Fault Tolerant CAN - LDO
Final Data Sheet
1 1.1 Overview Features
TLE 6262 G
• Standard fault tolerant differential CAN-transceiver (TLE6254 LS CAN cell) • Bus failure management • Low power mode management • CAN data transmission rate up to 125 kBaud • Low-dropout voltage regulator 5V ± 2% • Two Low Side Switches • Three High Side Switches • Power on and under-voltage reset generator • Vcc supervisor • Window watchdog • Programable time base • Integrated fail-safe mechanism • Standard 16 bit SPI-Interface • Wide input voltage and temperature range • Enhanced power P-DSO-Package Type TLE 6262 G Ordering Code on request
P-DSO-28-6 Enhanced Power
Package P-DSO-28-6
Description The TLE 6262 G is a monolithic integrated circuit in a P-DSO-28-6 package, which incorporates a failure tolerant low speed CAN-transceiver for differential mode data transmission, a low dropout voltage regulator for internal and external 5V supply as well as a 16 bit SPI interface to control and monitor the IC. Further there are integrated three high side switches, two low side switches, a window watchdog circuit and a reset circuit. Both, the window watchdog and reset function are referring to a time base that is programmable via an external resistor. The IC is designed to withstand the severe conditions of automotive applications.
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Final Data TLE 6262 G
1.2
Pin Configuration (top view)
CANH 1 RTH 2 RO 3 CANL 4 RTL 5 GND 6 GND 7 GND 8 GND 9 OUTH1 10 OUTL1 11 OUTL2 12 OUTH2 13 OUTH3 14
28 OSC 27 PWM 26 TxD 25 RxD 24 Vcc 23 GND 22 GND 21 GND 20 GND 19 CLK 18 DI 17 DO 16 CSN 15 Vs
P-DSO-28-6
(enhanced power package)
Figure 1
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Final Data TLE 6262 G
1.3 Pin No. 1 2 3 4 5
Pin Definitions and Functions Symbol CANH RTH RO CANL RTL Function CAN-H bus line; HIGH in dominant state Termination input for CANH Reset output; open drain output; integrated pull up; active low CAN-L bus line; LOW in dominant state Termination input for CANL Ground; to reduce thermal resistance place cooling areas on PCB close to this pins. High side output 1; controlled via PWM input and/or SPI input, short circuit protected Low side output 1; SPI controlled, with active zener Low side output 2; SPI controlled, with active zener High side output 2; SPI controlled High side output 3; SPI controlled, in low power mode controlled by internal autotiming function if selected Power supply; block to GND directly at the IC with ceramic capacitor SPI interface chip select not; CSN is an active low input; serial communication is enabled by pulling the CSN terminal low; CSN input should only be transitioned when CLK is low; CSN has an internal active pull up and requires CMOS logic level inputs SPI interface data out; this tristate output transfers diagnosis data to the control device; the output will remain 3-stated unless the device is selected by a low on Chip-Select-Not (CSN); see table 3 for diagnosis protocol SPI interface data in; receives serial data from the control device; serial data transmitted to DI is a 16 bit control word with the Least Significant Bit (LSB) being transferred first: the input has an active pull down and requires CMOS logic level inputs; DI will accept data on the falling edge of CLK-signal; see table 2 for input data protocol SPI interface clock input; clocks the shiftregister; CLK has an internal active pull down and requires CMOS logic level inputs
6, 7, 8, 9, GND 20, 21, 22, 23 10 11 12 13 14 15 16 OUTH1
OUTL1
OUTL2 OUTH2 OUTH3
VS
CSN
17
DO
18
DI
19
CLK
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Final Data TLE 6262 G
1.3 Pin No. 24
Pin Definitions and Functions (cont’d) Symbol VCC Function Output voltage regulator; 5V logic supply, block to GND with an 100nF external ceramic capacitor directly at the IC + external capacitor CQ ³ 22 µF CAN Receive data output; CAN Transmit data input; integrated pull up Pulse width control; for high side switch 1 Oscillator input; time base for power on reset, watchdog window and stand by timer for HS3, to program connect external resistor to GND
25 26 27 28
RxD TxD PWM OSC
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Final Data TLE 6262 G
1.4
Functional Block Diagram
OUTL1 Charge Pump Drive OUTL2 Drive Vs Protection + Drive PWM Switch Fail Detect OUTH2 Drive OUTH3 Drive CSN OUTH1
UVLO
POR
SPI
CLK DI DO Vcc
+ Band Gap
Timer Reset Generator + Window Watchdog CAN Standby / Sleep Control
OSC
RO
RTL
Fail Management
CANH CANL RTH Filter
H Output Stage L Output Stage
Driver Temp. Protect Input Stage
TxD
Receiver
RxD
CAN Fail Detect
GND
Figure 2
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Final Data TLE 6262 G
1.5
Circuit Description
The TLE 6262 G is a monolithic IC, which incorporates a failure tolerant low speed CANtransceiver for differential mode data transmission, a low dropout voltage regulator for internal and external 5V supply as well as a SPI interface to control and monitor the IC. Further there are integrated three high side switches, two low side switches, a window watchdog circuit and a reset circuit. Both, the window watchdog and reset function are referring to a time base that is programmable via an external resistor. Figure 2 shows a block schematic diagram of the TLE 6262 G Table 1: mode truth table Feature VCC Reset Watchdog SPI CAN transmit CAN receive OUTHS 13) 4) 5) OUTHS 23) 5) OUTHS 33) 5) OUTHS3-auto timing3) 5) OUTLS 13) 6) OUTLS 23) 6)
1) 2) 3) 4) 5) 6)
normal mode ON ON ON1) ON ON ON ON ON ON OFF ON ON
Receive-only mode ON ON ON1) ON OFF ON ON ON ON ON ON ON
VBAT stand-by mode ON ON ON1) ON OFF OFF2) ON ON ON ON ON ON
at low VCC output current only active when watchdog undercurrent function is not activated a bus wake-up is monitored by setting the RxD output low only active when selected via SPI also active when driven via the PWM input automatically disabled when a reset occurs automatically disabled when a reset or watchdog reset respectively, occurs or the watchdog is disabled by the undercurrent function
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Final Data TLE 6262 G
CAN Transceiver The TLE 6262 is optimized for low speed data transmission up to 125 kbaud in automotive applications. Normally a differential signal is transmitted or received respectively. When a bus wiring failure (see table 4) is detected the device automatically switches to a dedicated CANH or CANL single-wire mode to maintain the communication if necessary. Therefore it is equipped with one differential receiver and four single ended comparators (two for each bus line). To avoid false triggering by external RF influences the single wire modes are activated after a certain delay time. As soon as the bus failure disappears the transceiver switches back to differential mode after another time delay. The bus failures are monitored via the diagnosis protocol of the SPI. Therefore it is possible to distinguish 6 CAN bus failures or failure groups on the bits 8 to 13 (see table 3). To reduce EMC caused by the transceiver the dynamic slopes of the CANL and CANH signals are both limited and symmetric. This allows the use of an unshielded twisted or parallel pair of wires for the bus. During single-wire transmission (bus-failure) the EMC performance of the system is degraded from the differential mode. The differential receiver threshold is set to typ. -2.8 V. This ensures correct reception in the normal operation mode as well as in the failure cases 1, 2, 3a and 4 with a noise margin as high as possible. When one of the bus failures 3, 5, 6, 6a, and 7 is detected, the defective bus wire is disabled by switching off the affected bus termination and output stage. The CAN-transceiver offers three different operation modes that are controlled via the SPI: the normal operation mode, Receive-only mode and Vbat stand-by mode. Please see the state diagram (figure 3). In the Vbat stand-by mode the RTL output voltage is switched to VS. In case of a wake-up via the bus lines or one of the bus lines respectively, the TLE 6262 automatically sets the RxD output LOW. To send respectively receive messages the CAN-transceiver can now be set in normal operation mode or receive-only mode by the microcontroller. When a reset occurs the transceiver circuit is automatically switched to Vbat-stand-by mode because the SPI input bits are automatically set LOW for this event. A thermal shutdown of the CAN-transceiver circuit is monitored via the SPI diagnosis bit 15.
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Final Data TLE 6262 G
Start Up Power Up
Normal Mode NSTB 1 ENT 1 V CC ON
NSTB ENT 1 1
ENT
0
ENT
1
NSTB ENT or VCC
0 0 VRT
RxD-Only NSTB 1
NSTB 0
NSTB VCC
0 or VRT 1
Vbat Stand-By NSTB 0 ENT 0 VCC ON
ENT 0
0 1
V CC ON
NSTB
NSTB ENT
Go- To-Sleep Mode NSTB 0 ENT 1 V CC ON
ENT 1
Figure 3: State Diagram Low Dropout Voltage Regulator The TLE 6262 is able to drive external 5V loads up to 45 mA. Its output voltage tolerance is less than ± 2%. In addition the regulator circuit drives the internal loads like the CANtransceiver circuit. An external reverse current protection is recommended to prevent the output capacitor from being discharged by negative transients or low input voltage. Stability of the output voltage is guaranteed for output capacitors CVCC ³ 100 nF. Nevertheless a lot of applications require a much larger output capacitance to buffer the output voltage in case of low input voltage or negative transients. Furthermore the due function of e.g. the reset and 3V-supervisor circuit are supported by a larger output capacitance because of their reaction times. Therefore a output capacitance CVCC ³ 10 µF is recommended.
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Final Data TLE 6262 G
SPI (serial peripheral interface) The 16-bit wide programming word or input word (see table 1) is read in via the data input DI, and this is synchronized with the clock input CLK supplied by the µC. The diagnosis word appears synchronously at the data output DO (see table 3). The transmission cycle begins when the chip is selected by the chip select not input CSN (H to L). After the CSN input returns from L to H, the word that has been read in becomes the new control word. The DO output switches to tristate status at this point. For details of the SPI timing please refer to figure 3 to 7. Oscillator All internal delay times are referring to the internal oscillator frequency, which is set by an external resistor from pin OSC to GND. The oscillator frequency and the resulting internal cycling time can be calculated by the equations:
28, 45 ´10 [ Hz W ] f OSC = ----------------------------------------R OSC
9
32 t CYL = ----------f OSC
Window Watchdog, Reset and 3V-Supervisor When the output voltage VCC exceeds the reset threshold voltage VRT the reset output RO is switched HIGH after a delay time of 16 cycles. This is necessary for a defined start of the microcontroller when the application is switched on. As soon as an under-voltage condition of the output voltage (VCC < VRT) appears, the reset output RO is switched LOW again. The LOW signal is guaranteed down to an output voltage VCC ³ 1V. Please refer to fig.11, reset timing diagram. Should the output voltage fall short of the 3V-supervisor threshold VST an internal flipflop is set LOW. The SPI diagnosis bit 7 monitors this. In normal operation this flip-flop has to be activated via the SPI input bit 7. This feature is useful e.g. to monitor that the RAM data of the microcontroller might be damaged or the application is connected to VS the first time. After the above described delayed reset (LOW to HIGH transition of RO) the window watchdog circuit is started by opening a long open window of 32 cycles. Now the microcontroller has to service a watchdog trigger signal via the SPI interface (input bit 0). A watchdog trigger is detected as a falling edge by sampling for 2 cycles a HIGH followed by 2 cycles LOW of the SPI input bit 0. The long open window ensures a simple and fast
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Final Data TLE 6262 G
synchronization of the TLE 6262 watchdog timing to the watchdog services of the microcontroller. After the first trigger the watchdog has to be serviced by meeting an open window of 20 cycles that follows a closed window of 12 cycles. A correct watchdog service immediately results in starting the next closed window. Please refer to fig. 10, watchdog timing diagram. If the trigger signal does not meet the open window (trigger to early or to late) the reset output RO is set LOW for a period of 4 cycles. Afterwards a long open window is started again. In addition, the SPI diagnosis bit 2 is set HIGH to monitor a watchdog reset. Both, the undervoltage reset and the watchdog reset are setting all SPI input bits LOW. To avoid a cyclic wake-up of the microcontroller in low power mode (sleep mode) the watchdog circuit can be automatically disabled at low output currents (ICC < ICCWD). To activate this feature the SPI input bit 8 has to be set HIGH. In this under-current mode the low side switches are switched off automatically by the TLE 6262 to guarantee failsave operation of the application. When the microcontroller returns back to normal mode (ICC > ICCWD) the first closed window is transformed to an open window so that the total open window time is 32 cycles. This ensures a more simple and fast synchronization of the TLE 6262 watchdog timing to the watchdog services of the microcontroller. Flash program mode To disable the watchdog feature a flash program mode is available. This mode is selected by applying a voltage of 6.8V < VPWM < 7.2V at pin PWM. This is useful e.g. if the flash-memory of the micro has to be programmed and therefore a regular watchdog triggering is not possible. If the SPI is required in the flash program mode to change e.g. the mode of the TLE6262 the first input telegram has to be “00000000”. High Side Switch 1 The high side output OUTH1 is able to switch loads up to 250 mA. Its on-resistance is 1.0 W typ. @ 25°C. This switch can be controlled either via the PWM input or the SPI input bit 1. When the input PWM is used it has to be enabled by setting the SPI input bit 11 HIGH. In case of both control inputs being active the PWM signal is masked by the SPI signal (see fig. 8, High Side Switch 1 Timing Diagram). The SPI diagnosis bit 14 monitors a thermal shutdown of the switches, whereas bit 0 flags a thermal prewarning. By this the microcontroller is able to reduce the power dissipation of the TLE 6262 by switching off functions of minor priority before the temperature threshold of the thermal shutdown is reached. Further OUTH1 is protected against short circuit and overload. The SPI diagnosis bit 1 indicates an overload of OUTH1. As soon as the under-voltage condition of the supply voltage is met (VS < VUVOFF), the switches are automatically disabled by the under-voltage lockout circuit.
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Final Data TLE 6262 G
This is flagged by the SPI diagnosis bit 3. Moreover the switches are disabled when a reset occurs. High Side Switch 2 The high side output OUTH2 is able to switch loads up to 250 mA. Its on-resistance is 1.0 W typ. @ 25°C. This switch is controlled via the SPI input bit 2. The SPI diagnosis bit 14 monitors a thermal shutdown of the switches, whereas bit 0 flags a thermal prewarning. By this the microcontroller is able to reduce the power dissipation of the TLE 6262 by switching off functions of minor priority before the temperature threshold of the thermal shutdown is reached. As soon as the under-voltage condition of the supply voltage is met (VS < VUVOFF), the switches are automatically disabled by the under-voltage lockout circuit. This is flagged by the SPI diagnosis bit 3. Moreover the switches are disabled when a reset occurs. High Side Switch 3 The high side output OUTH3 is able to switch loads up to 150 mA. Its on-resistance is 1.5 W typ. @ 25°C. This switch is controlled via the SPI input bits 3 and 4. To supply external wake-up circuits in low power mode (sleep mode or Vbat-stand-by mode), the output OUTH3 can be periodically activated by the internal oscillator circuit. For activating this feature the SPI input bits 3 and 4 have to be set HIGH. The autotiming period is 128 internal cycle times; the on-time is 2 cycles. In case of a watchdog reset the autotiming period may be shorter. The SPI diagnosis bit 14 monitors a thermal shutdown of the switches, whereas bit 0 flags a thermal prewarning. By this the microcontroller is able to reduce the power dissipation of the TLE 6262 by switching off functions of minor priority before the temperature threshold of the thermal shutdown is reached. As soon as the under-voltage condition of the supply voltage is met (VS < VUVOFF), the switches are automatically disabled by the under-voltage lockout circuit. This is flagged by the SPI diagnosis bit 3. Moreover the switches are disabled when a reset occurs. Low Side Switches 1/2 The two low side outputs OUTL1 and OUTL2 are able to switch loads up to 100 mA. Their on-resistance is 1.5 W (typ.) @ 25°C. This switches are controlled via the SPI input bits 5 and 6. In case of high inrush currents a built in zener circuit (typ. 37 V) activates the switches to protect them. The SPI diagnosis bit 14 monitors a thermal shutdown of the switches, whereas bit 0 flags a thermal prewarning. By this the microcontroller is able to reduce the power dissipation of the TLE 6262 by switching off functions of minor priority before the temperature threshold of the thermal shutdown is reached. The SPI diagnosis bits 5/6
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Final Data TLE 6262 G
are giving a feedback about current status of OUTL1/OUTL2. As soon as the undervoltage condition of the supply voltage is met (VS < VUVOFF), the switches are automatically disabled by the under-voltage lockout circuit. This is flagged by the SPI diagnosis bit 3. In addition the outputs OUTL1 and OUTL2 are also disabled when the watchdog is switched off in undercurrent state or when a reset occurs.
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Final Data TLE 6262 G
Table 2 Input Data Protocol BIT 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 H = ON L = OFF not used not used not used not used PWM Enable CAN Enable Transmit CAN Not Stand-By Watchdog Control Supervisor Enable LS-Switch 2 LS-Switch 1 HS3 Auto Timing HS-Switch 3 HS-Switch 2 HS-Switch 1 Watchdog Trigger
Table 3 Diagnosis Data Protocol BIT 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 H = ON L = OFF Thermal Shutdown Transceiver Thermal Shutdown Switches CAN Failure 2 and 4 CAN Failure 1 and 3a CAN Failure 6 CAN Failure 6a CAN Failure 6a, 5 and 7 CAN Failure 3 Vcc < 3V Status LS2 Status LS1 not used Vs Undervoltage Lockout Window Watchdog Reset Overload HS1 Temperature Prewarning
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Final Data TLE 6262 G
Table 4 CAN bus line failure cases (according to ISO 11519-2) failure # 1 2 3 4 5 6 7 failure description CANL line interrupted CANH line interrupted CANL shorted to Vbat, CANL > 7.2 V CANH shorted to GND CANL shorted to GND CANH shorted to Vbat; CANH > 7.2 V CANL shorted to CANH
3a (no ISO failure) CANL shorted to Vcc; 3.2 V < CANL < 7.2 V
6a (no ISO failure) CANH shorted to Vcc; 1.8 V < CANH < 7.2 V
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Final Data TLE 6262 G
2 2.1
Electrical Characteristics Absolute Maximum Ratings Symbol Limit Values min. max. Unit Remarks
Parameter
Voltages Supply voltage Supply voltage Regulator output voltage CAN input voltage (CANH, CANL) CAN input voltage (CANH, CANL)
VS VS VCC VCANH/L VCANH/L
-0.3 -0.3 -0.3 -10 -40 -0.3
28 40 5.5 28 40
V V V V V V V V V V
– tp< 0.5s; tp/T < 0.1
V S >0 V tp< 0.5s; tp/T < 0.1 0 V < VS < 24 V 0 V < VCC < 5.5 V 0 V < VS < 24 V 0 V < VCC < 5.5 V 0 V < VS < 24 V 0 V < VCC < 5.5 V human body model; C = 100pF, R = 1.5kW human body model; C = 100pF, R = 1.5kW
Logic input voltages (DI, CLK, VI CSN, OSC, PWM, TxD) Logic output voltage (DO, RO, RxD) Termination input voltage (RTH, RTL) Electrostatic discharge voltage at pin CANH, CANL Electrostatic discharge voltage Currents Output current; Vcc Output current; OUTH1 Output current; OUTH2 Output current; OUTH3 Output current; OUTL1 Output current; OUTL2
VCC
+0.3
VDO/RO/RD -0.3 VTL /TH VESD VESD
-0.3 -4000 -2000
VCC
+0.3
VS
+0.3 4000 2000
ICC IOUTH1 IOUTH2 IOUTH3 IOUTL1 IOUTL2
– *) -0.7 -0.5 -0.2 -0.2
– 0.3 0.3 0.2 0.4 0.4
A A A A A A
internally limited *) internally limited tp< 0.5s; tp/T < 0.1 tp< 0.5s; tp/T < 0.1 tp< 0.5s; tp/T < 0.1 tp< 0.5s; tp/T < 0.1
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Final Data TLE 6262 G
2.1
Absolute Maximum Ratings (cont’d) Symbol Limit Values min. max. Unit Remarks
Parameter
Temperatures Junction temperature Storage temperature
Tj Tstg
-40 -50
150 150
°C °C
– –
Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit.
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Final Data TLE 6262 G
2.2
Operating Range Symbol Limit Values min. max. V V/ms
After VS rising above VUV ON – Outputs in tristate Outputs in tristate –
Parameter Supply voltage Supply voltage slew rate Supply voltage increasing Supply voltage decreasing Logic input voltage (DI, CLK, CSN, PWM, TxD) Output current Output current Output capacitor SPI clock frequency OSC-Adjust Resistor Junction temperature Thermal Resistances Junction pin Junction ambient
Unit
Remarks
VS
dVS /dt
VUV OFF 27
-0.5 -0.3 -0.3 -0.3 5
VS VS VI ICC ICC CCC fCLK ROSC Tj
VUV ON V VUV OFF V VCC V
35 45 mA mA mF 1 680 150 MHz kW °C
T < 0.1s
22 – 51 -40
– Ta=-40°C; f = 10kHz –
Rthj-pin Rthj-a
– –
25 65
K/W K/W
measured to pin 7 –
Thermal Prewarning and Shutdown (junction temperatures) Thermal prewarning ON temperature Thermal shutdown temp. Ratio of SD to PW temp.
TjPW TjSD
120 150 135
170 200 – 160
°C °C – °C
bit 0 of SPI diagnosis word; hysteresis 30°K (typ.) hysteresis 30°K (typ.) – hysteresis 10°K (typ.)
TjSD / TjPW 1.05
Thermal shutdown temp. CAN TjSD
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Final Data TLE 6262 G
2.3
Electrical Characteristics
9 V < VS < 16 V; ICC = -100 mA; normal mode; all outputs open; – 40 °C < Tj < 150 °C; CANtransceiver circuitry: – 40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Limit Values min. typ. max.
Unit Test Condition
Quiescent current Pin VS Current consumption Quiescent current
ISSB1 = IS - ICC
Voltage Regulator; Pin VCC Output voltage Output voltage Line regulation Load regulation
IS ISSB1
– –
5 180
10 280
mA mA
low power mode; VS=12V; Tj=25°C
VCC VCC ,VCC ,VCC
4.9 4.8 -20 -25
5.0 5.0
5.2 5.5 20 25
V V mV mV dB mA
0.1mA < ICC< 30mA 0A < ICC < 100µA 9 V < VS < 15 V; ICC = 10mA 0.1mA < ICC< 30mA; VS = 9V VS < 1 Vss; CQ ³ 22µF; 100Hz< f 0.7VCC; CL = 100 pF
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Final Data TLE 6262 G
3
Timing Diagrams
CSN High to Low & rising edge of CLK: DO is enabled. Status information is transfered to Output Shift Register
CSN time CSN Low to High: Data from Shift-Register is transfered to Output Power Switches
CLK
0
1
2
3
4
5
6
7
8
9
10 11 12
13 14 15
0
1
actual Data DI 0 1 2 3 4 5 _ 6 7 8 9 10 11 12 13 14 15
new Data 0 + 1 +
DI: Data will be accepted on the falling edge of CLK-Signal previous Status DO _ 0 _ 1 _ 2 _ 3 _ 4 _ 5 _ 6 _ 7 _ 8 _ 9 ___ 10 11 12 ___ 13 14 15 actual Status 0 1
DO: State will change on the rising edge of CLK-Signal
eg. HS1
old Data
actual Data
Figure 4 Data Transfer Timing
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Final Data TLE 6262 G
Figure 5 SPI-Input Timing
Figure 6 Turn OFF/ON Time
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Final Data TLE 6262 G
Figure 7 DO Valid Data Delay Time and Valid Time
Figure 8 DO Enable and Disable Time
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Final Data TLE 6262 G
Figure 9: High Side Switch1 Timing Diagram
SPI input bit 1
H
L
PWM (SPI input bit 11 = H)
t
H
L
HSSwitch1
t
ON
OFF
t
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Final Data TLE 6262 G
Figure 10: Watchdog Time-out Definitions
tWD tCW
closed window
tOW
open window
t / ms
Figure 11: Watchdog Timing Diagram
tCW WD Trigger tLOW tOW tCW+tOW tLOW tLOW tCW tOW tCW tLOW tCW tOW
Reset Out
tWDR
t
Watchdog timer reset
t
normal operation
timeout (to long)
normal operation
timeout (to short)
normal operation
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Final Data TLE 6262 G
Figure 12: Reset Timing Diagram
Vcc
VRT VST
t < tRR
WD Trigger
tRD
tLOW
tLOW
tCW
tOW
tCW
tRD
tLOW
tCW
t
Reset Out
tWDR
tRR
t
Watchdog timer reset
t
SPI diagnosis bit 7
start up
HIGH
normal operation
tSR
undervoltage
start up
LOW activation by microcontroller
t
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Final Data TLE 6262 G
4
Application
Vbat
CAN bus
+VS
CSN CLK
22 µF 68 nF
DI CANH CANL TxD RxD RTH PWM RTL RQ OUTL2 OUTL1 OUTH3 OUTH2 OSC OUTH1 GND
453 k9 22 µF
DQ
µP
Vcc
GND
TLE 6262 G
Figure 13 Application Circuit
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Final Data TLE 6262 G
5
Package Outlines P-DSO-28-6 (Plastic Dual Small Outline Package)
Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”. Dimensions in mm 37 version: 2.03 date: 2002-03-20
GPS05123
Final Data TLE 6262 G
Edition 1999-10-12 Published by Infineon Technologies AG St.-Martin-Strasse 53 D-81541 München © Infineon Technologies AG1999 All Rights Reserved.
Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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