TLE7276
Low Drop Linear Voltage Regulator 5V Fixed Output Voltage
Data Sheet
Rev. 1.11, 2010-11-22
Automotive Power
5-V Low Drop Voltage Regulator
TLE 7276
Features • • • • • • • Output voltage 5 V ±2% Ultra low current consumption: typ. 20 μA 300 mA current capability Inhibit input Very low-drop voltage Short-circuit-proof Suitable for use in automotive electronics
Functional Description The TLE 7276 is a monolithic integrated low-drop voltage regulator for load currents up to 300 mA. An input voltage up to 42 V is regulated to VQ,nom = 5.0 V with a precision of ±2%. The sophisticated design allows to achieve stable operation even with ceramic output capacitors down to 470 nF. The device is designed for the harsh environment of automotive applications. Therefore it is protected against overload, short circuit and overtemperature conditions. Of course the TLE 7276 can be used also in all other applications, where a stabilized 5 V voltage is required. Due to its ultra low stand-by current consumption of typ. 20 μA the TLE 7276 is dedicated for use in applications permanently connected to VBAT. The regulator can be shut down via an Inhibit input. An integrated output sink current circuitry keeps the voltage at the Output pin Q below 5.5 V even when reverse currents are applied. Thus connected devices are protected from overvoltage damage. For applications requiring extremely low noise levels the Infineon voltage regulator family TLE 42XY and TLE 44XY is more suited than the TLE 7276. A mV-range output noise on the TLE 7276 caused by the charge pump operation is unavoidable due to the ultra low quiescent current concept.
Type TLE 7276 D TLE 7276 G
Data Sheet
Ordering Code
Package P-TO252-5-1,P-TO252-5-11 P-TO263-5-1
Rev. 1.11, 2010-11-22
Q67006-A9733 Q67006-A9732
2
TLE 7276
I
1
TLE 7276
5
Q
Overtemperature Shutdown Bandgap Reference
1
INH
2
Inhibit
Charge Pump
3, Tab GND
AEB03609.VSD
Figure 1
Block Diagram
Data Sheet
3
Rev. 1.11, 2010-11-22
TLE 7276
GND
1 I Q
5
1 I GND Q INH N.C.
5
INH N.C.
PG-TO252 -5-1 .vsd
PG-TO263-5-1.vsd
Figure 2 Table 1 Pin No. 1 2 3 4 5 I INH
Pin Configuration P-TO252-5 (D-PAK), P-TO263-5 (D2-PAK)(top view) Pin Definitions and Functions Symbol Function Input; block to ground directly at the IC with a ceramic capacitor Inhibit Input; low level disables the IC. Integrated pull-down resistor Ground; internally connected to heat sink Not connected Output; block to ground with a ceramic capacitor, C ≥ 470 nF
GND N.C. Q
Data Sheet
4
Rev. 1.11, 2010-11-22
TLE 7276
Table 2 Parameter Input I Voltage Current Inhibit INH Voltage Current Output Q Voltage Voltage Current Temperature
Absolute Maximum Ratings Symbol Limit Values Min. Max. 45 – 45 1 5.5 6.2 – 150 150 V mA V mA V V mA °C °C – – Observe current limit IINH,max1) – – Unit Test Condition
VI II VINH IINH VQ VQ IQ Tj Tstg
-0.3 -1 -0.3 -1 -0.3 -0.3 -1 -40 -50
t < 10 s2)
– – –
Junction temperature Storage temperature
1) External resistor required to keep current below absolute maximum rating when voltages ≥ 5.5 V are applied. 2) Exposure to these absolute maximum ratings for extended periods (t > 10 s) may affect device reliability.
Note: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3 Parameter Input voltage Junction temperature Operating Range Symbol Limit Values Min. Max. 42 150 V °C – – 5.5 -40 Unit Remarks
VI Tj
Data Sheet
5
Rev. 1.11, 2010-11-22
TLE 7276
Table 4 Parameter Junction case
Thermal Resistance Symbol Limit Values Min. Max. 8 80 55 K/W K/W K/W – TO2521) – – – Unit Remarks
Junction ambient Junction ambient
1) area 300 mm2
TO2632) Worst case, regarding peak temperature; zero airflow; mounted on a PCB FR4, 80 × 80 × 1.5 mm3, heat sink × 80 × 1.5 mm3, heat sink
Rthj-c Rthj-a Rthj-a
2) Worst case, regarding peak temperature; zero airflow; mounted on a PCB FR4, 80 area 300 mm2
Note: In the operating range, the functions given in the circuit description are fulfilled.
Data Sheet
6
Rev. 1.11, 2010-11-22
TLE 7276
Table 5 Parameter Output Q
Electrical Characteristics Symbol Limit Values Min. Typ. Max. 5.0 5.0 – – 20 – 5 250 15 5 60 0.5 – – – 3 0.5 5.1 5.1 – 800 30 40 9 500 40 20 – – – – 0.8 4 1 V V mA mA μA μA μA mV mV mV dB 0.1 mA < IQ < 300 mA; 6 V < VI < 16 V 0.1 mA < IQ < 100 mA; 6 V < VI < 40 V
1)
VI = 13.5 V; VINH = 5 V; -40 °C < Tj < 150 °C (unless otherwise specified)
Unit Measuring Condition
Output voltage Output voltage
VQ VQ
4.9 4.9 320 – – – – – -40 -20 – – 470 3.1 – – –
Output current limitation IQ Output current limitation IQ Current consumption;
Iq = II - IQ
Current consumption; Iq = II - IQ Quiescent current; inhibited Drop voltage Load regulation Line regulation Power supply ripple rejection Temperature output voltage drift Output Capacitor Inhibit Input INH Turn-on Voltage Turn-off Voltage H-input current L-input current
Iq Iq Iq Vdr
ΔVQ, lo ΔVQ, li
PSRR
dVQ/dT
VQ = 0V IQ = 0.1 mA; Tj = 25 °C IQ = 0.1 mA; Tj ≤ 80 °C VINH = 0 V; Tj < 80 °C IQ = 200 mA; Vdr = VI - VQ1) IQ = 5 mA to 250 mA Vl = 10V to 32 V; IQ = 5 mA fr = 100 Hz; Vr = 0.5 Vpp
mV/K – nF V V μA μA ESR < 3 Ohm VQ ≥ 4.9 V VQ ≤ 0.3 V
CQ VINH ON VINH OFF IINH ON IINH OFF
VINH = 5 V VINH = 0 V; Tj < 80 °C
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
Data Sheet
7
Rev. 1.11, 2010-11-22
TLE 7276
Application Information
VBat
100 nF
TLE 7276 1I Q5 470 nF + 4.7 µF
VC C
Overtemperature Shutdown Bandgap Reference
1
e. g. Ignition
2 INH
Inhibit
Charge Pump GND 3, Tab
AEA03608.VSD
Figure 3 Input, Output
Application Diagram
An input capacitor is necessary for damping line influences. A resistor of approx. 1 Ω in series with CI, can damp the LC of the input inductivity and the input capacitor. In contrast to most low drop voltage regulators the TLE 7276 only needs moderate capacitance at the output to assure stability of the regulation loop. This offers more design flexibility to the circuit designer providing for cost efficient solutions. The TLE 7276 requires a ceramic output capacitor of at least 470 nF. In order to damp influences resulting from load current surges it is recommended to add an additional electrolytic capacitor of 4.7 μF to 47 μF at the output as shown in Figure 3.
Data Sheet
8
Rev. 1.11, 2010-11-22
TLE 7276
Additionally a buffer capacitor CB of > 10μF should be used for the output to suppress influences from load surges to the voltage levels. This one can either be an aluminum electrolytic capacitor or a tantalum capacitor following the application requirements. A general recommendation is to keep the drop over the equivalent serial resistor (ESR) together with the discharge of the blocking capacitor below the allowed Headroom of the Application to be supplied (e.g. typ. dVQ = 350mV).
Since the regulator output current roughly rises linearly with time the discharge of the capacitor can be calculated as follows: dVCB = dIQ*dt/CB The drop across the ESR calculates as: dVESR = dI*ESR To prevent a reset the following relationship must be fullfilled: dVC + dVESR < VRH = 350mV Example: Assuming a load current change of dIQ = 100mA, a blocking capacitor of CB = 22µF and a typical regulator reaction time under normal operating conditions of dt ~ 25µs and for special dynamic load conditions, such as load step from very low base load, a reaction time of dt ~ 75µs. dVC = dIQ*dt/CB = 100mA * 25µs/22µF = 113mV So for the ESR we can allow dVESR = VRH2 - dVC = 350mV - 113mV = 236mV The permissible ESR becomes: ESR = dVESR / dIQ = 236mV/100mA = 2.36Ohm During design-in of the TLE7469 product family, special care needs to be taken with regards to the regulators reaction time to sudden load current changes starting from very low pre-load as well as cyclic load changes. The application note “TLE7x Voltage Regulators - Application Note about Transient Response at ultra low quiescent current Voltage Regulators” (see 3_cip05405.pdf) gives important hints for successful design-in of the Voltage Regulators of the TLE7x family.
Data Sheet
9
Rev. 1.11, 2010-11-22
TLE 7276
Typical Performance Characteristics Current Consumption Iq versus Junction Temperature Tj
1_Iq-Tj.vsd
Current Consumption Iq versus Input Voltage VI
3_IQ-VI.VSD
Iq [µA] VI = 13.5V
100
Iq [µA]
Tj = 25°C
IQ = 100 µA
10
40 IQ = 50mA 30 IQ = 10mA IQ = 0.2mA 20
1
10
0.01 -40 -20
0
20 40 60 80 100 120 140
0
10
20
30
40
Tj [°C]
VI [V]
Current Consumption Iq versus Output Current IQ
30
2_IQ-IQ.VSD
Output Voltage VQ versus Junction Temperature Tj
5A_VQ-TJ.VSD
Iq [µA] Tj = 25 °C
20
VI = 13.5 V
VQ [V]
VI = 13.5 V
Tj = -40 °C
5.05
15
5.00
IQ =100µA...100mA
10
4.95
5
4.90
0
20
40
60
100
-40 -20
0
20 40 60 80 100 120 140
IQ [mA]
Tj [°C]
Data Sheet
10
Rev. 1.11, 2010-11-22
TLE 7276
Dropout Voltage Vdr versus Output Current IQ
600
6_VDR-IQ.VSD
Maximum Output Current IQ versus Junction Temperature Tj
620
8_IQMAX-TJ.VSD
Vdr [mV] Tj = 150 °C
400
IQ [mA]
VI = 13.5 V
580
300
Tj = 25 °C
560
200
Tj = -40 °C
540
100
520
0
100
200
300
500 -40 -20
0
20 40 60 80 100 120 140
IQ [mA]
Tj [°C]
Dropout Voltage Vdr versus Junction Temperature Tj
600
7_VDR-TJ.VSD
Maximum Output Current IQ versus Input Voltage VI
600
9_SOA.VSD
Vdr [mV]
IQ [mA]
Tj = 125 °C Tj = 25 °C
IQlim
400
IQ = 250 mA
400
300
IQ = 150mA
300
200
200
Pvmax = 1,18W for TO252 @ 300mm2 cooling area
100
100
IQ = 10 mA
-40 -20 0 20 40 60 80 100 120 140
0 10 20 30 40
Tj [°C]
VI [V]
Data Sheet
11
Rev. 1.11, 2010-11-22
TLE 7276
Region of Stability
100
12_ESR-IQ.VSD
Output Voltage VQ Start-up behaviour
14_VItime_startup.vsd
ESRCQ
[Ω]
CQ = 10nF ...10 µF Tj = 25 °C
VQ [V] INH = ON
5.05
10
IQ = 5mA
1 Stable Region 0.1
5.00
4.90
4.80
0.01
0
50
100
150
200
1
2
3
4
5
IQ [mA]
t [ms]
Power Supply Ripple Rejection PSRR versus Frequency f
80
13_PSRR.VSD
Load Regulation dVQ versus Output Current Change dIQ
0
18a_dVQ-dIQ_Vi6V.vsd
PSRR
[dB]
ΔVQ
[mV]
VI = 6V
60
IQ = 30 mA IQ = 100 mA
IQ = 0.1 mA
-10
Tj = -40 °C
50
-15
Tj = 25 °C
-20
40
30
VRIPPLE = 1 V VIN = 13.5 V CQ = 10 µF Tantalum Tj = 25 °C
100 1k 10k 100k
-25
Tj = 150 °C
10
-30
0
50
100
150
250
f [Hz]
IQ [mA]
Data Sheet
12
Rev. 1.11, 2010-11-22
TLE 7276
Load Regulation dVQ versus Output Current Change dIQ
0
18b_dVQ-dIQ_Vi135V.vsd
Line Regulation dVQ versus Input Voltage ChangedVI
0
19_dVQ-dVI__150C.vsd
ΔVQ
[mV]
VI = 13.5V
ΔVQ
[mV]
IQ = 1mA
IQ = 10mA
Tj =150 °C IQ = 100mA
-10
-2
-15
Tj = -40 °C Tj = 25 °C
-3
-20
-4
IQ = 200mA
-25 -5
Tj = 150 °C
-30 0 50 100 150 250 -6 0 5 10 15 20 25 30 35 40 45
IQ [mA]
VI [V]
Load Regulation dVQ versus Output Current Change dIQ
0
18c_dVQ-dIQ_Vi28V.vsd
Line Regulation dVQ versus Input Voltage ChangedVI
0
19_dVQ-dVI_25C.vsd
ΔVQ
[mV]
V I = 28
ΔVQ
[mV]
Tj = 25 °C
-10
-2
IQ = 1mA
IQ = 10mA
IQ = 200mA
-15
IQ = 100mA
-3
-20
Tj = -40 °C Tj = 25 °C
-4
-25
-5
Tj = 150 °C
-30 0 50 100 150 250
-6
0
5
10 15 20 25 30 35 40 45
IQ [mA]
VI [V]
Data Sheet
13
Rev. 1.11, 2010-11-22
TLE 7276
Line Regulation dVQ versus Input Voltage ChangedVI
0
19_dVQ-dVI_-40C.vsd
Load Transient Response Peak Voltage dVQ
20_Load Trancient vs time 125.vsd
ΔVQ
[mV]
Tj =40 °C
IQ1:100mA
-2
Tj=125°C Vi=13.5V
IQ = 1mA
IQ = 10mA IQ = 100mA
-3
IQ = 200mA
-4
VQ
-5
-6
0
5
10 15 20 25 30 35 40 45
T=40µs/DIV
VQ=100mV/DIV
VI [V]
Load Transient Response Peak Voltage dVQ
20_Load Trancient vs time 25.vsd
Line Transient Response Peak Voltage dVQ
21_Line Trancient vs time 25.vsd
IQ1:100mA
Tj=25°C Vi=13.5V
dVI 2V
Tj=25°C Vi=13.5V
VQ VQ
T=40µs/DIV
VQ=100mV/DIV
T=400µs/DIV
VQ=50mV/DIV
Data Sheet
14
Rev. 1.11, 2010-11-22
TLE 7276
Line Transient Response Peak Voltage dVQ
21_Line Trancient vs time 125.vsd
Inhibit Input Current IINH versus Input Voltage VI, INH=Off
25_IINH vs VIN INH_off.vsd
dVI 2V
Tj=125°C Vi=13.5V
[µA] 1.0
IINH
INH = OFF
0.8
Tj = 150°C Tj = 25°C Tj = -40°C
0.6
VQ
0.4
0.2
T=400µs/DIV
VQ=50mV/DIV
10
20
30
40
VIN [V]
Inhibit Input Current IINH versus Inhibit Input Voltage VINH
24_IINH vs VINH.vsd
Thermal Resistance Junction-Ambient RTHJA versus Power Dissipation PV
75
32_RTH VS PV TO252.VSD
[µA] 50
IINH
Tj = 150°C
RTH-JA
[K/W]
A = 300mm2
Cooling Area single sided PCB
Tj = 25°C
40 65
TO252-3
Tj = -40°C
30 60
TO252-5
20 55
10
50
10
20
30
40
3
6
9
12
VINH [V]
PV [W]
Data Sheet
15
Rev. 1.11, 2010-11-22
TLE 7276
Package Outlines
6.5 +0.15 -0.10
2.3 +0.05 -0.10 B A 1 ±0.1 0...0.15 0.9 +0.08 -0.04
1 ±0.1
5.4 ±0.1
9.9 ±0.5 6.22 -0.2
0.8 ±0.15
(4.17)
0.15 max per side
0.51 min
5x0.6 ±0.1 1.14
0.5 +0.08 -0.04 0.1
4.56
0.25
M
AB
GPT09161
All metal surfaces tin plated, except area of cut.
Figure 4
P-TO252-5-1 (Plastic Transistor Single Outline)
Data Sheet
16
Rev. 1.11, 2010-11-22
TLE 7276
6.5 +0.15 -0.05 5.7 MAX.
(4.24) 1 ±0.1
1)
A B
0.8 ±0.15
2.3 +0.05 -0.10 0.5 +0.08 -0.04
(5)
9.98 ±0.5 6.22 -0.2
0.9 +0.20 -0.01 0...0.15
0.51 MIN.
0.15 MAX. per side
5 x 0.6 ±0.1 1.14
0.5 +0.08 -0.04 0.1 B
4.56
0.25 M A B
1) Includes mold flashes on each side. All metal surfaces tin plated, except area of cut.
Figure 5
P-TO252-5-11 (Plastic Transistor Single Outline)
5.8
10.6 6.4
0.8 5.36
Figure 6
Foot Print for P-TO-252-5-1 and P-TO-252-5-11 (Plastic Transistor Single Outline)
Data Sheet
17
2.2
Rev. 1.11, 2010-11-22
TLE 7276
4.4 10 ±0.2 0...0.3 8.5 1) A 1.27 ±0.1 B 0.05
1±0.3
(15)
9.25 ±0.2
7.55 1)
2.4 0.1
0...0.15 5 x 0.8 ±0.1 4 x 1.7 0.25
M
4.7 ±0.5
2.7 ±0.3
0.5 ±0.1
8˚ MAX.
AB
0.1 B
1) Typical Metal surface min. X = 7.25, Y = 6.9 All metal surfaces tin plated, except area of cut.
GPT09113
Figure 7
P-TO263-5-1 (Plastic Transistor Single Outline)
10.8
16.15 4.6
9.4
0.6 1.1 7.9
Figure 8
Foot Print for P-TO263-5-1 (Plastic Transistor Single Outline)
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 18
Dimensions in mm Rev. 1.11, 2010-11-22
TLE 7276
Remarks TLE 7276 D 5-V Low Drop Voltage Regulator Revision History: 2010-11-22 Previous Version: Page 4 all 1.1 Subjects (major changes since last revision) Pin configuration: Typo corrected (No change of product, process or test) New Infineon-Layout and Cover added
Rev. 1.11
Data Sheet
19
Rev. 1.11, 2010-11-22
Edition 2010-11-22 Published by Infineon Technologies AG 81726 Munich, Germany
© 2010 Infineon Technologies AG
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Information
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Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.