wake-Up pin is disabled. The INH pin is connected to VS. The RxD pin is “Low” for a “Dominant” bus signal and “High” for a “Recessive” bus signal” The SPLIT pin is set to VCC/2. The bus basing is set to VCC/2. The failure detection is active and failures are indicated at the NERR pin. (see Chapter 8). The undervoltage detection on the all 3 power supplies VCC, VIO and VS is active. The HS CAN transceiver TLE6251-2G enters Normal Operation Mode by setting the mode selection pins EN and NSTB to logical “High” (see Table 1 or Figure 4). 5.2 Receive - Only Mode The Receive - Only Mode can be used to test the connection of the bus medium. The TLE6251-2G can still receive data from the bus, but the output driver stage is disabled and therefore no data can be sent to the CAN bus. All other functions are active: • • • • The output driver stage is disabled and data which is available on the TxD pin will be blocked and not communicated to the CAN bus. The normal receiver unit is active and provides the data which is available on the CAN bus to the RxD pin. The INH pin is connected to VS. The RxD pin is “Low” for a “Dominant” bus signal and “High” for a “Recessive” bus signal. 10 Rev. 1.0, 2009-05-07 Data Sheet TLE6251-2G Operation Modes • • • • • • The SPLIT pin is set to VCC/2. The bus biasing is set to VCC/2. The low power receiver and the bus Wake - Up function is inactive. The local Wake - Up pin WK is disabled. The failure diagnostic is active and local failures are indicated at the NERR pin (see Chapter 8). The under - voltage detection on the all 3 power supplies VCC, VIO and VS is active. The HS CAN transceiver TLE6251-2G enters Receive - Only Mode by setting the EN pin to logical “Low” and the NSTB to logical “High” (see Table 1 or Figure 4). 5.3 Stand - By Mode After the power - up sequence the TLE6251-2G enters automatically into Stand - By Mode. Stand - By Mode is an idle mode of the TLE6251-2G with optimized power consumption. In Stand - By Mode the TLE6251-2G can not send or receive any data. The output driver stage and the normal receiver unit are disabled. Both CAN bus pins, CANH and CANL are connected to GND and the Split termination output is floating. The following functions are available in Stand-By Mode: • • • The output driver stage is disabled. The normal receiver unit is disabled. The low power receiver is active and monitors the CAN bus. In case of a message on the CAN bus the TLE6251-2G sets an internal Wake - Up flag. If the power supplies VCC and VIO are active, the Wake - Up event is indicated by the RxD pin and the NERR pin (see Chapter 8). The local Wake - Up pin is active and a local Wake - Up event is indicated by the RxD and NERR pin, if the power supplies VCC and VIO are active (see Chapter 8). The INH output is active and set to VS. Through the internal resistors RI (see Figure 1), the pins CANH and CANL are connected to GND. If the power supplies VCC and VIO are active, the RxD pin indicates the Wake - Up events. The TxD pin is disabled The failure diagnostic is disabled. The under - voltage detection on the all 3 power supplies VCC, VIO and VS is active. The TLE6251-2G detects a Power-Up event and indicates it at the NERR pin (see Chapter 8). After the start - up sequence the device enters per default Stand - By Mode. Mode changes are only possible if VCC and VIO are present. The device is in Sleep Mode and a Wake - Up event occurs. The device is in the Go - To - Sleep command and the EN pin goes low before the time t < th(min) has expired. The device is in Normal Operation Mode or Receive - Only Mode and the EN pin and NSTB pin are set to logical “Low”. An under - voltage event occurs on the power supply VS. In case of an undervoltage event, the TLE6251-2G device always changes to Stand - By Mode regardless in which mode the device currently operates. • • • • • • • • • • • • • There are several ways to enter the Stand - By Mode (see Figure 4): Data Sheet 11 Rev. 1.0, 2009-05-07 TLE6251-2G Operation Modes 5.4 Go - To - Sleep Command The Go - To - Sleep command is a transition mode allowing external circuitry like a microcontroller to prepare the ECU for the Sleep mode. The TLE6251-2G stays in the Go - To - Sleep command for the maximum time t = th(min), after exceeding the time th(min) the device changes into Sleep Mode. A mode change into Sleep Mode is only possible via the Go - To - Sleep command. During the Go-To Sleep command the following functions on the TLE6251-2G are available: • • • • • • • • • The output driver stage is disabled. The normal receiver unit is disabled. The low power receiver is active and monitors the CAN bus. In case of a message on the CAN bus the TLE6251-2G sets an internal Wake - Up flag. The local Wake - Up pin is active and can detect a local Wake - Up event. The INH output is active and set to VS. Through the internal resistors RI (see Figure 1), the pins CANH and CANL are connected to GND. The TxD pin is disabled. The failure diagnostic is disabled. The under - voltage detection on all 3 power supplies VCC, VIO and VS is active. Setting the NSTB pin to logical “Low”, while the EN signal remains at logical “High”, activates the Go - To - Sleep command. The Go -To - Sleep command can be entered from Normal Operation Mode, Receive - Only Mode and from Stand - By Mode. 5.5 Sleep Mode The Sleep Mode is a power save mode. In Sleep Mode the current consumption of the TLE6251-2G is reduced to a minimum while the device is still able to Wake - Up by a message on the CAN bus or a local Wake - Up event on the pin WK. Most of the functions of the TLE6251-2G are disabled: • • • • • • • • • The output driver stage is disabled. The normal receiver unit is disabled. The low power receiver is active and monitors the CAN bus. In case of a message on the CAN bus the TLE6251-2G changes from Sleep Mode to Stand - By Mode and sets an internal Wake - Up flag. The local Wake - Up pin is active and in case of a signal change on the WK pin the operation mode changes to Stand - By Mode. The INH output is floating. Through the internal resistors RI (see Figure 1), the pins CANH and CANL are connected to GND. If the power supplies VCC and VIO are present, the RxD pin indicates the Wake - Up event. The TxD pin is disabled The under - voltage detection on the power supplies VS is active and sends the device into Stand - By Mode in case of an under - voltage event. The device can activate the Sleep Mode via the mode control pins EN and NSTB. An under - voltage event on the power supplies VCC and VIO changes the operation mode to Sleep Mode. There are only two ways to enter Sleep Mode: • • Data Sheet 12 Rev. 1.0, 2009-05-07 TLE6251-2G Operation Modes In order to enter the Stand - By Mode or the Sleep Mode, the EN signal needs to be set to logical “Low” a defined time after the NSTB pin was set to logical “Low”. Important for the mode selection is the timing between the falling edge of the NSTB signal and the EN signal. If the logical signal on the EN pin goes low before the transition time t < th(min) has been reached, the TLE6251-2G enters into Stand-By Mode and the INH pin remains connected to the VS supply. In the case the logical signal on the EN pin goes low after the transition time t > th(min), the TLE62512G enters into Sleep Mode simultaneous with the expiration of the time window th(min) and the INH becomes disconnected from the VS supply and is floating. (see Figure 5). NSTB th(min) t EN t INH t t < th(min) Normal Operation Mode Go-To Sleep Command Stand-By Mode NSTB th(min) t EN t > th(min) t INH t Normal Operation Mode Go-To Sleep Command Sleep Mode Figure 5 Entering Sleep Mode or Stand - By Mode The signal on the CAN bus has no impact to mode changes. The operation mode can be changed regardless if the CAN bus is “Dominant” or “Recessive”. Data Sheet 13 Rev. 1.0, 2009-05-07 TLE6251-2G Wake - Up Functions 6 • • • • Wake - Up Functions Remote Wake - Up via a message on the CAN bus. Local Wake - Up via a signal change on the pin WK. A status change of the logical signals applied to the mode control pins EN and NSTB. An under - voltage detection on the VS power supply. There are several possibilities for a mode change from Sleep Mode to another operation mode. In typical applications the power supplies VCC and VIO are turned off in Sleep Mode, meaning a mode change can only be caused by an external event, also called Wake - Up. In case the VCC and VIO power supply are available, a mode change can be simple caused by changing the status on the mode control pins EN and NSTB. 6.1 Remote Wake - Up A remote Wake - Up or also called bus Wake - Up occurs via a CAN bus message and changes the operation mode from Sleep Mode to Stand - By Mode. A signal change from “Recessive” to “Dominant”, followed by a “Dominant” signal for the time t > tWake initiates a bus Wake - Up (see Figure 6). t < tWake CANH CANL No Wake-Up Recessive to Dominant Change t > tWake Wake-Up t INH t Normal Operation Mode Go-To Sleep Command Sleep Mode Stand-By Mode Figure 6 Remote Wake - Up In case the time of the “Dominant” signal on the CAN bus is shorter than the filtering time tWake, no bus Wake - Up occurs. The filter time is implemented to protect the HS CAN transceiver TLE6251-2G against unintended bus Wake - Up’s, triggered by spikes on the CAN bus. The signal change on the CAN bus from “Recessive” to “Dominant” is mandatory, a permanent “Dominant” signal would not activate any bus Wake - Up. In Stand - By Mode the RxD output pin and the NERR output pin display the CAN bus Wake - Up event by a logical “Low” signal (Details see Chapter 8). Once the HS CAN Transceiver TLE6251-2G has recognized the Wake - Up event and has changed to Stand-By Mode, the INH output pin becomes active and provides the voltage VS to the external circuitry. Data Sheet 14 Rev. 1.0, 2009-05-07 TLE6251-2G Wake - Up Functions 6.2 Local Wake - Up The TLE6251-2G can be activated from Sleep Mode by a signal change on the WK pin, also called local Wake Up. Designed to withstand voltages up to 40V the WK pin can be directly connected to VS. The internal logic on the WK pin works bi-sensitive, meaning the Wake - Up logic on the pin WK triggers on a both signal changes, from “High” to “Low” and from “Low” to “High” (see Figure 7). t < tWk(local) t > tWk(local) No Wake-Up VWK,H Wake-Up VWK t INH t Sleep Mode Stand-By Mode t < tWk(local) t > tWk(local) VWK VWK,L No Wake-Up Wake-Up t INH t Sleep Mode Sleep Mode Stand-By Mode Stand-By Mode Figure 7 Local Wake - Up A filter time tWK(local) is implemented to protect the TLE6251-2G against unintended Wake - Up’s, caused by spikes on the pin WK. The threshold values VWK,H and VWK,L depend on the level of the VS power supply. In Stand-By mode the RxD output pin and the NERR output pin display the CAN bus Wake - Up event by a logical “Low” signal (Details see Chapter 8). Once the HS CAN Transceiver TLE6251-2G has recognized the Wake - Up event and has changed to Stand-By Mode, the INH output pin becomes active and provides the voltage VS to the external circuitry. Data Sheet 15 Rev. 1.0, 2009-05-07 TLE6251-2G Wake - Up Functions 6.3 Mode Change via the EN and NSTB pin Besides a mode change issued by a Wake - Up event, the operation mode on the TLE6251-2G can be changed by changing the signals on the EN and NSTB pins. Therefore the power supplies VCC and VIO have to be active. According to the mode diagram in Figure 4 the operation mode can be changed directly from Sleep Mode to the Receive - Only Mode, Normal Operation Mode and to the Go - To - Sleep Command. A change from Sleep Mode direct to Stand-By Mode is only possible via a Wake - Up event. For example by setting the NSTB pin and the EN pin to logical “High” the TLE6251-2G changes from Sleep Mode to Normal Operation Mode (see Figure 8). The pins EN and NSTB have a hysteresis between the logical “Low” and the logical “High” signal in order to avoid any toggling during the operation mode change. Figure 8 Wake - Up via Mode Change Data Sheet 16 Rev. 1.0, 2009-05-07 TLE6251-2G Fail Safe Features 7 7.1 Fail Safe Features CAN Bus Failure Detection The High Speed CAN Transceiver TLE6251-2G is equipped with a bus failure detection unit. In Normal Operation Mode the TLE6251-2G can detect the following bus failures: • • • • • • • • • CANH shorted to GND CANL shorted to GND CANH shorted to VCC CANL shorted to VCC CANH shorted to VS CANL shorted to VS CANH open CANL open CANH short to CANL The TLE6251-2G can not detect the bus failures: The TLE6251-2G detects the bus failures while sending a “Dominant” signal to the CAN bus. After sending four “Dominant” bits to the CAN bus, a logical “Low” on the NERR pins indicates the CAN bus failure. For the failure indication the “Dominant” bits require a minimum pulse width of 4 µs. In case the TLE6251-2G detects an CAN bus failure, the failure is only indicated by the NERR pin, the transceiver doesn’t stop or block the communication, by disabling the output stage for example. Short to VCC CANH CANL t TxD t RxD t NERR t Four Dominant Bits Figure 9 CAN Bus Failure CANH short to VCC1) 1) The communication on the CAN bus could still be possible even with a short CANH to VCC or CANH to VS. If the CAN bus communication is possible or not, depends on parameters like the number of participants inside the CAN network, the network termination, etc. This figure shows a working CAN bus communication as an example and it shall not be considered as a liability that on HS CAN networks the CAN bus communication continues in every CAN bus failure case. Data Sheet 17 Rev. 1.0, 2009-05-07 TLE6251-2G Fail Safe Features 7.2 Local Failures If a local failure occurs during the operation of the TLE6251-2G, the devices sets an internal local failure flag. The local failure flag can be displayed to the microcontroller during the Receive - Only Mode and the failures are indicated by a logical “Low” signal on the NERR pin. The following local failures can be detected: • • • • • TxD Time - Out TxD to RxD Short RxD permanent Recessive Clamping Bus Dominant Clamping Over - Temperature Detection 7.2.1 TxD Time - Out Feature The TxD Time - out feature protects the CAN bus against permanent blocking in case the logical signal on the TxD pin is continuously “Low”. In Normal Operation Mode, a logical “Low” signal on the TxD input pin for the time t > tdom(TXD) enables the TxD Time - Out feature and the TLE6251-2G disables the output driver stage. In Receive - Only Mode the TLE6251-2G indicates the TxD Time-out by a logical “Low” signal on the NERR pin (see Figure 10). To release the output driver stage after the permanent “Low” signal on the TxD input pin disappears, a mode change from Receive - Only Mode to Normal Operation Mode is required. Figure 10 Data Sheet TxD Time - Out Feature 18 Rev. 1.0, 2009-05-07 TLE6251-2G Fail Safe Features 7.2.2 TxD to RxD Short Circuit Feature A short between the pins TxD and RxD causes permanent blocking of the CAN bus. In the case, that the low side driver capability of the RxD output pin is stronger as the high side driver capability of the external microcontroller output, which is connected to the TxD pin of the TLE6251-2G, the RxD output signal overrides the TxD signal provided by the microcontroller. In this case a continuous “Dominant” signal blocks the CAN bus. The TLE62512G detects the short between the TxD and the RxD pin, disables the output driver stage and sets the internal local failure flag. In Receive - Only Mode the TLE6251-2G indicates the TxD to RxD short by a logical “Low” signal on the NERR pin. The TLE6251-2G releases the failure flag and the output driver stage by an operation mode change from Receive - Only Mode to Normal Operation Mode. 7.2.3 RxD Permanent Recessive Clamping A logical “High” signal on the RxD pin indicates the external microcontroller, that there is no CAN message on the CAN bus. The microcontroller can transmit a message to the CAN bus only if the bus is recessive. In case the logical “High” signal on the RxD pin is caused by a failure, like a short from RxD to VIO, the RxD signal doesn’t mirror the signal on the CAN bus. This allows the microcontroller to place a message to the CAN bus at any time and corrupts CAN bus messages on the bus. The TLE6251-2G detects a permanent logical “High” signal on the RxD pin and set the local error flag. In order to avoid any data collisions on the CAN bus the output driver stage gets disabled. In Receive - Only Mode the TLE6251-2G indicates the RxD Clamping by a logical “Low” signal on the NERR pin. The TLE6251-2G releases the failure flag and the output driver stage by a operation mode change or if the RxD clamping failure disappears. 7.2.4 Bus Dominant Clamping Due to a fail function on one of the CAN bus participants, the CAN bus could be permanent in “Dominant” state. The external microcontroller doesn’t transmit any data to the CAN bus as long as the CAN bus remains “Dominant”. Even if the permanent “Dominate” state on the CAN bus is caused by a short from CANH to VCC, or similar, the transceiver can not detect the failure, because the CAN bus failure detection works only when the transceiver is active sending data to the bus. Therefore the TLE6251-2G has a bus dominant clamping detection unit installed. In case the bus signal is “Dominant” for the time t > tBus,t the TLE6251-2G detects the bus clamping and sets the local failure flag. The output driver stage remains active. In Receive - Only Mode the TLE6251-2G indicates the bus dominant clamping by a logical “Low” signal on the NERR pin. Data Sheet 19 Rev. 1.0, 2009-05-07 TLE6251-2G Fail Safe Features 7.2.5 Over - Temperature Detection The output driver stage is protected against over temperature. Exceeding the shutdown temperature results in deactivation of the output driving stage. To avoid any toggling after the device cools down, the output driver stage is enabled again only after a “Recessive” to “Dominant” signal change on the TxD pin (see Figure 11). An Over - Temperature event only deactivates the output drive stage, the TLE6251-2G doesn’t change its operation mode in this failure case. The Over - Temperature event is indicated by a logical “Low” signal on the NERR pin in Receive - Only Mode. Temp. Over – Temperature Event Device cool down Output - Stage Release t CANH CANL t TxD t RxD t Normal Operation Mode Figure 11 Release of the Transmission after an Over - Temperature event 7.3 Under - Voltage Detection The TLE6251-2G provides a power supply monitoring on all three power supply pins: VCC, VIO and VS. In case of an under - voltage event on any of this three power supplies, the TLE6251-2G changes the operation mode and sets an internal failure flag. The internal failure flag is not indicated by the NERR output pin. 7.3.1 Under - Voltage event on VCC and VIO An under - voltage event on the power supply VCC or the power supply VIO causes the change of the operation mode to Sleep Mode, regardless of the operation mode in which the TLE6251-2G might currently operate. The logical signals on the digital input pins EN and NSTB are also disregarded. After the power supplies VCC and VIO have been reestablished, the operation mode can be changed by a Wake - Up event or by applying a logical “High” signal to the EN pin or the NSTB pin. The under - voltage monitoring on the power supply VCC and VIO is combined with an internal filter time. Only if the voltage drop on each of these two power supplies is longer present as the time tDrop > tUV(VIO) (tDrop > tUV(VCC)) the operation mode change will be activated (see Figure 12). Under - voltage events on the power supplies VCC or VIO are not indicated by the NERR pin nor by the RxD pin. Data Sheet 20 Rev. 1.0, 2009-05-07 TLE6251-2G Fail Safe Features VCC VCC,UV t < tUV(VCC) t > tUV(VCC) t INH t Normal Operation Mode / Receive – Only Mode / Stand – By Mode or Go -To Sleep Command Sleep Mode VIO VIO,UV t < tUV(VIO) t > tUV(VIO) t INH t Normal Operation Mode / Receive – Only Mode / Stand – By Mode or Go -To Sleep Command Sleep Mode Figure 12 Under - Voltage on VIO or VCC 7.3.2 Under - Voltage Event on VS If an under - voltage event is detected at the power supply VS, the TLE6251-2G immediately transfers into the Stand - By Mode, regardless of the operation mode in which the TLE6251-2G might currently operate. After the power supply VS has been reestablished, the operation mode can be changed by applying a logical “High” signal to the EN pin or the NSTB pin. In the case the TLE6251-2G detects an under - voltage event on the VCC or VIO power supply, the TLE6251-2G changes to Sleep Mode. If the TLE6251-2G detects in Sleep Mode an under - voltage event on the VS power supply, the device changes to the Stand-By Mode, even if the under - voltage event on the VCC or VIO power supply is still present. Data Sheet 21 Rev. 1.0, 2009-05-07 TLE6251-2G Fail Safe Features Figure 13 Under - Voltage on VS 7.4 Voltage Adaptation The advantage of the adaptive microcontroller logic is the ratio metrical scaling of the I/O levels depending on the input voltage at the VIO pin. Connecting the VIO input to the I/O supply of the microcontroller ensures, that the I/O voltage of the microcontroller fits to the internal logic levels of the TLE6251-2G. 7.5 Split Circuit The SPLIT output pin is activated during Normal Operation Mode and Receive - Only Mode and deactivated (SPLIT pin high ohmic) during Sleep Mode and Stand - By Mode. The SPLIT pin is used to stabilize the recessive common mode signal in Normal Operation Mode and Receive - Only Mode. This is realized with a stabilized voltage of 0.5 x VCC at SPLIT pin. Data Sheet 22 Rev. 1.0, 2009-05-07 TLE6251-2G Diagnosis-Flags at NERR and RxD 8 Table 2 NSTB 1 1 Diagnosis-Flags at NERR and RxD Truth Table EN INH HIGH Mode NORMAL Event No CAN bus failure CAN bus failure 1) 1) NERR 1 0 RxD LOW: bus dominant, HIGH: bus recessive LOW: bus dominant, HIGH: bus recessive SPLIT ON Wake-up via CAN bus/no wake- 1 up request detected Wake-up via pin WK2) 1 0 HIGH RECEIVE ONLY No VS fail detected 3) 0 1 0 1 ON VS fail detected 3) No TxD time-out, Over - Temperature event, RxD recessive clamping or bus dominant time out detected4) TxD time-out, Over - Temperature event, RxD recessive clamping or bus dominant time out detected4) 0 0 0 0 HIGH Floating STAND BY SLEEP Wake-up request detected5) No Wake up request detected Wake-up request detected 5) 5) 5) 0 0 1 0 1 0 1 0 1 OFF OFF No wake-up request detected 1) Only valid after at least four recessive to dominant edges at TxD when entering the Normal Operation Mode. 2) Only valid before four recessive to dominant edges at TxD when entering the Normal Operation Mode. 3) Power - On flag only available, if VCC and VIO are active. Power - On flag will be cleared when entering Normal Operation Mode. 4) Valid after a transition from Normal Operation Mode. 5) Only valid if VCC and VIO are active. Data Sheet 23 Rev. 1.0, 2009-05-07 TLE6251-2G General Product Characteristics 9 9.1 Table 3 General Product Characteristics Absolute Maximum Ratings Absolute Maximum Ratings 1) All voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Voltages 9.1.1 Supply voltage 9.1.2 Transceiver supply voltage 9.1.3 Logic supply voltage 9.1.4 CANH DC voltage versus GND 9.1.5 CANL DC voltage versus GND 9.1.6 Split DC voltage versus GND 9.1.7 Input voltage at WK 9.1.8 Input voltage at INH 9.1.9 Differential voltage CANH to CANL 9.1.10 Differential voltage SPlIT to CANH and CANL Max. 40 6.0 6.0 40 40 40 40 40 V V V V V V V V – – – – – – – – Max. differential voltage between CAN and CANL Max. differential voltage between SPLIT and CAN Max. differential voltage between WK and SPLIT, CAN 0 V < VIO < 6.0 V Unit Conditions VS VCC VIO VCANH VCANL VSPLIT VWK VINH VDiff,CAN -0.3 -0.3 -0.3 -40 -40 -40 -27 -0.3 -40 VS + 0.3 V VDiff,SPLIT -40 -40 -0.3 40 40 V V V 9.1.11 Differential voltage WK to SPLIT, VDiff,WK CANH and CANL 9.1.12 Logic voltages at EN, NSTB, NERR, TxD, RxD Currents 9.1.13 Maximum Output Current INH Temperatures 9.1.14 Junction Temperature 9.1.15 Storage Temperature ESD Susceptibility 9.1.16 ESD Resistivity at CANH, CANL, VESD SPLIT and WK versus GND 9.1.17 ESD Resistivity all other pins VLogic VIO IINH(max) Tj Tstg -5 -40 -55 -8 -2 0 150 150 8 2 mA °C °C kV kV – – – HBM2) (100 pF / 1.5 kΩ) HBM2) (100 pF / 1.5 kΩ) VESD 1) Not subject to production test, specified by design. 2) ESD susceptibility, HBM according to AEC - Q100 - 002D. Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Data Sheet 24 Rev. 1.0, 2009-05-07 TLE6251-2G General Product Characteristics 9.2 Table 4 Pos. Functional Range Operating Range Parameter Symbol Min. Limit Values Max. 18 40 5.25 5.25 150 V V V V °C – Parameter Deviations possible – – 1) Unit Conditions Supply Voltages 9.2.18 9.2.19 9.2.20 9.2.21 9.2.22 Supply Voltage Range for Normal Operation Extended Supply Voltage Range for Operation Transceiver Supply Voltage Logic Supply Voltage Junction temperature VS(nom) VS(ext) VCC VIO TJ 6 6 4.75 3.0 -40 Thermal Parameters 1) Not subject to production test, specified by design Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 9.3 Table 5 Pos. Thermal Resistance Thermal Characteristics1) Parameter Symbol Min. Limit Values Typ. – 130 175 10 Max. 25 – 190 – K/W K/W °C K measured to pin 2 2) Unit Conditions Thermal Resistance 9.3.23 9.3.24 9.3.25 9.3.26 Junction to Soldering Point1) Junction to Ambient1) Thermal shutdown temp. Thermal shutdown hysteresis RthJSP RthJA TJSD ∆T – – 150 – Thermal Shutdown Junction Temperature – – 1) Not subject to production test, specified by design 2) EIA/JESD 52_2, FR4, 80 × 80 × 1.5 mm; 35µ Cu, 5µ Sn; 300 mm2 Data Sheet 25 Rev. 1.0, 2009-05-07 TLE6251-2G Electrical Characteristics 10 10.1 Table 6 Electrical Characteristics Functional Device Characteristics Electrical Characteristics 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 6.0 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Current Consumption 10.1.1 Current consumption in Normal Mode on VCC and VIO Symbol Limit Values Min. Typ. 6 50 6 Max. 10 80 10 mA mA mA Recessive state; TxD = “High” Dominant state; TxD = “Low” Receive - Only Mode Unit Conditions ICC+VIO ICC+VIO – – – 10.1.2 Current consumption in Receive - Only Mode on VCC and VIO ICC+VIO 10.1.3 Current consumption in Stand- IVS By Mode on VS 10.1.4 Current consumption in StandBy Mode on VCC and VIO – 45 70 µA Stand - By Mode; VS = WK = 12 V VCC = VIO = 5V Stand - By Mode; VS = VWK = 12 V VCC = VIO = 5V Sleep Mode, ICC+VIO – 2.5 10 µA 10.1.5 Current consumption in Sleep IVS Mode on VS – 20 30 µA VS = 12 V, Tj < 85 °C, VCC = VIO = 0 V Sleep Mode, VS = 12 V, Tj < 85 °C, VCC = VµC = 5V – – – – 10.1.6 Current consumption in Sleep ICC+VIO Mode on VCC and VIO – 2.5 10 µA Supply Resets VCC,UV 10.1.8 VIO under - voltage detection VIO,UV 10.1.9 VS power ON detection level VS,Pon 10.1.10 VS power OFF detection level VS,Poff Receiver Output RxD 10.1.11 HIGH level output current 10.1.12 LOW level output current 10.1.7 VCC under - voltage detection 2 1.5 2 2 – 2 3 2.5 4 3.5 -4 4 4 2.8 5 5 -2 – V V V V mA IRD,H IRD,L VRD = 0.8 × VIO mA VRD = 0.2 × VIO Data Sheet 26 Rev. 1.0, 2009-05-07 TLE6251-2G Electrical Characteristics Table 6 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 6.0 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Transmission Input TxD 10.1.13 High level input range 10.1.14 Low level input range 10.1.15 HIGH level input current 10.1.16 TxD pull-up resistance Mode Control Inputs EN, NSTB 10.1.17 High level input range 10.1.18 Low level input range 10.1.19 LOW level input current 10.1.20 Pull-down resistance Diagnostic Output NERR 10.1.21 HIGH level output voltage 10.1.22 LOW level output voltage Termination Output SPLIT 10.1.23 Split output voltage 10.1.24 Split output voltage no load 10.1.25 Leakage current 10.1.26 Output resistance Symbol Limit Values Min. Typ. Max. Unit Conditions VTD,H VTD,L ITD RTD VM,H VM,L IMD RM 0.7 × – VIO VIO + V 0.3 V 0.3 × V µA kΩ Recessive state Dominant state - 0.3 -5 10 – 0 20 VIO 5 40 VTxD = VIO – Recessive state Dominant state 0.7 × – VIO VIO + V 0.3 V 0.3 × V µA kΩ V V - 0.3 -5 50 – 0 100 VIO 5 200 – 0.2 × VEN and VNSTB = 0V – VNERR,H 0.8 × – VIO VNERR,L – – INERR = -100 µA INERR = 1.25 mA VIO VSPLIT VSPLIT ISPLIT RSPLIT 0.3 × 0.5 × 0.7 × V VCC VCC -5 – VCC VCC VCC VCC Normal Operation Mode; -500 µA < ISPLIT < 500 µA Normal Operation Mode; no load Sleep Mode 0.45 × 0.5 × 0 600 0.55 × V 5 – µA Ω VCC = VIO = 0 V RSPLIT = (VSPLIT(500 µA) - VSPLIT(-500 µA)) / 1mA Data Sheet 27 Rev. 1.0, 2009-05-07 TLE6251-2G Electrical Characteristics Table 6 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 6.0 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Wake Input WK 10.1.27 High Level voltage range at WK Symbol Limit Values Min. Typ. – – -5 5 0.4 0.8 – Max. Unit Conditions VWK,H VS 2V - 27 -10 – – – – VS + 3V V V µA µA V µA VEN = VNSTB = 0 V rising edge VEN = VNSTB = 0 V falling edge VWK = Vs - 2 V VWK = Vs - 4 V IINH = -1 mA 1) IINH = -5 mA Sleep mode; 10.1.28 Low Level voltage range at WK VWK,L 10.1.29 HIGH level input current 10.1.30 LOW level current Inhibit Output INH 10.1.31 HIGH level voltage drop ∆VH = VS - VINH 10.1.32 Leakage current Bus Transmitter 10.1.33 CANL and CANH recessive output voltage 10.1.34 CANL and CANH recessive output voltage 10.1.35 CANH to CANL recessive output voltage difference ∆ VH VS 4V – 10 0.8 1.6 5 IWKH IWKL IINH,lk VINH = 0 V Normal Operation Mode no load Low Power Mode no load VCANL/H 2.0 VCANL/H -0.1 Vdiff -500 0.5 2.75 1.5 50 -200 – – – – – – 80 -80 0 3.0 0.1 50 2.25 4.5 3.0 200 -50 5 V V mV V V V VTxD = VIO; no load VTxD = 0 V; 50 Ω < RL < 65 Ω VTxD = 0 V; 50 Ω < RL < 65 Ω 10.1.36 CANL dominant output voltage VCANL 10.1.37 CANH dominant output voltage VCANH 10.1.38 CANH, CANL dominant output Vdiff voltage difference 10.1.39 CANL short circuit current 10.1.40 CANH short circuit current 10.1.41 Leakage current ICANLsc ICANHsc VTxD = 0 V; 50 Ω < RL < 65 mA VCANLshort = 18 V mA µA VCANHshort = 0 V VS = VµC = VCC = 0 V; 0 V < VCANH,L < 5 V ICANHL,lk -5 Data Sheet 28 Rev. 1.0, 2009-05-07 TLE6251-2G Electrical Characteristics Table 6 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 6.0 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Bus Receiver 10.1.42 Differential receiver input range - Dominant 10.1.43 Differential receiver input range - Recessive 10.1.44 Differential receiver input range - Dominant 10.1.45 Differential receiver input range - Recessive 10.1.46 Common Mode Range Symbol Limit Values Min. Typ. – – – – – 100 20 40 150 Max. 5.0 0.5 5.0 0.4 12 – 30 60 255 V V V V V mV kΩ kΩ ns Normal Operation Mode, In respect to CMR Normal Operation Mode, In respect to CMR Sleep Mode, Stand - By Mode In respect to CMR Sleep mode, Stand - By Mode In respect to CMR Unit Conditions Vdiff,rdN Vdiff,drN Vdiff,rdL Vdiff,drL CMR 0.9 -1.0 1.15 -1.0 -12 – 10 20 – VCC = 5 V – Recessive state Recessive state 10.1.47 Differential receiver hysteresis Vdiff,hys 10.1.48 CANH, CANL input resistance Ri 10.1.49 Differential input resistance 10.1.50 Propagation delay TxD-to-RxD LOW (recessive to dominant) 10.1.51 Propagation delay TxD-to-RxD HIGH (dominant to recessive) 10.1.52 Propagation delay TxD LOW to bus dominant 10.1.53 Propagation delay TxD HIGH to bus recessive 10.1.54 Propagation delay bus dominant to RxD LOW 10.1.55 Propagation delay bus recessive to RxD HIGH 10.1.56 Min. hold time go to sleep command 10.1.57 Min. wake-up time on pin WK 10.1.58 Min. dominant time for bus wake-up 10.1.59 TxD permanent dominant disable time 10.1.60 Bus permanent time-out 10.1.61 VCC, VµC undervoltage filter time 10.1.62 Time for mode change Rdiff td(L),TR Dynamic CAN-Transceiver Characteristics CL = 100 pF; VCC = VIO = 5 V; CRxD = 15 pF CL = 100 pF; VCC = VIO = 5 V; CRxD = 15 pF CL = 100 pF; VCC = VIO = 5 V; CRxD = 15 pF CL = 100 pF; VCC = VIO = 5 V; CRxD = 15 pF CL = 100 pF; VCC = VIO = 5 V; CRxD = 15 pF CL = 100 pF; VCC = VIO = 5 V; CRxD = 15 pF – – – – – – 1) td(H),TR – 150 255 ns td(L),T td(H),T td(L),R td(H),R thSLP – – – – 8 50 50 100 100 25 10 3 0.6 0.6 320 20 120 120 135 135 50 20 5 1.0 1.0 480 – ns ns ns ns µs µs µs ms ms ms µs tWK(local) 5 tWake 0.75 tTxD 0.3 tBus,t 0.3 tUV(VIO) 200 tUV(VCC) tMode – 1) Not subject to production test, specified by design. Data Sheet 29 Rev. 1.0, 2009-05-07 TLE6251-2G Electrical Characteristics 10.2 Diagrams Figure 14 Test Circuit for Dynamic Characteristics Figure 15 Timing Diagrams for Dynamic Characteristics Data Sheet 30 Rev. 1.0, 2009-05-07 TLE6251-2G Application Information 11 Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. 11.1 Application Example 4.7 nF 1) 60 Ω VBat 60 Ω CAN Bus VS 10 kΩ 9 TLE6251-2G WK EN NSTB 51 µH 1) 6 14 8 4 1 5 100 nF 3 100 nF GND 100 nF Micro Controller E.g. XC22xx NERR 13 12 11 10 CANH CANL SPLIT RxD TxD VIO 100 7 INH nF VS GND 2 VCC INH VQ1 e.g. TLE 4476 (3.3/5 V) or TLE 4471 TLE 4276 TLE 4271 22 + µF 100 nF VI1 GND VQ2 5V + 22 µF + 22 µF ECU 51 µH 1) TLE6251DS 7 6 5 CANH CANL SPLIT GND 2 e. g. TLE 4270 STB RxD TxD 8 4 1 3 100 nF 100 nF GND Micro Controller E.g. XC22xx VCC 60 Ω 60 Ω 4.7 nF 1) VI 22 + µF 100 nF GND VQ + 5V 22 µF ECU 1) Optional, according to the car manufacturer requirements Figure 16 Data Sheet Application Circuit Example 31 Rev. 1.0, 2009-05-07 TLE6251-2G Application Information 11.2 ESD Robustness according to IEC61000-4-2 Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330 Ω) have been performed. The results and test conditions are available in a separate test report. Table 7 ESD Robustness according to IEC61000-4-2 Result Unit kV kV Remarks 1) Performed Test Electrostatic discharge voltage at pin VS, CANH, ≥ + 9 CANL and WK versus GND Electrostatic discharge voltage at pin VS, CANH, ≤ - 9 CANL and WK versus GND Positive pulse Negative pulse 1) 1) ESD susceptibility “ESD GUN” according to “Gift ICT Evaluation of CAN Transceiver “Section 4.3. (IEC 61000-4-2: 2001-12) -Tested by external test house (IBEE Zwickau, EMC Testreport Nr. 07a-04-09). 11.3 Voltage Drop over the INH Output Figure 17 INH output voltage drop versus output current (typical values only!) 11.4 • • • Further Application Information Please contact us for information regarding the FMEA. Existing App. Note For further information you may contact http://www.infineon.com/transceiver Data Sheet 32 Rev. 1.0, 2009-05-07 TLE6251-2G Package Outlines 12 Package Outlines gps09033 Figure 18 PG-DSO-14 (Plastic Dual Small Outline PG-DSO-14-24) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 33 Dimensions in mm Rev. 1.0, 2009-05-07 TLE6251-2G Revision History 13 Revision 1.0 Revision History Date 2009-05-07 Changes Initial Data Sheet Rev. 1.0 Data Sheet 34 Rev. 1.0, 2009-05-07 Edition 2009-05-07 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.