TLE7209-2R_07

7 A H-Bridge for DC-Motor Applications TLE 7209-2R 1 1.1 Overview Features • Operating supply voltage 5 V to 28 V • Typical RDSon = 150 mΩ for each output transistor (at 25 °C) • Continuous DC load current 5 A (TC < 100 °C) • Output current limitation at typ. 6.6 A ± 1.1 A • Short circuit shut-down for output currents over 8 A • Logic- inputs TTL/CMOS-compatible • Output switching frequency up to 30 kHz • Rise and fall times optimized for 0.5-2 kHz • Over-temperature protection • Short circuit protection • Undervoltage disable function • Diagnostic by SPI or Status-Flag (configurable) • Enable and Disable inputs • PG-DSO-20-37 power package • Green Product (RoHS compliant) Functional Description The TLE 7209-2R is an intelligent full H-Bridge, designed for the control of DC and stepper motors in safety critical applications and under extreme environmental conditions. The H-Bridge is protected against over-temperature and short circuits and has an under voltage lockout for all the supply voltages “VS” (main DC power supply). All malfunctions cause the output stages to go tristate. The device is configurable by the DMS pin. When grounded, the device gives diagnostic information via a simple error flag. When supplied with VCC = 5 V, the device works in SPI mode. In this mode, detailed failure diagnosis is available via the serial interface. Type TLE 7209-2R Data Sheet Package PG-DSO-20-37 1 Rev. 1.4, 2007-04-05 TLE 7209-2R Overview 1.2 Pin Configuration GND SCK/SF IN1 V S CP OUT1 OUT1 SDO SDI GND VS 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 GND IN2 DIS CSN VS OUT2 OUT2 EN DMS GND Metal slug is connected to GND pins internally Figure 1 Table 1 Pin. No. 1 2 3 4 5, 16 6, 7 8 9 10 11 Pinout TLE 7209-2R Pin Definitions and Functions Symbol GND SCK/SF IN1 Function Ground SPI-Clock/Status-flag Input 1 Supply voltage for internal charge pump Supply voltage; connect pins externally Output 1; connect pins externally Serial data out Serial data in Ground Ground VSCP VS OUT1 SDO SDI GND GND Data Sheet 2 Rev. 1.4, 2007-04-05 TLE 7209-2R Overview Table 1 Pin. No. 12 13 14, 15 17 18 19 20 Pin Definitions and Functions (cont’d) Symbol DMS EN OUT2 CSN DIS IN2 GND Function Diagnostic-Mode selection (+ Supply voltage for SPI-Interface) Enable Output 2; connect pins externally Chip Select (low active) Disable Input 2 Ground Data Sheet 3 Rev. 1.4, 2007-04-05 TLE 7209-2R Overview 1.3 Block Diagram DMS V SCP VS Bias Charge Pump FaultDetect EN DIS CSN SDI SDO SCK/SF SPI 8 Bit Logic and Latch Driver OUT 1 & GateControl OUT 2 IN1 IN2 Direct Input Under Voltage Over Temperature GND Figure 2 Block Diagram TLE 7209-2R Data Sheet 4 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2 2.1 Circuit Description Control Inputs The bridge is controlled by the Inputs IN1, IN2, DIS and EN as shown in Table 2. The outputs OUT1 and OUT2 are set to High or Low by the parallel inputs IN1 and IN2, respectively. In addition, the outputs can be disabled (set to tristate) by the Disable and Enable inputs DIS and EN. Inputs IN1, IN2 and DIS have an internal pull-up. Input EN has an internal pull-down. Table 2 Pos. 1. Forward 2. Reverse 3. Free-wheeling low 4. Free-wheeling high 5. Disable 6. Enable 7. IN1 disconnected 8. IN2 disconnected 9. DIS disconnected 10. EN disconnected 11. Current limit. active 12. Under Voltage 13. Over-temperature 14. Over-current 1) 2) Functional Truth Table DIS EN L L L L H X L L Z X L X X X H H H H X L H H X Z H X X X IN1 IN2 OUT1 H L L H X X Z X X X X X X X L H L H X X X Z X X X X X X H L L H Z Z H X Z Z Z Z Z Z OUT2 SF1) SPI2) DIA_REG L H L H Z Z X H Z Z Z Z Z Z H H H H L L H H L L H L L L see Chapter 2.4.2 If Mode “Status-Flag” is selected (see Chapter 2.4) If Mode “SPI-Diagnosis” is selected (see Chapter 2.4) Data Sheet 5 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.2 Power Stages Four n-channel power-DMOS transistors build up the output H-bridge. Integrated circuits protect the outputs against over current and over-temperature if there is a short-circuit to ground, to the supply voltage or across the load. Positive and negative voltage spikes, which occur when switching inductive loads, are limited by integrated freewheeling diodes. To drive the gates of the high-side DMOS, an internal charge pump is integrated to generate a voltage higher than the supply voltage. 2.2.1 Chopper Current Limitation To limit the output current at low power loss, a chopper current limitation is integrated as shown in Figure 3. The current is measured by sense cells integrated in the low-side switches. When the current limit IL has been exceeded for a time tb, all output stages are switched off for a fixed time ta. Blanking time tb Current limit IL IOUT Switch-off time ta time Figure 3 Chopper current limitation Data Sheet 6 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.2.2 Temperature-depending Current Reduction decreases from For TILR < Tj < TSD the current limit IL = 2.5 A ± 1.1 A as shown in Figure 4 A 6.6A IL = 6.6 A ± 1.1 A to IL tolerance of temperature dependent current reduction range of overtemperature shut-down 2.5A Tj TILR TSD °C Figure 4 Temperature dependent current reduction 2.3 Protection The TLE 7209-2R is protected against short circuits, overload and invalid supply voltage by the following measures: 2.3.1 Short circuit to Ground The high-side switches are protected against a short of the output to ground by an over current shut-down. If a high-side switch is turned on and the current rises above the short circuit detection current IOUK all output transistors are turned off after a typical filter time of 2 µs, and the error bit “Short Circuit to Ground on output 1 (2)”, SCG1 (SCG2) is stored in the internal status register. 2.3.2 Short circuit to VS Due to the chopper current regulation, the low-side switches are already protected against a short to the supply voltage. To be able to distinguish a short circuit from normal current limit operation, the current limitation is deactivated for the blanking time tb after the current has exceeded the current limit threshold IL. If the short circuit detection current IOUK is reached within this blanking time, a short circuit is detected (see Figure 5). All output transistors are turned OFF and the according error bit “Short Circuit to Battery on output 1 (2)”, SCB1 (SCB2) is set. Data Sheet 7 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description IN IN IOUK tb IL IOUT IOUT ta tb tb IOUK IL time time Figure 5 Short to Vs detection. Left: normal operation. Right: short circuit is detected 2.3.3 Short circuit across the load If short circuit messages from high- and low-side switch occur simultaneously within a delay time of typically 2µs, the error bit “Short Circuit Over Load”, SCOL is set. 2.3.4 Over-Temperature In case of high DC-currents, insufficient cooling or high ambient temperature, the chip temperature may rise above the thermal shut-down temperature TSD. In that case, all output transistors are shut-down and the error-bit “Over-Temperature”, OT is set. 2.3.5 Under-Voltage shut-down If the supply-voltage at the VS pins falls below the under-voltage detection threshold, the outputs are set to tristate and the error-bit “Under-Voltage at VS“ is set. 2.4 Diagnosis The Diagnosis-Mode can be selected between SPI-Diagnosis and Status-Flag Diagnosis. The choice of the Diagnosis-Mode is selected by the voltage-level on Pin 12 (DMS Diagnosis Mode Selection): • DMS = GND, Status-Flag Mode • DMS = VCC, SPI-Diagnosis Mode For the connection of Pins SDI, SDO, CSN and SCK/SF see Figure 14 and Figure 15. Data Sheet 8 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.4.1 2.4.1.1 Status-Flag (SF) Mode (DMS = GND) SF output In SF-mode, pin 2 is used as an open-drain output status-flag. The pin has to be pulled to the logic supply voltage with a pull-up resistor, 47 kOhm recommended. In case of any failure that leads to a shut-down of the outputs, the status-flag is set (e.g. SF pin pulled to low). These failures are: – – – – – Under Voltage on VS Short circuit of OUT1 or OUT2 against VS or GND Short circuit between OUT1 and OUT2 Over-current Over-temperature SF is also pulled low when the outputs are disabled by EN or DIS. 2.4.1.2 Fault storage and reset – In case of under-Voltage, the failure is not latched. As soon as VS falls below the under-Voltage detection threshold, the output stage switches in tristate and the statusflag is set from high level to low-level. If the voltage has risen above the specified value again, the output stage switches on again and the status-flag is reset to high-level. The Under Voltage failure is shown at the SF pin for VS in the voltage range below the detection threshold (typical 4.2V) down to 2.5V. – In the SF-mode, all internal circuitry is supplied by the voltage on VS. For that reason, a loss of VS supply voltage leads to a reset of all stored information (Power-ONReset). This Power-ON-Reset occurs as soon as under-Voltage is detected on VS – In case of short circuit, over-current or over-temperature, the fault will be stored. The output stage remains in tristate and the status-flag at low-level until the error is reset by one of the following conditions: H -> L on DIS, L -> H on EN or Power-ON Reset. 2.4.2 2.4.2.1 SPI-Mode (DMS = 5V) SPI-Interface The serial SPI interface establishes a communication link between TLE 7209-2R and the systems microcontroller. The TLE 7209-2R always operates in slave mode whereas the controller provides the master function. The maximum baud rate is 2 MBaud (200pF on SDO). By applying an active slave select signal at CSN the TLE 7209-2R is selected by the SPI master. SDI is the data input (Slave In), SDO the data output (Slave Out). Via SCK (Serial Clock Input) the SPI clock is provided by the master. In case of inactive slave select signal (High) the data output SDO goes into tristate. Data Sheet 9 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description The first two bits of an instruction may be used to establish an extended deviceaddressing. This gives the opportunity to operate up to 4 Slave-devices sharing one common CSN signal from the Master-Unit (see Figure 7) DMS S P I p o w e rs u p p ly CSN SCK S P I - C o n t r o l: - > s t a t e m a c h in e - > c lo c k c o u n t e r - > in s t r u c t io n r e c o g n it io n s h if t - r e g is t e r 8 SDI SDO D IA _ R E G R eset 8 D ia g n o s t ic s DMS U n d e rv o lt a g e D IS OR EN Figure 6 2.4.2.2 SPI block-diagram Characteristics of the SPI Interface 1. When DMS is > 3.5V, the SPI is active, independently of the state of EN or DIS. During active reset conditions (DMS < 3.5V) the SPI is driven into its default state. When reset becomes inactive, the state machine enters into a wait-state for the next instruction. 2. If the slave select signal at CSN is inactive (high), the state machine is forced to enter the wait-state, i.e. the state machine waits for the following instruction. 3. During active (low) state of the select signal CSN the falling edge of the serial clock signal SCK will be used to latch the input data at SDI. Output data at SDO are driven with the rising edge of SCK (see timing diagram Figure 13) 4. Chip-address: In order to establish the option of extended addressing the uppermost two bits of the instruction-byte (i.e the first two SDI-bits of a Frame) are reserved to send a chipaddress. To avoid a bus conflict the output SDO must stay high impedance during the addressing phase of a frame (i.e. until the address-bits are recognized as valid chipaddress). If the chip-address does not match, the data at SDI will be ignored and SDO remains high impedance for the complete frame. See also Figure 7 5. Verification byte: Simultaneously to the receipt of an SPI instruction TLE 7209-2R transmits a verification byte via the output SDO to the controller. Refer to Figure 8. This byte indicates normal or abnormal operation of the SPI. It contains an initial bit pattern and a flag indicating an error occurred during the previous access. Data Sheet 10 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 6. Because only read access is used in the TLE 7209-2R, the SDI data-bits (2nd byte) are not used 7. Invalid instruction/access: An instruction is invalid if an unused instruction code is detected (see tables with SPI instructions). In case an unused instruction code occurred, the data byte “ffhex” (no error) will be transmitted after having sent the verification byte. This transmission takes place within the same SPI-frame that contained the unused instruction byte. In addition any transmission is invalid if the number of SPI clock pulses (falling edge) counted during active CSN differs from exactly 16 clock pulses. If an invalid instruction is detected, bit TRANS_F in the following verification byte (next SPI transmission) is set to HIGH. The TRANS_F bit must not be cleared before it has been sent to the microcontroller. 8. Transfer error bit TRANS_F: The bit TRANS_F indicates an error during the previous transfer. An error is considered to have occurred when an invalid command was sent, the number of SPI clock pulses (falling edge) counted during active CSN was less than or greater than 16 clock pulses, or SPI clock (SCK) was logical high during falling edge of CSN. Data Sheet 11 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description SDO remains tristated after CSN active Address sent by master is "00" Correct addres is recognized, data transmitted to SDO CSN SCK SDI SDO Z 7 7 6 6 5 5 5 4 4 4 3 3 3 2 2 2 1 1 1 0 0 0 7 7 7 6 6 6 5 5 5 4 4 4 3 3 3 2 2 2 1 1 1 0 0 0 SDO remains tristated after CSN active Address sent by master is differnt from "00" Correct addres is not recognized, SDO remains tristated and SDI data are ignored CSN SCK SDI SDO 7 7 6 6 5 5 4 4 3 3 2 2 1 1 Z 0 0 7 6 7 6 5 5 4 4 3 3 2 2 1 1 0 0 Figure 7 Bus-arbitration by chip-address Data Sheet 12 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.4.2.3 SPI-Communication The 16 input bits consist of the SPI-instruction byte and a second, unused byte. The 16 output bits consist of the verification-byte and the data-byte (see also Figure 8). The definition of these bytes is given in the subsequent sections. CSN SCK SDI SDO 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 MSB MSB SPI Instruction Verification byte LSB LSB MSB not used data-byte LSB Figure 8 2.4.2.4 SPI communication SPI instruction The uppermost 2 bit of the instruction byte contain the chip-address. The chip-address of the TLE 7209-2R is 00. During read-access, the output data according to the register requested in the instruction byte are applied to SDO within the same SPI frame. That means, the output data corresponding to an instruction byte sent during one SPI frame are transmitted to SDO during the same SPI frame. Table 3 MSB 7 0 Table 4 Bit 7,6 5-1 0 6 0 Name CPAD1,0 INSTR (4-0) INSW 5 INSTR4 4 INSTR3 3 INSTR2 2 INSTR1 1 INSTR0 0 INSW SPI Instruction Format SPI instruction Description Description Chip Address (has to be ‘0’, ‘0’) SPI instruction (encoding) Even parity Data Sheet 13 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description Table 5 SPI Instruction-Bytes Encoding Encoding bit 7,6 bit 5-1 CPAD1,0 INSTR(4-0) RD_IDENT RD_VERSION RD_DIA – – SPI Instruction Description Bit 0 INSW 0 1 1 x x read identifier read version read DIA_REG unused, TRANS_F is set to high, ff_hex is sent as data bit invalid address, SDO remains tristate during entire SPI frame 00 00 00 00 all others 00000 00001 00100 all others xxxxx 2.4.2.5 Table 6 MSB 7 Z Verification Byte Verification Byte Format 6 Z 5 1 4 0 3 1 2 0 1 1 0 TRANS_F Table 7 Bit 0 1 2 3 4 5 6 7 Verification Byte Description Name TRANS_F Description Bit = 1: error detected during previous transfer Bit = 0: previous transfer was recognized as valid Fixed to High Fixed to Low Fixed to High Fixed to Low Fixed to High send as high impedance send as high impedance The default value after power-up at DMS of the TRANS_F bit is L (previous transfer valid) Data Sheet 14 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.4.2.6 ) Data-byte: Diagnostics/Encoding of Failures (Register DIA_REG, SPI Instruction RD_DIA) DIA_REG Format 6 OT 5 CurrRed 4 CurrLim 3 DIA21 2 DIA20 1 DIA11 0 DIA10 Table 8 MSB 7 EN/DIS Table 9 Bit 0 1 2 3 4 5 6 7 DIA_REG Description Name DIA 10 DIA 11 DIA 20 DIA 21 CurrLim Description Diagnosis-Bit1 of OUT1 Diagnosis-Bit2 of OUT1 Diagnosis-Bit1 of OUT2 Diagnosis-Bit2 of OUT2 is set to „0“ in case of current limitation. latch behavior see below see below see below see below latched latched latched not latched Default value after reset is FFhex. Access by controller is read only CurrRed is set to „0“ in case of temperature dependent current limitation OT EN/DIS is set to „0“ in case of over-temperature is set to „0“ in case of EN = L or DIS = H EN H L H L DIS L L H H DIA_REG_7 1 0 0 0 Data Sheet 15 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description Table 10 Encoding of the Diagnostic Bits of OUT1 and OUT2 latch behavior latched DIA21 DIA20 DIA11 DIA10 Description 1 0 0 1 1 0 1 0 1 0 1 0 0 0 1 1 1 0 0 1 0 1 1 0 Short circuit over load (SCOL) Short circuit to battery on OUT1 (SCB1) latched Short circuit to ground on OUT1 (SCG1) latched No error detected on OUT1 Open load (OL) latched Short circuit to battery on OUT2 (SCB2) latched Short circuit to ground on OUT2 (SCG2) latched No error detected on OUT2 Under Voltage on Pin Vs not latched Failure Encoding in case of multiple faults If multiple faults are stored in the failure register, the faults that are encoded in the DIAxx bits can not be displayed simultaneously due to the encoding scheme that is used. In this case, errors are encoded according to the following priority list. – Priority 1: Under Voltage (please note that after removal of Under Voltage, the original error will be restored, see below) – Priority 2: Short circuit across the load – Priority 3: all other short circuits – Priority 4: open load If a failure of higher priority is detected, the failures of lower priority are no longer visible in the encoded SPI message. Fault storage and reset of the Diagnosis Register DIA_REG Register DIA_REG is reset upon the following conditions: – With the rising edge of the CSN-Signal after the SPI-instruction RD_DIA. This reset only takes place if the correct number of 16 SCK pulses has been counted. – When the voltage on DMS exceeds the threshold for detecting SPI-Mode (after Under Voltage condition). Under Voltage on Vs (typ. < 5,0V) sets Bit 0.... Bit 3 of DIA_REG to 0000. If Vs rises above the Under Voltage level, Bits of DIA_REG are restored (when DMS > 3.5V). – A rising edge on EN while DIS=0 or a falling edge on DIS while EN=1 re-activates the output power-stages, and resets the DIA_REG register. Data Sheet 16 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.4.2.7 Data-byte: Device Identifier and Version (SPI instructions RD_IDENT and RD_VERSION) The IC‘s identifier (device ID) and version number are used for production test purposes and features plug & play functionality depending on the systems software release. The two numbers are read-only accessible via the SPI instructions RD_IDENT and RD_VERSION as described in Section 2.4.2.4. The device ID is defined to allow identification of different IC-Types by software and is fixed for the TLE 7209-2R. The Version number may be utilized to distinguish different states of hardware and is updated with each redesign of the TLE 7209-2R. The contents is divided into an upper 4 bit field reserved to define revisions (SWR) corresponding to specific software releases and a lower 4 bit field utilized to identify the actual mask set revision (MSR). Both (SWR and MSR) will start with 0000b and are increased by 1 every time an according modification of the hardware is introduced. Reading the IC Identifier (SPI Instruction: RD_IDENT): Table 11 MSB 7 ID7 Table 12 Bit 7...0 6 ID6 5 ID5 4 ID4 3 ID3 2 ID2 1 ID1 0 ID0 Device Identifier Format Device Identifier Description Name device-ID(7...0) Description ID-No.: 10100010 Reading the IC version number (SPI Instruction: RD_VERSION): Table 13 MSB 7 SWR3 Table 14 Bit 7...4 3...0 Data Sheet IC version number Format 6 SWR2 5 SWR1 4 SWR0 3 MSR3 2 MSR2 1 MSR1 0 MSR0 IC version number Description Name SWR(3...0) MSR(3...0) Description This register is set to 0 Version corresponding to Mask set 17 Rev. 1.4, 2007-04-05 TLE 7209-2R Circuit Description 2.4.2.8 Open-Load Diagnosis Open-load diagnostic in OFF-state is only possible in the SPI-mode (DMS = 5 V) if the device is Disabled (EN = L or DIS = H). The detection mechanism is depicted in Figure 9. The according diagnostic information can be read out via the SPI diagnostic register. The resulting overall diagnostic truth-table is shown as Table 15 VS DMS VS 1.5mA + DIS OR EN AND OUT1 OUT2 1V + 1V 1mA 1 to diagnostic register AND Figure 9 Table 15 Functional block diagram of open-load detection Diagnosis Truth Table for open load detection OUT1 OUT2 Output stage inactive, EN = low or DIS = high, DMS > 4.5 V Load available Open Load H H H L L L L H OL detected OL not detected – double Fault OL detected OL detected OL not detected – double Fault SC -> GND on OUT1 and Open Load L SC -> GND on OUT2 and Open Load H SC -> VS on OUT1 and Open Load SC -> VS on OUT2 and Open Load H H Data Sheet 18 Rev. 1.4, 2007-04-05 TLE 7209-2R Electrical Characteristics 3 3.1 Pos. 3.1.1 3.1.2 3.1.3 3.1.4 Electrical Characteristics Absolute Maximum Ratings Parameter Sym- Limit Values Unit Test Conditions bol min. max. -40 – Storage temperature Ts Ambient temperature Ta Supply voltage -55 -40 -1 -2 +150 +175 +125 +125 40 40 °C °C °C °C V V – dynamic: t < 1 s – – static destruction proof dynamic destruction proof t < 0.5 s (single pulse, Tj < 85 °C) In status-flag-mode, SF pull-up R ≥ 10 kΩ Junction temperature Tj VS 3.1.5 Voltage at logic inputs IN1, IN2, DIS, EN, SDI, SCK/SF V -0.5 18 V 3.1.6 3.1.7 3.1.8 3.1.9 Voltage at logic input V CSN -0.5 40 18 V V – – - Voltage at logic input VDMS -0.5 DMS Voltage at logic output SDO Voltage at VsCP V VCP -0.5 0.5 VS - 0.5 – – VDMS V +0.5 VS + V 3.1.10 ESD voltage human 3.1.11 body model (MIL STD 883D / ANSI EOS\ESD S5.1) VESD – VESD-- – OUT 4kV all pins 8kV only pins 6, 7, 14 and 15 (outputs) Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. Data Sheet 19 Rev. 1.4, 2007-04-05 TLE 7209-2R Electrical Characteristics 3.2 Pos. 3.2.1 3.2.2 3.2.3 Operating Range Parameter Supply Voltage DMS Supply Voltage PWM frequency Symbol VS VDMS f Limit Values min. 5 3.5 – max. 28 5.5 30 V V kHz Device in SPI-mode May be limited to lower values in the application due to switching losses or duty cycle requirements Unit Remark 3.2.4 Junction Temperature TJ -40 150 °C Note: In the operating range, the circuit functionality as described in the circuit description is fulfilled. 3.3 3.3.1 3.3.2 Thermal Resistance Junction-case Junction-ambient RthJC RthJA – – 1.5 50 K/W K/W specified by design minimal footprint 3.4 Pos. Electrical Characteristics Parameter Symbol Limit Values min. typ. max. Unit Test Conditions 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Power Supply 3.4.1 Under voltage at VS VUV OFF VUV ON VUV HY 3.4.2 Supply current 3.4 3.6 100 – – 4.2 4.4 – – – 5 5.2 1000 30 20 mV mA mA V Switch off threshold Switch on threshold Hysteresis IUB f = 20 kHz, IOUT = 0 A f = 0 Hz, IOUT = 0 A Data Sheet 20 Rev. 1.4, 2007-04-05 TLE 7209-2R Electrical Characteristics 3.4 Pos. Electrical Characteristics (cont’d) Parameter Symbol Limit Values min. typ. max. Unit Test Conditions 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Logic Inputs IN1, IN2, DIS, EN 3.4.3 3.4.4 3.4.5 3.4.6 3.4.7 Input “high” Input “low” Input hysteresis pull-up current IN1, IN2, DIS pull-down current EN VIH VIL VIHY IIL IIH 2 – 0.1 -200 – – – – -125 – – 1 0.6 – 100 V V V µA µA – – – U≤1V U≥2V Power Outputs OUT1, OUT2 3.4.8 3.4.9 Switch on resistance Switch-off current – – 5.5 1.4 3.4.10 3.4.11 3.4.12 3.4.13 3.4.14 3.4.15 Switch-off time Blanking time Switch-off Tracking Short circuit detection current Current Tracking Reactivation time after internal shut-down – 6.6 2.5 16 13 – – 3.5 – 300 7.7 3.6 26 19 – 18 – 200 mΩ A A µs µs – A A µs ROUT-UB, ROUT-GND VS > 5 V, IOUT = 3 A -40 °C < Tj < TILR |IL| Tj = TSD; specified by design Vs=13.2 V, L=2.2 mH, R=0.23 Ω Vs=13.2 V, L=2.2 mH, R=0.23 Ω Vs=13.2 V, L=2.2 mH, R=0.23 Ω – specified by design Over-current- or overtemperature shutdown to reactivation of the output stage ta tb ta/tb 8 8 1.0 8 2 – |IOUK| |IOUK||IL| t Note: Reactivation time is not subject to production test; specified by design Data Sheet 21 Rev. 1.4, 2007-04-05 TLE 7209-2R Electrical Characteristics 3.4 Pos. 3.4.16 3.4.17 3.4.18 Electrical Characteristics (cont’d) Parameter Leakage current Free-wheel diode forward voltage Free-wheel diode reverse recovery time Symbol – – – – Limit Values min. typ. – – – max. 200 2 100 µA V ns Output stage switched off Unit Test Conditions 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified UD trr IOUT = 3 A Reverse recovery time is not subject to production test; specified by design Output Status-flag, Open Drain Output DMS < 0.8 V 3.4.19 3.4.20 Output “high” (SF not set) Output “low” (SF set) ISF ISF – 300 100 – – – 20 – – µA µA µA VSF = 5 V VSF = 1 V VSF = 0.5 V Timing 3.4.21 Output ON-delay tdon – – 6 µs IN1 --> OUT1 resp. IN2 --> OUT2, IOUT = 3A IN1 --> OUT1 resp. IN2 --> OUT2, IOUT = 3A OUT1H --> OUT1L, OUT2H --> OUT2L, IOUT = 3 A OUT1L --> OUT1H, OUT2L --> OUT2H DIS --> OUTn, EN --> OUTn 3.4.22 Output OFF-delay tdoff – – 6 µs 3.4.23 Output switching time tr, tf – – 5 µs 3.4.24 3.4.25 3.4.26 3.4.27 Disable delay time Power on delay time Delay time for fault detection Minimum pulse width tddis – – – 1.0 – – – 2 1.6 2 1 – 2.2 µs ms µs µs VS = on --> output stage active; no load tdf tden specified by design EN/DIS-->Reset DIA_REG Rev. 1.4, 2007-04-05 Data Sheet 22 TLE 7209-2R Electrical Characteristics 3.4 Pos. Electrical Characteristics (cont’d) Parameter Symbol Limit Values min. typ. max. Unit Test Conditions 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Input SCK, SPI Clock Input 3.4.28 3.4.29 3.4.30 3.4.31 3.4.32 Low Level High Level Hysteresis Input Capacity Input Current USCKL USCKH ∆USCK – 2 0.1 – – – – – – 20 1 – 0.4 20 50 V V V pF µA – – – – Pull-up current source connected to VCC CSCK -ISCK Input CSN, Chip Select Signal 3.4.33 3.4.34 3.4.35 3.4.36 3.4.37 Low Level High Level Hysteresis Input Capacity Input Current UCSNL UCSNH ∆UCSN – 2 0.1 – – – – – – 20 1 – 0.4 20 50 V V V pF µA TLE 7209-2R is selected – – – Pull up current source connected to VCC CCSN -ICSN Input SDI, SPI Data Input 3.4.38 3.4.39 3.4.40 3.4.41 3.4.42 Low Level High Level Hysteresis Input Capacity Input Current USDIL USDIH ∆USDI – 2 0.1 – – – – – – 20 1 – 0.4 20 50 V V V pF µA – – – – Pull up current source connected to VCC CSDI -ISDI Data Sheet 23 Rev. 1.4, 2007-04-05 TLE 7209-2R Electrical Characteristics 3.4 Pos. Electrical Characteristics (cont’d) Parameter Symbol Limit Values min. typ. max. Unit Test Conditions 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Output SDO Tristate Output of the TLE 7209-2R (SPI output); 3.4.43 3.4.44 3.4.45 3.4.46 Low Level High Level Capacity Leakage Current VSDOL VSDOH CSDO ISDO – - 0.75 – -10 – 0.4 – 30 10 V V pF µA ISDO = 2 mA ISDO = -2 mA Capacity of the pin in tristate In tristate VDMS – – – Note: All in- and output pin capacities are not subject to production test; specified by design Input DMS Supply-Input for the SPI-Interface and Selection Pin for SPI- or SF-Mode 3.4.47 3.4.48 Input Voltage Input Current VDMS VDMS IDMS 3.5 – – – – – – 0.8 10 V V mA SPI-Mode Status-Flag-Mode SPI-Mode Open-Load Diagnosis 3.4.49 Diagnostic Threshold VOUT1 VOUT2 0.8 0.8 1000 – – 1500 2.0 2.0 2000 V V µA DMS > 4.5 V, EN < 0.8 V or DIS > 4.5 V; no load 3.4.50 Pull-up Current -IOUT1 VOUT1=0 V, DMS > 4.5 V, EN < 0.8 V or DIS > 4.5 V; no load DMS > 4.5 V, EN < 0.8 V or DIS > 4.5 V; no load 3.4.51 Pull-down Current IOUT2 700 1000 1400 µA VOUT2=5 V, 3.4.52 3.4.53 Tracking Diag. C Delay Time – 1.2 30 1.5 – 1.7 100 – ms IOUT1/IOUT2 – tD Note: Open Load is detected if VOUT1 > 2 V AND VOUT2 < 0.8 V (refer to fig. 9). Data Sheet 24 Rev. 1.4, 2007-04-05 TLE 7209-2R Electrical Characteristics 3.4 Pos. Electrical Characteristics (cont’d) Parameter Symbol Limit Values min. typ. max. Unit Test Conditions 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified SPI Timing (see Figure 13) 3.4.54 3.4.55 3.4.56 3.4.57 Cycle-Time (1) Enable Lead Time Enable Lag Time Data Valid tcyc (1) tlead (2) tlag (3) tv (4) 200 100 150 – – – – – – – – – – 40 150 ns ns ns ns ns referred to master referred to master referred to master referred to TLE 72092R 3.4.58 3.4.59 3.4.60 Data Setup Time Data Hold Time Disable Time CL = 40 pF CL = 200 pF tsu (5) th (6) tdis (7) 50 20 – – – – – – 100 ns ns ns referred to master referred to master referred to TLE 72092R; specified by design referred to master referred to master referred to master – 3.4.61 3.4.62 3.4.63 3.4.64 Transfer Delay Select time Access time Clock inactive before chip select becomes valid Clock inactive after chip select becomes invalid tdt (8) tCSN (9) tacc (10) (11) 150 50 8.35 200 – – – – – – – – ns ns µs ns 3.4.65 (12) 200 – – ns – Temperature Thresholds 3.4.66 3.4.67 Start of current limit reduction Thermal Shut-down TILR TSD 150 175 165 – – – °C °C Note: Temperature thresholds are not subject to production test; specified by design Data Sheet 25 Rev. 1.4, 2007-04-05 TLE 7209-2R Timing Diagrams 4 Timing Diagrams V 5 INx 50% 0 50% 80% OUTx 20% tdon tdoff Figure 10 Output Delay Time--Depicted for Low-Side FETs V 5 DIS / EN 50% 0 OUTx 20% Z tddis Figure 11 Disable Delay Time Data Sheet 26 Rev. 1.4, 2007-04-05 TLE 7209-2R Timing Diagrams tRISE tFALL 80% 80% OUTx 20% 20% Figure 12 Output Switching Time 10 9 CSN 11 2 1 3 8 SCK 12 4 7 SDO tristate Bit (n-3) Bit (n-4)...1 Bit 0; LSB 5 SDI 6 MSB IN Bit (n-2) Bit (n-3) Bit (n-4)...1 LSB IN n = 16 Figure 13 SPI-timing Data Sheet 27 Rev. 1.4, 2007-04-05 TLE 7209-2R Application 5 Application Vs < 40V 100µF 100nF DMS 100nF Vcc IN1 IN2 DIS µC CSN SDI SDO SCK/SF VSCP VS V-Reg OUT 1 OUT 2 M from Watchdog or fail-safe Controller EN GND Figure 14 Application Example with SPI-Interface Vs < 40V 100µF 100nF DMS VSCP VS Vcc V-Reg IN1 IN2 DIS µC 47k CSN SDI SDO SCK/SF OUT 2 OUT 1 M from Watchdog or fail-safe Controller EN GND Figure 15 Data Sheet Application Example with Status-Flag 28 Rev. 1.4, 2007-04-05 TLE 7209-2R Application Reverse polarity protection via main relay VS 100µF 100nF TLE 7209-2R ignition switch battery Figure 16 Application Examples for Over-Voltage- and Reverse-Voltage Protection Data Sheet Vs < 40V main relay 29 Rev. 1.4, 2007-04-05 TLE 7209-2R Package Outlines 6 Package Outlines PG-DSO-20-37 (Plastic Dual Small Outline Package) 11 ±0.15 1) 3.5 MAX. 0 +0.1 3.25 ±0.1 B 0.25 +0.07 -0.02 1.2 -0.3 2.8 1.27 15.74 ±0.1 (Heatslug) 0.25 M A 20x 1.3 6.3 (Mold) 14.2 ±0.3 11 20 0.1 Heatslug 0.95 ±0.15 0.25 B 0.4 +0.13 20 11 Index Marking Heatslug 1 x 45˚ 1 10 10 13.7 -0.2 (Metal) 1 15.9 ±0.15 1) (Mold) 1) A 3.2 ±0.1 (Metal) 5.9 ±0.1 (Metal) 5˚ ±3˚ Does not include plastic or metal protrusion of 0.15 max. per side Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 30 Dimensions in mm Rev. 1.4, 2007-04-05 GPS05791 TLE 7209-2R Package Outlines 7 Rev. 1.3 1.4 Revision History Date 2005-01-11 2007-04-05 Changes non RoHS compliant version of the TLE7209-2R RoHS compliant version of the TLE7209-2R RoHS Logo and references added Package changed to PG-DSO-20-37 Pos. 3.1.7, VDMS max. changed from 13V to 18V Data Sheet 31 Rev. 1.4, 2007-04-05 Edition 2007-04-05 Published by Infineon Technologies AG 81726 Munich, Germany © 2007 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.