550

Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531 and 520/521∆ Supporting Hyper-Threading Technology1 Datasheet On 90 nm Process in 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ May 2005 Document Number: 302351-004 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Pentium® 4 processor in the 775-land package on 90 nm process may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. 1 Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting Hyper-Threading Technology and an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http:/ /www.intel.com/info/hyperthreading/ for more information including details on which processors support HT Technology. ∆ ΦIntel® Extended Memory 64 Technology (Intel® EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support EM64T or consult with your system vendor for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2004–2005 Intel Corporation. 2 Datasheet Contents Contents 1 Introduction.................................................................................................................................... 11 1.1 1.2 2 2.1 2.2 2.3 Terminology ........................................................................................................................ 12 1.1.1 Processor Packaging Terminology ........................................................................ 12 References ......................................................................................................................... 13 FSB and GTLREF............................................................................................................... 15 Power and Ground Lands................................................................................................... 15 Decoupling Guidelines........................................................................................................ 15 2.3.1 VCC Decoupling .................................................................................................... 16 2.3.2 FSB GTL+ Decoupling........................................................................................... 16 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16 Voltage Identification .......................................................................................................... 17 2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19 Reserved, Unused, FC and TESTHI Signals...................................................................... 20 FSB Signal Groups ............................................................................................................. 21 GTL+ Asynchronous Signals ..............................................................................................22 Test Access Port (TAP) Connection ................................................................................... 23 FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23 Absolute Maximum and Minimum Ratings ......................................................................... 24 Processor DC Specifications ..............................................................................................24 VCC Overshoot Specification ............................................................................................. 33 2.12.1 Die Voltage Validation ........................................................................................... 33 GTL+ FSB Specifications....................................................................................................34 Package Mechanical Drawing ............................................................................................ 35 Processor Component Keep-Out Zones............................................................................. 39 Package Loading Specifications......................................................................................... 39 Package Handling Guidelines............................................................................................. 39 Package Insertion Specifications........................................................................................ 40 Processor Mass Specification............................................................................................. 40 Processor Materials ............................................................................................................ 40 Processor Markings ............................................................................................................ 40 Processor Land Coordinates ..............................................................................................41 Processor Land Assignments ............................................................................................. 43 Alphabetical Signals Reference .......................................................................................... 66 Processor Thermal Specifications ...................................................................................... 75 5.1.1 Thermal Specifications .......................................................................................... 75 5.1.2 Thermal Metrology ................................................................................................. 79 Processor Thermal Features ..............................................................................................79 5.2.1 Thermal Monitor..................................................................................................... 79 5.2.2 Thermal Monitor 2.................................................................................................. 80 Electrical Specifications ................................................................................................................. 15 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 5 5.1 Package Mechanical Specifications ..............................................................................................35 Land Listing and Signal Descriptions ............................................................................................ 43 Thermal Specifications and Design Considerations ...................................................................... 75 5.2 Datasheet 3 Contents 5.2.3 5.2.4 5.2.5 5.2.6 5.2.7 6 6.1 6.2 On-Demand Mode ................................................................................................. 81 PROCHOT# Signal................................................................................................ 82 THERMTRIP# Signal............................................................................................. 82 TCONTROL and Fan Speed Reduction.................................................................... 82 Thermal Diode ....................................................................................................... 83 Features ........................................................................................................................................ 85 Power-On Configuration Options........................................................................................ 85 Clock Control and Low Power States ................................................................................. 85 6.2.1 Normal State.......................................................................................................... 86 6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86 6.2.3 Stop-Grant State.................................................................................................... 87 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88 Mechanical Specifications .................................................................................................. 90 7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 90 7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 91 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly............................................................................................. 91 Electrical Requirements...................................................................................................... 91 7.2.1 Fan Heatsink Power Supply .................................................................................. 91 Thermal Specifications ....................................................................................................... 93 7.3.1 Boxed Processor Cooling Requirements............................................................... 93 7.3.2 Variable Speed Fan ............................................................................................... 95 7 Boxed Processor Specifications .................................................................................................... 89 7.1 7.2 7.3 4 Datasheet Contents Figures 2-1 2-2 2-3 2-4 3-1 3-2 3-3 3-4 3-5 3-6 3-7 4-1 4-2 5-1 5-2 5-3 5-4 6-1 7-1 7-2 7-3 7-4 7-5 7-6 7-7 7-8 7-9 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30 VCC Overshoot Example Waveform .......................................................................................... 33 Processor Package Assembly Sketch ........................................................................................ 35 Processor Package Drawing 1 ................................................................................................... 36 Processor Package Drawing 2 ................................................................................................... 37 Processor Package Drawing 3 ................................................................................................... 38 Processor Top-Side Marking Example ....................................................................................... 40 Processor Top-Side Marking Example for Processors Supporting Intel® EM64T ...................... 41 Processor Land Coordinates (Top View).................................................................................... 42 Landout Diagram (Top View – Left Side).................................................................................... 44 Landout Diagram (Top View – Right Side) ................................................................................. 45 Thermal Profile for Processors with PRB = 1 ............................................................................. 77 Thermal Profile for Processors with PRB = 0 ............................................................................. 78 Case Temperature (TC) Measurement Location ........................................................................ 79 Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81 Processor Low Power State Machine......................................................................................... 87 Mechanical Representation of the Boxed Processor.................................................................. 89 Space Requirements for the Boxed Processor (Side View) ....................................................... 90 Space Requirements for the Boxed Processor (Top View) ........................................................ 90 Space Requirements for the Boxed Processor (Overall View) ................................................... 91 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92 Baseboard Power Header Placement Relative to Processor Socket ......................................... 93 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94 Boxed Processor Fan Heatsink Set Points................................................................................. 95 Datasheet 5 Contents Tables 1-1 References ................................................................................................................................. 13 2-1 Core Frequency to FSB Multiplier Configuration ........................................................................ 16 2-2 Voltage Identification Definition .................................................................................................. 18 2-3 FSB Signal Groups..................................................................................................................... 21 2-4 Signal Characteristics ................................................................................................................. 22 2-5 Signal Reference Voltages ......................................................................................................... 22 2-6 BSEL[2:0] Frequency Table for BCLK[1:0] ................................................................................. 23 2-7 Processor DC Absolute Maximum Ratings ................................................................................ 24 2-8 Voltage and Current Specifications ............................................................................................ 25 2-9 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors ........................... 27 2-10 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors ........................... 29 2-11 GTL+ Asynchronous Signal Group DC Specifications .............................................................. 31 2-12 GTL+ Signal Group DC Specifications ....................................................................................... 31 2-13 PWRGOOD and TAP Signal Group DC Specifications .............................................................. 32 2-14 VTTPWRGD DC Specifications.................................................................................................. 32 2-15 BSEL [2:0] and VID[5:0] DC Specifications ................................................................................ 32 2-16 BOOTSELECT DC Specifications .............................................................................................. 32 2-17 VCC Overshoot Specifications ................................................................................................... 33 2-18 GTL+ Bus Voltage Definitions .................................................................................................... 34 3-1 Processor Loading Specifications .............................................................................................. 39 3-2 Package Handling Guidelines .................................................................................................... 39 3-3 Processor Materials .................................................................................................................... 40 4-1 Alphabetical Land Assignments ................................................................................................. 46 4-2 Numerical Land Assignment....................................................................................................... 56 4-3 Signal Description....................................................................................................................... 66 5-1 Processor Thermal Specifications .............................................................................................. 76 5-2 Thermal Profile for Processors with PRB = 1 ............................................................................. 77 5-3 Thermal Profile for Processors with PRB = 0 ............................................................................. 78 5-4 Thermal Diode Parameters ........................................................................................................ 83 5-5 Thermal Diode Interface ............................................................................................................. 83 6-1 Power-On Configuration Option Signals..................................................................................... 85 7-1 Fan Heatsink Power and Signal Specifications .......................................................................... 92 7-2 Fan Heatsink Power and Signal Specifications .......................................................................... 96 § 6 Datasheet Contents Revision History Revision No. -001 • Initial release • Added specifications for processor number 550 with PRB = 0 -002 • Added support for Execute Disable Bit capability • Added Icc Enhanced Auto Halt specifications • Added support for Thermal Monitor 2 -003 • Added specifications for processor number 570 with PRB = 1 • Added specifications for processor numbers 571, 561, 551, 541, 531, and 521. • Modified Table 2-3, “FSB Signal Groups“. -004 • Added Note 5 to Table 2-18. • Updated Figure 3-5 Top SIde Marking Example and added Figure 3-6. • Minor edits throughout for clarity. May 2005 November 2004 September 2004 Description Date of Release June 2004 § Datasheet 7 Contents 8 Datasheet Contents Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 • Available at 3.80 GHz, 3.60 GHz, 3.40 GHz, 3.20 GHz, 3 GHz, and 2.80 GHz • Supports Hyper-Threading Technology1 (HT Technology) for all frequencies with 800 MHz front side bus (FSB) • 16-KB Level 1 data cache • 1-MB Advanced Transfer Cache (on-die, fullspeed Level 2 (L2) cache) with 8-way associativity and Error Correcting Code (ECC) • Intel® Pentium® 4 processors 571, 561, 551, 541, • Supports Execute Disable Bit capability • Binary compatible with applications running on • 144 Streaming SIMD Extensions 2 (SSE2) instructions 531, and 521 support Intel® Extended Memory 64 Technology (EM64T)Φ • 13 Streaming SIMD Extensions 3 (SSE3) instructions • Enhanced floating point and multimedia unit for enhanced video, audio, encryption, and 3D performance previous members of the Intel microprocessor line • • • • • • • Intel NetBurst® microarchitecture FSB frequency at 800 MHz Hyper-Pipelined Technology Advance Dynamic Execution Very deep out-of-order execution Enhanced branch prediction Optimized for 32-bit applications running on advanced 32-bit operating systems • • • • Power Management capabilities System Management mode Multiple low-power states 8-way cache associativity provides improved cache hit rate on load/store operations • 775-land Package The Intel® Pentium® 4 processor family supporting Hyper-Threading Technology1 (HT Technology) delivers Intel's advanced, powerful processors for desktop PCs and entry-level workstations that are based on the Intel NetBurst® microarchitecture. The Pentium 4 processor is designed to deliver performance across applications and usages where end-users can truly appreciate and experience the performance. These applications include Internet audio and streaming video, image processing, video content creation, speech, 3D, CAD, games, multimedia, and multitasking user environments. Intel® Extended Memory 64 Technology enables the Intel® Pentium® processor to execute operating systems and applications written to take advange of the Intel EM64TΦ. § Datasheet 9 Contents 10 Datasheet Introduction 1 Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Grid Array (FC-LGA4) package technology, and plugs into a 775LGA socket. The Pentium 4 processor in the 775-land package, like its predecessor, the Pentium 4 processor in the 478-pin package, is based on the same Intel 32-bit microarchitecture and maintains the tradition of compatibility with IA-32 software. Note: In this document the Pentium 4 processor on 90 nm process in the 775-land package is also referred to as the processor. The Pentium 4 processor on 90 nm process in the 775-land package supports Hyper-Threading Technology1. Hyper-Threading Technology allows a single, physical processor to function as two logical processors. While some execution resources (such as caches, execution units, and buses) are shared, each logical processor has its own architecture state with its own set of general-purpose registers, control registers to provide increased system responsiveness in multitasking environments, and headroom for next generation multithreaded applications. Intel recommends enabling Hyper-Threading Technology with Microsoft Windows* XP Professional or Windows* XP Home, and disabling Hyper-Threading Technology via the BIOS for all previous versions of Windows operating systems. For more information on Hyper-Threading Technology, see http://www.intel.com/info/hyperthreading. Refer to Section 6.1, for Hyper-Threading Technology configuration details. The Intel Pentium 4 processor 571, 561, 541, 531, and 521 support Intel® Extended Memory 64 Technology (EM64T)Φ as an enhancement to Intel’s IA-32 architecture. This enhancement enables the processor to execute operating systems and applications written to take advantage of Intel EM64T. With appropriate 64 bit supporting hardware and software, platforms based on an Intel processor supporting Intel® EM64T can enable use of extended virtual and physical memory. Further details on the 64-bit extension architecture and programming model is provided in the Intel® Extended Memory 64 Technology Software Developer Guide at: http://developer.intel.com/ technology/64bitextensions/. In addition to supporting all the existing Streaming SIMD Extensions 2 (SSE2), there are 13 new instructions that further extend the capabilities of Intel processor technology. These new instructions are called Streaming SIMD Extensions 3 (SSE3). These new instructions enhance the performance of optimized applications for the digital home such as video, image processing, and media compression technology. 3D graphics and other entertainment applications such as gaming will have the opportunity to take advantage of these new instructions as platforms with the Pentium 4 processor in the 775-land package and SSE3 become available in the market place. The processor’s Intel NetBurst microarchitecture FSB uses a split-transaction, deferred reply protocol like the Pentium 4 processor. The Intel NetBurst microarchitecture FSB uses SourceSynchronous Transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 6.4 GB/s. Datasheet 11 Introduction The Pentium 4 processor on 90 nm process in the LGA775-land package will also include the Execute Disable Bit capability previously available in Intel® Itanium® processors. This feature combined with a support operating system allows memory to be marked as executable or nonexecutable. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel® Architecture Software Developer's Manual for more detailed information. Intel will enable support components for the processor including heatsink, heatsink retention mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be completed from the top of the baseboard and should not require any special tooling. The processor includes an address bus powerdown capability that removes power from the address and data pins when the FSB is not in use. This feature is always enabled on the processor. 1.1 Terminology A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level). “FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O. 1.1.1 Processor Packaging Terminology Commonly used terms are explained here for clarification: • Pentium 4 processor on 90 nm process in the 775-land package — Processor in the FCLGA4 package with a 1-MB L2 cache. • Processor — For this document, the term processor is the generic form of the Pentium 4 processor in the 775-land package. • Keep-out zone — The area on or near the processor that system design can not use. • Intel 925X/915G/915P Express chipsets — Chipsets that supports DDR and DDR2 memory technology for the Pentium 4 processor in the 775-land package. • Processor core — Processor core die with integrated L2 cache. • FC-LGA4 package — The Pentium 4 processor in the 775-land package is available in a FlipChip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with an integrated heat spreader (IHS). • LGA775 socket — The Pentium 4 processor in the 775-land package mates with the system board through a surface mount, 775-land, LGA socket. • Integrated heat spreader (IHS) —A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. 12 Datasheet Introduction • Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical features for heatsink attach, a retention mechanism is required. Component thermal solutions should attach to the processor via a retention mechanism that is independent of the socket. • Storage conditions—Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. • Functional operation—Refers to normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are satisfied. 1.2 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. References Document Document Numbers/ Location http://developer.intel.com/ design/Pentium4/ specupdt/302352.htm http://developer.intel.com/ design/Pentium4/guides/ 302553.htm http://developer.intel.com/ design/Pentium4/guides/ 302356.htm Intel® Pentium® 4 Processor on 90 nm Process Specification Update Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket Intel® Architecture Software Developer's Manual IA-32 Intel® Architecture Software Developer's Manual Volume 1: Basic Architecture IA-32 Intel® Architecture Software Developer's Manual Volume 2A: Instruction Set Reference Manual A–M IA-32 Intel® Architecture Software Developer's Manual Volume 2B: Instruction Set Reference Manual, N–Z IA-32 Intel® Architecture Software Developer's Manual Volume 3: System Programming Guide IA-32 Intel® Architecture and Intel® Extended Memory 64 Software Developer's Manual Documentation Changes http://developer.intel.com/ design/pentium4/ manuals/index_new.htm http://developer.intel.com/ design/pentium4/ manuals/index_new.htm § Datasheet 13 Introduction 14 Datasheet Electrical Specifications 2 Electrical Specifications This chapter describes the electrical characteristics of the processor interfaces and signals. DC electrical characteristics are provided. 2.1 FSB and GTLREF Most processor FSB signals use Gunning Transceiver Logic (GTL+) signaling technology. Platforms implement a termination voltage level for GTL+ signals defined as VTT. VTT must be provided via a separate voltage source and not be connected to VCC. This configuration allows for improved noise tolerance as processor frequency increases. Because of the speed improvements to the data and address bus, signal integrity and platform design methods have become more critical than with previous processor families. The GTL+ inputs require a reference voltage (GTLREF) that is used by the receivers to determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the system board (see Table 2-18 for GTLREF specifications). Termination resistors are provided on the processor silicon and are terminated to VTT. Intel chipsets will also provide on-die termination, thus eliminating the need to terminate the bus on the system board for most GTL+ signals. Some GTL+ signals do not include on-die termination and must be terminated on the system board. See Table 2-4 for details regarding these signals. The GTL+ bus depends on incident wave switching. Therefore, timing calculations for GTL+ signals are based on flight time as opposed to capacitive deratings. Analog signal simulation of the FSB, including trace lengths, is highly recommended when designing a system. 2.2 Power and Ground Lands For clean on-chip power distribution, the Pentium 4 processor in the 775-land package has 226 VCC (power), 24 VTT and 273 VSS (ground) lands. All power lands must be connected to VCC, all VTT lands must be connected to VTT, while all VSS lands must be connected to a system ground plane. The processor VCC lands must be supplied the voltage determined by the Voltage IDentification (VID) signals. 2.3 Decoupling Guidelines Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large current swings between low and full power states. This may cause voltages on power planes to sag below their minimum values if bulk decoupling is not adequate. Care must be taken in the board design to ensure that the voltage provided to the processor remains within the specifications listed in Table 2-8. Failure to do so can result in timing violations or reduced lifetime of the component. For further information and design guidelines, refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket. Datasheet 15 Electrical Specifications 2.3.1 VCC Decoupling Regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR) and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the large current swings when the part is powering on, or entering/exiting low power states, must be provided by the voltage regulator solution (VR). For more details on this topic, refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket. 2.3.2 FSB GTL+ Decoupling The Pentium 4 processor in the 775-land package integrates signal termination on the die as well as incorporating high frequency decoupling capacitance on the processor package. Decoupling must also be provided by the system baseboard for proper GTL+ bus operation. 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor. As in previous generation processors, the Pentium 4 processor in the 775-land package core frequency is a multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its default ratio during manufacturing. No user intervention is necessary, and the processor will automatically run at the speed indicated on the package. The Pentium 4 processor in the 775-land package uses a differential clocking implementation. For more information on the Pentium 4 processor in the 775-land package clocking, refer to the CK410/CK410M Clock Synthesizer/Driver Specification. Table 2-1. Core Frequency to FSB Multiplier Configuration Multiplication of System Core Frequency to FSB Frequency 1/14 1/15 1/16 1/17 1/18 1/19 NOTES: 1. 2. Individual processors operate only at or below the rated frequency. Listed frequencies are not necessarily committed production frequencies. Core Frequency (200 MHz BCLK/800 MHz FSB) 2.80 GHz 3 GHz 3.20 GHz 3.40 GHz 3.60 GHz 3.80 GHz Notes1, - 2 16 Datasheet Electrical Specifications 2.4 Voltage Identification The VID specification for the Pentium 4 processor in the 775-land package is supported by the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket. The voltage set by the VID signals is the reference VR output voltage to be delivered to the processor VCC pins. A minimum voltage is provided in Table 2-8 and changes with frequency. This allows processors running at a higher frequency to have a relaxed minimum voltage specification. The specifications have been set such that one voltage regulator can work with all supported frequencies. Individual processor VID values may be calibrated during manufacturing such that two devices at the same speed may have different VID settings. The Pentium 4 processor in the 775-land package uses six voltage identification signals, VID[5:0], to support automatic selection of power supply voltages. Table 2-2 specifies the voltage level corresponding to the state of VID[5:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to low voltage level. If the processor socket is empty (VID[5:0] = x11111), or the voltage regulation circuit cannot supply the voltage that is requested, it must disable itself. See the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for more details. Power source characteristics must be guaranteed to be stable when the supply to the voltage regulator is stable. The LL_ID[1:0] lands are used by the platform to configure the proper loadline slope for the processor. LL_ID[1:0] = 00 for the Pentium 4 processor in the 775-land package. The VTT_SEL land is used by the platform to configure the proper VTT voltage level for the processor. VTT_SEL = 1 for the Pentium 4 processor in the 775-land package. The GTLREF_SEL signal is used by the platform to select the appropriate chipset GTLREF level. GTLREF_SEL = 0 for the Pentium 4 processor in the 775-land package. LL_ID[1:0] and VTT_SEL are signals that are implemented on the processor package. That is, they are either connected directly to VSS or are open lands. Datasheet 17 Electrical Specifications Table 2-2. VID5 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VID4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 Voltage Identification Definition VID3 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 VID2 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 VID1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 VID0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 VID 0.8375 0.8500 0.8625 0.8750 0.8875 0.9000 0.9125 0.9250 0.9375 0.9500 0.9625 0.9750 0.9875 1.0000 1.0125 1.0250 1.0375 1.0500 1.0625 1.0750 1.0875 VR output off VR output off 1.1000 1.1125 1.1250 1.1375 1.1500 1.1625 1.1750 1.1875 1.2000 VID5 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VID4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 VID3 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 VID2 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 VID1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 VID0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 VID 1.2125 1.2250 1.2375 1.2500 1.2625 1.2750 1.2875 1.3000 1.3125 1.3250 1.3375 1.3500 1.3625 1.3750 1.3875 1.4000 1.4125 1.4250 1.4375 1.4500 1.4625 1.4750 1.4875 1.5000 1.5125 1.5250 1.5375 1.5500 1.5625 1.5750 1.5875 1.6000 18 Datasheet Electrical Specifications 2.4.1 Phase Lock Loop (PLL) Power and Filter VCCA and VCCIOPLL are power sources required by the PLL clock generators for the Pentium 4 processor in the 775-land package. Since these PLLs are analog, they require low noise power supplies for minimum jitter. Jitter is detrimental to the system: it degrades external I/O timings as well as internal core timings (i.e., maximum frequency). To prevent this degradation, these supplies must be low pass filtered from VTT. The AC low-pass requirements, with input at VTT are as follows: • • • • . < 0.2 dB gain in pass band < 0.5 dB attenuation in pass band < 1 Hz > 34 dB attenuation from 1 MHz to 66 MHz > 28 dB attenuation from 66 MHz to core frequency The filter requirements are illustrated in Figure 2-1. Figure 2-1. Phase Lock Loop (PLL) Filter Requirements 0.2 dB 0 dB –0.5 dB Forbidden Zone Forbidden Zone –28 dB –34 dB DC 1 Hz Passband fpeak 1 MHz 66 MHz High Frequency Band fcore Filter_Spec NOTES: 1. Diagram not to scale. 2. No specification exists for frequencies beyond fcore (core frequency). 3. fpeak, if existent, should be less than 0.05 MHz. Datasheet 19 Electrical Specifications 2.5 Reserved, Unused, FC and TESTHI Signals All RESERVED signals must remain unconnected. Connection of these signals to VCC, VSS, VTT, or to any other signal (including each other) can result in component malfunction or incompatibility with future processors. See Chapter 4 for a land listing of the processor and the location of all RESERVED signals. For reliable operation, always connect unused inputs or bidirectional signals to an appropriate signal level. In a system level design, on-die termination has been included on the Pentium 4 processor in the 775-land package to allow signals to be terminated within the processor silicon. Most unused GTL+ inputs should be left as no connects, as GTL+ termination is provided on the processor silicon. However, see Table 2-4 for details on GTL+ signals that do not include on-die termination. Unused active high inputs should be connected through a resistor to ground (VSS). Unused outputs can be left unconnected, however this may interfere with some test access port (TAP) functions, complicate debug probing, and prevent boundary scan testing. A resistor must be used when tying bidirectional signals to power or ground. When tying any signal to power or ground, a resistor will also allow for system testability. For unused GTL+ input or I/O signals, use pull-up resistors of the same value as the on-die termination resistors (RTT). Refer to Table 2-18 for more details. TAP, GTL+ Asynchronous inputs, and GTL+ Asynchronous outputs do not include on-die termination. Inputs and used outputs must be terminated on the system board. Unused outputs may be terminated on the system board or left unconnected. Note that leaving unused outputs unterminated may interfere with some TAP functions, complicate debug probing, and prevent boundary scan testing. FCx signals are signals that are available for compatibility with other processors. The TESTHI signals must be tied to the processor VTT using a matched resistor, where a matched resistor has a resistance value within ±20% of the impedance of the board transmission line traces. For example, if the trace impedance is 60 Ω, then a value between 48 Ω and 72 Ω is required. The TESTHI signals may use individual pull-up resistors or be grouped together as detailed below. A matched resistor must be used for each group: • • • • • • • • TESTHI[1:0] TESTHI[7:2] TESTHI8 – cannot be grouped with other TESTHI signals TESTHI9 – cannot be grouped with other TESTHI signals TESTHI10 – cannot be grouped with other TESTHI signals TESTHI11 – cannot be grouped with other TESTHI signals TESTHI12 – cannot be grouped with other TESTHI signals TESTHI13 – cannot be grouped with other TESTHI signals 20 Datasheet Electrical Specifications 2.6 FSB Signal Groups The FSB signals have been combined into groups by buffer type. GTL+ input signals have differential input buffers, which use GTLREF as a reference level. In this document, the term "GTL+ Input" refers to the GTL+ input group as well as the GTL+ I/O group when receiving. Similarly, "GTL+ Output" refers to the GTL+ output group as well as the GTL+ I/O group when driving. With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals which are dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals which are relative to their respective strobe lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 2-3 identifies which signals are common clock, source synchronous, and asynchronous. Table 2-3. FSB Signal Groups Signal Group GTL+ Common Clock Input GTL+ Common Clock I/O Type Synchronous to BCLK[1:0] Synchronous to BCLK[1:0] Signals1 BPRI#, DEFER#, RS[2:0]#, RSP#, TRDY# AP[1:0]#, ADS#, BINIT#, BNR#, BPM[5:0]#, BR0#, DBSY#, DP[3:0]#, DRDY#, HIT#, HITM#, LOCK#, MCERR# Signals REQ[4:0]#, A[16:3]# GTL+ Source Synchronous I/O Synchronous to assoc. strobe A[35:17]# 3 3 Associated Strobe ADSTB0# ADSTB1# DSTBP0#, DSTBN0# DSTBP1#, DSTBN1# DSTBP2#, DSTBN2# DSTBP3#, DSTBN3# D[15:0]#, DBI0# D[31:16]#, DBI1# D[47:32]#, DBI2# D[63:48]#, DBI3# GTL+ Strobes GTL+ Asynchronous Input GTL+ Asynchronous Output GTL+ Asynchronous Input/Output TAP Input TAP Output FSB Clock Synchronous to TCK Synchronous to TCK Clock Synchronous to BCLK[1:0] ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]# A20M#, IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, SMI#, STPCLK#, RESET# FERR#/PBE#, IERR#, THERMTRIP# PROCHOT# TCK, TDI, TMS, TRST# TDO BCLK[1:0], ITP_CLK[1:0]2 VCC, VTT, VCCA, VCCIOPLL, VID[5:0], VSS, VSSA, GTLREF, COMP[1:0], RESERVED, TESTHI[13:0], THERMDA, THERMDC, VCC_SENSE, VSS_SENSE, BSEL[2:0], SKTOCC#, DBR#2, VTTPWRGD, BOOTSELECT, PWRGOOD, VTT_OUT_LEFT, VTT_OUT_RIGHT, VTT_SEL, LL_ID[1:0], FCx, VSS_MB_REGULATION, VCC_MB_REGULATION, MSID[1:0] Power/Other Datasheet 21 Electrical Specifications NOTES: 1. Refer to Section 4.2 for signal descriptions. 2. In processor systems where there is no debug port implemented on the system board, these signals are used to support a debug port interposer. In systems with the debug port implemented on the system board, these signals are no connects. 3. The value of these signals during the active-to-inactive edge of RESET# defines the processor configuration options. See Section 6.1 for details. Table 2-4. Signal Characteristics Signals with RTT A[35:3]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BINIT#, BNR#, BOOTSELECT1, BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DP[3:0]#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, HIT#, HITM#, LOCK#, MCERR#, PROCHOT#, REQ[4:0]#, RS[2:0]#, RSP#, TRDY# Open Drain Signals2 BSEL[2:0], VID[5:0], THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#, BR0#, TDO, VTT_SEL, LL_ID[1:0], MSID[1:0] NOTES: 1. 2. . Signals with no RTT A20M#, BCLK[1:0], BPM[5:0]#, BR0#, BSEL[2:0], COMP[1:0], FERR#/PBE#, IERR#, IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, PWRGOOD, RESET#, SKTOCC#, SMI#, STPCLK#, TDO, TESTHI[13:0], THERMDA, THERMDC, THERMTRIP#, VID[5:0], VTTPWRGD, GTLREF, TCK, TDI, TRST#, TMS The BOOTSELECT signal has a 500-5000 Ω pull-up to VTT rather than on-die termination. Signals that do not have RTT, nor are actively driven to their high-voltage level. Table 2-5. Signal Reference Voltages GTLREF BPM[5:0]#, LINT0/INTR, LINT1/NMI, RESET#, BINIT#, BNR#, HIT#, HITM#, MCERR#, PROCHOT#, BR0#, A[35:0]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DP[3:0]#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, LOCK#, REQ[4:0]#, RS[2:0]#, RSP#, TRDY# NOTES: 1. These signals also have hysteresis added to the reference voltage. See Table 2-13 for more information. VTT/2 BOOTSELECT, VTTPWRGD, A20M#, IGNNE#, INIT#, PWRGOOD1, SMI#, STPCLK#, TCK1, TDI1, TMS1, TRST#1 2.7 GTL+ Asynchronous Signals Legacy input signals such as A20M#, IGNNE#, INIT#, SMI#, and STPCLK# use CMOS input buffers. All of these signals follow the same DC requirements as GTL+ signals, however the outputs are not actively driven high (during a logical 0 to 1 transition) by the processor. These signals do not have setup or hold time specifications in relation to BCLK[1:0]. All of the GTL+ Asynchronous signals are required to be asserted/de-asserted for at least six BCLKs for the processor to recognize the proper signal state. See Section 6.2 for additional timing requirements for entering and leaving the low power states. 22 Datasheet Electrical Specifications 2.8 Test Access Port (TAP) Connection Due to the voltage levels supported by other components in the Test Access Port (TAP) logic, it is recommended that the Pentium 4 processor in the 775-land package be first in the TAP chain and followed by any other components within the system. A translation buffer should be used to connect to the rest of the chain unless one of the other components is capable of accepting an input of the appropriate voltage level. Similar considerations must be made for TCK, TMS, TRST#, TDI, and TDO. Two copies of each signal may be required, with each driving a different voltage level. 2.9 FSB Frequency Select Signals (BSEL[2:0]) The BSEL[2:0] signals are used to select the frequency of the processor input clock (BCLK[1:0]). Table 2-6 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset, and clock synthesizer. All agents must operate at the same frequency. The Pentium 4 processor in the 775-land package currently operates at a 533 MHz or 800 MHz FSB frequency (selected by a 133 MHz or 200 MHz BCLK[1:0] frequency). Individual processors will only operate at their specified FSB frequency. For more information about these signals, refer to Section 4.2. Table 2-6. BSEL[2:0] Frequency Table for BCLK[1:0] BSEL2 L L L L H H H H BSEL1 L L H H L L H H BSEL0 L H H L L H H L FSB Frequency RESERVED 133 MHz RESERVED 200 MHz RESERVED RESERVED RESERVED RESERVED Datasheet 23 Electrical Specifications 2.10 Absolute Maximum and Minimum Ratings Table 2-7 specifies absolute maximum and minimum ratings. Within functional operation limits, functionality and long-term reliability can be expected. At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these limits, but within the absolute maximum and minimum ratings, the device may be functional, but with its lifetime degraded depending on exposure to conditions exceeding the functional operation condition limits. At conditions exceeding absolute maximum and minimum ratings, neither functionality nor longterm reliability can be expected. Moreover, if a device is subjected to these conditions for any length of time then, when returned to conditions within the functional operating condition limits, it will either not function, or its reliability will be severely degraded. Although the processor contains protective circuitry to resist damage from static electric discharge, precautions should always be taken to avoid high static voltages or electric fields. Table 2-7. Processor DC Absolute Maximum Ratings Symbol VCC VTT TC TSTORAGE NOTES: 1. 2. 3. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must be satisfied. Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect the long-term reliability of the device. For functional operation, refer to the processor case temperature specifications. This rating applies to the processor and does not include any tray or packaging. Parameter Core voltage with respect to VSS FSB termination voltage with respect to VSS Processor case temperature Processor storage temperature Min –0.3 –0.3 See Section 5 –40 Max 1.55 1.55 See Section 5 +85 Unit V V °C °C Notes1, — — — 3, 4 2 4. 2.11 Processor DC Specifications The processor DC specifications in this section are defined at the processor core silicon and not at the package lands unless noted otherwise. See Chapter 4 for the signal definitions and signal assignments. Most of the signals on the processor FSB are in the GTL+ signal group. The DC specifications for these signals are listed in Table 2-12. Previously, legacy signals and Test Access Port (TAP) signals to the processor used low-voltage CMOS buffer types. However, these interfaces now follow DC specifications similar to GTL+. The DC specifications for these signal groups are listed in Table 2-11 and Table 2-13. Table 2-8 through Table 2-15 list the DC specifications for the Pentium 4 processor in the 775-land package and are valid only while meeting specifications for case temperature, clock frequency, and input voltages. Care should be taken to read all notes associated with each parameter. MSR_PLATFORM_BRV bit 18 is a Platform Requirement Bit (PRB) that indicates that the processor has specific platform requirements. 24 Datasheet Electrical Specifications Table 2-8. Voltage and Current Specifications (Sheet 1 of 2) Symbol VID range VID Processor Number Core Frequency VCC for 775_VR_CONFIG_04B processors VCC 570/571 560/561 550 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) VCC for 775_VR_CONFIG_04A processors 550/551 VCC 540/541 530/531 520/521 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 GHz (PRB = 0) 2.80 GHz (PRB = 0) ICC for processor with multiple VID 570/571 560/561 ICC 550 550/551 540/541 530/531 520/521 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 GHz (PRB = 0) 2.80 GHz (PRB = 0) ICC Stop-Grant 570/571 560/561 ISGNT 550 550/551 540/541 530/531 520/521 570/571 560/561 IENHANCED_AUTO_ HALT Parameter Min 1.200 Typ — Max 1.425 Unit V Notes1 2 Refer to Table 2-10 and Figure 2-3 V 3, 4, 5, 6 Refer to Table 2-9 and Figure 2-2 V 3, 4, 6, 7, 8 119 119 — — 119 78 78 78 78 A 9 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 GHz (PRB = 0) 2.80 GHz (PRB = 0) ICC Enhanced Auto Halt 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 GHz (PRB = 0) 2.80 GHz (PRB = 0) — 1.14 — — — 1.20 — — — — — — 56 56 56 40 40 40 40 37 37 31 31 40 40 ICC 1.26 580 3.5 A V mA A 15, 16 12 13, 14 A 10, 11, 15 550/551 540/541 530/531 520/521 A 11, 15 ITCC VTT VTT_OUT ICC ITT ICC TCC active FSB termination voltage (DC+AC specifications) DC Current that may be drawn from VTT_OUT per pin FSB termination current Datasheet 25 Electrical Specifications Table 2-8. Voltage and Current Specifications (Sheet 2 of 2) Symbol ICC_VCCA ICC_VCCIOPLL ICC_GTLREF NOTES: 1. 2. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and can not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note this differs from the VID employed by the processor during a power management event (Thermal Monitor 2 or Enhanced HALT State). These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is required. See Section 2.4 and Table 2-2 for more information. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe. Refer to Table 2-10 and Figure 2-3 for the minimum, typical, and maximum VCC allowed for a given current. The processor should not be subjected to any Vcc and Icc combination wherein VCC exceeds Vcc_max for a given current. 775_VR_CONFIG_04A and 775_VR_CONFIG_04B refer to voltage regulator configurations that are defined in the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket. Refer to Table 2-9 and Figure 2-2 for the minimum, typical, and maximum VCC allowed for a given current. The processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_max for a given current. These frequencies will operate in a system designed for 775_VR_CONFIG_04B processors. The power and ICC will be incrementally higher in this configuration due to the improved loadline and resulting higher VCC. Icc_max is specified at VCC_max. The current specified is also for AutoHALT State. Icc Stop-Grant and ICC Enhanced Auto Halt are specified at VCC_max. The maximum instantaneous current the processor will draw while the thermal control circuit is active as indicated by the assertion of PROCHOT# is the same as the maximum Icc for the processor. VTT must be provided via a separate voltage source and not be connected to VCC. This specification is measured at the land. Baseboard bandwidth is limited to 20 MHz. These parameters are based on design characterization and are not tested. This is maximum total current drawn from VTT plane by only the processor. This specification does not include the current coming from RTT (through the signal line). Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket to determine the total ITT drawn by the system. Parameter ICC FOR PLL LANDS ICC FOR I/O PLL LAND ICC for GTLREF Min — — — Typ — — — Max 120 100 200 Unit mA mA µA Notes1 15 15 15 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 26 Datasheet Electrical Specifications Table 2-9. VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors Voltage Deviation from VID Setting (V)1, 2, 3, 4 ICC (A) Maximum Voltage 1.70 mΩ 0.000 -0.009 -0.017 -0.026 -0.034 -0.043 -0.051 -0.060 -0.068 -0.077 -0.085 -0.094 -0.102 -0.111 -0.119 -0.128 -0.133 Typical Voltage 1.75 mΩ -0.025 -0.034 -0.043 -0.051 -0.060 -0.069 -0.078 -0.086 -0.095 -0.104 -0.113 -0.121 -0.130 -0.139 -0.148 -0.156 -0.162 Minimum Voltage 1.80 mΩ -0.050 -0.059 -0.068 -0.077 -0.086 -0.095 -0.104 -0.113 -0.122 -0.131 -0.140 -0.149 -0.158 -0.167 -0.176 -0.185 -0.190 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 78 NOTES: 1. 2. 3. 4. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. This table is intended to aid in reading discrete points on Figure 2-2. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. Datasheet 27 Electrical Specifications Figure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Icc [A] 0 VID - 0.000 10 20 30 40 50 60 70 VID - 0.025 Vcc Maximum VID - 0.050 VID - 0.075 Vcc [V] VID - 0.100 Vcc Typical VID - 0.125 Vcc Minimum VID - 0.150 VID - 0.175 VID - 0.200 NOTES: 1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. 2. This loadline specification shows the deviation from the VID set point. 3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. 4. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. 28 Datasheet Electrical Specifications Table 2-10. VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors Voltage Deviation from VID Setting (V)1, 2, 3, 4 ICC (A) Maximum Voltage 1.30 mΩ 0.000 -0.007 -0.013 -0.020 -0.026 -0.033 -0.039 -0.046 -0.052 -0.059 -0.065 -0.072 -0.078 -0.085 -0.091 -0.098 -0.104 -0.111 -0.117 -0.124 -0.130 -0.137 -0.143 -0.150 -0.155 Typical Voltage 1.35 mΩ -0.019 -0.026 -0.033 -0.039 -0.046 -0.053 -0.060 -0.066 -0.073 -0.080 -0.087 -0.093 -0.100 -0.107 -0.114 -0.120 -0.127 -0.134 -0.141 -0.147 -0.154 -0.161 -0.168 -0.174 -0.180 Minimum Voltage 1.40 mΩ -0.038 -0.045 -0.052 -0.059 -0.066 -0.073 -0.080 -0.087 -0.094 -0.101 -0.108 -0.115 -0.122 -0.129 -0.136 -0.143 -0.150 -0.157 -0.164 -0.171 -0.178 -0.185 -0.192 -0.199 -0.205 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 119 NOTES: 1. 2. 3. 4. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. This table is intended to aid in reading discrete points on Figure 2-2. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. Datasheet 29 Electrical Specifications Figure 2-3. VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Icc [A] 0 VID - 0.000 VID - 0.019 VID - 0.038 Vcc Maximum VID - 0.057 VID - 0.076 VID - 0.095 Vcc [V] VID - 0.114 VID - 0.133 Vcc Minimum VID - 0.152 VID - 0.171 VID - 0.190 VID - 0.209 VID - 0.228 10 20 30 40 50 60 70 80 90 100 110 120 Vcc Typical NOTES: 1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. 2. This loadline specification shows the deviation from the VID set point. 3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. 4. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. 30 Datasheet Electrical Specifications Table 2-11. GTL+ Asynchronous Signal Group DC Specifications Symbol VIL VIH VOH IOL ILI ILO RON NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Unless otherwise noted, all specifications in this table apply to all processor frequencies. VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical low value. LINT0/INTR and LINT1/NMI use GTLREF as a reference voltage. For these two signals VIH = GTLREF + (0.10 * VTT) and VIL= GTLREF – (0.10 * VTT). VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical high value. VIH and VOH may experience excursions above VTT. However, input signal drivers must comply with the signal quality specifications. The VTT referred to in these specifications refers to instantaneous VTT. All outputs are open drain. The maximum output current is based on maximum current handling capability of the buffer and is not specified into the test load. Leakage to VSS with land held at VTT. Leakage to VTT with land held at 300 mV. Parameter Input Low Voltage Input High Voltage Output High Voltage Output Low Current Input Leakage Current Output Leakage Current Buffer On Resistance Min 0.0 VTT/2 + (0.10 * VTT) 0.90*VTT — N/A N/A 8 Max VTT/2 – (0.10 * VTT) VTT VTT VTT/[(0.50*RTT_MIN) + RON_MIN] ± 200 ± 200 12 Unit V V V A µA µA Ω Notes1 2, 3 3, 4, 5, 6 5, 6, 7 8 9 10 - Table 2-12. GTL+ Signal Group DC Specifications Symbol VIL VIH VOH IOL ILI ILO RON NOTES: 1. 2. 3. 4. 5. Unless otherwise noted, all specifications in this table apply to all processor frequencies. VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical low value. The VTT referred to in these specifications is the instantaneous VTT. VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical high value. Leakage to VSS with land held at VTT. Parameter Input Low Voltage Input High Voltage Output High Voltage Output Low Current Input Leakage Current Output Leakage Current Buffer On Resistance Min 0.0 GTLREF + (0.10 * VTT) 0.90*VTT N/A N/A N/A 8 Max GTLREF – (0.10 * VTT) VTT VTT VTT/[(0.50*RTT_MIN) + RON_MIN] ± 200 ± 200 12 Unit V V V A µA µA Ω Notes1 2, 3 3, 4 3 5 - - Datasheet 31 Electrical Specifications Table 2-13. PWRGOOD and TAP Signal Group DC Specifications Symbol VHYS VT+ VTVOH IOL ILI ILO RON NOTES: 1. 2. 3. 4. 5. 6. Unless otherwise noted, all specifications in this table apply to all processor frequencies. All outputs are open drain. VHYS represents the amount of hysteresis, nominally centered about 0.5 * VTT, for all TAP inputs. The VTT referred to in these specifications refers to instantaneous VTT. The maximum output current is based on maximum current handling capability of the buffer and is not specified into the test load. Leakage to VSS with land held at VTT. Parameter Input Hysteresis Input low to high threshold voltage Input high to low threshold voltage Output High Voltage Output Low Current Input Leakage Current Output Leakage Current Buffer On Resistance Min 200 0.5 * (VTT + VHYS_MIN) 0.5 * (VTT – VHYS_MAX) N/A — — — 7 Max 350 0.5 * (VTT + VHYS_MAX) 0.5 * (VTT – VHYS_MIN) VTT 45 ± 200 ± 200 12 Unit mV V V V mA µA µA Ω Notes1, 3 4 2 4 4 5 6 - - Table 2-14. VTTPWRGD DC Specifications Symbol VIL VIH Parameter Input Low Voltage Input High Voltage Min — 0.9 Typ — — Max 0.3 — Unit V V Notes Table 2-15. BSEL [2:0] and VID[5:0] DC Specifications Symbol Parameter Max 60 60 8 200 VTT (max) Unit Ω Ω mA µA V Notes1, — — — 3 2 RON (BSEL) Buffer On Resistance RON (VID) IOL ILO VTOL NOTES: 1. 2. 3. Buffer On Resistance Max Land Current Output Leakage Current Voltage Tolerance — Unless otherwise noted, all specifications in this table apply to all processor frequencies. These parameters are not tested and are based on design simulations. Leakage to VSS with land held at 2.5 V. Table 2-16. BOOTSELECT DC Specifications Symbol VIL VIH NOTES: 1. These parameters are not tested and are based on design simulations. Parameter Input Low Voltage Input High Voltage Min — 0.96 Typ — — Max 0.24 — Unit V V Notes 1 — 32 Datasheet Electrical Specifications 2.12 VCC Overshoot Specification The Pentium 4 processor in the 775-land package can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from a high to low current load condition. This overshoot cannot exceed VID + VOS_MAX (VOS_MAX is the maximum allowable overshoot voltage). The time duration of the overshoot event must not exceed TOS_MAX (TOS_MAX is the maximum allowable time duration above VID). These specifications apply to the processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands. Table 2-17. VCC Overshoot Specifications Symbol VOS_MAX TOS_MAX Parameter Magnitude of VCC overshoot above VID Time duration of VCC overshoot above VID Min — — Typ — — Max 0.050 25 Unit V µs Figure 2-4 2-4 Figure 2-4. VCC Overshoot Example Waveform Example Overshoot Waveform VID + 0.050 VOS Voltage (V) VID TOS Time TOS: Overshoot time above VID VOS: Overshoot above VID NOTES: 1. VOS is measured overshoot voltage. 2. TOS is measured time duration above VID. 2.12.1 Die Voltage Validation Overshoot events from application testing on real processors must meet the specifications in Table 2-17 when measured across the VCC_SENSE and VSS_SENSE lands. Overshoot events that are < 10 ns in duration may be ignored. These measurements of processor die level overshoot should be taken with a 100 MHz bandwidth limited oscilloscope. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for additional voltage regulator validation details. Datasheet 33 Electrical Specifications 2.13 GTL+ FSB Specifications Termination resistors are not required for most GTL+ signals, as these are integrated into the processor silicon.Valid high and low levels are determined by the input buffers which compare a signal’s voltage with a reference voltage called GTLREF. Table 2-18 lists the GTLREF specifications. The GTL+ reference voltage (GTLREF) should be generated on the system board using high precision voltage divider circuits. Table 2-18. GTL+ Bus Voltage Definitions Symbol GTLREF Parameter Bus Reference Voltage On die pullup for BOOTSELECT signal Termination Resistance COMP Resistance Min (0.98 * 0.67) * VTT 500 Typ 0.67 * VTT — Max (1.02 * 0.67) * VTT 5000 Units V Ω Ω Ω Notes1 2, 3, 4, 5 RPULLUP RTT COMP[1:0] NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 6 54 59.8 60 60.4 66 61 7 8 Unless otherwise noted, all specifications in this table apply to all processor frequencies. The tolerances for this specification have been stated generically to enable the system designer to calculate the minimum and maximum values across the range of VTT. GTLREF should be generated from VTT by a voltage divider of 1% resistors or 1% matched resistors. The VTT referred to in these specifications is the instantaneous VTT. The Intel® 915G/915GV/915P and 910GL Express chipset platforms use a pull-up resistor of 100 Ω and a pull-down resistor of 210 Ω. Contact your Intel representative for further details and documentation. These pull-ups are to VTT. RTT is the on-die termination resistance measured at VTT/2 of the GTL+ output driver. COMP resistance must be provided on the system board with 1% resistors. COMP[1:0] resistors are to VSS. § 34 Datasheet Package Mechanical Specifications 3 Package Mechanical Specifications The Pentium 4 processor in the 775-land package is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The package consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket. The package components shown in Figure 3-1 include the following: • • • • • Integrated Heat Spreader (IHS) Thermal Interface Material (TIM) Processor core (die) Package substrate Capacitors Figure 3-1. Processor Package Assembly Sketch IHS Substrate Capacitors LGA775 Socket System Board Core (die) TIM NOTE: 1. Socket and motherboard are included for reference and are not part of processor package. 3.1 Package Mechanical Drawing The package mechanical drawings are shown in Figure 3-2 and Figure 3-4. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: • • • • • Package reference with tolerances (total height, length, width, etc.) IHS parallelism and tilt Land dimensions Top-side and back-side component keep-out dimensions Reference datums All drawing dimensions are in mm [in]. Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal/Mechanical Design Guidelines. Datasheet 35 Package Mechanical Specifications Figure 3-2. Processor Package Drawing 1 36 Datasheet Package Mechanical Specifications Figure 3-3. Processor Package Drawing 2 Datasheet 37 Package Mechanical Specifications Figure 3-4. Processor Package Drawing 3 38 Datasheet Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keepout zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum loading specification must be maintained by any thermal and mechanical solutions. . Table 3-1. Processor Loading Specifications Parameter Static Dynamic NOTES: 1. 2. 3. 4. These specifications apply to uniform compressive loading in a direction normal to the processor IHS. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the processor package. These specifications are based on limited testing for design characterization. Loading limits are for the package only and does not include the limits of the processor socket. Dynamic loading is defined as the sum of the load on the package from a 1 lb heatsink mass accelerating through a 11 ms trapezoidal pulse of 50 g and the maximum static load. Minimum 80 N [18 lbf] — Maximum 311 N [70 lbf] 756 N [170 lbf] Notes 1, 2, 3 1, 3, 4 3.4 Package Handling Guidelines Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 3-2. Package Handling Guidelines Parameter Shear Tensile Torque NOTES: 1. 2. 3. 4. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. These guidelines are based on limited testing for design characterization. Maximum Recommended 311 N [70 lbf] 111 N [25 lbf] 3.95 N-m [35 lbf-in] Notes 1, 4 2, 4 3, 4 Datasheet 39 Package Mechanical Specifications 3.5 Package Insertion Specifications The Pentium 4 processor in the 775-land package can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 3-3 lists some of the package components and associated materials. Table 3-3. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Processor Markings Figure 3-5 and Figure 3-6 show the topside markings on the processor. These diagrams aid in the identification of the Pentium 4 processor in the 775-land package. Figure 3-5. Processor Top-Side Marking Example Frequency/L2Cache/Bus/ 775_VR_CONFIG_04x S-Spec/CountryofAssy FPO INTEL m © ‘04 Pentium ® 4 3.60GHz/1M/800/04B SLxxx [COO] [FPO] UniqueUnit Identifier ATPO Serial # ATPO S/N 2-D MatrixMark 40 Datasheet Package Mechanical Specifications Figure 3-6. Processor Top-Side Marking Example for Processors Supporting Intel® EM64T ProcessorNumber/S-Spec/ CountryofAssy Frequency/L2Cache/Bus/ 775_VR_CONFIG_04x FPO INTEL m © ‘04 Pentium ® 4 571 SLxxx [COO] 3.80GHZ/1M/800/04B [FPO] UniqueUnit Identifier ATPO Serial # ATPO S/N 2-D MatrixMark 3.9 Processor Land Coordinates Figure 3-7 shows the top view of the processor land coordinates. The coordinates are referred to throughout the document to identify processor lands. Datasheet 41 Package Mechanical Specifications . Figure 3-7. Processor Land Coordinates (Top View) VCC / VSS 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Socket 775 Quadrants Top View AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Address / Common Clock / Async 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VTT / Clocks Data § 42 Datasheet Land Listing and Signal Descriptions 4 Land Listing and Signal Descriptions This chapter provides the processor land assignment and signal descriptions. 4.1 Processor Land Assignments This section contains the land listings for the Pentium 4 processor in the 775-land package. The landout footprint is shown in Figure 4-1 and Figure 4-2. These figures represent the landout arranged by land number and they show the physical location of each signal on the package land array (top view). Table 4-1 is a listing of all processor lands ordered alphabetically by land (signal) name. Table 4-2 is also a listing of all processor lands; the ordering is by land number. Datasheet 43 Land Listing and Signal Descriptions Figure 4-1. Landout Diagram (Top View – Left Side) 30 AN VCC VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VSS 29 VCC VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VSS 28 VSS VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VSS 27 VSS VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VSS 26 VCC VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VSS 25 VCC VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VSS 24 VSS VSS VSS VSS VSS VSS VSS VSS VSS VCC VCC VSS VSS 23 VSS VSS VSS VSS VSS VSS VSS VSS VCC VCC VCC VSS VSS 22 VCC VCC VCC VCC VCC VCC VCC VCC VCC 21 VCC VCC VCC VCC VCC VCC VCC VCC VCC 20 VSS VSS VSS VSS VSS VSS VSS VSS VSS 19 VCC VCC VCC VCC VCC VCC VCC VCC VCC 18 VCC VCC VCC VCC VCC VCC VCC VCC VCC 17 VSS VSS VSS VSS VSS VSS VSS VSS VSS 16 VSS VSS VSS VSS VSS VSS VSS VSS VSS 15 VCC VCC VCC VCC VCC VCC VCC VCC VCC AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC GTLREF _SEL BSEL0 RSVD VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VCC VCC VCC VCC DP3# DP0# VCC H BSEL1 BSEL2 VSS BCLK1 VSS VSS VSS VSS VSS VSS D47# VSS D45# D46# VSS D63# D62# 22 VSS D44# D43# D42# VSS D58# D59# VSS 21 VSS VSS VSS D35# D38# D39# VSS D54# D57# VSS 18 VSS D36# D37# VSS D49# DSTBP3# VSS D56# 17 DP2# D32# VSS D34# RSVD VSS D55# DSTBN3# 16 DP1# D31# D30# D33# VSS D51# D53# VSS 15 G F E D C B A TESTHI4 TESTHI5 TESTHI3 TESTHI6 RESET# RSVD RSVD RSVD VCCIO PLL VSSA VCCA 23 DSTBN2# DSTBP2# D41# VSS D48# DBI3# VSS RSVD 20 VSS D40# DBI2# VSS D60# D61# 19 BCLK0 VTT_SEL TESTHI0 TESTHI2 TESTHI7 VSS VTT VTT VTT VTT 28 VSS VTT VTT VTT VTT 27 VSS VTT VTT VTT VTT 26 VSS VTT VTT VTT VTT 25 RSVD VSS VSS VSS VSS 24 VTT VTT VTT VTT 30 VTT VTT VTT VTT 29 44 Datasheet Land Listing and Signal Descriptions Figure 4-2. Landout Diagram (Top View – Right Side) 14 VCC VCC VCC VCC VCC VCC VCC VCC VCC 13 VSS VSS VSS VSS VSS VSS VSS VSS VSS 12 VCC VCC VCC VCC VCC VCC VCC VCC VCC 11 VCC VCC VCC VCC VCC VCC VCC VCC VCC 10 VSS VSS VSS VSS VSS VSS VSS VSS VSS 9 VCC VCC VCC VCC VCC VCC VCC VCC VCC 8 VCC VCC VCC VCC VCC VCC VCC VCC SKTOCC# VCC VCC VCC VCC 7 FC16 FC12 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS 6 5 4 VSS_ SENSE VSS VID5 VID4 VSS A32# A30# A28# RSVD VSS RSVD A26# A21# 3 VCC_ SENSE VID2 VSS ITP_CLK0 ITP_CLK1 VSS BPM5# VSS RSVD BINIT# VSS MCERR# VSS 2 VSS VID0 1 VSS VSS AN AM AL AK AJ AH AG AF AE AD AC AB AA VSS_MB_ VCC_MB_ REGULATION REGULATION VTTPWRGD VID3 RSVD A35# VSS A29# VSS RSVD A22# VSS A17# VSS FC11 VID1 VSS A34# A33# A31# A27# VSS ADSTB1# A25# A24# A23# PROCHOT# THERMDA VSS BPM0# RSVD BPM3# BPM4# VSS BPM2# DBR# IERR# LL_ID1 THERMDC BPM1# VSS TRST# TDO TCK TDI TMS VSS VTT_OUT_ RIGHT BOOT SELECT MSID0 MSID1 VSS COMP1 FC2 TESTHI11 PWRGOOD VSS LINT1 LINT0 VTT_OUT_ LEFT GTLREF VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS A19# A18# VSS A10# VSS ADSTB0# A4# VSS REQ2# VSS REQ3# REQ4# VSS A16# A14# A12# A9# VSS RSVD RSVD A5# A3# VSS REQ1# A20# VSS A15# A13# A11# A8# VSS RSVD A7# A6# REQ0# VSS RSVD TESTHI1 VSS AP1# VSS FERR#/ PBE# INIT# VSS STPCLK# VSS A20M# RSVD VSS TESTHI12 LL_ID0 AP0# FC4 VSS SMI# IGNNE# THERMTRIP# TESTHI13 VSS FC3 Y W V U T R P N M L K J H VSS D29# D28# VSS RSVD D52# VSS D50# 14 VSS D27# VSS D26# D25# VSS RSVD COMP0 13 VSS DSTBN1# D24# DSTBP1# VSS D14# D13# VSS 12 VSS DBI1# D23# VSS D15# D11# VSS D9# 11 VSS RSVD VSS D21# D22# VSS D10# D8# 10 VSS D16# D18# D19# VSS RSVD DSTBP0# VSS 9 VSS BPRI# D17# VSS D12# DSTBN0# VSS DBI0# 8 VSS DEFER# VSS RSVD D20# VSS D6# D7# 7 VSS RSVD RSVD RSVD VSS D3# D5# VSS 6 TESTHI10 FC7 RS1# RSVD VSS D1# VSS D4# 5 RSP# TESTHI9 VSS HITM# HIT# VSS D0# D2# 4 VSS TESTHI8 BR0# TRDY# VSS LOCK# RS0# RS2# 3 FC6 FC1 FC5 VSS ADS# BNR# DBSY# VSS 2 G F E RSVD DRDY# VSS D C B A 1 Datasheet 45 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name A3# A4# A5# A6# A7# A8# A9# A10# A11# A12# A13# A14# A15# A16# A17# A18# A19# A20# A20M# A21# A22# A23# A24# A25# A26# A27# A28# A29# A30# A31# A32# A33# A34# A35# ADS# ADSTB0# ADSTB1# AP0# AP1# BCLK0 Land # L5 P6 M5 L4 M4 R4 T5 U6 T4 U5 U4 V5 V4 W5 AB6 W6 Y6 Y4 K3 AA4 AD6 AA5 AB5 AC5 AB4 AF5 AF4 AG6 AG4 AG5 AH4 AH5 AJ5 AJ6 D2 R6 AD5 U2 U3 F28 Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Asynch GTL+ Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Table 4-1. Alphabetical Land Assignments Land Name BCLK1 BINIT# BNR# BOOTSELECT BPM0# BPM1# BPM2# BPM3# BPM4# BPM5# BPRI# BR0# BSEL0 BSEL1 BSEL2 COMP0 COMP1 D0# D1# D2# D3# D4# D5# D6# D7# D8# D9# D10# D11# D12# D13# D14# D15# D16# D17# D18# D19# D20# D21# D22# Land # G28 AD3 C2 Y1 AJ2 AJ1 AD2 AG2 AF2 AG3 G8 F3 G29 H30 G30 A13 T1 B4 C5 A4 C6 A5 B6 B7 A7 A10 A11 B10 C11 D8 B12 C12 D11 G9 F8 F9 E9 D7 E10 D10 Signal Buffer Type Clock Direction Input Common Clock Input/Output Common Clock Input/Output Power/Other Input Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Common Clock Input Common Clock Input/Output Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Output Output Output Input Input Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Common Clock Input/Output Source Synch Source Synch Input/Output Input/Output Common Clock Input/Output Common Clock Input/Output Clock Input 46 Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name D23# D24# D25# D26# D27# D28# D29# D30# D31# D32# D33# D34# D35# D36# D37# D38# D39# D40# D41# D42# D43# D44# D45# D46# D47# D48# D49# D50# D51# D52# D53# D54# D55# D56# D57# D58# D59# D60# D61# D62# Land # F11 F12 D13 E13 G13 F14 G14 F15 G15 G16 E15 E16 G18 G17 F17 F18 E18 E19 F20 E21 F21 G21 E22 D22 G22 D20 D17 A14 C15 C14 B15 C18 B16 A17 B18 C21 B21 B19 A19 A22 Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Direction Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Table 4-1. Alphabetical Land Assignments Land Name D63# DBI0# DBI1# DBI2# DBI3# DBR# DBSY# DEFER# DP0# DP1# DP2# DP3# DRDY# DSTBN0# DSTBN1# DSTBN2# DSTBN3# DSTBP0# DSTBP1# DSTBP2# DSTBP3# FC1 FC2 FC3 FC4 FC5 FC6 FC7 FC11 FC12 FC16 FERR#/PBE# GTLREF GTLREF_SEL HIT# HITM# IERR# IGNNE# INIT# ITP_CLK0 Land # B22 A8 G11 D19 C20 AC2 B2 G7 J16 H15 H16 J17 C1 C8 G12 G20 A16 B9 E12 G19 C17 G2 R1 J2 T2 F2 H2 G5 AM5 AM7 AN7 R3 H1 H29 D4 E4 AB2 N2 P3 AK3 Signal Buffer Type Source Synch Source Synch Source Synch Source Synch Source Synch Power/Other Direction Input/Output Input/Output Input/Output Input/Output Input/Output Output Common Clock Input/Output Common Clock Input Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Common Clock Power/Other Source Synch Power/Other Power/Other Power/Other Asynch GTL+ Power/Other Power/Other Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input Input Input Input Input Input Output Output Output Output Output Input Output Common Clock Input/Output Common Clock Input/Output Asynch GTL+ Asynch GTL+ Asynch GTL+ TAP Output Input Input Input Datasheet 47 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name ITP_CLK1 LINT0 LINT1 LL_ID0 LL_ID1 LOCK# MCERR# MSID0 MSID1 PROCHOT# PWRGOOD REQ0# REQ1# REQ2# REQ3# REQ4# RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED Land # AJ3 K1 L1 V2 AA2 C3 AB3 W1 V1 AL2 N1 K4 J5 M6 K6 J6 A20 AC4 AE3 AE4 AE6 AH2 C9 D1 D14 D16 E23 E24 E5 E6 E7 F23 F29 F6 G10 B13 J3 N4 N5 P5 Signal Buffer Type TAP Asynch GTL+ Asynch GTL+ Power/Other Power/Other Direction Input Input Input Output Output Table 4-1. Alphabetical Land Assignments Land Name RESERVED RESERVED RESERVED RESERVED RESET# RS0# RS1# RS2# RSP# SKTOCC# SMI# STPCLK# TCK TDI TDO TESTHI0 TESTHI1 TESTHI2 TESTHI3 TESTHI4 TESTHI5 TESTHI6 TESTHI7 TESTHI8 TESTHI9 TESTHI10 TESTHI11 TESTHI12 TESTHI13 THERMDA THERMDC THERMTRIP# TMS TRDY# TRST# VCC VCC VCC VCC VCC Land # Y3 D23 AK6 G6 G23 B3 F5 A3 H4 AE8 P2 M3 AE1 AD1 AF1 F26 W3 F25 G25 G27 G26 G24 F24 G3 G4 H5 P1 W2 L2 AL1 AK1 M2 AC1 E3 AG1 AA8 AB8 AC23 AC24 AC25 Common Clock Common Clock Common Clock Common Clock Common Clock Power/Other Asynch GTL+ Asynch GTL+ TAP TAP TAP Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Power/Other Power/Other Asynch GTL+ TAP Common Clock TAP Power/Other Power/Other Power/Other Power/Other Power/Other Output Input Input Input Input Input Input Input Input Output Input Input Input Input Output Input Input Input Input Input Input Input Input Input Input Input Input Input Input Signal Buffer Type Direction Common Clock Input/Output Common Clock Input/Output Power/Other Power/Other Asynch GTL+ Power/Other Source Synch Source Synch Source Synch Source Synch Source Synch Output Output Input/Output Input Input/Output Input/Output Input/Output Input/Output Input/Output 48 Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Land # AC26 AC27 AC28 AC29 AC30 AC8 AD23 AD24 AD25 AD26 AD27 AD28 AD29 AD30 AD8 AE11 AE12 AE14 AE15 AE18 AE19 AE21 AE22 AE23 AE9 AF11 AF12 AF14 AF15 AF18 AF19 AF21 AF22 AF8 AF9 AG11 AG12 AG14 AG15 AG18 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-1. Alphabetical Land Assignments Land Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Land # AG19 AG21 AG22 AG25 AG26 AG27 AG28 AG29 AG30 AG8 AG9 AH11 AH12 AH14 AH15 AH18 AH19 AH21 AH22 AH25 AH26 AH27 AH28 AH29 AH30 AH8 AH9 AJ11 AJ12 AJ14 AJ15 AJ18 AJ19 AJ21 AJ22 AJ25 AJ26 AJ8 AJ9 AK11 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Datasheet 49 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Land # AK12 AK14 AK15 AK18 AK19 AK21 AK22 AK25 AK26 AK8 AK9 AL11 AL12 AL14 AL15 AL18 AL19 AL21 AL22 AL25 AL26 AL29 AL30 AL8 AL9 AM11 AM12 AM14 AM15 AM18 AM19 AM21 AM22 AM25 AM26 AM29 AM30 AM8 AM9 AN11 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-1. Alphabetical Land Assignments Land Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Land # AN12 AN14 AN15 AN18 AN19 AN21 AN22 AN25 AN26 AN29 AN30 AN8 AN9 J10 J11 J12 J13 J14 J15 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 J8 J9 K23 K24 K25 K26 K27 K28 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction 50 Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Land # K29 K30 K8 L8 M23 M24 M25 M26 M27 M28 M29 M30 M8 N23 N24 N25 N26 N27 N28 N29 N30 N8 P8 R8 T23 T24 T25 T26 T27 T28 T29 T30 T8 U23 U24 U25 U26 U27 U28 U29 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-1. Alphabetical Land Assignments Land Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC_MB_ REGULATION VCC_SENSE Land # U30 U8 V8 W23 W24 W25 W26 W27 W28 W29 W30 W8 Y23 Y24 Y25 Y26 Y27 Y28 Y29 Y30 Y8 AN5 AN3 A23 C23 AM2 AL5 AM3 AL6 AK4 AL4 A12 A15 A18 A2 A21 A24 A6 A9 AA23 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Output Output Output Output Output Direction Power/Other VCCA Power/Other VCCIOPLL Power/Other VID0 Power/Other VID1 Power/Other VID2 Power/Other VID3 Power/Other VID4 Power/Other VID5 Power/Other VSS Power/Other VSS Power/Other VSS Power/Other VSS Power/Other VSS Power/Other VSS Power/Other VSS Power/Other VSS Power/Other VSS Datasheet 51 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Land # AA24 AA25 AA26 AA27 AA28 AA29 AA3 AA30 AA6 AA7 AB1 AB23 AB24 AB25 AB26 AB27 AB28 AB29 AB30 AB7 AC3 AC6 AC7 AD4 AD7 AE10 AE13 AE16 AE17 AE2 AE20 AE24 AE25 AE26 AE27 AE28 AE29 AE30 AE5 AE7 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Land # AF10 AF13 AF16 AF17 AF20 AF23 AF24 AF25 AF26 AF27 AF28 AF29 AF3 AF30 AF6 AF7 AG10 AG13 AG16 AG17 AG20 AG23 AG24 AG7 AH1 AH10 AH13 AH16 AH17 AH20 AH23 AH24 AH3 AH6 AH7 AJ10 AJ13 AJ16 AJ17 AJ20 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction 52 Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Land # AJ23 AJ24 AJ27 AJ28 AJ29 AJ30 AJ4 AJ7 AK10 AK13 AK16 AK17 AK2 AK20 AK23 AK24 AK27 AK28 AK29 AK30 AK5 AK7 AL10 AL13 AL16 AL17 AL20 AL23 AL24 AL27 AL28 AL3 AL7 AM1 AM10 AM13 AM16 AM17 AM20 AM23 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Land # AM24 AM27 AM28 AM4 AN1 AN10 AN13 AN16 AN17 AN2 AN20 AN23 AN24 AN27 AN28 B1 B11 B14 B17 B20 B24 B5 B8 C10 C13 C16 C19 C22 C24 C4 C7 D12 D15 D18 D21 D24 D3 D5 D6 D9 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Datasheet 53 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Land # E11 E14 E17 E2 E20 E25 E26 E27 E28 E29 E8 F10 F13 F16 F19 F22 F4 F7 G1 H10 H11 H12 H13 H14 H17 H18 H19 H20 H21 H22 H23 H24 H25 H26 H27 H28 H3 H6 H7 H8 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Land # H9 J4 J7 K2 K5 K7 L23 L24 L25 L26 L27 L28 L29 L3 L30 L6 L7 M1 M7 N3 N6 N7 P23 P24 P25 P26 P27 P28 P29 P30 P4 P7 R2 R23 R24 R25 R26 R27 R28 R29 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction 54 Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS_MB_ REGULATION VSS_SENSE VSSA VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT Land # R30 R5 R7 T3 T6 T7 U1 U7 V23 V24 V25 V26 V27 V28 V29 V3 V30 V6 V7 W4 W7 Y2 Y5 Y7 AN6 AN4 B23 A25 A26 A27 A28 A29 A30 B25 B26 B27 B28 B29 B30 C25 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Direction Table 4-1. Alphabetical Land Assignments Land Name VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT_OUT_LEFT VTT_OUT_RIGHT VTT_SEL VTTPWRGD Land # C26 C27 C28 C29 C30 D25 D26 D27 D28 D29 D30 J1 AA1 F27 AM6 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Input Direction Datasheet 55 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 Land Name VSS RS2# D2# D4# VSS D7# DBI0# VSS D8# D9# VSS COMP0 D50# VSS DSTBN3# D56# VSS D61# RESERVED VSS D62# VCCA VSS VTT VTT VTT VTT VTT VTT VSS DBSY# RS0# D0# VSS D5# D6# VSS DSTBP0# D10# VSS D13# Power/Other Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input/Output Common Clock Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Input/Output Input/Output Input/Output Input/Output Input/Output Input Input/Output Input/Output Signal Buffer Type Power/Other Common Clock Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Input/Output Input/Output Input/Output Input Input/Output Input/Output Input/Output Input/Output Input/Output Input Input/Output Input/Output Direction Table 4-2. Numerical Land Assignment Land # B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 Land Name RESERVED VSS D53# D55# VSS D57# D60# VSS D59# D63# VSSA VSS VTT VTT VTT VTT VTT VTT DRDY# BNR# LOCK# VSS D1# D3# VSS DSTBN0# RESERVED VSS D11# D14# VSS D52# D51# VSS DSTBP3# D54# VSS DBI3# D58# VSS VCCIOPLL Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input/Output Common Clock Input/Output Common Clock Input/Output Power/Other Source Synch Source Synch Power/Other Source Synch Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Signal Buffer Type Direction 56 Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # C24 C25 C26 C27 C28 C29 C30 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 E2 E3 E4 E5 Land Name VSS VTT VTT VTT VTT VTT VTT RESERVED ADS# VSS HIT# VSS VSS D20# D12# VSS D22# D15# VSS D25# RESERVED VSS RESERVED D49# VSS DBI2# D48# VSS D46# RESERVED VSS VTT VTT VTT VTT VTT VTT VSS TRDY# HITM# RESERVED Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Input/Output Input/Output Input/Output Input/Output Power/Other Common Clock Input/Output Power/Other Common Clock Input/Output Power/Other Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Input/Output Input/Output Input/Output Input/Output Input/Output Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-2. Numerical Land Assignment Land # E6 E7 E8 E9 E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E20 E21 E22 E23 E24 E25 E26 E27 E28 E29 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 F18 Land Name RESERVED RESERVED VSS D19# D21# VSS DSTBP1# D26# VSS D33# D34# VSS D39# D40# VSS D42# D45# RESERVED RESERVED VSS VSS VSS VSS VSS FC5 BR0# VSS RS1# RESERVED VSS D17# D18# VSS D23# D24# VSS D28# D30# VSS D37# D38# Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Power/Other Source Synch Source Synch Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Signal Buffer Type Direction Common Clock Input/Output Power/Other Common Clock Input Common Clock Input/Output Datasheet 57 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # F19 F20 F21 F22 F23 F24 F25 F26 F28 F29 G1 G2 G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 G19 G20 G21 G22 G23 G24 G25 G26 G27 G28 G29 G30 H1 Land Name VSS D41# D43# VSS RESERVED TESTHI7 TESTHI2 TESTHI0 BCLK0 RESERVED VSS FC1 TESTHI8 TESTHI9 FC7 RESERVED DEFER# BPRI# D16# RESERVED DBI1# DSTBN1# D27# D29# D31# D32# D36# D35# DSTBP2# DSTBN2# D44# D47# RESET# TESTHI6 TESTHI3 TESTHI5 TESTHI4 BCLK1 BSEL0 BSEL2 GTLREF Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Source Synch Common Clock Power/Other Power/Other Power/Other Power/Other Clock Power/Other Power/Other Power/Other Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input Input Input Input Input Input Output Output Input Common Clock Common Clock Source Synch Input Input Input/Output Power/Other Power/Other Power/Other Power/Other Source Synch Input Input Input Output Power/Other Power/Other Power/Other Clock Input Input Input Input Signal Buffer Type Power/Other Source Synch Source Synch Power/Other Input/Output Input/Output Direction Table 4-2. Numerical Land Assignment Land # H2 H3 H4 H5 H6 H7 H8 H9 H10 H11 H12 H13 H14 H15 H16 H17 H18 H19 H20 H21 H22 H23 H24 H25 H26 H27 H28 H29 H30 J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 J11 J12 Land Name FC6 VSS RSP# TESTHI10 VSS VSS VSS VSS VSS VSS VSS VSS VSS DP1# DP2# VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS GTLREF_SEL BSEL1 VTT_OUT_LEFT FC3 RESERVED VSS REQ1# REQ4# VSS VCC VCC VCC VCC VCC Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Input/Output Input/Output Signal Buffer Type Power/Other Power/Other Common Clock Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input/Output Common Clock Input/Output Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Input Input Input Direction Input 58 Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 K1 K2 K3 K4 K5 K6 K7 K8 K23 K24 K25 K26 K27 K28 K29 K30 L1 L2 L3 L4 L5 L6 L7 Land Name VCC VCC VCC DP0# DP3# VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC LINT0 VSS A20M# REQ0# VSS REQ3# VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC LINT1 TESTHI13 VSS A6# A3# VSS VSS Signal Buffer Type Power/Other Power/Other Power/Other Common Clock Input/Output Common Clock Input/Output Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Power/Other Asynch GTL+ Source Synch Power/Other Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Asynch GTL+ Power/Other Source Synch Source Synch Power/Other Power/Other Input/Output Input/Output Input Input Input/Output Input Input/Output Input Direction Table 4-2. Numerical Land Assignment Land # L8 L23 L24 L25 L26 L27 L28 L29 L30 M1 M2 M3 M4 M5 M6 M7 M8 M23 M24 M25 M26 M27 M28 M29 M30 N1 N2 N3 N4 N5 N6 N7 N8 N23 N24 N25 N26 N27 N28 N29 N30 Land Name VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS THERMTRIP# STPCLK# A7# A5# REQ2# VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC PWRGOOD IGNNE# VSS RESERVED RESERVED VSS VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Asynch GTL+ Source Synch Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Power/Other Input Input Output Input Input/Output Input/Output Input/Output Direction Datasheet 59 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # P1 P2 P3 P4 P5 P6 P7 P8 P23 P24 P25 P26 P27 P28 P29 P30 R1 R2 R3 R4 R5 R6 R7 R8 R23 R24 R25 R26 R27 R28 R29 R30 T1 T2 T3 T4 T5 T6 T7 T8 T23 Land Name TESTHI11 SMI# INIT# VSS RESERVED A4# VSS VCC VSS VSS VSS VSS VSS VSS VSS VSS FC2 VSS FERR#/PBE# A8# VSS ADSTB0# VSS VCC VSS VSS VSS VSS VSS VSS VSS VSS COMP1 FC4 VSS A11# A9# VSS VSS VCC VCC Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Source Synch Power/Other Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Input/Output Input/Output Input Input Input/Output Output Input/Output Input Input/Output Signal Buffer Type Power/Other Asynch GTL+ Asynch GTL+ Power/Other Direction Input Input Input Table 4-2. Numerical Land Assignment Land # T24 T25 T26 T27 T28 T29 T30 U1 U2 U3 U4 U5 U6 U7 U8 U23 U24 U25 U26 U27 U28 U29 U30 V1 V2 V3 V4 V5 V6 V7 V8 V23 V24 V25 V26 V27 V28 V29 V30 W1 W2 Land Name VCC VCC VCC VCC VCC VCC VCC VSS AP0# AP1# A13# A12# A10# VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC MSID1 LL_ID0 VSS A15# A14# VSS VSS VCC VSS VSS VSS VSS VSS VSS VSS VSS MSID0 TESTHI12 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input/Output Common Clock Input/Output Source Synch Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Input Input/Output Input/Output Output Output Input/Output Input/Output Input/Output Direction 60 Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # W3 W4 W5 W6 W7 W8 W23 W24 W25 W26 W27 W28 W29 W30 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y23 Y24 Y25 Y26 Y27 Y28 Y29 Y30 AA2 AA3 AA4 AA5 AA6 AA7 AA8 AA23 AA24 AA25 AA26 Land Name TESTHI1 VSS A16# A18# VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC BOOTSELECT VSS RESERVED A20# VSS A19# VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC LL_ID1 VSS A21# A23# VSS VSS VCC VSS VSS VSS VSS Source Synch Power/Other Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Input/Output Input/Output Output Input/Output Input/Output Signal Buffer Type Power/Other Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Input Input/Output Input/Output Direction Input Table 4-2. Numerical Land Assignment Land # AA27 AA28 AA29 AA30 AB1 AB2 AB3 AB4 AB5 AB6 AB7 AB8 AB23 AB24 AB25 AB26 AB27 AB28 AB29 AB30 AC1 AC2 AC3 AC4 AC5 AC6 AC7 AC8 AC23 AC24 AC25 AC26 AC27 AC28 AC29 AC30 AD1 AD2 AD3 AD4 AD5 Land Name VSS VSS VSS VSS VSS IERR# MCERR# A26# A24# A17# VSS VCC VSS VSS VSS VSS VSS VSS VSS VSS TMS DBR# VSS RESERVED A25# VSS VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC TDI BPM2# BINIT# VSS ADSTB1# Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other TAP Input Input/Output Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Output Direction Common Clock Input/Output Source Synch Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other TAP Power/Other Power/Other Input Output Input/Output Input/Output Input/Output Common Clock Input/Output Common Clock Input/Output Power/Other Source Synch Input/Output Datasheet 61 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # AD6 AD7 AD8 AD23 AD24 AD25 AD26 AD27 AD28 AD29 AD30 AE1 AE2 AE3 AE4 AE5 AE6 AE7 AE8 AE9 AE10 AE11 AE12 AE13 AE14 AE15 AE16 AE17 AE18 AE19 AE20 AE21 AE22 AE23 AE24 AE25 AE26 AE27 AE28 AE29 AE30 Land Name A22# VSS VCC VCC VCC VCC VCC VCC VCC VCC VCC TCK VSS RESERVED RESERVED VSS RESERVED VSS SKTOCC# VCC VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Power/Other Signal Buffer Type Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other TAP Power/Other Input Direction Input/Output Table 4-2. Numerical Land Assignment Land # AF1 AF2 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 AF16 AF17 AF18 AF19 AF20 AF21 AF22 AF23 AF24 AF25 AF26 AF27 AF28 AF29 AF3 AF30 AG1 AG2 AG3 AG4 AG5 AG6 AG7 AG8 AG9 AG10 AG11 Land Name TDO BPM4# A28# A27# VSS VSS VCC VCC VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS TRST# BPM3# BPM5# A30# A31# A29# VSS VCC VCC VSS VCC Signal Buffer Type TAP Direction Output Common Clock Input/Output Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other TAP Input Input/Output Input/Output Common Clock Input/Output Common Clock Input/Output Source Synch Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Input/Output Input/Output Input/Output 62 Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # AG12 AG13 AG14 AG15 AG16 AG17 AG18 AG19 AG20 AG21 AG22 AG23 AG24 AG25 AG26 AG27 AG28 AG29 AG30 AH1 AH2 AH3 AH4 AH5 AH6 AH7 AH8 AH9 AH10 AH11 AH12 AH13 AH14 AH15 AH16 AH17 AH18 AH19 AH20 AH21 AH22 Land Name VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VCC VCC VCC VCC VSS RESERVED VSS A32# A33# VSS VSS VCC VCC VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Input/Output Input/Output Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Table 4-2. Numerical Land Assignment Land # AH23 AH24 AH25 AH26 AH27 AH28 AH29 AH30 AJ1 AJ2 AJ3 AJ4 AJ5 AJ6 AJ7 AJ8 AJ9 AJ10 AJ11 AJ12 AJ13 AJ14 AJ15 AJ16 AJ17 AJ18 AJ19 AJ20 AJ21 AJ22 AJ23 AJ24 AJ25 AJ26 AJ27 AJ28 AJ29 AJ30 AK1 AK2 AK3 Land Name VSS VSS VCC VCC VCC VCC VCC VCC BPM1# BPM0# ITP_CLK1 VSS A34# A35# VSS VCC VCC VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VSS VSS VSS THERMDC VSS ITP_CLK0 Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Common Clock Input/Output Common Clock Input/Output TAP Power/Other Source Synch Source Synch Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other TAP Input Input/Output Input/Output Input Direction Datasheet 63 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # AK4 AK5 AK6 AK7 AK8 AK9 AK10 AK11 AK12 AK13 AK14 AK15 AK16 AK17 AK18 AK19 AK20 AK21 AK22 AK23 AK24 AK25 AK26 AK27 AK28 AK29 AK30 AL1 AL2 AL3 AL4 AL5 AL6 AL7 AL8 AL9 AL10 AL11 AL12 AL13 AL14 Land Name VID4 VSS RESERVED VSS VCC VCC VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VSS VSS VSS THERMDA PROCHOT# VSS VID5 VID1 VID3 VSS VCC VCC VSS VCC VCC VSS VCC Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Asynch GTL+ Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Input/Output Signal Buffer Type Power/Other Power/Other Direction Output Table 4-2. Numerical Land Assignment Land # AL15 AL16 AL17 AL18 AL19 AL20 AL21 AL22 AL23 AL24 AL25 AL26 AL27 AL28 AL29 AL30 AM1 AM2 AM3 AM4 AM5 AM7 AM8 AM9 AM10 AM11 AM12 AM13 AM14 AM15 AM16 AM17 AM18 AM19 AM20 AM21 AM22 AM23 AM24 AM25 AM26 Land Name VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VID0 VID2 VSS FC11 FC12 VCC VCC VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Output Direction 64 Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # AM27 AM28 AM29 AM30 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 Land Name VSS VSS VCC VCC VSS VSS VCC_SENSE VSS_SENSE VCC_MB_ REGULATION VSS_MB_ REGULATION FC16 VCC VCC VSS VCC VCC VSS VCC VCC Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Output Output Output Output Output Direction Table 4-2. Numerical Land Assignment Land # AN16 AN17 AN18 AN19 AN20 AN21 AN22 AN23 AN24 AN25 AN26 AN27 AN28 AN29 AN30 Land Name VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC Signal Buffer Type Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Power/Other Direction Datasheet 65 Land Listing and Signal Descriptions 4.2 Alphabetical Signals Reference Table 4-3. Signal Description (Sheet 1 of 8) Name Type Description A[35:3]# (Address) define a 236-byte physical memory address space. In subphase 1 of the address phase, these signals transmit the address of a transaction. In sub-phase 2, these signals transmit transaction type information. These signals must connect the appropriate pins/lands of all agents on the processor FSB. A[35:3]# are protected by parity signals AP[1:0]#. A[35:3]# are source synchronous signals and are latched into the receiving buffers by ADSTB[1:0]#. On the active-to-inactive transition of RESET#, the processor samples a subset of the A[35:3]# signals to determine power-on configuration. See Section 6.1 for more details. If A20M# (Address-20 Mask) is asserted, the processor masks physical address bit 20 (A20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. Asserting A20M# emulates the 8086 processor's address wrap-around at the 1-MB boundary. Assertion of A20M# is only supported in real mode. A20M# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/Output Write bus transaction. ADS# (Address Strobe) is asserted to indicate the validity of the transaction address on the A[35:3]# and REQ[4:0]# signals. All bus agents observe the ADS# activation to begin parity checking, protocol checking, address decode, internal snoop, or deferred reply ID match operations associated with the new transaction. Address strobes are used to latch A[35:3]# and REQ[4:0]# on their rising and falling edges. Strobes are associated with signals as shown below. ADSTB[1:0]# Input/ Output Signals REQ[4:0]#, A[16:3]# A[35:17]# Associated Strobe ADSTB0# ADSTB1# A[35:3]# Input/ Output A20M# Input ADS# Input/ Output AP[1:0]# Input/ Output AP[1:0]# (Address Parity) are driven by the request initiator along with ADS#, A[35:3]#, and the transaction type on the REQ[4:0]#. A correct parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low. This allows parity to be high when all the covered signals are high. AP[1:0]# should connect the appropriate pins/lands of all processor FSB agents. The following table defines the coverage model of these signals. Request Signals A[35:24]# A[23:3]# REQ[4:0]# Subphase 1 AP0# AP1# AP1# Subphase 2 AP1# AP0# AP0# BCLK[1:0] Input The differential pair BCLK (Bus Clock) determines the FSB frequency. All processor FSB agents must receive these signals to drive their outputs and latch their inputs. All external timing parameters are specified with respect to the rising edge of BCLK0 crossing VCROSS. 66 Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 2 of 8) Name Type Description BINIT# (Bus Initialization) may be observed and driven by all processor FSB agents and if used, must connect the appropriate pins/lands of all such agents. If the BINIT# driver is enabled during power-on configuration, BINIT# is asserted to signal any bus condition that prevents reliable future operation. Input/ Output If BINIT# observation is enabled during power-on configuration, and BINIT# is sampled asserted, symmetric agents reset their bus LOCK# activity and bus request arbitration state machines. The bus agents do not reset their IOQ and transaction tracking state machines upon observation of BINIT# activation. Once the BINIT# assertion has been observed, the bus agents will re-arbitrate for the FSB and attempt completion of their bus queue and IOQ entries. If BINIT# observation is disabled during power-on configuration, a central agent may handle an assertion of BINIT# as appropriate to the error handling architecture of the system. BNR# Input/ Output BNR# (Block Next Request) is used to assert a bus stall by any bus agent unable to accept new bus transactions. During a bus stall, the current bus owner cannot issue any new transactions. This input is required to determine whether the processor is installed in a platform that supports the Pentium 4 processor in the 775-land package. The processor will not operate if this signal is low. This input has a weak internal pull-up to VCC. BPM[5:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals. They are outputs from the processor which indicate the status of breakpoints and programmable counters used for monitoring processor performance. BPM[5:0]# should connect the appropriate pins/lands of all processor FSB agents. BPM[5:0]# Input/ Output BPM4# provides PRDY# (Probe Ready) functionality for the TAP port. PRDY# is a processor output used by debug tools to determine processor debug readiness. BPM5# provides PREQ# (Probe Request) functionality for the TAP port. PREQ# is used by debug tools to request debug operation of the processor. These signals do not have on-die termination. Refer to Section 2.5 for termination requirements. BPRI# (Bus Priority Request) is used to arbitrate for ownership of the processor FSB. It must connect the appropriate pins/lands of all processor FSB agents. Observing BPRI# active (as asserted by the priority agent) causes all other agents to stop issuing new requests, unless such requests are part of an ongoing locked operation. The priority agent keeps BPRI# asserted until all of its requests are completed, then releases the bus by de-asserting BPRI#. BR0# drives the BREQ0# signal in the system and is used by the processor to request the bus. During power-on configuration this signal is sampled to determine the agent ID = 0. This signal does not have on-die termination and must be terminated. The BCLK[1:0] frequency select signals BSEL[2:0] are used to select the processor input clock frequency. Table 2-6 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset and clock synthesizer. All agents must operate at the same frequency. For more information about these signals, including termination recommendations refer to Section 2.9. COMP[1:0] must be terminated to VSS on the system board using precision resistors. BINIT# BOOTSELECT Input BPRI# Input BR0# Input/ Output BSEL[2:0] Output COMP[1:0] Analog Datasheet 67 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 3 of 8) Name Type Description D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path between the processor FSB agents, and must connect the appropriate pins/ lands on all such agents. The data driver asserts DRDY# to indicate a valid data transfer. D[63:0]# are quad-pumped signals and will, thus, be driven four times in a common clock period. D[63:0]# are latched off the falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a pair of one DSTBP# and one DSTBN#. The following table shows the grouping of data signals to data strobes and DBI#. Quad-Pumped Signal Groups D[63:0]# Input/ Output Data Group D[15:0]# D[31:16]# D[47:32]# D[63:48]# DSTBN#/ DSTBP# 0 1 2 3 DBI# 0 1 2 3 Furthermore, the DBI# signals determine the polarity of the data signals. Each group of 16 data signals corresponds to one DBI# signal. When the DBI# signal is active, the corresponding data group is inverted and therefore sampled active high. DBI[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity of the D[63:0]# signals.The DBI[3:0]# signals are activated when the data on the data bus is inverted. If more than half the data bits, within a 16-bit group, would have been asserted electrically low, the bus agent may invert the data bus signals for that particular sub-phase for that 16-bit group. DBI[3:0] Assignment To Data Bus DBI[3:0]# Input/ Output Bus Signal DBI3# DBI2# DBI1# DBI0# Data Bus Signals D[63:48]# D[47:32]# D[31:16]# D[15:0]# DBR# Output DBR# (Debug Reset) is used only in processor systems where no debug port is implemented on the system board. DBR# is used by a debug port interposer so that an in-target probe can drive system reset. If a debug port is implemented in the system, DBR# is a no connect in the system. DBR# is not a processor signal. DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on the processor FSB to indicate that the data bus is in use. The data bus is released after DBSY# is de-asserted. This signal must connect the appropriate pins/lands on all processor FSB agents. DEFER# is asserted by an agent to indicate that a transaction cannot be guaranteed in-order completion. Assertion of DEFER# is normally the responsibility of the addressed memory or input/output agent. This signal must connect the appropriate pins/lands of all processor FSB agents. DP[3:0]# (Data parity) provide parity protection for the D[63:0]# signals. They are driven by the agent responsible for driving D[63:0]#, and must connect the appropriate pins/lands of all processor FSB agents. DBSY# Input/ Output DEFER# Input DP[3:0]# Input/ Output 68 Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 4 of 8) Name Type Input/ Output Description DRDY# (Data Ready) is asserted by the data driver on each data transfer, indicating valid data on the data bus. In a multi-common clock data transfer, DRDY# may be de-asserted to insert idle clocks. This signal must connect the appropriate pins/lands of all processor FSB agents. DSTBN[3:0]# are the data strobes used to latch in D[63:0]#. Signals DSTBN[3:0]# Input/ Output D[15:0]#, DBI0# D[31:16]#, DBI1# D[47:32]#, DBI2# D[63:48]#, DBI3# Associated Strobe DSTBN0# DSTBN1# DSTBN2# DSTBN3# DRDY# DSTBP[3:0]# are the data strobes used to latch in D[63:0]#. Signals DSTBP[3:0]# Input/ Output D[15:0]#, DBI0# D[31:16]#, DBI1# D[47:32]#, DBI2# D[63:48]#, DBI3# FCx Other Associated Strobe DSTBP0# DSTBP1# DSTBP2# DSTBP3# FC signals are signals that are available for compatibility with other processors. FERR#/PBE# (floating point error/pending break event) is a multiplexed signal and its meaning is qualified by STPCLK#. When STPCLK# is not asserted, FERR#/PBE# indicates a floating-point error and will be asserted when the processor detects an unmasked floating-point error. When STPCLK# is not asserted, FERR#/PBE# is similar to the ERROR# signal on the Intel 387 coprocessor, and is included for compatibility with systems using MS-DOS*type floating-point error reporting. When STPCLK# is asserted, an assertion of FERR#/PBE# indicates that the processor has a pending break event waiting for service. The assertion of FERR#/PBE# indicates that the processor should be returned to the Normal state. For additional information on the pending break event functionality, including the identification of support of the feature and enable/disable information, refer to volume 3 of the Intel Architecture Software Developer's Manual and the Intel Processor Identification and the CPUID Instruction application note. GTLREF determines the signal reference level for GTL+ input signals. GTLREF is used by the GTL+ receivers to determine if a signal is a logical 0 or logical 1. GTLREF_SEL is used to select the appropriate chipset GTLREF voltage. HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation results. Any FSB agent may assert both HIT# and HITM# together to indicate that it requires a snoop stall, which can be continued by reasserting HIT# and HITM# together. IERR# (Internal Error) is asserted by a processor as the result of an internal error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the processor FSB. This transaction may optionally be converted to an external error signal (e.g., NMI) by system core logic. The processor will keep IERR# asserted until the assertion of RESET#. This signal does not have on-die termination. Refer to Section 2.5 for termination requirements. FERR#/PBE# Output GTLREF GTLREF_SEL HIT# HITM# Input Output Input/ Output Input/ Output IERR# Output Datasheet 69 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 5 of 8) Name Type Description IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a numeric error and continue to execute noncontrol floating-point instructions. If IGNNE# is de-asserted, the processor generates an exception on a noncontrol floating-point instruction if a previous floating-point instruction caused an error. IGNNE# has no effect when the NE bit in control register 0 (CR0) is set. IGNNE# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/Output Write bus transaction. INIT# (Initialization), when asserted, resets integer registers inside the processor without affecting its internal caches or floating-point registers. The processor then begins execution at the power-on Reset vector configured during power-on configuration. The processor continues to handle snoop requests during INIT# assertion. INIT# is an asynchronous signal and must connect the appropriate pins/lands of all processor FSB agents. If INIT# is sampled active on the active to inactive transition of RESET#, then the processor executes its Built-in Self-Test (BIST). ITP_CLK[1:0] are copies of BCLK that are used only in processor systems where no debug port is implemented on the system board. ITP_CLK[1:0] are used as BCLK[1:0] references for a debug port implemented on an interposer. If a debug port is implemented in the system, ITP_CLK[1:0] are no connects in the system. These are not processor signals. LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins/lands of all APIC Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a maskable interrupt request signal, and LINT1 becomes NMI, a nonmaskable interrupt. INTR and NMI are backward compatible with the signals of those names on the Pentium processor. Both signals are asynchronous. Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI/INTR or LINT[1:0]. Because the APIC is enabled by default after Reset, operation of these signals as LINT[1:0] is the default configuration. LL_ID[1:0] Output The LL_ID[1:0] signals are used to select the correct loadline slope for the processor. LL_ID[1:0] = 00 for the Pentium 4 processor in the 775-land package. LOCK# indicates to the system that a transaction must occur atomically. This signal must connect the appropriate pins/lands of all processor FSB agents. For a locked sequence of transactions, LOCK# is asserted from the beginning of the first transaction to the end of the last transaction. When the priority agent asserts BPRI# to arbitrate for ownership of the processor FSB, it will wait until it observes LOCK# de-asserted. This enables symmetric agents to retain ownership of the processor FSB throughout the bus locked operation and ensure the atomicity of lock. MCERR# (Machine Check Error) is asserted to indicate an unrecoverable error without a bus protocol violation. It may be driven by all processor FSB agents. MCERR# assertion conditions are configurable at a system level. Assertion options are defined by the following options: • Enabled or disabled. MCERR# Input/ Output • Asserted, if configured, for internal errors along with IERR#. • Asserted, if configured, by the request initiator of a bus transaction after it observes an error. • Asserted by any bus agent when it observes an error in a bus transaction. For more details regarding machine check architecture, refer to the IA-32 Software Developer’s Manual, Volume 3: System Programming Guide. MSID[1:0] Output MSID[1:0] are provided to indicate the market segment for the processor and may be used for future processor compatibility or for keying. IGNNE# Input INIT# Input ITP_CLK[1:0] Input LINT[1:0] Input LOCK# Input/ Output 70 Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 6 of 8) Name Type Description As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled. The TCC will remain active until the system de-asserts PROCHOT#. See Section 5.2.4 for more details. PWRGOOD (Power Good) is a processor input. The processor requires this signal to be a clean indication that the clocks and power supplies are stable and within their specifications. ‘Clean’ implies that the signal will remain low (capable of sinking leakage current), without glitches, from the time that the power supplies are turned on until they come within specification. The signal must then transition monotonically to a high state. PWRGOOD can be driven inactive at any time, but clocks and power must again be stable before a subsequent rising edge of PWRGOOD. The PWRGOOD signal must be supplied to the processor; it is used to protect internal circuits against voltage sequencing issues. It should be driven high throughout boundary scan operation. REQ[4:0]# (Request Command) must connect the appropriate pins/lands of all processor FSB agents. They are asserted by the current bus owner to define the currently active transaction type. These signals are source synchronous to ADSTB0#. Refer to the AP[1:0]# signal description for a details on parity checking of these signals. Asserting the RESET# signal resets the processor to a known state and invalidates its internal caches without writing back any of their contents. For a power-on Reset, RESET# must stay active for at least one millisecond after VCC and BCLK have reached their proper specifications. On observing active RESET#, all FSB agents will de-assert their outputs within two clocks. RESET# must not be kept asserted for more than 10 ms while PWRGOOD is asserted. A number of bus signals are sampled at the active-to-inactive transition of RESET# for power-on configuration. These configuration options are described in the Section 6.1. This signal does not have on-die termination and must be terminated on the system board. RS[2:0]# Input RS[2:0]# (Response Status) are driven by the response agent (the agent responsible for completion of the current transaction), and must connect the appropriate pins/lands of all processor FSB agents. RSP# (Response Parity) is driven by the response agent (the agent responsible for completion of the current transaction) during assertion of RS[2:0]#, the signals for which RSP# provides parity protection. It must connect to the appropriate pins/lands of all processor FSB agents. A correct parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low. While RS[2:0]# = 000, RSP# is also high, since this indicates it is not being driven by any agent guaranteeing correct parity. SKTOCC# (Socket Occupied) will be pulled to ground by the processor. System board designers may use this signal to determine if the processor is present. SMI# (System Management Interrupt) is asserted asynchronously by system logic. On accepting a System Management Interrupt, the processor saves the current state and enter System Management Mode (SMM). An SMI Acknowledge transaction is issued, and the processor begins program execution from the SMM handler. If SMI# is asserted during the de-assertion of RESET#, the processor will tristate its outputs. PROCHOT# Input/ Output PWRGOOD Input REQ[4:0]# Input/ Output RESET# Input RSP# Input SKTOCC# Output SMI# Input Datasheet 71 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 7 of 8) Name Type Description STPCLK# (Stop Clock), when asserted, causes the processor to enter a low power Stop-Grant state. The processor issues a Stop-Grant Acknowledge transaction, and stops providing internal clock signals to all processor core units except the FSB and APIC units. The processor continues to snoop bus transactions and service interrupts while in Stop-Grant state. When STPCLK# is de-asserted, the processor restarts its internal clock to all units and resumes execution. The assertion of STPCLK# has no effect on the bus clock; STPCLK# is an asynchronous input. TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port). TDI (Test Data In) transfers serial test data into the processor. TDI provides the serial input needed for JTAG specification support. TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support. TESTHI[13:0] must be connected to the processor’s appropriate power source (refer to VTT_OUT_LEFT and VTT_OUT_RIGHT signal description) through a resistor for proper processor operation. See Section 2.5 for more details. Thermal Diode Anode. See Section 5.2.7. Thermal Diode Cathode. See Section 5.2.7. In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the maximum TC. Assertion of THERMTRIP# (Thermal Trip) indicates the processor junction temperature has reached a level beyond where permanent silicon damage may occur. Upon assertion of THERMTRIP#, the processor will shut off its internal clocks (thus, halting program execution) in an attempt to reduce the processor junction temperature. To protect the processor, its core voltage (VCC) must be removed following the assertion of THERMTRIP#. Driving of the THERMTRIP# signal is enabled within 10 µs of the assertion of PWRGOOD and is disabled on de-assertion of PWRGOOD. Once activated, THERMTRIP# remains latched until PWRGOOD is de-asserted. While the deassertion of the PWRGOOD signal will de-assert THERMTRIP#, if the processor’s junction temperature remains at or above the trip level, THERMTRIP# will again be asserted within 10 µs of the assertion of PWRGOOD. TMS (Test Mode Select) is a JTAG specification support signal used by debug tools. TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive a write or implicit writeback data transfer. TRDY# must connect the appropriate pins/lands of all FSB agents. TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset. VCC are the power pins for the processor. The voltage supplied to these pins is determined by the VID[5:0] pins. VCCA provides isolated power for the internal processor core PLLs. VCCIOPLL provides isolated power for internal processor FSB PLLs. VCC_SENSE is an isolated low impedance connection to processor core power (VCC). It can be used to sense or measure voltage near the silicon with little noise. This land is provided as a voltage regulator feedback sense point for VCC. It is connected internally in the processor package to the sense point land U27 as described in the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775. STPCLK# Input TCK TDI TDO Input Input Output TESTHI[13:0] THERMDA THERMDC Input Other Other THERMTRIP# Output TMS Input TRDY# Input TRST# VCC VCCA VCCIOPLL VCC_SENSE Input Input Input Input Output VCC_MB_ REGULATION Output 72 Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 8 of 8) Name Type Description VID[5:0] (Voltage ID) signals are used to support automatic selection of power supply voltages (VCC). These are open drain signals that are driven by the processor and must be pulled up on the motherboard. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775 for more information. The voltage supply for these signals must be valid before the VR can supply VCC to the processor. Conversely, the VR output must be disabled until the voltage supply for the VID signals becomes valid. The VID signals are needed to support the processor voltage specification variations. See Table 2-2 for definitions of these signals. The VR must supply the voltage that is requested by the signals, or disable itself. VSS are the ground pins for the processor and should be connected to the system ground plane. VSSA is the isolated ground for internal PLLs. VSS_SENSE is an isolated low impedance connection to processor core VSS. It can be used to sense or measure ground near the silicon with little noise. This land is provided as a voltage regulator feedback sense point for VSS. It is connected internally in the processor package to the sense point land V27 as described in the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775. Miscellaneous voltage supply. The VTT_OUT_LEFT and VTT_OUT_RIGHT signals are included to provide a voltage supply for some signals that require termination to VTT on the motherboard. For future processor compatibility some signals are required to be pulled up to VTT_OUT_LEFT or VTT_OUT_RIGHT. Refer to the following table for the signals that should be pulled up to VTT_OUT_LEFT and VTT_OUT_RIGHT. Output VTT_OUT_RIGHT Pull-up Signal VTT_OUT_RIGHT VTT_OUT_LEFT Signals to be Pulled Up VTT_PWRGOOD, VID[5:0], GTLREF, TMS, TDI, TDO, BPM[5:0], other VRD components RESET#, BR0#, PWRGOOD, TESTHI1, TESTHI8, TESTHI9, TESTHI10, TESTHI11, TESTHI12 VID[5:0] Output VSS VSSA VSS_SENSE Input Input Output VSS_MB_ REGULATION VTT Output VTT_OUT_LEFT VTT_SEL VTTPWRGD Output Input The VTT_SEL signal is used to select the correct VTT voltage level for the processor. The processor requires this input to determine that the VTT voltages are stable and within specification. § Datasheet 73 Land Listing and Signal Descriptions 74 Datasheet Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations Processor Thermal Specifications The Pentium 4 processor in the 775-land package requires a thermal solution to maintain temperatures within operating limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete thermal solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting. For more information on designing a component level thermal solution, refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines. Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on the boxed processor. 5.1 5.1.1 Thermal Specifications To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (TC) specifications when operating at or below the Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the appropriate processor thermal design guidelines. The Pentium 4 processor in the 775-land package introduces a new methodology for managing processor temperatures which is intended to support acoustic noise reduction through fan speed control. Selection of the appropriate fan speed will be based on the temperature reported by the processor’s thermal diode. If the diode temperature is greater than or equal to TCONTROL, the processor case temperature must remain at or below the temperature as specified by the thermal profile. If the diode temperature is less than TCONTROL then the case temperature is permitted to exceed the thermal profile, but the diode temperature must remain at or below TCONTROL. Systems that implement fan speed control must be designed to take these conditions into account. Systems that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile specifications. To determine a processor's case temperature specification based on the thermal profile, it is necessary to accurately measure processor power dissipation. Datasheet 75 Thermal Specifications and Design Considerations The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained periods of time. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained period of time. For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature must be enabled for the processor to remain within specification. Table 5-1. Processor Thermal Specifications Processor Number 520/521 530/531 540/541 550/551 550 560/561 570/571 NOTES: 1. 2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC. Core Frequency (GHz) 2.80 (PRB = 0) 3 (PRB = 0) 3.20 (PRB = 0) 3.40 (PRB = 0) 3.40 (PRB = 1) 3.60 (PRB = 1) 3.80 (PRB = 1) Thermal Design Power (W) 84 84 84 84 115 115 115 Minimum TC (°C) 5 5 5 5 5 5 5 Maximum TC (°C) See Table 5-3 and Figure 5-2 See Table 5-3 and Figure 5-2 See Table 5-3 and Figure 5-2 See Table 5-3 and Figure 5-2 See Table 5-2 and Figure 5-1 See Table 5-2 and Figure 5-1 See Table 5-2 and Figure 5-1 Notes 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 76 Datasheet Thermal Specifications and Design Considerations Table 5-2. Thermal Profile for Processors with PRB = 1 Power (W) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 Maximum TC (°C) 44.0 44.5 45.0 45.5 46.0 46.5 47.0 47.5 48.0 48.5 49.0 49.5 50.0 50.5 51.0 Power (W) 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 Maximum TC (°C) 51.5 52.0 52.5 53.0 53.5 54.0 54.5 55.0 55.5 56.0 56.5 57.0 57.5 58.0 58.5 Power (W) 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 Maximum TC (°C) 59.0 59.5 60.0 60.5 61.0 61.5 62.0 62.5 63.0 63.5 64.0 64.5 65.0 65.5 66.0 Power (W) 90 92 94 96 98 100 102 104 106 108 110 112 114 115 Maximum TC (°C) 66.5 67.0 67.5 68.0 68.5 69.0 69.5 70.0 70.5 71.0 71.5 72.0 72.5 72.8 Figure 5-1. Thermal Profile for Processors with PRB = 1 75.0 70.0 y = 0.25x + 44 65.0 60.0 Tcase (C) 55.0 50.0 45.0 40.0 0 10 20 30 40 50 60 Power (W) 70 80 90 100 110 Datasheet 77 Thermal Specifications and Design Considerations Table 5-3. Thermal Profile for Processors with PRB = 0 Power (W) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 Maximum Tc (°C) 44.2 44.8 45.3 45.9 46.4 47.0 47.6 48.1 48.7 49.2 49.8 50.4 50.9 51.5 52.0 Power (W) 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 Maximum Tc (°C) 52.6 53.2 53.7 54.3 54.8 55.4 56.0 56.5 57.1 57.6 58.2 58.8 59.3 59.9 60.4 Power (W) 60 62 64 66 68 70 72 74 76 78 80 82 84 Maximum Tc (°C) 61.0 61.6 62.1 62.7 63.2 63.8 64.4 64.9 65.5 66.0 66.6 67.2 67.7 Figure 5-2. Thermal Profile for Processors with PRB = 0 70.0 65.0 y = 0.28x + 44.2 60.0 Tcase (C) 55.0 50.0 45.0 40.0 0 10 20 30 40 Power (W) 50 60 70 80 78 Datasheet Thermal Specifications and Design Considerations 5.1.2 Thermal Metrology The maximum and minimum case temperatures (TC) are specified in Table 5-1. These temperature specifications are meant to help ensure proper operation of the processor. Figure 5-3 illustrates where Intel recommends TC thermal measurements should be made. For detailed guidelines on temperature measurement methodology, refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines. Figure 5-3. Case Temperature (TC) Measurement Location Measure TC at this point (geometric center of the package) 37.5 mm 37.5 mm 5.2 5.2.1 Processor Thermal Features Thermal Monitor The Thermal Monitor feature helps control the processor temperature by activating the TCC when the processor silicon reaches its maximum operating temperature. The TCC reduces processor power consumption as needed by modulating (starting and stopping) the internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to be operating within specifications. The temperature at which Thermal Monitor activates the thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal manner, and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active. When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to the processor (typically 30–50%). Clocks often will not be off for more than 3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and will decrease as processor core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases. Datasheet 79 Thermal Specifications and Design Considerations With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable. An under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss, and in some cases may result in a TC that exceeds the specified maximum temperature and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for information on designing a thermal solution. The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and cannot be modified. The Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines. 5.2.2 Thermal Monitor 2 The Pentium 4 processor in the 775-land package also supports a power management capability known as Thermal Monitor 2. This mechanism provides an efficient mechanism for limiting the processor temperature by reducing power consumption within the processor. When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the enhanced Thermal Control Circuit (TCC) will be activated. This enhanced TCC causes the processor to adjust its operating frequency (bus multiplier) and input voltage (VID). This combination of reduced frequency and VID results in a decrease in processor power consumption. A processor enabled for Thermal Monitor 2 includes two operating points, each consisting of a specific operating frequency and voltage. The first point represents the normal operating conditions for the processor. The second point consists of both a lower operating frequency and voltage. When the enhanced TCC is activated, the processor automatically transitions to the new frequency. This transition occurs very rapidly (on the order of 5 µs). During the frequency transition, the processor is unable to service any bus requests, and consequently, all bus traffic is blocked. Edge-triggered interrupts will be latched and kept pending until the processor resumes operation at the new frequency. Once the new operating frequency is engaged, the processor will transition to the new core operating voltage by issuing a new VID code to the voltage regulator. The voltage regulator must support VID transitions in order to support Thermal Monitor 2. During the voltage change, it will be necessary to transition through multiple VID codes to reach the target operating voltage. Each step will be one VID table entry (i.e., 12.5 mV steps). The processor continues to execute instructions during the voltage transition. Operation at this lower voltage reduces both the dynamic and leakage power consumption of the processor, providing a reduction in power consumption at a minimum performance impact. Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, to insure proper operation once the processor reaches its normal operating frequency. Refer to Figure 5-4 for an illustration of this ordering. 80 Datasheet Thermal Specifications and Design Considerations Figure 5-4. Thermal Monitor 2 Frequency and Voltage Ordering TTM2 fMAX fTM2 VID VIDTM2 Temperature Frequency VID PROCHOT# Time The PROCHOT# signal is asserted when a high temperature situation is detected, regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled. It should be noted that the Thermal Monitor 2 TCC can not be activated via the on demand mode. The Thermal Monitor TCC, however, can be activated through the use of the on demand mode. 5.2.3 On-Demand Mode The Pentium 4 processor in the 775-land package provides an auxiliary mechanism that allows system software to force the processor to reduce its power consumption. This mechanism is referred to as "On-Demand" mode and is distinct from the Thermal Monitor feature. On-Demand mode is intended as a means to reduce system level power consumption. Systems using the Pentium 4 processor in the 775-land package must not rely on software usage of this mechanism to limit the processor temperature. If bit 4 of the ACPI P_CNT Control Register (located in the processor IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce its power consumption via modulation (starting and stopping) of the internal core clock, independent of the processor temperature. When using On-Demand mode, the duty cycle of the clock modulation is programmable via bits 3:1 of the same ACPI P_CNT Control Register. In On-Demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be used in conjunction with the Thermal Monitor. If the system tries to enable On-Demand mode at the same time the TCC is engaged, the factory configured duty cycle of the TCC will override the duty cycle selected by the On-Demand mode. Datasheet 81 Thermal Specifications and Design Considerations 5.2.4 PROCHOT# Signal An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the Thermal Monitor must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or de-assertion of PROCHOT#. Refer to the Intel Architecture Software Developer's Manuals for specific register and programming details. The Pentium 4 processor in the 775-land package implements a bi-directional PROCHOT# capability to allow system designs to protect various components from over-temperature situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components. One application is the thermal protection of voltage regulators (VR). System designers can create a circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR can cool down as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power. With a properly designed and characterized thermal solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very short periods of time when running the most power intensive applications. An under-designed thermal solution that is not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may cause a noticeable performance loss. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775 for details on implementing the bi-directional PROCHOT# feature. 5.2.5 THERMTRIP# Signal Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in Table 4-3). At this point, the FSB signal THERMTRIP# will go active and stay active as described in Table 4-3. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles. 5.2.6 TCONTROL and Fan Speed Reduction TCONTROL is a temperature specification based on a temperature reading from the thermal diode. The value for TCONTROL will be calibrated in manufacturing and configured for each processor. When Tdiode is above TCONTROL, then TC must be at or below TC-MAX as defined by the thermal profile in Table 5-2 and Figure 5-1; otherwise, the processor temperature can be maintained at TCONTROL (or lower) as measured by the thermal diode. The purpose of this feature is to support acoustic optimization through fan speed control. Contact your Intel representative for further details and documentation. 82 Datasheet Thermal Specifications and Design Considerations 5.2.7 Thermal Diode The processor incorporates an on-die thermal diode. A thermal sensor located on the system board may monitor the die temperature of the processor for thermal management/long term die temperature change purposes. Table 5-4 and Table 5-5 provide the diode parameter and interface specifications. This thermal diode is separate from the Thermal Monitor’s thermal sensor and cannot be used to predict the behavior of the Thermal Monitor. Table 5-4. Thermal Diode Parameters Symbol IFW n RT NOTES: 1. 2. 3. 4. Intel does not support or recommend operation of the thermal diode under reverse bias. Characterized at 75 °C. Not 100% tested. Specified by design characterization. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equation: Parameter Forward Bias Current Diode Ideality Factor Series Resistance Min 11 1.0083 3.242 Typ Max 187 Unit µA Notes 1 2, 3, 4, 5 1.011 3.33 1.023 3.594 Ω 2, 3, 6 IFW = IS * (e qVD/nkT –1) where IS = saturation current, q = electronic charge, VD = voltage across the diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin). 5. Devices found to have an ideality factor of 1.0183 to 1.023 will create a temperature error approximately 2 C° higher than the actual temperature. To minimize any potential acoustic impact of this temperature error, TCONTROL will be increased by 2 C° on these parts. The series resistance, RT, is provided to allow for a more accurate measurement of the thermal diode temperature. RT, as defined, includes the pins of the processor but does not include any socket resistance or board trace resistance between the socket and the external remote diode thermal sensor. RT can be used by remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term. Another application is that a temperature offset can be manually calculated and programmed into an offset register in the remote diode thermal sensors as exemplified by the equation: 6. Terror = [RT * (N-1) * IFWmin] / [nk/q * ln N] where Terror = sensor temperature error, N = sensor current ratio, k = Boltzmann Constant, q = electronic charge. Table 5-5. Thermal Diode Interface Signal Name THERMDA THERMDC Land Number AL1 AK1 Signal Description diode anode diode cathode § Datasheet 83 Thermal Specifications and Design Considerations 84 Datasheet Features 6 6.1 Features Power-On Configuration Options Several configuration options can be configured by hardware. The Pentium 4 processor in the 775land package samples the hardware configuration at reset, on the active-to-inactive transition of RESET#. For specifications on these options, refer to Table 6-1. The sampled information configures the processor for subsequent operation. These configuration options cannot be changed except by another reset. All resets reconfigure the processor; for reset purposes, the processor does not distinguish between a "warm" reset and a "power-on" reset. Frequency determination functionality will exist on engineering sample processors which means that samples can run at varied frequencies. Production material will have the bus to core ratio locked and can only be operated at the rated frequency. Table 6-1. Power-On Configuration Option Signals Configuration Option Output tristate Execute BIST In Order Queue pipelining (set IOQ depth to 1) Disable MCERR# observation Disable BINIT# observation APIC Cluster ID (0-3) Disable bus parking Disable Hyper-Threading Technology Symmetric agent arbitration ID RESERVED NOTES: 1. 2. Asserting this signal during RESET# will select the corresponding option. Address signals not identified in this table as configuration options should not be asserted during RESET#. Signal1, SMI# INIT# A7# A9# A10# 2 A[12:11]# A15# A31# BR0# A[6:3]#, A8#, A[14:13]#, A[16:30]#, A[32:35]# 6.2 Clock Control and Low Power States The processor allows the use of AutoHALT and Stop-Grant states to reduce power consumption by stopping the clock to internal sections of the processor, depending on each particular state. See Figure 6-1 for a visual representation of the processor low power states. The processor adds support for the Enhanced HALT powerdown state. Refer to Figure 6-1 and the following sections. Not all processors are capable of supporting the Enhanced HALT state. Refer to the Specification Update to determine which processor stepping and frequencies will support the Enhanced HALT state. Datasheet 85 Features 6.2.1 Normal State This is the normal operating state for the processor. 6.2.2 HALT and Enhanced HALT Powerdown States The Prescott processor supports the HALT or Enhanced HALT powerdown state. The Enhanced HALT powerdown state is configured and enabled via the BIOS. The Enhanced HALT state is a lower power state as compared to the Stop Grant State. If Enhanced HALT is not enabled, the default powerdown state entered will be HALT. Refer to the sections below for details about the HALT and Enhanced HALT states. 6.2.2.1 HALT Powerdown State HALT is a low power state entered when all the logical processors have executed the HALT or MWAIT instructions. When one of the logical processors executes the HALT instruction, that logical processor is halted, however, the other processor continues normal operation. The processor will transition to the Normal state upon the occurrence of SMI#, BINIT#, INIT#, or LINT[1:0] (NMI, INTR). RESET# will cause the processor to immediately initialize itself. The return from a System Management Interrupt (SMI) handler can be to either Normal Mode or the HALT Power Down state. See the Intel Architecture Software Developer's Manual, Volume III: System Programmer's Guide for more information. The system can generate a STPCLK# while the processor is in the HALT Power Down state. When the system deasserts the STPCLK# interrupt, the processor will return execution to the HALT state. While in HALT Power Down state, the processor will process bus snoops. 6.2.2.2 Enhanced HALT Powerdown State Enhanced HALT is a low power state entered when all logical processors have executed the HALT or MWAIT instructions and Enhanced HALT has been enabled via the BIOS. When one of the logical processors executes the HALT instruction, that logical processor is halted; however, the other processor continues normal operation. The processor will automatically transition to a lower frequency and voltage operating point before entering the Enhanced HALT state. Note that the processor FSB frequency is not altered; only the internal core frequency is changed. When entering the low power state, the processor will first switch to the lower bus ratio and then transition to the lower VID. While in Enhanced HALT state, the processor will process bus snoops. The processor exits the Enhanced HALT state when a break event occurs. When the processor exits the Enhanced HALT state, it will first transition the VID to the original value and then change the bus ratio back to the original value. 86 Datasheet Features Figure 6-1. Processor Low Power State Machine HALT or MWAIT Instruction and HALT Bus Cycle Generated Normal State Normal execution INIT#, BINIT#, INTR, NMI, SMI#, RESET#, FSB interrupts Enhanced HALT or HALT State BCLK running Snoops and interrupts allowed S As TP se C L rte K# d S D TP e- C as LK se # rte d STPCLK# Asserted STPCLK# De-asserted Snoop Event Occurs Snoop Event Serviced HALT Snoop State BCLK running Service snoops to caches Snoop Event Occurs Snoop Event Serviced Stop-Grant State BCLK running Snoops and interrupts allowed Grant Snoop State BCLK running Service snoops to caches 6.2.3 Stop-Grant State When the STPCLK# signal is asserted, the Stop-Grant state of the processor is entered 20 bus clocks after the response phase of the processor-issued Stop Grant Acknowledge special bus cycle. Since the GTL+ signals receive power from the FSB, these signals should not be driven (allowing the level to return to VTT) for minimum power drawn by the termination resistors in this state. In addition, all other input signals on the FSB should be driven to the inactive state. BINIT# will not be serviced while the processor is in Stop-Grant state. The event will be latched and can be serviced by software upon exit from the Stop Grant state. RESET# will cause the processor to immediately initialize itself, but the processor will stay in Stop-Grant state. A transition back to the Normal state will occur with the de-assertion of the STPCLK# signal. A transition to the HALT/Grant Snoop state will occur when the processor detects a snoop on the FSB (see Section 6.2.3). While in the Stop-Grant State, SMI#, INIT#, BINIT# and LINT[1:0] will be latched by the processor, and only serviced when the processor returns to the Normal State. Only one occurrence of each event will be recognized upon return to the Normal state. While in Stop-Grant state, the processor will process a FSB snoop. Datasheet 87 Features 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State The Enhanced HALT Snoop State is used in conjunction with the new Enhanced HALT state. If Enhanced HALT state is not enabled in the BIOS, the default Snoop State entered will be the HALT Snoop State. Refer to the sections below for details on HALT Snoop State, Grant Snoop State and Enhanced HALT Snoop State. 6.2.4.1 HALT Snoop State, Grant Snoop State The processor will respond to snoop transactions on the FSB while in Stop-Grant state or in HALT Power Down state. During a snoop transaction, the processor enters the HALT:Grant Snoop state. The processor will stay in this state until the snoop on the FSB has been serviced (whether by the processor or another agent on the FSB). After the snoop is serviced, the processor will return to the Stop-Grant state or HALT Power Down state, as appropriate. 6.2.4.2 Enhanced HALT Snoop State The Enhanced HALT Snoop State is the default Snoop State when the Enhanced HALT state is enabled via the BIOS. The processor will remain in the lower bus ratio and VID operating point of the Enhanced HALT state. While in the Enhanced HALT Snoop State, snoops are handled the same way as in the HALT Snoop State. After the snoop is serviced the processor will return to the Enhanced HALT Power Down state. § 88 Datasheet Boxed Processor Specifications 7 Boxed Processor Specifications The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as a boxed Intel processor. Boxed Intel processors are intended for system integrators who build systems from baseboards and standard components. The boxed Pentium 4 processor in the 775-land package will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed Pentium 4 processor in the 775-land package. This chapter is particularly important for OEMs that manufacture baseboards for system integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor in the 775-land package. Note: Drawings in this section reflect only the specifications on the boxed Intel processor product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers’ responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further guidance. Contact your local Intel Sales Representative for this document. Figure 7-1. Mechanical Representation of the Boxed Processor NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Datasheet 89 Boxed Processor Specifications 7.1 7.1.1 Mechanical Specifications Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed Pentium 4 processor on 90 nm process in the 775-land package. The boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor in the 775-land package. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 7-2 (side view), and Figure 7-3 (top view). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Figure 7-2. Space Requirements for the Boxed Processor (Side View) 3.74 [95.0] 3.2 [81.3] 0.39 [10.0] 0.98 [25.0] Figure 7-3. Space Requirements for the Boxed Processor (Top View) 3.74 [95.0] 3.74 [95.0] NOTES: 1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. 90 Datasheet Boxed Processor Specifications Figure 7-4. Space Requirements for the Boxed Processor (Overall View) 7.1.2 Boxed Processor Fan Heatsink Weight The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5 and the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for details on the processor weight and heatsink requirements. 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink attach clip assembly. 7.2 7.2.1 Electrical Requirements Fan Heatsink Power Supply The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be shipped with the boxed processor to draw power from a power header on the baseboard. The power cable connector and pinout are shown in Figure 7-5. Baseboards must provide a matched power header to support the boxed processor. Table 7-1 contains specifications for the input and output signals at the fan heatsink connector. Datasheet 91 Boxed Processor Specifications The fan heatsink outputs a SENSE signal that is an open-collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system boardmounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND. The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL. The boxed processor's fan heatsink requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control. The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 7-6 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 110 mm [4.33 inches] from the center of the processor socket. Figure 7-5. Boxed Processor Fan Heatsink Power Cable Connector Description Pin 1 2 3 4 Signal GND +12 V SENSE CONTROL Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp. 0.100" pitch, 0.025" square pin width. Match with straight pin, friction lock header on mainboard. 1234 Boxed_Proc_PwrCable Table 7-1. Fan Heatsink Power and Signal Specifications Description +12 V: 12 volt fan power supply IC: Peak Fan current draw Fan start-up current draw Fan start-up current draw maximum duration SENSE: SENSE frequency CONTROL NOTES: 1. 2. 3. Baseboard should pull this pin up to 5V with a resistor. Open drain type, pulse width modulated. Fan will have pull-up resistor to 4.75 V maximum of 5.25 V. Min 10.2 Typ 12 1.1 — — Max 13.8 1.5 2.2 1.0 — 28 Unit V A A Second pulses per fan revolution kHz Notes - — - — 21 2 25 1 2, 3 92 Datasheet Boxed Processor Specifications Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket B R4.33 [110] C 7.3 Thermal Specifications This section describes the cooling requirements of the fan heatsink solution used by the boxed processor. 7.3.1 Boxed Processor Cooling Requirements The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is in Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature within the specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's temperature specification is the responsibility of the system integrator. Datasheet 93 Boxed Processor Specifications Figure 7-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) Figure 7-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) 94 Datasheet Boxed Processor Specifications 7.3.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header it will operate as follows: The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. This allows the processor fan to operate at a lower speed and noise level, while internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set point, the fan speed will rise linearly with the internal temperature until the higher set point is reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan noise levels. Systems should be designed to provide adequate air around the boxed processor fan heatsink that remains cooler then lower set point. These set points, represented in Figure 7-9 and Table 7-2, can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis temperature should be kept below 38 ºC. Meeting the processor's temperature specification (see Chapter 5) is the responsibility of the system integrator. The motherboard must supply a constant +12 V to the processor's power header to ensure proper operation of the variable speed fan for the boxed processor. Refer to Table 7-1 for the specific requirements. Figure 7-9. Boxed Processor Fan Heatsink Set Points Higher Set Point Highest Noise Level Increasing Fan Speed & Noise Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) Datasheet 95 Boxed Processor Specifications Table 7-2. Fan Heatsink Power and Signal Specifications Boxed Processor Fan Heatsink Set Point (ºC) X ≤ 30 Boxed Processor Fan Speed When the internal chassis temperature is below or equal to this set point, the fan operates at its lowest speed. Recommended maximum internal chassis temperature for nominal operating environment. When the internal chassis temperature is at this point, the fan operates between its lowest and highest speeds. Recommended maximum internal chassis temperature for worst-case operating environment. When the internal chassis temperature is above or equal to this set point, the fan operates at its highest speed. Notes 1 Y = 34 Z ≥ 38 NOTES: 1. - - Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink. If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM output (CONTROL see Table 7-1) and remote thermal diode measurement capability the boxed processor will operate as follows: As processor power has increased the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage. The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by more accurate measurement of processor die temperature through the processor's temperature diode (Tdiode). Fan RPM is modulated through the use of an ASIC located on the motherboard that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan speed is based on actual processor temperature instead of internal ambient chassis temperatures. If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard processor fan header, it will default back to a thermistor controlled mode, allowing compatibility with existing 3pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied based on the Tinlet temperature measured by a thermistor located at the fan inlet. For more details on specific motherboard requirements for 4-wire based fan speed control see the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guide. § 96 Datasheet