TLE7810G

Data Sheet, Rev. 3.01, April 2008 TLE7810G Integrated double low-side switch, high-side/LED driver, hall supply, wake-up inputs and LIN communication with embedded MCU (16kB Flash) Automotive Power TLE7810G Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1 2 3 4 4.1 4.2 4.3 4.4 4.5 4.5.1 4.5.2 4.5.3 5 6 6.1 6.1.1 6.2 6.2.1 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 18.1 18.2 18.3 18.4 18.5 19 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBC Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBC Active Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBC Active Mode “LIN Sleep” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LIN Receive-Only Mode (“LIN RxD-Only”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBC Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBC Stop Mode with Cyclic Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADC Measurement Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Measurement Calibration Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Measurement Calibration Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 11 12 12 13 13 14 15 17 17 17 18 18 LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Low Dropout Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI (Serial Peripheral Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Reset Behavior and Window Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling . . . . . . . . . . . . . . . . . . 27 Low Side Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Supply Output for Hall Sensor Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 High-Side Switch as LED Driver (HS-LED) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 General Purpose I/Os (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Error Interconnect (ERR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hints for Unused Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Program Mode via LIN-Fast-Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 34 35 35 36 49 49 49 50 50 50 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Data Sheet 2 Rev. 3.01, 2008-04-15 TLE7810G Table of Contents 20 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Data Sheet 3 Rev. 3.01, 2008-04-15 Integrated double low-side switch, high-side/LED driver, hall supply, wake-up inputs and LIN communication with embedded MCU (16kB Flash) TLE7810G 1 • • • • • • • • • • Overview Low-Dropout Voltage Regulator (LDO) LIN Transceiver Standard 16-bit SPI-Interface 2 × Low-Side Switches, e.g. as Relay Driver 2 × Supply e.g. for Hall Sensor Supply / LED Driver 5 × High-Voltage Wake-Up Inputs Programmable. Window Watchdog & Power Saving Modes Power-On and Undervoltage Reset Generator Overtemperature Protection Short Circuit Protection Relay Driver - System Basis Chip PG-DSO-28-21 8-bit Microcontroller • • • • • • • • • • • • • • Compatible to 8051 μC Core Two clocks per machine cycle 8kByte Boot ROM for test and Flash routines LIN Bootloader (Boot ROM) 256 Byte RAM / 512 Byte XRAM 16kByte Flash Memory for Program Code & Data On-Chip Oscillator Power Saving Modes (slow-down & idle mode) Programmable Watchdog Timer 10-bit A/D Converter, e.g. for Temperature & Vbat-Measurement Three 16-bit Timers & Capture/Compare Unit General Purpose I/Os, e.g. with PWM Functionality On-Chip Debug Support (JTAG) UART and Synchronous Serial Channel (SSC respective SPI) General Characteristics • • • • Package PG-DSO-28-21 Temperature Range TJ: -40 °C up to 150 °C Green Package (RoHS compliant) AEC Qualified Type TLE7810G Data Sheet Package PG-DSO-28-21 4 Marking TLE7810G Rev. 3.01, 2008-04-15 TLE7810G Overview Description This single-packaged solution incorporates an 8-bit state-of-the-art microcontroller compatible to the standard 8051 core with On-Chip Debug Support (OCDS), and a System-Basis-Chip (SBC). The SBC is equipped with LIN transceiver, low-dropout voltage regulator (LDO) as well as two low-side switches (relay driver) and a high-side driver e.g. for driving LEDs. An additional supply, e.g. to supply hall sensors (TLE 4966) is also available. For Micro Controller Unit (MCU) supervision and additional protection of the circuit a programmable window watchdog circuit with a reset feature, supply voltage supervision and integrated temperature sensor is implemented on the SBC. Microcontroller and LIN module offer low power modes in order to support terminal 30 connected automotive applications. A wake-up from the low power mode is possible via a LIN bus message or wake-up inputs. This integrated circuit is realized as Multi-Chip-Module (MCM) in a PG-DSO-28-21 package, and is designed to withstand the severe conditions of automotive and industrial applications. Note: A detailed description of the 8-bit microcontroller XC866 can be found in a dedicated User’s Manual and Data Sheet. Data Sheet 5 Rev. 3.01, 2008-04-15 TLE7810G Block Diagram 2 Block Diagram Vbat SBC 8-bit µC On-Chip Oscillator Supply Output (Hall Sensor) Low-Side Switch 1 Low-Side Switch 2 5* Wake-Up Inputs Voltage Regulator SPI Diagnostic / Ctrl. Flash JTAG GPIOs Hall Sensor I/F R eset Watchdog Temp. / Vbat Measurement I/F 10-bit ADC 1* LED-Driver LIN Serial I/F LIN-Bus * note: LED Driver and Wake-up input 5 share the same pin (MON5/HS_LED) Figure 1 Functional Block Diagram (Module Overview) Data Sheet 6 Rev. 3.01, 2008-04-15 TLE7810G Pin Definitions and Functions 3 Pin Definitions and Functions MON3 MON4 MON5 / HS_LED LIN LS2 LS1 GND RESET P0.3/SCLK_1/COUT63_1 P0.4/MTSR_1/CC62_1 P0.5/MRST_1/EXINT0_0/COUT62_1 GND VDDC TMS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 MON2 MON1 VBAT_SENSE VS SUPPLY VCC GND GND VDDP P2.1/CCPOS1_0/EXINT2/T13HR_2/TDI_1/CC62_3/AN1 TLE7810G 23 22 21 20 19 18 17 16 15 P2.0/CCPOS0_0/EXINT1/T12HR_2/TCK_1/CC61_3/AN0 P0.1/TDI_0/T13HR_1/RXD_1/EXF2_1/COUT61_1 P0.2/CTRAP_2/TDO_0/TXD_1 P0.0/TCK_0/T12HR_1/CC61_1/CLKOUT/RXDO_1 Figure 2 Pin No. 27 28 1 2 3 25 26 23 Pin Configuration Symbol Function Monitoring / Wake-Up Inputs; bi-level sensitive inputs used to monitor signals for MON1, example coming from an external switch panel MON2, MON3, MON4, MON5/HS_LED MON5 is combined with an LED Driver output VS VBAT_SENSE VCC Power Supply Input; recommendation to block to GND directly at the IC with ceramic capacitor (ferrite bead for better EMC behavior) Battery Voltage Sense Input; for connection to terminal 30 with external serial resistor Voltage Regulator Output; for internal supply (5 V); to stabilize block to GND with an external capacitor; for external loads up to the specified value (see Table 13 “Operating Range” on Page 35) Reset; output of SBC; “low active”; input for μController 8 RESET Data Sheet 7 Rev. 3.01, 2008-04-15 TLE7810G Pin Definitions and Functions Pin No. 4 24 5 6 9 10 11 13 14 15 16 17 18 19 20 – – – Symbol LIN SUPPLY LS2 LS1 P0.3 P0.4 P0.5 Function LIN Bus; Bus Line for the LIN interface, according to ISO 9141 and LIN specification 1.3 and 2.0 Supply Output; e.g. for Hall Sensor; controlled via SPI Low Side Switch 2 Output; controlled via SPI Low Side Switch 1 Output; controlled via SPI General Purpose I/O with PWM Functionality (alternate function: SCK, see XC866 data sheet) General Purpose I/O with Capture and PWM Functionality (alternate function: MTSR, see XC866 data sheet) General Purpose I/O with PWM Functionality (alternate function: MRST and EXINT0 ,see XC866 data sheet) Voltage Regulator Output for μController Core (2.5 V); for connection of block capacitor to GND; not to be used for external loads Test Mode Select (JTAG) General Purpose I/O; see XC866 data sheet (alternate function: JTAG Clock Input) General Purpose I/O; see XC866 data sheet (alternate function: JTAG Serial Data Output; RxD1) General Purpose I/O; see XC866 data sheet (alternate function: JTAG Serial Data Input; TxD1) General Purpose Input (digital/analog) with Capture Functionality; e.g. for Hall Sensor (alternate function: EXINT1) General Purpose Input (digital/analog) with Capture Functionality; e.g. for Hall Sensor (alternate function: EXINT2) Voltage Supply Input for μController I/Os (5 V); to be connected with VCC pin LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 1.3 and 2.0; LOW in dominant state; connected to µC General Purpose Input P1.0 LIN Transceiver Data Input; according to ISO 9141 and LIN specification 1.3 and 2.0; TxD has an internal pull-up; connected to µC General Purpose Input P1.1 SPI Data Input; receives serial data from the control device; serial data transmitted to DI is a 16-bit control word with the Least Significant Bit (LSB) transferred first: the input has a pull-down and requires CMOS logic level inputs; DI will accept data on the falling edge of CLK-signal; connected to µC General Purpose Input P1.3 SPI Data Output; this tri-state output transfers diagnosis data to the control device; the output will remain in the high-impedance state unless the device is selected by a low on Chip-Select-Not (CSN); connected to µC General Purpose Input P1.4 (EXTINT0_1) SPI Clock Input; clock input for shift register; CLK has an internal pull-down and requires CMOS logic level inputs; connected to µC General Purpose Input P1.2 SPI Chip Select Not Input; CSN is an active low input; serial communication is enabled by pulling the CSN terminal low; CSN input should only be transitioned when CLK is low; CSN has an internal pull-up and requires CMOS logic level inputs; connected to µC General Purpose Input P1.5 Voltage Reference for ADC VDDC TMS P0.0 [TCK_0] P0.2 [TDO_0] P0.1 [TDI_0] P2.0 P2.1 VDDP RxD TxD DI – DO – – CLK CSN – VAREF Data Sheet 8 Rev. 3.01, 2008-04-15 TLE7810G Pin Definitions and Functions Pin No. – – 7 12 21 22 Symbol Function ADC Measurement Output (analog); for chip temperature and battery voltage measurement Error Pin; bi-directional signal; ERR has an internal pull-up; low-active; connected to µC General Purpose Input P3.6 (RSTOUT) Ground; including GND for LSx and LIN Ground; corresponding GND to VDDC Ground; VAGND (ADC) & corresponding GND to VDDP Ground; VAGND (ADC); also GND for LDO and Measurement Interface VA ERR GND VS 25 SUPPLY 24 VCC 23 GND 22 GND 21 VDDP 20 P2.1 19 P2.0 18 VBAT_ SENSE 26 17 P0.1 [TDI_0] VAREF MON1 27 VA TxD RxD MON3 1 V AREF P2.7 P1.1 P1.0 P1.5 P1.2 P1.3 P1.4 P3.6 P0.2 16 [TDO_0] MON2 28 P0.0 15 [TCK_0] SBC CSN CLK 8-Bit µC 14 TMS MON4 2 DI DO 13 V DDC MON5 / HS_LED 3 ERR 12 GND LIN 4 11 P0.5 5 LS2 6 LS1 7 GND 8 RESET 9 P0.3 10 P0.4 Figure 3 Pinout and Module Interconnects Data Sheet 9 Rev. 3.01, 2008-04-15 TLE7810G Operating Modes 4 Operating Modes The TLE7810G incorporates several SBC operating modes, that are listed in Table 1. Table 1 SBC Operating Modes SBC Standby Mode ON ON ON / OFF3) OFF ON / OFF OFF ON ON OFF OFF 3) Functional Block SBC Active Mode SBC Stop Mode ON ON SPI-controlled SPI-controlled SPI-controlled SPI-controlled ON OFF ON ON ON OFF / ON OFF ON / OFF OFF ON ON OFF OFF 3) 1)2) SBC Sleep Mode OFF OFF / ON2) ON / OFF3) OFF OFF OFF OFF ON OFF OFF VCC, 5 V, LDO Window Watchdog Monitoring / wake-up pins LS1,LS2 -switch Supply Output HS-LED 16-bit SPI LIN wake-up via bus message LIN Transmit LIN Receive RxD Measurement I/F VAREF Voltage Monitoring at VS and VBAT ON / OFF3) Active low wake-up L / H interrupt OFF OFF OFF SPI-controlled ON (2.5V) ON Active low wake-up Active low wake-up interrupt interrupt OFF OFF OFF OFF OFF OFF 1) WD “off” when voltage-regulator output current below “watchdog disable current threshold” 2) WD default “off” in SBC Stop / Sleep Mode; WD can be active in order to generate period wake-ups of SBC 3) “ON / OFF” state is inherited from previous operating mode (“OFF” after POR and RESET) The System-Basis-Chip (SBC) offers several operation modes that are controlled via three mode select bits MS0, MS1 and MS2 within the SPI: SBC Active, Sleep and Stop mode, as well as LIN Receive-Only mode. An overview of the operating modes and the operating mode transitions is indicated in Figure 4 below. Note: It is possible to directly change from Stand-By to Stop or Sleep mode, however this might result in a higher current consumption (~200µA). The higher current consumption will occur in case of a power up and in case of a LIN wake-up from Stop and Sleep mode. To avoid this conditions its recommended to prior set Active mode before changing to Stop or Sleep mode. Data Sheet 10 Rev. 3.01, 2008-04-15 TLE7810G Operating Modes Start Up Power Up SBC Stand-By SBC Stop Mode MS2 1 MS1 1 MS0 1 Vcc ON MS2 1 SBC Sleep Mode MS1 0 MS0 0 Vcc OFF SBC Active Mode MS2 0 MS1 1 MS0 1 Vcc ON LIN Receive-Only MS2 1 MS1 1 MS0 0 Vcc ON SBC Active Mode: „LIN Sleep“ MS2 0 MS1 1 MS0 0 Vcc ON on wake-up / after reset Figure 4 State Diagram “SBC Operation Modes” 4.1 SBC Standby Mode After powering-up the SBC or wake-up from power-saving, it automatically starts-up in SBC Standby Mode, waiting for the microcontroller to finish its startup and initialization sequences. However, this mode cannot be selected via SPI command. From this transition mode the SBC can be switched via SPI command into the desired operating mode. All modes are selected via SPI bits or certain operation conditions, e.g. external wake-up events. 4.2 SBC Active Mode The SBC Active Mode is used to transmit and receive LIN messages and provides the sub-mode “LIN Sleep”. Data Sheet 11 Rev. 3.01, 2008-04-15 TLE7810G Operating Modes 4.3 SBC Active Mode “LIN Sleep” In SBC Active Mode “LIN Sleep” the SBC’s current consumption is reduced by disabling the LIN transceiver. This also means that the internal pull-up resistor of the LIN transceiver is turned off in SBC Active Mode “LIN Sleep”. During this mode the LIN transceiver remains its wake-up capability in order to react on a remote frame or wake-up pulse (specified in LIN Specification V2.0) from the master node or other slave nodes. In case of a wakeup event via LIN message the (internal) RxD is pulled “low” and the “bus wake-up bit” within the SPI status word is set. However, the LIN transceiver needs to be activated by switching to “SBC Active Mode”. 4.4 LIN Receive-Only Mode (“LIN RxD-Only”) The LIN Receive-Only Mode (“LIN RxD-Only”) is designed for a special test procedure to check the bus connections. Figure 5 shows a network consisting of 5 nodes. Node 1 is the LIN master node, the others are LIN slave nodes. If the connection between node 1 and node 3 shall be tested, the nodes 2, 4 and 5 are switched into LIN Receive-Only Mode. Node 1 and node 3 are in Active Mode. If node 1 sends a message (“remote frame”), node 3 is the only node which is physically able to reply to the remote frame. The other nodes have their outputs drivers disabled. The main difference between the SBC Active Mode and the LIN Receive-Only Mode is that the LIN transmit stage is automatically turned-off in LIN Receive-Only-Mode. However, the LIN receiver is still active in both modes. 5 4 1 3 2 Figure 5 Network Diagram “LIN Receive-Only Mode” Data Sheet 12 Rev. 3.01, 2008-04-15 TLE7810G Operating Modes 4.5 4.5.1 Power Saving Modes SBC Sleep Mode During SBC Sleep Mode (see Figure 6), the lowest power consumption is achieved, by having its main voltage regulator switched-off. As the microcontroller cannot be supplied, the integrated window watchdog can be disabled in Sleep Mode via a dedicated SPI control bit. However, it can be turned-on for periodically waking-up the system, e.g. ECU, by generating a reset and automatically switching to SBC Standby Mode. This mode is entered via SPI command, and turns-off the integrated LIN bus transceiver, main voltage regulator as well as all switches. Upon a voltage level change at the monitoring / wake-up pins or by LIN message the SBC Sleep Mode will be terminated and the SBC Standby Mode will automatically be entered (turning-on the LDO). Note: Upon a wake-up via LIN message the (internal) RxD signal stays “low” until mode switch. Note: If the Window Watchdog was not enabled in Sleep Mode the Window Watchdog starts after wake-up with a “long open window” in SBC Standby Mode. Note: In Sleep Mode with activated watchdog (see Table 2 “SPI Input Data Bits” on Page 21) the oscillator remains turned on. SBC Active Mode MS2 0 MS1 1 MS0 0/1 Vcc ON SBC Standby Mode Vcc ON Start Up Power Up „single“ µController SPI -Command: - select SBC Sleep Mode via SPI Mode Bits - window watchdog activation / deactivation via SPI [can remain active as periodic reset timer ] transition caused by : - event at MONx inputs - LIN message [SPI indicates source] SBC Sleep Mode MS2 1 MS1 0 MS0 0 Vcc OFF Figure 6 State Diagram “SBC Sleep Mode” Data Sheet 13 Rev. 3.01, 2008-04-15 TLE7810G Operating Modes 4.5.2 SBC Stop Mode The SBC Stop Mode has the advantage of reducing the current consumption to a minimum, while supplying the microcontroller with its quiescent current during its power saving mode (“Stop”). This mode is entered via SPI command, and turns-off the integrated bus transceivers and respective termination, but the voltage regulator for the microcontroller supply remains active. A microcontroller in a power saving mode has the advantage over a turned-off microcontroller to have a reduced reaction time upon a wake-up event. A voltage level change at the monitoring/wake-up pins will, in contrast to the behavior in Sleep Mode, generate a signal that indicates the wake-up event at the microcontroller in Power-Down Mode. This is realized via an interconnect from the SPI of the SBC [DO] to the microcontroller [P1.4]. In case the wake-up event was a LIN message, the respective RxD pin of the SBC and the SPI Data Out [DO] will be pulled “low”. RxD is pulled “low” until mode switch, while DO stays “low” for two internal SBC cycles. (The microcontroller itself has to take care of switching SBC modes after a wake-up event notification (see Figure 7).) Note: The window watchdog is automatically disabled once the LDO output current goes below a specified “watchdog current threshold”, unless the SPI setting “WD On/Off” prevents this (see Figure 10, Watchdog disable current threshold, Table 14 and “Window Watchdog Reset Period Settings” on Page 23). Note: If the Window Watchdog was not enabled in Stop Mode the Window Watchdog starts after wake-up with a “long open window” in SBC Standby Mode. SBC Active Mode MS2 0 MS1 1 MS0 0/1 Vcc ON SBC Standby Mode Vcc ON Start Up Power Up „single“ µController SPI -Command : - select SBC Stop Mode via SPI Mode Bits - window watchdog activation / deactivation via SPI [„off“ once current consumption below threshold ] transition caused by : - event at MONx inputs - LIN message [SPI indicates source] wake event notification [to µC]: - LIN msg. => RxD + DO („low“) - MONx => DO („low“) SBC Stop Mode MS2 1 MS1 1 MS0 1 Vcc ON Figure 7 State Diagram “SBC Stop Mode” Data Sheet 14 Rev. 3.01, 2008-04-15 TLE7810G Operating Modes 4.5.3 SBC Stop Mode with Cyclic Wake The SBC Stop Mode has the advantage of reducing the current consumption to a minimum, while supplying the microcontroller with its quiescent current during its power saving mode (“Stop”). This mode is entered via SPI command, and turns-off the integrated LIN bus transceiver, but the voltage regulator remains active. The SBC periodically generates a wake-up “low” pulse at DO (“interconnect signal”) that is connected to an interrupt input [P1.4] of the microcontroller. This period can be defined via the “cyclic wake period” bit field within the SPI register. This pulse at DO has a length of two internal SBC cycles. In case of a detected wake-up event via LIN message or any of the MONx pins, DO stays “low” until the first valid SPI command. Note: The window watchdog is automatically disabled once the LDO output current goes below a specified “watchdog current threshold”, unless the SPI setting “WD On/Off” prevents this (see Figure 10). Note: A wake-up event via LIN message or via MONx inputs can happen independently of the cyclic wake phase. Note: The Window Watchdog starts with a “long open window” after a mode switch, e.g. to SBC Active Mode. SBC Active Mode MS2 0 MS1 1 MS0 0/1 Vcc ON SBC Standby Mode Vcc ON Start Up Power Up „single“ µController SPI -Command: - select „cyclic wake timing“ via SPI Timing Bits - select SBC Stop Mode via SPI Mode Bits - window watchdog activation / deactivation via SPI [„off“ once current consumption below threshold ] select SBC operating mode µC transition caused by: 2 ) - event at MONx inputs: => DO „low“ - LIN message => RxD + DO „low“ [SPI indicates source] cyclic wake-up 1) STOP: Cyclic Wake MS2 1 MS1 1 MS0 1 Vcc ON µC wake-up inputs NOTES: 1) window watchdog activated automatically once current threshold is exceeded 2) wake-up via MONx inputs and LIN message independent of cyclic wake phase („asynchronous“ ) Figure 8 State Diagram “SBC Stop Mode with Cyclic Wake” Data Sheet 15 Rev. 3.01, 2008-04-15 TLE7810G LIN Transceiver 5 LIN Transceiver The TLE7810G offers a LIN transceiver, which is compatible to ISO9141 and certified according to LIN Specification 1.3 and 2.0 “Physical Layer”. The transceiver has a pull-up resistor of 30 kΩ implemented and is protected against short to battery and short to GND. The LIN transceiver has an implemented wake-up capability during operation in power saving modes. In Stop Mode a wake-up event is indicated via (internal) RxD and DO signals, that are pulled “low”. Out of Sleep Mode a wake-up event causes an automatic transition into Standby Mode and the (internal) RxD and DO signals are pulled “low”. If the TxD input is pulled low for longer than the TxD dominant timeout the TxD input is ignored and the LIN bus goes back to recessive state. This fail-safe feature in case of a permanent low TxD signal recovers if the TxD pin is high for TxD dominant timeout recovery time. For LIN automotive applications in the United States a dedicated mode by the name “Low Slope Mode” can be used. This mode reduces the maximum data transmission rate of 20 kBaud to 10.4 kBaud by switching to a different slew rate. By using this mode the EM noise emission can be reduced. Data Sheet 16 Rev. 3.01, 2008-04-15 TLE7810G ADC Measurement Interface 6 ADC Measurement Interface The SBC measurement interface comprises a battery measurement unit (high voltage input Vbat_sense) and an onchip temperature sensor. A multiplexer is used to select the desired input channel that is connected to the ADC of the μC. This multiplexer is controlled via the SPI interface. Also, the reference voltage VAREF is provided by the SBC. The Vbat_sense input must be protected against voltage transients, like ISO pulses by a resistor in series to terminal 30. SBC VAREF VA Mux On-Chip Temperature Sensor μC VBAT_SENSE Voltage Attenuator ADC Driver Amplifier P2.7 ADC CA AGND Mode Selection Figure 9 Simplified Block Diagram of ADC Measurement Interface 6.1 Voltage Measurement The input voltage is filtered and scaled down to the input voltage range of the ADC converter. The voltage measurement output code of the ADC can be calculated using the following equation, where VSENS is the voltage at the pin VBAT_SENSE and N the resolution of the ADC: V SENS C VSENS = round ---------------- 1 ( 2 N – 1 ) , 0V ≤ V SENS ≤ V bat –f s -V AREF 8 (1) The input voltage corresponding to the ADC output code CVSENS can be calculated with the following equation: 8 × V AREF V SENS = ------------------------ × C N 2 –1 (2) VSENS 6.1.1 Voltage Measurement Calibration Concept Best measurement accuracy can be obtained by applying the calibration function: C VSENSCAL = round [ c 1 ( C VSENS – c 0 ) ] (3) CVSENS represents the ADC output code for the analog input voltage at the pin VBAT_SENSE. The correction coefficients c1 and c0 correct for slope variations and offset errors of the measurement transfer function. During the production test these calibration figures are calculated and stored in the flash memory of the microcontroller. Data Sheet 17 Rev. 3.01, 2008-04-15 TLE7810G ADC Measurement Interface Further details on the implementation of the calibration function and location of the calibration figures in Flash memory can be found in a dedicated application note. The voltage measurement target parameters can be found in “ADC Battery Voltage Measurement Interface, VBAT_SENSE” on Page 44. 6.2 Temperature Measurement In the temperature measurement mode the typical internal analog output voltage of the on-chip temperature sensor can be described with the first order approximation: VA ≈ m0 – m1 × Tj Where: • • (4) Tj is the junction temperature in Kelvin moand m1 are typical linear fitting parameters (see Table “ADC Temperature Measurement Interface” on Page 44) The output code of the ADC is given by the following equation, where VAREF and N denote the ADC reference voltage and the resolution of the ADC: C A = round V A ( T j ) × -------------------- , V A ≤ V AREF V AREF The junction temperature TJ corresponding to the output code CA is given by: (2 – 1) N (5) C A ( T j ) × V AREF 1 T j = ------ m 0 – -------------------------------------N m1 2 –1 273.15 °C need to be subtracted to convert Tj [K] into Centigrade Scale [°C]. [unit: K] (6) The temperature measurement target parameters can be found in“ADC Temperature Measurement Interface” on Page 44. 6.2.1 Temperature Measurement Calibration Concept Best measurement accuracy can be obtained by applying the calibration function: T C AL = 586 + f 0 • 2 – 1 – [ 2 – 2 + f 1 • 2 – 10 ] C ( T j ) A (7) The calibration coefficients f0 / 1 are computed during the production test and stored in the flash memory of the microcontroller. The selection between battery voltage and temperature measurement is done via SPI bit (see “SPI (Serial Peripheral Interface)” on Page 20). Further details on the implementation of the calibration function and location of the calibration figures can be found in a dedicated application note. Data Sheet 18 Rev. 3.01, 2008-04-15 TLE7810G Low Dropout Voltage Regulator 7 Low Dropout Voltage Regulator The Low Drop-Out Voltage Regulator (LDO) has mainly been integrated in the TLE7810G in order to supply the integrated microcontroller and several modules of the SBC. Note: The LDO is not intended to be used as supply for external loads. However, it might be used as supply for small external loads (see Table 13 “Operating Range” on Page 35). In the event of a short circuit condition at the Vcc pin, a shutdown/reset of the TLE7810G may occur due to overcurrent condition. This maximum output current for external loads is specified in the electrical characteristics. The voltage regulator output is protected against overload and overtemperature. An external reverse current protection is required at the pin VS to prevent the output capacitor at VCC from being discharged by negative transients or low VS voltage. Data Sheet 19 Rev. 3.01, 2008-04-15 TLE7810G SPI (Serial Peripheral Interface) 8 SPI (Serial Peripheral Interface) Control and status information between SBC and μC is exchanged via a digital interface, that is called “serial peripheral interface” (SPI) on the SBC side, and “synchronous serial channel” (SSC) on the μC side. The 16-bit wide Programming or Input Word of the SBC (see Table 2 to Table 8) is read in via the data input DI (with “LSB first”), which is synchronized with the clock input CLK supplied by the μC. The Diagnosis or Output Word appears synchronously at the data output DO (see Table 9). The transmission cycle begins when the chip is selected by the Chip Select Not input CSN (“low” active). After the CSN input returns from L to H, the word that has been read in becomes the new control word. The DO output switches to tri-state status at this point, thereby releasing the DO bus for other usage. The state of DI is shifted into the input register with every falling edge on CLK. The state of DO is shifted out of the output register after every rising edge on CLK. The number of received input clocks is supervised by a modulo16 operation and the Input/Control Word is discarded in case of a mismatch. This error is flagged by a “high” at the data output pin DO (interconnect to μC: P1.4) of the following SPI output word before the first rising edge of the clock is received. Additionally the logic level of DO will be “OR-ed” with the logic level of DI (P1.3). Note: After wake-up from low-power modes the device needs to be set to Active Mode first before switches like LS1, LS2, Supply Output and LED Driver can be turned on with the second SPI command. MSB LSB Input Data 15 14 13 12 11 10 Meas. I/F On/Off ADC Vbat/ Vtemp* MON5 On/Off* 9 8 7 6 5 4 CS1 3 CS0 2 MS2 1 MS1 0 MS0 WD On/Off Configuration Registers MON4 On/Off* MON3 On/Off* MON2 On/Off* MON1 On/ Off* Configuration Select Mode Selection Bits not valid not valid Active LIN Sleep Active Sleep 000 LIN Reset Reset 10.4k* Delay* Thres* 00 Reserved LS2 LS1 HS-LED HS-LED Supply OV/UV Output On/Off On/Off disable On /Off On/Off 01 001 Reserved Cyclic Wake Timing* Bit Position: 9 .. 5 Window Watchdog Timing Bit Position: 10 .. 5 (Watchdog Trigger Register ) 10 010 Reserved 0** 11 011 100 * remains unchanged after Vcc-UV or WD-RESET ** if bit set to „1" command will be ignored not valid LIN RxD Only Stop 101 110 111 Figure 10 16-Bit SPI Input Data / Control Word Data Sheet 20 Rev. 3.01, 2008-04-15 TLE7810G SPI (Serial Peripheral Interface) Table 2 BIT 0 1 2 3 4 5 … 13 14 15 SPI Input Data Bits Input Data Mode Selection Bit 0 (MS0) Mode Selection Bit 1 (MS1) Mode Selection Bit 2 (MS2) Configuration Selection Bit 0 (CS0) Configuration Selection Bit 1 (CS1) Configuration Register (meaning based on “Configuration Selection Bits”) Measurement Interface “on” / “off” (setting only valid in active mode, in power saving modes the Measurement interface is turned off) Window Watchdog Stop/Sleep mode configuration “on” / “off” (the configuration is only valid for Stop/Sleep mode, in Active mode the Window Watchdog is always on); if “on” is set before Stop Mode is entered, watchdog remains active regardless of “watchdog disable current threshold” Mode Selection Bits MS1 0 0 1 1 0 0 1 1 MS0 0 1 0 1 0 1 0 1 Mode Selection: SBC Mode “reserved” / not used “reserved” / not used SBC Active Mode: “LIN Sleep” SBC Active Mode (LIN “on”) SBC Sleep (LIN & VReg “off”) “reserved” / not used LIN Transceiver: LIN Receive-Only SBC Stop Mode (LIN “off”) Table 3 MS2 0 0 0 0 1 1 1 1 Table 4 CS1 0 0 1 1 Configuration Selection Bits CS0 0 1 0 1 Configuration Selection General Configuration Integrated Switch Configuration Cyclic Wake Configuration Window Watchdog Configuration Data Sheet 21 Rev. 3.01, 2008-04-15 TLE7810G SPI (Serial Peripheral Interface) Table 5 Pos. 5 6 7 General & Integrated Switch Configuration General Configuration1) Reset Threshold: “default” or “SPI option” (see Table 14: Reset Generator; Pin RESET) Reset Delay: “default” or “SPI option” (see Table 14: Reset Generator; Pin RESET) LIN “Low Slope Mode” (10.4 kBaud) Integrated Switch Configuration2) Supply Output “on” / “off” HS-LED “on” / “off” HS-LED OV/UV disable “0”: HS-LED will be turned off in case of Vbat OV/UV “1”: HS-LED will not be turned off in case of Vbat OV/UV LS1 “on” / “off” LS2 “on” / “off” “reserved” / not used “reserved” / not used “reserved” / not used “reserved” / not used 8 9 10 11 12 13 MON1 Input Activation MON2 Input Activation MON3 Input Activation MON4 Input Activation MON5 Input Activation ADC Measurement: Vbat / Vtemp (“0” = Vbat; “1” = Vtemp) 1) “1” = ON / enable, “0” = OFF / disable 2) “1” = ON, “0” = OFF Table 6 Pos. 5 6 7 8 9 10 11 12 13 Cyclic Wake & Window Watchdog Period Settings1)2) Cyclic Sense / Wake Config. Cyclic Period Bit 0 (T0) Cyclic Period Bit 1 (T1) Cyclic Period Bit 2 (T2) Cyclic Period Bit 3 (T3) Cyclic Period Bit 4 (T4) “reserved” / not used “reserved” / not used “reserved” / not used “reserved” / not used Window Watchdog Config. Watchdog Period Bit 0 (T0) Watchdog Period Bit 1 (T1) Watchdog Period Bit 2 (T2) Watchdog Period Bit 3 (T3) Watchdog Period Bit 4 (T4) Watchdog Period Bit 5 (T5) “0” (mandatory) “reserved” / not used “reserved” / not used 1) “1” = ON, “0” = OFF 2) Cyclic wake and window watchdog period settings see Table 7 “Cyclic Wake Period Settings (Stop Mode only)” on Page 23 Data Sheet 22 Rev. 3.01, 2008-04-15 TLE7810G SPI (Serial Peripheral Interface) Table 7 T4 0 0 0 0 0 0 0 … 1 Cyclic Wake Period Settings (Stop Mode only) T3 0 0 0 0 0 0 0 … 1 T2 0 0 0 0 1 1 1 … 1 T1 0 0 1 1 0 0 1 … 1 T0 0 1 0 1 0 1 0 … 1 Cyclic Wake Period Cyclic Wake “off” 16 ms 32 ms 48 ms 64 ms 80 ms 96 ms … ms 496 ms Table 8 T5 0 0 0 0 0 0 0 … 1 Table 9 Pos. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Window Watchdog Reset Period Settings T4 0 0 0 0 0 0 0 … 1 T3 0 0 0 0 0 0 0 … 1 T2 0 0 0 0 1 1 1 … 1 T1 0 0 1 1 0 0 1 … 1 T0 0 1 0 1 0 1 0 … 1 Window Watchdog Reset Period “not a valid selection” 16 ms 32 ms 48 ms 64 ms 80 ms 96 ms … ms 1008 ms SPI Output Data Output Data1) Output Data after Wake-up2) VCC Temperature Prewarning HS-LED fail (OC / OT) VCC Temperature Prewarning HS-LED fail (OC / OT) VINT-Fail (“active low”) LS1/2 (OC / OT) Window Watchdog Reset MON1 Logic Input Level MON2 Logic Input Level MON3 Logic Input Level MON4 Logic Input Level MON5 Logic Input Level “reserved” / not used LIN Failure VINT-Fail (“active low”) LS1/2 (OC / OT) Window Watchdog Reset Wake-Up via MON1 Wake-Up via MON2 Wake-Up via MON3 Wake-Up via MON4 Wake-Up via MON5 “reserved” / not used Bus Wake-Up via LIN Msg. End of Cyclic Wake Period “low”4) Vbat Range 1 (UV)3) [only “SBC Active Mode”] Vbat Range 2 (OV) [only “SBC Active Mode”] Data Sheet 23 Rev. 3.01, 2008-04-15 TLE7810G SPI (Serial Peripheral Interface) Table 9 Pos. 14 15 SPI Output Data (cont’d) Output Data1) Supply Output (OC / OT) Output Data after Wake-up2) Supply Output (OC / OT) “low” VS UV5) [only “SBC Active Mode”] 1) “1” = ON / enable, “0” = OFF / disable, OC = overcurrent, UV = undervoltage, OT = overtemperature (temp. shut-down) 2) “1” = ON, “0” = OFF, OC = overcurrent, UV = undervoltage, OT = overtemperature (temp. shut-down) 3) Becomes valid after start-up time for voltage monitoring 4) Voltage monitoring not active in SBC Standby Mode 5) This bit needs to be read twice to indicate an undervoltage condition (only for VS ramping down - bit15 set to “1”) Table 10 Module Diagnostic, Protection and Safety Functions Function 1) Effect Reset; see Table 11 “Reset Behavior SBC” on Page 26 current limitation Reset, see Table 11 “Reset Behavior SBC” on Page 26 Reset, see Table 11 “Reset Behavior SBC” on Page 26 WD only disabled if Concept SPI status latched until next read-out – Condition occurs at VS below operating range – WD enabled if VCC-current > threshold Window Watchdog WD Failure LDO (VReg) OC2) at VCC voltage regulator UV condition (VS related) VCC-UV WD current threshold (Stop Mode) OT3) VCC-current < threshold and WD not enabled via SPI VCC-shutdown, Reset as soon as automatically enabled with VCC falls below reset threshold, see thermal hysteresis Table 11 “Reset Behavior SBC” on Page 26 OT prewarning internal supply [SBC] (VS related) LS-Switches SPI status output (internal) Reset; register settings cleared; SPI status output; see Table 11 “Reset Behavior SBC” on Page 26 LSx-shutdown; SPI status output; signalization via ERR pin SPI status latched until next read-out – VINT-UV OC, OT re-activation via SPI command; SPI status latched until next read-out microcontroller error signalization (ERR) Supply Output OC, OT LSx-shutdown; see “Error re-activation via SPI Interconnect (ERR)” on Page 33 command Supply-shutdown; SPI status output re-activation via SPI command; SPI status latched until next read-out Data Sheet 24 Rev. 3.01, 2008-04-15 TLE7810G SPI (Serial Peripheral Interface) Table 10 Module HS-LED Diagnostic, Protection and Safety Functions (cont’d) Function OC, OT Effect HS-LED-shutdown; SPI status output HS-LED-shutdown (optional), SPI status output HS-LED-shutdown (optional), SPI status output HS-LED-shutdown (optional), SPI status output HS-LED-shutdown (optional), SPI status output SPI status output SPI status output Concept re-activation via SPI command; SPI status latched until next read-out re-activation via SPI command; SPI status latched until next read-out re-activation via SPI command; SPI status latched until next read-out SPI status latched until next read-out SPI status latched until next read-out SPI status latched until next read-out – VBAT-UV VBAT-OV VBAT-Monitor (at VBAT_SENSE pin) VBAT-UV VBAT-OV VS-Monitor LIN VS-UV LIN-Failure (OT, UV, TxD time-out) Wake-up signalization via interconnect to μC – (RxD and DO “low”) and SPI status output signalization via interconnect to μC – (DO “low”) and SPI status output signalled at interconnect (DO “high” – OR-ed with DI) once CSN is active MONx-Inputs SPI Wake-up Failure Indicator 1) WD (Window) Watchdog 2) OC overcurrent detection 3) OT overtemperature detection Data Sheet 25 Rev. 3.01, 2008-04-15 TLE7810G Reset Behavior and Window Watchdog 9 • • • Reset Behavior and Window Watchdog VINT-UV: reset of SBC upon undervoltage detection at internal supply voltage VCC-UV: reset of SBC upon undervoltage detection at supply voltage (VCC) Watchdog: reset of SBC caused by integrated window watchdog The SBC provides three different resets: Should the internal supply voltage become lower than the internal threshold the VINT-Fail SPI bit will be reset in order to indicate the undervoltage condition (VINT-UV). All other SPI settings are also reset by this condition. The VINT-Fail feature can also be used to give an indication that the system supply was disconnected and therefore a pre-setting routine of the microcontroller has to be started. When the VCC voltage falls below the reset threshold voltage VRTx for a time duration longer than the filter time tRR the reset output is switched LOW and will be released after a programmable delay time (default setting for PowerOn-Reset) when VCC > VRTx. This is necessary for a defined start of the microcontroller when the application is switched on after Power-On-Reset. As soon as an undervoltage condition of the output voltage (VCC < VRTx) appears, the reset output is switched LOW again (VCC-UV). The reset delay time can be shortened via SPI bit. Please refer to Figure 17. Table 11 Reset Pin Watchdog Timer Operating Mode LS-Switches Supply Output HS-LED Configuration Settings Reset Behavior SBC Affected by Reset VINT-UV “low” long open window SBC Standby “off” “off” “off” Reset (“all bits cleared”) VCC-UV or Watchdog-Reset “low” long open window SBC Standby “off” “off” “off” see Figure 10 “16-Bit SPI Input Data / Control Word” on Page 20 After the above described delayed reset (LOW to HIGH transition at RESET pin) the window watchdog circuit is started by opening a long open window in SBC Standby Mode. The long open window allows the microcontroller to run its initialization sequences and then to trigger the watchdog via the SPI. Within the long open window period a watchdog trigger is detected as a write access to the “window watchdog period bit field” within the SPI control word. The trigger is accepted when the CSN input becomes HIGH after the transmission of the SPI word. A correct watchdog trigger results in starting the window watchdog by opening a closed window with a width of 50% of the selected window watchdog period. This period, selected via the SPI window watchdog timing bit field, is programmable in a wide range. The closed window is followed by an open window with a width of 50% of the selected period. The microcontroller has to service the watchdog by periodically writing to the window watchdog timing bit field. This write access has to meet the open window. A correct watchdog service immediately results in starting the next closed window. Should the trigger signal not meet the open window a watchdog reset is generated by setting the reset output low. Then the watchdog again starts by opening a long open window. In addition, a “window watchdog reset flag” is set within the SPI to monitor a watchdog reset. For fail safe reasons the TLE7810G is automatically switched to SBC Standby mode if a watchdog trigger failure occurs. This minimizes the power consumption in case of a permanent faulty microcontroller. This “window watchdog reset flag” will be cleared by any access to the SPI. When entering a low power mode the watchdog can be requested to be enabled via an SPI bit. In SBC Stop Mode the watchdog is only turned off once the current consumption at VCC falls below the “watchdog current threshold”. Data Sheet 26 Rev. 3.01, 2008-04-15 TLE7810G Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling 10 Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling In addition to a wake-up from SBC Stop / Sleep Mode via the LIN bus line it is also possible to wake-up the TLE7810G from low power mode via the monitoring/wake-up inputs. These inputs are sensitive to a transition of the voltage level, either from high to low or vice versa. Monitoring is available in Active Mode and indicates the voltage level of the inputs via SPI status bits. A positive or negative voltage edge at MONx in SBC Sleep or Stop Mode results in signalling a wake-up event (via SBC [DO] to μC [P1.4] interconnect). After a wake-up via MONx the first transmission of the SPI diagnosis word in SBC Standby mode indicates the wake-up source. Further SPI status word transmissions show the logic level at the monitoring input pins. Note: Immediately before switching the TLE7810G into a SBC power saving mode the activated MONx are initialized with the actual logic level detected at the MONx. In case a MONx is deactivated it can neither be used as wake-up source nor can it be used to detect logic levels. However, there should be a minimum delay of three times “CSN high time” (see Table “SPI Data Input Timing1)” on Page 43) between activation of MONx and entering a power saving mode. The monitoring input module consists of an input circuit with pull-up and pull-down current sources to define a certain voltage level with open inputs and a filter function to avoid wake-up events caused by unwanted voltage transients at the module inputs. At a voltage level at the monitoring pins of VMON_th < VMONx < 5.5 V the pull-up current source becomes active, while at 1 V < VMONx < VMON_th the pull-down sink is activated (see Figure 11) guaranteeing stable levels at the monitoring/wake-up inputs. Below and above these voltage ranges the current is minimized to a leakage current (see “Monitoring Inputs MONx” on Page 38). Vs MONx + 1 tWK Figure 11 Monitoring Input Block Diagram Data Sheet 27 Rev. 3.01, 2008-04-15 TLE7810G Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling IMON VMONth_min Pull-down current VMONth_max VMON Pull-up current Figure 12 Monitoring Input Characteristics Data Sheet 28 Rev. 3.01, 2008-04-15 TLE7810G Low Side Switches 11 Low Side Switches The low side switches LS1 and LS2 have been designed to drive relays, e.g. in window lift applications. The continuous output current is dimensioned for 300mA (each) maximum. In SBC Active and LIN Receive-Only mode the low side outputs can be switched on and off, respectively via an SPI input bit. Protection against overcurrent, overtemperature and overvoltage conditions is integrated in the low-side drivers. In case of a load current that is exceeding the overcurrent threshold both drivers are switched-off after a filter time. A thermal protection circuit is included as well, and is switching-off the drivers in case the overtemperature threshold is reached. In both cases the SPI diagnostic information is updated accordingly and the ERR interconnect is pulled “low” for one internal cycle (see “SBC Oscillator” on Page 37). The drivers have to be re-activated via SPI command. An overvoltage protection has been implemented by active clamping for inductive loads preventing the occurrence of voltage peaks. Moreover the switches are automatically disabled when a reset or watchdog reset occurs. However, the switches are not automatically switched off in case of an overvoltage condition, e.g. load dump. If a double-failure occurs at the same time causing an overcurrent (OC) or overtemperature (OT) condition, than the LSx are turned off in order to protect the IC. Note: In case one LSx is turned off due to an OC / OT condition the second LSx is turned off automatically (bidirectional ERR interconnect pulled “low”). The LSx can also be switched off by the microcontroller by pulling the bi-directional ERR interconnect “low” for at least one internal cycle (see “SBC Oscillator” on Page 37). Data Sheet 29 Rev. 3.01, 2008-04-15 TLE7810G Supply Output for Hall Sensor Supply 12 Supply Output for Hall Sensor Supply The SUPPLY Output is intended to be used as Hall Sensor supply. In SBC Active and LIN Receive-Only mode this output can be switched on and off, respectively via an SPI input bit. Note: The SUPPLY Output needs to be turned-off prior to entering SBC Stop Mode via SPI command as it will inherit the “on or off state” from the previous operation mode. In case of entering SBC Sleep Mode it is turned-off automatically. This output provides an output voltage limitation and is protected against overcurrent and overtemperature. The protection mechanisms for the low-sides switches also apply for this high-side switch. In case of an overcurrent shutdown the supply output can be re-activated via SPI command. In order to prevent an unintended shut-down due to an overcurrent situation when a capacitive load is connected, a specified blanking time after switching-on has been implemented and is applied directly after activation of this output. Data Sheet 30 Rev. 3.01, 2008-04-15 TLE7810G High-Side Switch as LED Driver (HS-LED) 13 High-Side Switch as LED Driver (HS-LED) The high side output HS_LED is intended for driving LEDs or small lamps. This function and the wake-up function via MON5 input are realized on the same pin (MON5/HS_LED). In SBC Active and LIN Receive-Only mode the high side output can be switched on and off, respectively via an SPI input bit (automatically “off” in SBC Stop Mode). The high-side driver is protected against overcurrent and overtemperature. The HS-LED is automatically disabled in case of an undervoltage (Vbat-UV) and overvoltage condition (Vbat-OV) and can only be re-activated via SPI command. This HS-LED OV/UV feature can be disabled via SPI bit (see Table 5 “General & Integrated Switch Configuration” on Page 22). Data Sheet 31 Rev. 3.01, 2008-04-15 TLE7810G General Purpose I/Os (GPIO) 14 General Purpose I/Os (GPIO) The pins P0.3 / P0.4 / P0.5 and P2.0 / P2.1 provide general purpose functionality, like Hall Sensor inputs, PWM output and capture. GPIOs P0.0, P0.1 and P0.2 are available in user mode only (alternate JTAG functionality). For further information see dedicated XC866 User’s Manual and/or Data Sheet. Data Sheet 32 Rev. 3.01, 2008-04-15 TLE7810G Error Interconnect (ERR) 15 Error Interconnect (ERR) The ERR interconnect provides a bi-directional error signalization. The ERR output (active low) immediately signals that a low side switch LSx has been shut down due to overcurrent or overtemperature condition. If the ERR signal is pulled “low” by the microcontroller for at least one internal cycle (see “SBC Oscillator” on Page 37), the low side switches LS1/LS2 are turned off (see Table 10 “Diagnostic, Protection and Safety Functions” on Page 24). Data Sheet 33 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics 16 16.1 Table 12 General Product Characteristics Absolute Maximum Ratings Absolute Maximum Ratings1) Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Voltages 16.1.1 16.1.2 16.1.3 Supply voltage Regulator output voltage Input voltage at MON1-4 Parameter Symbol Limit Values Min. Max. 40 5.5 40 V V V – – also for pulses according to ISO 7637; external series resistor R > 1.0 kΩ required MON5 input voltage limited due to LED driver functionality. R > 1.0 kΩ required also for pulses according to ISO 7637; external series resistor R > 1.0 kΩ required limited by output clamping voltage & clamping energy – 0 V < VS < 27 V 0 V < VCC < 5.5 V 0 V < VS < 27 V 0 V < VCC < 5.5 V – EIA/JESD22-A114-B Unit Conditions VS VCC VMONx -0.3 -0.3 VS - 4 0 16.1.4 Input voltage at MON5/HS_LED VMON5 (output) VS - 4 0 VS + 0.3 V 16.1.5 Input voltage at VBAT_SENSE VBATSENSE VS - 40 40 V 16.1.6 16.1.7 16.1.8 16.1.9 16.1.10 16.1.11 Low-Side Switches LSx SUPPLY Output VLSx VSupply -0.3 -0.3 -0.3 -0.3 VLSx_CL V Logic input voltages (TMS, TCK, VI TDI, CLKIN) Logic output voltage (TDO, RESET) LIN line bus input voltages Electrostatic discharge voltage “HBM” at pin LIN, MONx, VBAT_SENSE vs. GND Electrostatic discharge voltage “HBM” at pin VDDC vs. GND Electrostatic discharge voltage “HBM” at any other pin Electrostatic discharge voltage “CDM” at any pin VS + 0.3 V VCC + V 0.3 VDRI,RD Vbus VESD VCC + 0.3 40 4 V V kV VS - 4 0 -4 C = 100 pF, R = 1.5 kΩ -600 -2 -500 600 2 500 V kV V EIA/JESD22-A114-B 16.1.12 16.1.13 16.1.14 VESD VESD VESD C = 100 pF; R = 1.5 kΩ EIA/JESD22-A114-B C = 100 pF; R = 1.5 kΩ Charged device model; according to AEC Q100-011 Rev-B – – Temperatures 16.1.15 16.1.16 Junction temperature Storage temperature Tj Tstg -40 -50 150 150 °C °C 1) Not subject to production test, specified by design. Data Sheet 34 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. 16.2 Table 13 Pos. 16.2.1 Functional Range Operating Range Parameter Supply voltage Symbol Limit Values Min. Max. 27 V 40 V load dump; t ≤ 0.4 s; 27V jump start; t ≤ 60s; VS (min) valid for ramp-down 3.9 Unit Conditions VS 16.2.2 Voltage range at LSx pins VLSx -0.3 27 V 40 V load dump; t ≤ 0.4s; can withstand short circuit to VS ≤ 20V external loads – – ESR < 6 Ω @ f = 10 kHz; 100 nF in parallel recommended – – min. time between 2 SPI commands; CSN “high” 16.2.3 16.2.4 16.2.5 16.2.6 External output current at pin VCC ICC_ext Supply voltage slew rate Logic input voltage (TMS, TCK, TDI, CLKIN) Output capacitor connected to VCC pin dVS/dt – -0.5 -0.3 1 5 5 mA V/μs V μF VI CCC VCC + 0.3 V – 16.2.7 16.2.8 16.2.9 SPI clock frequency Junction temperature Delay time for operating mode change fclk Tj tchmode – -40 10 4 150 – MHz °C μs 16.3 Pos. 16.3.1 16.3.2 Thermal Resistance Parameter Junction to Soldering Point Junction to Ambient1) 1) Symbol Min. Limit Values Typ. – 43 Max. 17 – – – Unit K/W K/W Conditions measured to pin 7,8,22 2) RthJSP RthJA 1) Not subject to production test, specified by design 2) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Data Sheet 35 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics 16.4 Table 14 Electrical Characteristics Electrical Characteristics VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Min. Current Consumption @ Pin VS 16.4.1 Current Consumption IMCM_norm (MCM): IMCM_norm = ISBC_AM + IµC_NM Current Consumption (SBC): SBC Active Mode Current Consumption (μC): Normal Mode Quiescent Current (MCM): STOP Mode SBC STOP Mode with “cyclic wake” SBC STOP Mode without “cyclic wake” μC Power Down Mode Quiescent Current (MCM): STANDBY μC Power Down Mode SBC STANDBY Mode SBC STANDBY Mode – 24 30 mA Limit Values Typ. Max. Unit Conditions Tj = -40 … 85 °C; SBC: active mode μC: normal mode 16.4.2 ISBC_AM – 3 5 mA Tj = -40 … 85 °C; w/o data transmission; only SBC; all switches “off” Tj = -40 … 85 °C; only μC Tj = -40 … 85 °C; IMCM = ISBC + IµC 16.4.3 16.4.4 16.4.5 16.4.6 16.4.7 16.4.8 16.4.9 16.4.10 16.4.11 IµC_NM IMCM_Stop ISBC_Stop ISBC_Stop IµC_Stop IMCM_Stby – – – – – – 21 60 – 50 10 – 10 50 250 25 95 80 65 30 95 30 65 800 mA μA μA Tj = -40 … 85 °C; IMCM = ISBC + IµC Supply Output (Hall Supply) turned-off IµC_PWR_DWN – ISBC_Stby – ISBC_Stby – μA Quiescent Current @ Tj = -40 … 85 °C; Supply Output (Hall Supply) turned-off; after LIN wake-up/power-up 16.4.12 Quiescent Current (MCM): IMCM_Sleep Sleep Mode – 25 40 μA Tj = -40 … 85 °C; IMCM = ISBC + IµC; μC “turned-off” Voltage Regulator; Pin VCC 16.4.13 Output voltage VCC 4.9 5.0 5.1 V 1 mA < ICC < 45 mA; 5.5 V < VS < 27 V; CL ≥ 1 μF; ESR < 6 Ω 5.5 V < VS < 27 V; ICC = 1 mA 1 mA < ICC < 45 mA; 5.5 V < VS < 27 V Vr = 1 Vpp; fr = 100 Hz; CVCC = 1 μF 16.4.14 16.4.15 16.4.16 Line regulation Load regulation Power supply ripple rejection1) ΔVCC ΔVCC – – – – – 40 20 50 – mV mV dB PSRR Data Sheet 36 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. 16.4.17 Parameter Output current limit Symbol Min. Limit Values Typ. – Max. 200 mA 45 Unit Conditions ICCmax VCC = 4.5 V; power transistor thermally monitored 16.4.18 16.4.19 16.4.20 16.4.21 16.4.22 16.4.23 Drop voltage VDR = VS - VCC VDR TjPW TjPW_hys TjSD TjSD_hys TjSD/TjPW – 120 – 155 20 – – 145 10 185 35 1.25 0.3 170 – 200 – – V °C K °C K – 1 mA < ICC < 45 mA; 3.9 V < VS < 5.1 V 1) VCC thermal prewarning ON temperature VCC thermal prewarning hysteresis 1) VCC thermal shutdown temperature 1) VCC thermal shutdown hysteresis 1) VCC ratio of SD to PW temp. 1) Under-/Overvoltage Detection @ Vbat_sense Pin 16.4.24 Undervoltage Threshold “ramp-up” Undervoltage Threshold “ramp-down” Undervoltage Threshold hysteresis Overvoltage Threshold “ramp-up” Overvoltage Threshold “ramp-down” Overvoltage threshold hysteresis Undervoltage threshold “ramp-down” Undervoltage threshold hysteresis Internal cycling time VUVT_Vbat 7.1 7.65 8.2 V indicated within SPI output word; LED Driver turned off indicated within SPI output word; LED Driver turned off 1) 16.4.25 VUVT_Vbat 6.8 7.25 7.65 V 16.4.26 16.4.27 VUVT_Vbat_hys – VOVT_Vbat 17.6 400 18.5 – 19.4 mV V indicated within SPI output word; LED Driver turned off indicated within SPI output word; LED Driver turned off 1) 16.4.28 VOVT_Vbat 16.6 17.4 18.2 V 16.4.29 VOVT_Vbat_hys – 1.1 – V Undervoltage Detection @ VS Pin 16.4.30 16.4.31 VUVT_Vs VUVT_Vs_hys 5.8 – 6.5 250 7.2 – V mV indicated within SPI output word 1) SBC Oscillator 16.4.32 tCYL 3.2 3.9 4.8 μs internal oscillator fOSC = 256 kHz (typ.) Data Sheet 37 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Min. Reset Generator; Pin RESET 16.4.33 Reset threshold voltage (for VCC UV condition indication) Reset threshold voltage hysteresis Reset low output voltage Limit Values Typ. 4.65 3.15 90 90 0.2 Max. 4.8 3.3 – – 0.4 V V mV mV V at pin VCC, default SPI setting at pin VCC, SPI option 1) Unit Conditions VRT1 VRT2 VRT1_hys VRT2_hys VRESET 4.5 3.0 20 20 – 16.4.34 16.4.35 IRESET = 1 mA for VCC = VRTx; IRESET = 200 μA for VRTx > VCC ≥ 1 V – 16.4.36 16.4.37 16.4.38 16.4.39 Reset high output voltage VRESET Reset pull-up current Reset reaction time Reset delay time 0.7 × – -150 10 5.0 0.5 64 1 VCC -20 4 4.0 0.4 51 0.2 VCC + 0.1 -500 26 6.0 0.6 77 4 V μA μs ms ms ms mA IRESET tRR tRD1 tRD2 VRESET = 0 V VCC < VRT to RESET = “low” default SPI setting; after Power-On-Reset SPI setting option – only SBC Stop Mode Watchdog Generator 16.4.40 16.4.41 tLW Watchdog disable current IWDI,th Long open window threshold Monitoring Inputs MONx 16.4.42 Wake-up/monitoring threshold voltage VMONth 3.7 4 4.3 V in all SBC modes; without serial resistor (with RS: ΔV = IPD/PU × RS) VS > 6.0 V (drops linearly for VS < 6.0 V) without serial resistor RS (with RS: ΔV = IPD/PU × RS) – 16.4.43 16.4.44 16.4.45 16.4.46 16.4.47 Threshold hysteresis Wake-up/monitoring filter time Pull-up current Pull-down current Input leakage current (except MON5 due to alternative LED supply voltage functionality) Input leakage current MON5 VMONth,hys tMON IPU, MONx IPD, MONx ILK,I ILK,I ILK_MON5,I 20 10 -10 1 -2 -2 -5 50 15 -5 5 0 0 0 600 25 -1 10 2 2 2 mV μs μA μA μA μA μA 16.4.48 VMON_th < VMONx < 5.5 V 1 V < VMONx < VMON_th 0 V < VMONx < 1 V; 5.5 V < VMONx < 40 V VMON = 40 V;VS = 0 V; general: VMONx > VS 0 V < VMON5 < 1 V; 5.5 V < VMON5 < VS + 0.3 V Data Sheet 38 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Min. Low Side Output LS1 / LS2 16.4.49 Static Drain-Source ON-Resistance Limit Values Typ. – 1.0 45 Max. 3.0 – 50 Ω Ω V Unit Conditions RDSON LSx – – TJ = 150 °C; VS > 4.5 V; ILS = 200 mA TJ = 25°C; VS > 4.5 V; ILS = 200 mA output “off”; current pulse: ILS1/2 = 100 mA; condition during production test 16.4.50 Output clamping voltage VLSx_CL 40 16.4.51 16.4.52 16.4.53 16.4.54 Leakage current Switch ON time Switch OFF time Overcurrent shutdown threshold IQLLSx tONLSx tOFFLSx ISDLSx – – – 600 – 15 – 800 5 40 40 1000 μA μs μs mA VLSx = VS; -40 °C < TJ < 85 °C CSN high to LSx on; resistive load 120 Ω CSN high to LSx off; resistive load 120 Ω to prevent shutdown at overvoltage conditions @ -40 °C higher limits have been chosen2) after continuos overcurrent detection t > tdSDLSx affected LSx will be shutdown and overcurrent condition will be indicated via SPI output word 1) 16.4.55 Overcurrent shutdown filter time tdSDLSx 10 18 26 μs 16.4.56 16.4.57 16.4.58 LS1/2 thermal shutdown temp. LS1/2 thermal shutdown temp. hysteresis Output Clamping Energy at pins LSx Drop voltage VS - VSupply Output voltage range TjSD TjSD_hys ECL 155 10 – – 15 – 200 – 4 °C K mJ 1) based on 250.000 switching cycles Supply Output (Hall Sensor Supply) 16.4.59 16.4.60 VDROP_Supply – VSUPPLY 2.7 – – 300 18.0 mV V 16.4.61 16.4.62 16.4.63 16.4.64 Leakage current Switch ON time Switch OFF time Overcurrent shutdown threshold IQL_SUPPLY tON_SUPPLY tOFF_SUPPLY ISD_SUPPLY -5 – – -80 – – – -40 – 200 100 -20 μA μs μs mA ISupply = -18 mA; 3.9 V < VS < 13.5 V 3.9 V < VS < 27.0 V; for t < 0.4 s: 27.0 V < VS < 40.0 V; VSupply = 0 V CSN high to SUPPLY CSN high to SUPPLY – Data Sheet 39 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. 16.4.65 16.4.66 Parameter Switch ON overcurrent shutdown blanking time Shutdown filter time Symbol Min. Limit Values Typ. – 18 Max. 140 26 μs μs – overcurrent will be indicated/shutdown will be initiated after continuous detection of overcurrent condition 1) 1) Unit Conditions tblank_ON _SUPPLY 60 10 tdSDHSUPPLY 16.4.67 16.4.68 Thermal shutdown temp. Thermal shutdown temp. hysteresis Static Drain-Source ON-Resistance TjSD_SUPPLY TjSD _SUPPLY_hys 155 10 175 15 200 – °C K LED Driver (HS-LED) 16.4.69 RDSONHS_LED – – – 8.5 – – – -80 18 20.0 – – 100 100 -50 26 Ω Ω μA μs μs mA μs 16.4.70 16.4.71 16.4.72 16.4.73 16.4.74 Leakage current Switch ON time Switch OFF time Overcurrent shutdown threshold Overcurrent shutdown filter time IHS_LED tONHS_LED tOFFHS_LED ISDHS_LED tdSDHS_LED -5 – – -120 10 TJ = 150 °C; IHS-LED = -45 mA TJ = 25°C; IHS-LED = -45 mA VHS_LED = 0 V CSN high to HS_LED on CSN high to HS_LED off – overcurrent will be indicated/shutdown will be initiated after continuous detection of overcurrent condition 1) 1) 16.4.75 16.4.76 Thermal shutdown temp. Thermal shutdown temp. hysteresis Receiver threshold voltage, recessive to dominant edge Receiver dominant state Receiver threshold voltage, dominant to recessive edge Receiver recessive state Receiver center voltage TjSDHS_LED TjSDHS_hys 155 – 175 10 200 – °C K LIN Bus Receiver 16.4.77 Vbus,rd 0.42 × 0.48 × – V – VS – – VS – 0.42 × V (LIN Spec 1.3 (2.0); Line 10.1.9 (3.1.9)) 16.4.78 16.4.79 Vbusdom Vbus,dr VS 0.52 × 0.58 × V VS 0.58 × – VS – 0.525 × VS V V Vbus,rec < Vbus < 27 V 16.4.80 16.4.81 Vbusrec Vbuscent VS 0.475 × VS 0.5 × (LIN Spec 1.3 (2.0); Line 10.1.10 (3.1.10)) (LIN Spec 1.3 (2.0); Line 10.1.11 (3.1.11)) VS Data Sheet 40 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. 16.4.82 Parameter Receiver hysteresis Symbol Min. Limit Values Typ. Max. V 0.02 × 0.04 × 0.1 × Unit Conditions Vbus,hys VS VS VS Vbus,hys = Vbus,rec - Vbus,dom (LIN Spec 1.3 (2.0); Line 10.1.12 (3.1.12)) 16.4.83 16.4.84 Wake-up threshold voltage RxD filter time Vwake tRxD_filter 0.4 × 0.5 × 0.6 × V µs – 1) VS – VS 0.85 VS – Note: RC filter between LIN and RxD signal LIN Bus Transmitter 16.4.85 16.4.86 Bus serial diode voltage drop Bus dominant output voltage Vserdiode Vbus,dom 0.4 – 0.7 – 1.0 1.2 V V VTxD = high Level VTxD = 0 V; VS = 7 V; RL = 500 Ω; (LIN Spec 1.3; Line 10.1.13) – – 2.0 V VS = 18 V; RL = 500 Ω; (LIN Spec 1.3; Line 10.1.14) 16.4.87 Bus dominant output voltage Vbus,dom 0.6 – – V VTxD = 0 V; VS = 7 V; RL = 1 kΩ; (LIN Spec 1.3; Line 10.1.15) 0.8 – – V VS = 18 V; RL = 1 kΩ; (LIN Spec 1.3; Line 10.1.16) Vbus,short = 18 V; (LIN Spec 1.3 (2.0); Line 10.1.4 (3.1.4)) 16.4.88 Bus short circuit current (current limitation) Leakage current Ibus,sc 40 100 150 mA 16.4.89 Ibus,lk -500 -140 – μA VS = 0 V; Vbus = -8 V (LIN Spec 1.3 (2.0); Line 10.1.7 (3.1.7)) – 10 25 μA VS = 0 V; Vbus = 18 V (LIN Spec 1.3 (2.0); Line 10.1.8 (3.1.8)) -1 – – mA VS = 18 V; Vbus = 0 V (LIN Spec 1.3 (2.0); Line 10.1.5 (3.1.5)) – – 20 μA VS = 8 V; Vbus = 18 V (LIN Spec 1.3 (2.0); Line 10.1.6 (3.1.6)) Data Sheet 41 Rev. 3.01, 2008-04-15 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. 16.4.90 Parameter Bus pull-up resistance Symbol Min. Limit Values Typ. 30 Max. 60 kΩ Active/Standby Mode (LIN Spec 1.3 (2.0); Line 10.2.2 (3.2.2)) Sleep mode; Vbus = 0 V 60% > Vbus > 40%; 1 μs < (τ = Rl × Cbus) < 5 μs; VS = 13.5 V; Active Mode (LIN Spec 1.3; Line 10.3.1) 40% < Vbus < 60%; 1 μs < (τ = Rl × Cbus) < 5 μs; VS = 13.5 V; Active Mode (LIN Spec 1.3; Line 10.3.1) 20 Unit Conditions Rbus 16.4.91 16.4.92 LIN output current Slew rate falling edge Ilin Sfslope 5 -3 20 – 60 -1 μA V/μs Dynamic LIN Transceiver Characteristics3) 16.4.93 Slew rate rising edge Srslope 1 – 3 V/μs 16.4.94 Slope symmetry tslopesym -5 – 5 μs tfslope - trslope; VS = 13.5 V (LIN Spec 1.3; Line 10.3.3) 16.4.95 16.4.96 16.4.97 Propagation delay TxD LOW to bus Propagation delay TxD HIGH to bus Propagation delay Bus dominant to RxD LOW Propagation delay Bus recessive to RxD HIGH Receiver delay symmetry td(L),T td(H),T td(L),R – – – 1 1 1 4 4 6 μs μs μs (LIN Spec 1.3; Line 10.3.6) (LIN Spec 1.3; Line 10.3.6) CRxD = 20 pF; RRxD = 2.4 kΩ (LIN Spec 1.3; Line 10.3.7) 16.4.98 td(H),R – 1 6 μs CRxD = 20 pF; RRxD = 2.4 kΩ (LIN Spec 1.3; Line 10.3.7) 16.4.99 tsym,R -2 – 2 μs tsym,R = td(L),R - td(H),R (LIN Spec 1.3; Line 10.3.8) 16.4.100 Transmitter delay symmetry 16.4.101 Wake-up delay time 16.4.102 TxD dominant time out tsym,T -2 – 2 μs tsym,T = td(L),T - td(H),T (LIN Spec 1.3; Line 10.3.9) twake ttimeout 30 – 6 100 – 12 150 170 20 μs μs ms Tj ≤ 125 °C Tj ≤ 150 °C VTxD = 0 V Rev. 3.01, 2008-04-15 Data Sheet 42 TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Min. 16.4.103 TxD dominant time out recovery time 16.4.104 Duty cycle D1 Limit Values Typ. 10 Max. – μs – Unit Conditions ttorec VTxD = 5 V1) Transfer Rate 20 kbit/s; 1 μs < τ = RL × Cbus < 5 μs D1 0.396 – – μs duty cycle 1: THRec(max) = 0.744 × VS; THDom(max) = 0.581 × VS; VS = 7.0 … 18 V; tbit = 50 μs; D1 = tbus_rec(min) / 2 tbit; (LIN Spec 2.0; Line 3.3.1) duty cycle 2: THRec(min) = 0.422 × VS; THDom(min) = 0.284 × VS; VS = 7.6 … 18 V; tbit = 50 μs; D2 = tbus_rec(max) / 2 tbit; (LIN Spec 2.0; Line 3.3.2) duty cycle 3: THRec(max) = 0.778 × VS; THDom(max) = 0.616 × VS; VS = 7.0 … 18 V; tbit = 96 μs; D3 = tbus_rec(min) / 2 tbit; (LIN Spec 2.0; Line 3.4.1) duty cycle 4: THRec(min) = 0.389 × VS; THDom(min) = 0.251 × VS; VS = 7.6 … 18 V; tbit = 96 μs; D4 = tbus_rec(max) / 2 tbit; (LIN Spec 2.0; Line 3.4.2) – – – – – – Rev. 3.01, 2008-04-15 16.4.105 Duty cycle D2 D2 – – 0.581 μs Transfer Rate 10.4 kbit/s; 1 μs < τ = RL × Cbus < 5 μs 16.4.106 Duty cycle D3 D3 0.417 – – μs 16.4.107 Duty cycle D4 D4 – – 0.590 μs SPI Data Input Timing1) 16.4.108 Clock period 16.4.109 16.4.110 16.4.111 16.4.112 16.4.113 tpCLK Clock high time tCLKH Clock low time tCLKL Clock low before CSN low tbef CSN setup time tlead CLK setup time tlag 250 125 125 125 250 250 43 – – – – – – – – – – – – ns ns ns ns ns ns Data Sheet TLE7810G General Product Characteristics Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Min. 125 50 50 – – – Limit Values Typ. – – – – – – Max. – – – 50 50 10 ns ns ns ns ns μs – – – – – – Unit Conditions tbeh 16.4.115 DI setup time tDISU 16.4.116 DI hold time tDIHO 16.4.117 Input signal rise time at pin trIN 16.4.114 Clock low after CSN high DI, CLK and CSN 16.4.118 Input signal fall time at pin tfIN DI, CLK and CSN 16.4.119 Delay time for mode tfIN change from Normal Mode to Sleep Mode 16.4.120 CSN high time Data Output Timing 1) tCSN(high) trDO tfDO tENDO tDISDO VAREF Vbat_fs Rbat_sense bw 10 – – – – 2.45 19.2 0.8 – -0.5 -300 – 30 30 – – 2.5 20 1.6 50 – – – 80 80 50 50 2.55 20.8 2.2 – 0.5 300 μs ns ns ns ns V V MΩ kHz μA mV – 16.4.121 DO rise time 16.4.122 DO fall time 16.4.123 DO enable time 16.4.124 DO disable time 16.4.125 ADC reference voltage 16.4.126 Max. measurement input voltage (full scale) 16.4.127 Measurement input impedance 16.4.128 Vbat_sense input filter bandwidth 16.4.129 Measurement input leakage current 16.4.130 Measurement accuracy after μController-based calibration 16.4.131 Settling time CL = 100 pF CL = 100 pF low impedance high impedance 4) ADC Measurement Interface (general) interconnect ADC Battery Voltage Measurement Interface, VBAT_SENSE – measurement I/F = on 1) Ibat_sense – measurement I/F = off; Vbat_sense = 13.5 V 4 < Vbat_sense < Vbat_fs; VCC ≥ 4.5 V 4) Tset – – 30 μs CSN high to settled output voltage VA ADC Temperature Measurement Interface 16.4.132 Temp. Measurement Range 16.4.133 Temp. sensor offset voltage 16.4.134 Temp. coefficient TJ m0 m1 -40 – – – 3.82 5.94 150 – – °C V mV/K via on-chip sensor 1) VA = m0 - m1 x TJ 1) Data Sheet 44 Rev. 3.01, 2008-04-15 TLE7810G Timing Diagrams Table 14 Electrical Characteristics (cont’d) VS = 13.5 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Min. 16.4.135 Measurement accuracy after μController-based calibration 16.4.136 Settling time Limit Values Typ. – Max. 15 °C -40 °C < TJ < 150 °C -15 Unit Conditions TJ Tset – – 30 μs 4) after measurement mode change; CSN “high” to settled output voltage at interconnect VA 1) 2) 3) 4) Not subject to production test, specified by design. normal operation continuous current should not exceed 300mA (for each low-side LS1 and LS2) Production testing in 20 kbit/s mode Tested on wafer level only. 17 Timing Diagrams CSN high to low: DO is enabled. Status information transferred to output shift register CSN time CSN low to high: data from shift register is transferred to output functions CLK time Actual data DI FI 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DI: will accept data on the falling edge of CLK signal Previous status DO FO 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 --------------- DO: will change state on the rising edge of CLK signal e.g. HS switch Old data Actual data time New data FI 01 ++ time Actual status FO 0 1 time Figure 13 SPI-Data Transfer Timing Data Sheet 45 Rev. 3.01, 2008-04-15 TLE7810G Timing Diagrams Figure 14 SPI-Input Timing tWD tCWmax tCWmin closed window tOWmax tOWmin open window safe trigger area t / [tWDPER] Figure 15 Watchdog Time-Out Definitions Data Sheet 46 Rev. 3.01, 2008-04-15 TLE7810G Timing Diagrams tCW WD Trigger tCW tOW tOW tCW +tOW tLW tLW tCW tOW tCW tLW tCW tOW Reset Out t RDx t Watchdog timer reset t normal operation timeout (too long) normal operation timeout (too short) normal operation Figure 16 Watchdog Timing Diagram VCC VRTx t < tRR WD Trigger tRD1 tLW t LW tCW t OW tRDx tLW tCW t Reset Out tRDx tRR t Watchdog timer reset t start up normal operation undervoltage start up t Figure 17 Reset Timing Diagram Data Sheet 47 Rev. 3.01, 2008-04-15 TLE7810G Timing Diagrams VCC VTxD GND td(L),T VS t d(H),T t Vbus GND Vbus,rd Vbus,dr td(L),R VCC t d(H),R t VRxD 0.3*VCC GND t d(L),TR td(H),TR 0.7*VCC t Figure 18 LIN Dynamic Characteristics Timing Diagram Data Sheet 48 Rev. 3.01, 2008-04-15 TLE7810G Application Information 18 18.1 Application Information Application Diagram Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device LIN GND 1k LIN GND VBAT_SENSE VS 10uF MON1 MON2 MON3 MON4 >1k >1k >1k >1k VBAT MON5/HS_LED LS 1 220nF M TLE7810G VDDC 100nF LS 2 Logic Level FET e.g. IPD15No6S2L-64 VCC VDDP 1uF PWM SUPPLY Double Hall Sensor e.g. TLE4966 Speed Direction CCPOS0 CCPOS1 Figure 19 Application Diagram Note: This is a very simplified example of an application circuit. The function must be verified in the real application. Note: For inverse-polarity protection / protection against ISO pulses the diode and the 10µF capacitor is required. 18.2 • • • Hints for Unused Pins SUPPLY: connect to VS MON1/2/3/4: connect to GND or leave open MON5/HS-LED, LIN: leave open Data Sheet 49 Rev. 3.01, 2008-04-15 TLE7810G Application Information 18.3 Flash Program Mode via LIN-Fast-Mode For flash programming the transmission rate of the integrated LIN transceiver can be changed to maximum 115 kBaud via SPI command. A dedicated BROM routine of the XC866 takes care of periodically servicing the watchdog during this LIN-Fast-Mode. Further details are available in the XC866 User’s Manual. MSB LSB Input Data 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 LIN FLASH mode on LIN FLASH mode off Figure 20 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 LIN Flash mode SPI command 18.4 • • • • • • Thermal Resistance (8) TJ = TA + (PD × RthJA) TJ = Junction temperature [°C] TA = Ambient temperature [°C] PD = Total chip power dissipation [W] PINT = Chip internal power dissipation [W] PIO = Power dissipation caused by I/O currents [W] RthJA = Package thermal resistance [K/W]; junction-ambient The total power dissipation can be calculated from: PD = PINT + PIO (9) 18.5 ESD Tests Tests for ESD robustness according to IEC61000-4-2 “gun test” (150pF, 330Ω) have been performed. The results and test condition are available in a test report. Table 15 ESD “GUN test” Result ≥ +8 ≤ -8 Unit kV kV Remarks 1) 1) Performed Test ESD at pin LIN, VS, MON4 versus GND ESD at pin LIN, VS, MON4 versus GND Positive pulse Negative pulse 1) ESD susceptibility “ESD GUN” according LIN EMC 1.3 Test Specification, Section 4.3. (IEC 61000-4-2) -Tested by external test house (IBEE Zwickau, EMC Test report Nr. ). Data Sheet 50 Rev. 3.01, 2008-04-15 TLE7810G Package Outlines 19 Package Outlines 0.2 -0.1 2.65 MAX. 0.35 x 45˚ 2.45 -0.2 1.27 0.35 +0.15 2) 0.1 0.2 28x 15 0.4 +0.8 10.3 ±0.3 28 1 Index Marking 1) 2) 18.1 -0.4 1) 14 Does not include plastic or metal protrusion of 0.15 max. per side Does not include dambar protrusion of 0.05 max. per side 8˚ MAX. 7.6 -0.2 1) 0.23 +0.09 GPS05123 Figure 21 PG-DSO-28-21 (Plastic Dual Small Outline Package) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 51 Dimensions in mm Rev. 3.01, 2008-04-15 TLE7810G Revision History 20 Revision 3.01 3.00 Revision History Date 2008-04-15 2008-04-04 Changes Chapter 16.3 Thermal Resistance - corrected RthJSP (16.3.1) Initial datasheet version Data Sheet 52 Rev. 3.01, 2008-04-15 Edition 2008-04-15 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.