8XC196MC

8XC196MC INDUSTRIAL MOTOR CONTROL MICROCONTROLLER 87C196MC 16 Kbytes of On-Chip OTPROM 87C196MC ROM 16 Kbytes of On-Chip Factory-Programmed OTPROM 80C196MC ROMless Y Y High-Performance CHMOS 16-Bit CPU 16 Kbytes of On-Chip OTPROM Factory-Programmed OTPROM 488 bytes of On-Chip Register RAM Register to Register Architecture Up to 53 I O Lines Peripheral Transaction Server (PTS) with 11 Prioritized Sources Event Processor Array (EPA) 4 High Speed Capture Compare Modules 4 High Speed Compare Modules Extended Temperature Standard Y Two 16-Bit Timers with Quadrature Decoder Input 3-Phase Complementary Waveform Generator 13 Channel 8 10-Bit A D with Sample Hold with Zero Offset Adjustment H W 14 Prioritized Interrupt Sources Flexible 8- 16-Bit External Bus 1 75 ms 16 x 16 Multiply 3 ms 32 16 Divide Idle and Power Down Modes Y Y Y Y Y Y Y Y Y Y Y Y Y The 8XC196MC is a 16-bit microcontroller designed primarily to control 3 phase AC induction and DC brushless motors The 8XC196MC is based on Intel’s MCS 96 16-bit microcontroller architecture and is manufactured with Intel’s CHMOS process The 8XC196MC has a three phase waveform generator specifically designed for use in ‘‘Inverter’’ motor control applications This peripheral allows for pulse width modulation three phase sine wave generation with minimal CPU intervention It generates 3 complementary non-overlapping PWM pulses with resolutions of 0 125 ms (edge trigger) or 0 250 ms (centered) The 8XC196MC has 16 Kbytes on-chip OTPROM ROM and 488 bytes of on-chip RAM It is available in three packages PLCC (84-L) SDIP (64-L) and EIAJ QFP (80-L) Note that the 64-L SDIP package does not include P1 4 P2 7 P5 1 and the CLKOUT pins Operational characteristics are guaranteed over the temperature range of b 40 C to a 85 C The 87C196MC contains 16 Kbytes on-chip OTPROM The 83C196MC contains 16 Kbytes on-chip ROM All references to the 80C196MC also refers to the 83C196MC and 87C196MC unless noted OTPROM (One Time Programmable Read Only Memory) is the same as EPROM but it comes in an unwindowed package and cannot be erased It is user programmable Other brands and names are the property of their respective owners Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata COPYRIGHT INTEL CORPORATION 1995 April 1994 Order Number 270946-005 8XC196MC 270946 – 1 NOTE Connections between the standard I O ports and the bus are not shown Figure 1 87C196MC Block Diagram 2 8XC196MC PROCESS INFORMATION This device is manufactured on PX29 5 a CHMOS III-E process Additional process and reliability information is available in Intel’s Components Quality and Reliability Handbook Order Number 210997 8XC196MC Memory Map Description External Memory or I O Internal ROM EPROM or External Memory (Determined by EA) Reserved Must contain FFH (Note 5) PTS Vectors Upper Interrupt Vectors ROM EPROM Security Key 270946 – 16 Address 0FFFFH 06000H 5FFFH 2080H 207FH 205EH 205DH 2040H 203FH 2030H 202FH 2020H 201FH 201CH 201BH 201AH 2019H 2018H 2017H 2014H 2013H 2000H 1FFFH 1F00H 1EFFH 0200H 01FFH 0018H 0017H 0000H Reserved Must contain FFH (Note 5) Reserved Must Contain 20H (Note 5) CCB1 Reserved Must Contain 20H (Note 5) CCB0 Reserved Must contain FFH (Note 5) Lower Interrupt Vectors EXAMPLE N87C196MC is 84-Lead PLCC OTPROM 16 MHz For complete package dimensional data refer to the Intel Packaging Handbook (Order Number 240800) NOTE 1 EPROMs are available as One Time Programmable (OTPROM) only Figure 3 The 8XC196MC Family Nomenclature Thermal Characteristics Package Type PLCC QFP SDIP ija 35 C W 56 C W TBD ijc SFR’s 13 C W 12 C W TBD 488 Bytes Register RAM (Note 1) CPU SFR’s (Notes 1 3) External Memory All thermal impedance data is approximate for static air conditions at 1W of power dissipation Values will change depending on operation conditions and application See the Intel Packaging Handbook (order number 240800) for a description of Intel’s thermal impedance test methodology NOTES 1 Code executed in locations 0000H to 03FFH will be forced external 2 Reserved memory locations must contain 0FFH unless noted 3 Reserved SFR bit locations must contain 0 4 Refer to 8XC196KC for SFR descriptions 5 WARNING Reserved memory locations must not be written or read The contents and or function of these locations may change with future revisions of the device Therefore a program that relies on one or more of these locations may not function properly 3 8XC196MC 270946 – 2 NOTE The pin sequence is correct The 64-Lead SDIP package does not include the following pins P1 4 ACH12 P2 7 COMPARE3 P5 1 INST CLKOUT Figure 2 64-Lead Shrink DIP (SDIP) Package 4 8XC196MC 270946 – 3 NOTE NC means No Connect Do not connect these pins Figure 3 84-Lead PLCC Package 5 8XC196MC 270946 – 4 NOTE NC means No Connect Do not connect these pins Figure 4 80-Lead Shrink EIAJQFP (Quad Flat Pack) 6 8XC196MC PIN DESCRIPTIONS Symbol ACH0–ACH12 (P0 0–P0 7 P1 0–P1 4) ANGND ALE ADV(P5 0) (Alphabetically Ordered) Function Analog inputs to the on-chip A D converter ACH0 – 7 share the input pins with P0 0–7 and ACH8 – 12 share pins with P1 0 – 4 If the A D is not used the port pins can be used as standard input ports Reference ground for the A D converter Must be held at nominally the same potential as VSS Address Latch Enable or Address Valid output as selected by CCR Both options allow a latch to demultiplex the address data bus on the signal’s falling edge When the pin is ADV it goes inactive (high) at the end of the bus cycle ALE ADV is active only during external memory accesses Can be used as standard I O when not used as ALE ADV Byte High Enable or Write High output as selected by the CCR BHE will go low for external writes to the high byte of the data bus WRH will go low for external writes where an odd byte is being written BHE WRH is activated only during external memory writes Input for bus width selection If CCR bits 1 and 2 e 1 this pin dynamically controls the bus width of the bus cycle in progress If BUSWIDTH is low an 8-bit cycle occurs If it is high a 16-bit cycle occurs This pin can be used as standard I O when not used as BUSWIDTH The EPA Capture Compare pins These pins share P2 0 – P2 3 If not used for the EPA they can be configured as standard I O pins Output of the internal clock generator The frequency is of the oscillator frequency It has a 50% duty cycle The EPA Compare pins These pins share P2 4 – P2 7 If not used for the EPA they can be configured as standard I O pins External Access enable pin EA e 0 causes all memory accesses to be external to the chip EA e 1 causes memory accesses from location 2000H to 5FFFH to be from the on-chip OTPROM QROM EA e 12 5V causes execution to begin in the programming mode EA is latched at reset A programmable input on this pin causes a maskable interrupt vector through memory location 203CH The input may be selected to be a positive negative edge or a high low level using WG PROTECT (1FCEH) INST is high during the instruction fetch from the external memory and throughout the bus cycle It is low otherwise This pin can be configured as standard I O if not used as INST A positive transition on this pin causes a non-maskable interrupt which vectors to memory location 203EH If not used it should be tied to VSS May be used by Intel Evaluation boards 8-bit high impedance input-only port Also used as A D converter inputs Port0 pins should not be left floating These pins also used to select programming modes in the OTPROM devices 5-bit high impedance input-only port P1 0 – P1 4 are also used as A D converter inputs In addition P1 2 and P1 3 can be used as Timer 1 clock input and direction select respectively 8-bit bidirectional I O port All of the Port2 pins are shared with the EPA I O pins (CAPCOMP0 – 3 and COMPARE0 – 3) 8-bit bidirectional I O ports with open drain outputs These pins are shared with the multiplexed address data bus which uses strong internal pullups 8-bit bidirectional I O port 7 of the pins are shared with bus control signals (ALE INST WR RD BHE READY BUSWIDTH) Can be used as standard IO BHE WRH (P5 5) BUSWIDTH (P5 7) CAPCOMP0–CAPCOMP3 (P2 0–P2 3) CLKOUT COMPARE0–COMPARE3 (P2 4–P2 7) EA EXTINT INST (P5 1) NMI PORT0 PORT1 PORT2 PORT3 PORT4 PORT5 7 8XC196MC PIN DESCRIPTIONS Symbol PORT6 PWM0 PWM1 (P6 6 P6 7) (Alphabetically Ordered) (Continued) Function 8-bit output port P6 6 and P6 7 output PWM the others are used as the Wave Form Generator outputs Can be used as standard output ports Programmable duty cycle Programmable frequency Pulse Width Modulator pins The duty cycle has a resolution of 256 steps and the frequency can vary from 122 Hz to 31 KHz (16 MHz input clock) Pins may be configured as standard output if PWM is not used Read signal output to external memory RD is low only during external memory reads Can be used as standard I O when not used as RD Ready input to lengthen external memory cycles If READY e 0 the memory controller inserts wait states until the next positive transition of CLKOUT occurs with READY e 1 Can be used as standard I O when not used as READY Reset input to and open-drain output from the chip Held low for at least 16 state times to reset the chip Input high for normal operation RESET has an Ohmic internal pullup resistor Timer 0 Clock input This pin has two other alternate functions ACH10 and P1 2 Timer 0 Direction input This pin has two other alternate functions ACH11 and P1 3 The programming voltage is applied to this pin It is also the timing pin for the return from Power Down circuit Connect this pin with a 1 mF capacitor to VSS and a 1 MX resistor to VCC If the Power Down feature is not used connect the pin to VCC 3 phase output signals and their complements used in motor control applications The pins can also be configured as standard output pins Write and Write Low output to external memory WR will go low every external write WRL will go low only for external writes to an even byte Can be used as standard I O when not used as WR WRL Input of the oscillator inverter and the internal clock generator This pin should be used when using an external clock source Output of the oscillator inverter Determines the EPROM programming mode A low signal in Auto Programming mode indicates that programming is in process A high signal indicates programming is complete A falling edge in Slave Programming Mode and Auto Configuration Byte Programming Mode indicates that ports 3 and 4 contain valid programming address command information (input to slave) A falling edge in Slave Programming Mode begins programming A rising edge ends programming A high signal in Slave Programming Mode and Auto Configuration Byte Programming Mode indicates the byte programmed correctly Cumulative Program Verification Pin is high if all locations since entering a programming mode have programmed correctly Auto Increment Active low input enables the auto increment mode Auto increment will allow reading or writing of sequential EPROM locations without address transactions across the PBUS for each read or write RD (P5 3) READY (P5 6) RESET T1CLK (P1 2) T1DIR (P1 3) VPP WG1–WG3 WG1 –WG3 (P6 0–P6 5) WR WRL (P5 2) XTAL1 XTAL2 PMODE (P0 4–7) PACT (P2 5) PALE (P2 1) PROG (P2 2) PVER (P2 0) CPVER (P2 6) AINC (P2 4) 8 8XC196MC ABSOLUTE MAXIMUM RATINGS Ambient Temperature Under Bias Storage Temperature Voltage from EA or VPP to VSS or ANGND Voltage on VPP or EQ to VSS or ANGND Voltage on Any Other Pin to VSS or ANGND Power Dissipation b 40 C to a 85 C b 65 C to a 150 C a 13 00V b 0 5V to 13 0V b 0 5V to a 7 0V(1) NOTICE This data sheet contains preliminary information on new products in production The specifications are subject to change without notice Verify with your local Intel Sales office that you have the latest data sheet before finalizing a design WARNING Stressing the device beyond the ‘‘Absolute Maximum Ratings’’ may cause permanent damage These are stress ratings only Operation beyond the ‘‘Operating Conditions’’ is not recommended and extended exposure beyond the ‘‘Operating Conditions’’ may affect device reliability 1 5W(2) NOTES 1 This includes VPP and EA on ROM or CPU only devices 2 Power dissipation is based on package heat transfer limitations not device power consumption OPERATING CONDITIONS Symbol TA VCC VREF FOSC Description Ambient Temperature Under Bias Digital Supply Voltage Analog Supply Voltage Oscillator Frequency Min b 40 Max a 85 Units C V V MHz 4 50 4 00 8 5 50 5 50 16 NOTE ANGND and VSS should be nominally at the same potential Also VSS and VSS1 must be at the same potential DC ELECTRICAL CHARACTERISTICS Symbol VIL VIH VOL Parameter Input Low Voltage Input High Voltage Output Low Voltage Port 2 and 5 P6 6 P6 7 CLKOUT Output Low Voltage on Port 3 4 Output Low Voltage on Port 6 0–6 5 Output High Voltage (Over Specified Operating Conditions) Min b0 5 Max 0 3 VCC VCC a 0 5 03 0 45 15 10 0 45 Units V V V V V V V V V V V Test Conditions 0 7 VCC IOL e 200 mA IOL e 3 2 mA IOL e 7 mA IOL e 15 mA IOL e 10 mA IOH e b 200 mA IOH e b 3 2 mA IOH e b 7 mA Typical VOL1 VOL2 VOH VCC b 0 3 VCC b 0 7 VCC b 1 5 02 Vth a –Vthb Hysteresis Voltage Width on RESET 9 8XC196MC DC ELECTRICAL CHARACTERISTICS Symbol ILI ILI1 IIL IIL1 IOH ICC IREF IIDL IPD RRST CS Parameter Input Leakage Current on All Input Only Pins Input Leakage Current on Port0 and Port1 Input Low Current on BD Ports (Note 1) Input Low Current on P5 4 and P2 6 during Reset Output High Current on P5 4 and P2 6 during Reset Active Mode Current in Reset A D Conversion Reference Current Idle Mode Current Power-Down Mode Current RESET Pin Pullup Resistor Pin Capacitance (Any Pin to VSS) 6k b2 (Over Specified Operating Conditions) (Continued) Test Conditions 0V k VIN k VCC – 0 3V (in RESET) 0V k VIN k VREF VIN e 0 3 VCC 0 2 VCC 0 7 VCC XTAL1 e 16 MHz VCC e VPP e VREF e 5 5V Min Typ Max Units g 10 g3 mA mA mA mA mA b 70 b7 50 2 15 5 70 5 30 50 65k 10 mA mA mA mA X pF VCC e VPP e VREF e 5 5V FTEST e 1 0 MHz NOTES 1 BD (Bidirectional ports) include P2 0 – P2 7 except P2 6 P3 0 – P3 7 P4 0 – P4 7 P5 0 – P5 3 P5 5 – P5 7 2 During normal (non-transient) conditions the following total current limits apply P6 0 – P6 5 IOL 40 mA IOH 28 mA P3 IOL 90 mA IOH 42 mA P4 IOL 90 mA IOH 42 mA P5 CLKOUT IOL 35 mA IOH 35 mA P2 P6 6 P6 7 IOL 63 mA IOH 63 mA 10 8XC196MC EXPLANATION OF AC SYMBOLS Each symbol is two pairs of letters prefixed by ‘‘T’’ for time The characters in a pair indicate a signal and its condition respectively Symbols represent the time between the two signal condition points Conditions H L V X Z High Low Valid No Longer Valid Floating Signals A B C D G H HA Address BHE CLKOUT DATA Buswidth HOLD HLDA L BR R W X Y Q ALE ADV BREQ RD WR WRH WRL XTAL1 READY Data Out AC ELECTRICAL CHARACTERISTICS (Over Specified Operating Conditions) Test Conditions Capacitive load on all pins e 100 pF Rise and fall times e 10 ns FOSC e 16 MHz The system must meet the following specifications to work with the 87C196MC Symbol FXTAL TOSC TAVYV TLLYV TYLYH TCLYX TLLYX TAVGV TLLGV TCLGX TAVDV TRLDV TCLDV TRHDZ TRXDX Parameter Frequency on XTAL1 1 FXTAL Address Valid to READY Setup ALE Low to READY Setup Not READY Time READY Hold after CLKOUT Low READY Hold after ALE Low Address Valid to BUSWIDTH Setup ALE Low to BUSWIDTH Setup Buswidth Hold after CLKOUT Low Address Valid to Input Data Valid RD Active to Input Data Valid CLKOUT Low to Input Data Valid End of RD to Input Data Float Data Hold after RD Inactive 0 0 3 TOSC b 55 TOSC b 22 TOSC b 50 TOSC 0 TOSC b 15 Min 8 62 5 Max 16 125 2 TOSC b 75 TOSC b 70 No Upper Limit TOSC b 30 2 TOSC b 40 2 TOSC b 75 TOSC b 60 Units MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns 2 2 4 1 1 4 Notes 3 NOTES 1 If Max is exceeded additional wait states will occur 2 If wait states are used add 2 TOSC N where N e number of wait states 3 Testing performed at 8 MHz However the device is static by design and will typically operate below 1 Hz 4 These timings are included for compatibility with older b90 and BH products They should not be used for newer highspeed designs 11 8XC196MC AC ELECTRICAL CHARACTERISTICS (Continued) Test Conditions Capacitive load on all pins e 100 pF Rise and fall times e 10 ns FOSC e 16 MHz The 87C196MC will meet the following timing specifications Symbol TXHCH TCLCL TCHCL TCLLH TLLCH TLHLH TLHLL TAVLL TLLAX TLLRL TRLCL TRLRH TRHLH TRLAZ TLLWL TCLWL TQVWH TCHWH TWLWH TWHQX TWHLH TWHBX TWHAX TRHBX TRHAX Parameter XTAL1 to CLKOUT High or Low CLKOUT Cycle Time CLKOUT High Period CLKOUT Falling Edge to ALE Rising ALE Falling Edge to CLKOUT Rising ALE Cycle Time ALE High Period Address Setup to ALE Falling Edge Address Hold after ALE Falling ALE Falling Edge to RD Falling RD Low to CLKOUT Falling Edge RD Low Period RD Rising Edge to ALE Rising Edge RD Low to Address Float ALE Falling Edge to WR Falling CLKOUT Low to WR Falling Edge Data Stable to WR Rising Edge CLKOUT High to WR Rising Edge WR Low Period Data Hold after WR Rising Edge WR Rising Edge to ALE Rising Edge BHE INST Hold after WR Rising AD8–15 Hold after WR Rising BHE INST Hold after RD Rising AD8–15 Hold after RD Rising TOSC b 10 0 TOSC b 23 b 10 Min 30 2 TOSC TOSC b 10 b5 b 20 Max 110 Units ns ns ns ns ns ns ns ns ns ns Notes TOSC a 15 15 15 4 TOSC TOSC b 10 TOSC b 15 TOSC b 40 TOSC b 30 4 TOSC b 5 TOSC 30 TOSC a 25 TOSC a 25 5 TOSC a 10 3 ns ns ns ns ns 3 1 25 ns ns 15 ns ns ns 3 TOSC b 30 TOSC b 25 TOSC b 10 TOSC b 10 TOSC b 30 TOSC b 10 TOSC b 30 TOSC a 15 ns ns ns ns ns 1 2 2 NOTES 1 Assuming back to back cycles 2 8-bit bus only 3 If wait states are used add 2 TOSC N where N e number of wait states 12 8XC196MC SYSTEM BUS TIMINGS 270946 – 5 13 8XC196MC READY TIMINGS (One Wait State) 270946 – 6 BUSWIDTH TIMINGS 270946 – 7 14 8XC196MC EXTERNAL CLOCK DRIVE Symbol 1 TXLXL TXLXL TXHXX TXLXX TXLXH TXHXL Parameter Oscillator Frequency Oscillator Period High Time Low Time Rise Time Fall Time Min 8 62 5 22 22 10 10 Max 16 0 125 Units MHz ns ns ns ns ns EXTERNAL CRYSTAL CONNECTIONS EXTERNAL CLOCK CONNECTIONS 270946 – 14 270946 – 15 NOTE Keep oscillator components close to chip and use short direct traces to XTAL1 XTAL2 and VSS When using crystals C1 e 20 pF C2 e 20 pF When using ceramic resonators consult manufacturer for recommended circuitry Required if TTL driver used Not needed if CMOS driver is used EXTERNAL CLOCK DRIVE WAVEFORMS 270946 – 8 An external oscillator may encounter as much as a 100 pF load at XTAL1 when it starts-up This is due to interaction between the amplifier and its feedback capacitance Once the external signal meets the VIL and VIH specifications the capacitance will not exceed 20 pF AC TESTING INPUT OUTPUT WAVEFORMS FLOAT WAVEFORMS 270946 – 9 AC Testing inputs are driven at 3 5V for a Logic ‘‘1’’ and 0 45V for a Logic ‘‘0’’ Timing measurements are made at 2 0V for a Logic ‘‘1’’ and 0 8V for a Logic ‘‘0’’ 270946 – 10 For Timing Purposes a Port Pin is no Longer Floating when a 100 mV change from Load Voltage Occurs and Begins to Float when a 100 mV change from the Loaded VOH VOL Level occurs IOL IOH e s g 15 mA 15 8XC196MC TCONV e Conversion time ms FOSC e Processor frequency MHz B e 8 for 8-bit conversion B e 10 for 10-bit conversion CONV e Value loaded into AD TIME bits 0 – 5 CONV must be in the range 2 through 31 The converter is ratiometric so absolute accuracy is dependent on the accuracy and stability of VREF VREF must be close to VCC since it supplies both the resistor ladder and the analog portion of the converter and input port pins There is also an AD TEST SFR that allows for conversion on ANGND and VREF as well as adjusting the zero offset The absolute error listed is WITHOUT doing any adjustments A D CONVERTER SPECIFICATION The specifications given assume adherence to the operating conditions section of this data sheet Testing is performed with VREF e 5 12V and 16 0 MHz operating frequency After a conversion is started the device is placed in the IDLE mode until the conversion is complete A TO D CHARACTERISTICS The sample and conversion time of the A D converter in the 8-bit or 10-bit modes is programmed by loading a byte into the AD TIME Special Function Register This allows optimizing the A D operation for specific applications The AD TIME register is functional for all possible values but the accuracy of the A D converter is only guaranteed for the times specificed in the operating conditions table The value loaded into AD TIME bits 5 6 7 determines the sample time TSAM and is calculated using the following formula SAM e (TSAM c FOSC) b 2 8 TSAM e Sample time ms FOSC e Processor frequency MHz SAM e Value loaded into AD TIME bits 5 6 7 SAM must be in the range 1 through 7 The value loaded into AD TIME bits 0–5 determines the conversion time TCONV and is calculated using the following formula CONV e (TCONV c FOSC) b 3 b1 2B 16 8XC196MC 10-BIT MODE A D OPERATING CONDITIONS Symbol TA VCC VREF TSAM TCONV FOSC Description Ambient Temperature Digital Supply Voltage Analog Supply Voltage Sample Time Conversion Time Oscillator Frequency Min b 40 Max a 85 Units C V V(1) ms(2) ms(2) MHz 4 50 4 00 10 10 0 80 5 50 5 50 20 0 16 0 NOTES ANGND and VSS should nominally be at the same potential 1 VREF must be within 0 5V of VCC 2 The value of AD TIME is selected to meet these specifications 10-BIT MODE A D CHARACTERISTICS Parameter Resolution Absolute Error Full Scale Error Zero Offset Error Non-Linearity Differential Non-Linearity Channel-to-Channel Matching Repeatability Temperature Coefficients Offset Full Scale Differential Non-Linearity Off Isolation Feedthrough VCC Power Supply Rejection Input Series Resistance Voltage on Analog Input Pin Sampling Capacitor DC Input Leakage 3 g1 g0 1 g 0 25 (Over Specified Operating Conditions) Min 1024 10 0 Max 1024 10 g4 Typical(1) Units Levels Bits LSBs LSBs LSBs 0 25 g 0 5 0 25 g 0 5 1 0 g2 0 l b1 g4 LSBs LSBs LSBs LSBs LSB C LSB C LSB C a2 g1 0 0 0 0 009 0 009 0 009 b 60 b 60 b 60 dB(2 3) dB(2) dB(2) X(4) V(5 6) pF 750 ANGND b 0 5 2K VREF a 0 5 g3 0 0 mA NOTES An ‘‘LSB’’ as used here has a value of approximately 5 mV (See Embedded Microcontrollers and Processors Handbook for A D glossary of terms) 1 These values are expected for most parts at 25 C but are not tested or guaranteed 2 DC to 100 KHz 3 Multiplexer Break-Before-Make is guaranteed 4 Resistance from device pin through internal MUX to sample capacitor 5 These values may be exceeded if the pin current is limited to g 2 mA 6 Applying voltages beyond these specifications will degrade the accuracy of other channels being converted 7 All conversions performed with processor in IDLE mode 17 8XC196MC 8-BIT MODE A D OPERATING CONDITIONS Symbol TA VCC VREF TSAM TCONV FOSC Description Ambient Temperature Digital Supply Voltage Analog Supply Voltage Sample Time Conversion Time Oscillator Frequency Min b 40 Max a 85 Units C V V(1) ms(2) ms(2) MHz 4 50 4 00 10 70 80 5 50 5 50 20 0 16 0 NOTES ANGND and VSS should nominally be at the same potential 1 VREF must be within 0 5V of VCC 2 The value of AD TIME is selected to meet these specifications 8-BIT MODE A D CHARACTERISTICS Parameter Resolution Absolute Error Full Scale Error Zero Offset Error Non-Linearity Differential Non-Linearity Channel-to-Channel Matching Repeatability Temperature Coefficients Offset Full Scale Differential Non-Linearity Off Isolation Feedthrough VCC Power Supply Rejection Input Series Resistance Voltage on Analog Input Pin Sampling Capacitor DC Input Leakage 3 g1 g 0 25 g0 5 g0 5 (Over the Above Operating Conditions) Min 256 8 0 Max 256 8 g1 Typical(1) Units Level Bits LSBs LSBs LSBs 0 l b1 g1 LSBs LSBs LSBs LSBs LSB C LSB C LSB C a1 g1 0 0 0 003 0 003 0 003 b 60 b 60 b 60 dB(2 3) dB(2) dB(2) X(4) V(5 6) pF 750 VSS b 0 5 0 2K VREF a 0 5 g3 0 mA NOTES An ‘‘LSB’’ as used here has a value of approximately 20 mV (See Embedded Microcontrollers and Processors Handbook for A D glossary of terms) 1 These values are expected for most parts at 25 C but are not tested or guaranteed 2 DC to 100 KHz 3 Multiplexer Break-Before-Make is guaranteed 4 Resistance from device pin through internal MUX to sample capacitor 5 These values may be exceeded if the pin current is limited to g 2 mA 6 Applying voltages beyond these specifications will degrade the accuracy of other channels being converted 7 All conversions performed with processor in IDLE mode 18 8XC196MC EPROM SPECIFICATIONS OPERATING CONDITIONS Symbol TA VCC VREF VPP VEA FOSC TOSC Description Ambient Temperature during Programming Supply Voltage during Programming Reference Supply Voltage during Programming Programming Voltage EA Pin Voltage Oscillator Frequency during Auto and Slave Mode Programming Oscillator Frequency during Run-Time Programming Min 20 45 45 12 25 12 25 60 60 Max 30 55 55 12 75 12 75 80 12 0 Units C V(1) V(1) V(2) V(2) MHz MHz NOTES 1 VCC and VREF should nominally be at the same voltage during programming 2 VPP and VEA must never exceed the maximum specification or the device may be damaged 3 VSS and ANGND should nominally be at the same potential (0V) 4 Load capacitance during Auto and Slave Mode programming e 150 pF AC EPROM PROGRAMMING CHARACTERISTICS Symbol TSHLL TLLLH TAVLL TLLAX TPLDV TPHDX TDVPL TPLDX TPLPH(1) TPHLL TLHPL TPHPL TPHIL TILIH TILVH TILPL TPHVL Parameter Reset High to First PALE Low PALE Pulse Width Address Setup Time Address Hold Time PROG Low to Word Dump Valid Word Dump Data Hold Data Setup Time Data Hold Time PROG Pulse Width PROG High to Next PALE Low PALE High to PROG Low PROG High to Next PROG Low PROG High to AINC Low AINC Pulse Width PVER Hold after AINC Low AINC Low to PROG Low PROG High to PVER Valid 0 400 50 220 220 220 0 240 50 170 220 Min 1100 50 0 100 50 50 Max Units TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC TOSC NOTE 1 This specification is for the Word Dump Mode For programming pulses use the Modified Quick Pulse Algorithm 19 8XC196MC DC EPROM PROGRAMMING CHARACTERISTICS Symbol IPP Parameter VPP Supply Current (When Programming) Min Max 100 Units mA NOTE Do not apply VPP until VCC is stable and within specifications and the oscillator clock has stabilized or the device may be damaged SLAVE PROGRAMMING MODE DATA PROGRAM MODE WITH SINGLE PROGRAM PULSE 2709461 – 11 NOTE P3 0 must be high (‘‘1’’) 20 8XC196MC SLAVE PROGRAMMING MODE IN WORD DUMP WITH AUTO INCREMENT 270946 – 12 NOTE P3 0 must be low (‘‘0’’) SLAVE PROGRAMMING MODE TIMING IN DATA PROGRAM WITH REPEATED PROG PULSE AND AUTO INCREMENT 270946 – 13 21 8XC196MC 3 EXTINT function description now includes WG PROTECT (1FCEH) as the name and address of the register used to select positive negative or high low detection for EXTINT 4 The memory range 01F00H – 01FBFH was added to the SFR map as RESERVED 5 IIL changed from b 60 mA to b 70 mA 6 IREF changed from 5 mA to 2 mA maximum and the typical specification was removed 7 The READY description of the READY TIMINGS (One Wait State) graphic was modified to denote the shifting of the leading edge of READY versus frequency At 16 MHz the falling edge of READY occurs before the falling edge of ALE 8 AC Testing Input Output Waveform was changed to reflect inputs driven at 3 5V for a Logic ‘‘1’’ and 45V for a Logic ‘‘0’’ and timing measurements made at 2 0V for a Logic ‘‘1’’ and 0 8V for a Logic ‘‘0’’ 9 Float Waveform was changed from IOL IOH e g 15 mA to IOL IOH s g 15 mA 10 AD TIME register for 10-bit conversions was changed from 0C7H to 0D8H The number of sample time states was changed from 24 to 25 states the conversion time states was changed from 80 to 240 states and the total conversion time for AD TIME e D8H replaced the total conversion time for AD TIME e C7H 11 The number of sample time states for an 8-bit conversion was changed from 20 states to 21 states 12 There is a single entry in the ERRATA section of this version of the data sheet concerning the results of an indirect shift during divide The following important differences exist between this data sheet (270946-002) and the previous version (270946-001) 1 TA Ambient Temperature Under Bias Min changed from b 20 C to b 40 C 2 IREF A D Conversion Reference Current Max changed from 5 mA to 2 mA 3 Testing levels changed from TTL values to CMOS values 4 A D Input Series Resistance Max changed from 1 2 KX to 2 KX 87C196MC DESIGN CONSIDERATIONS When an indirect shift during divide occurs the upper 3 bits of the shift count are not masked completely If the shift count register has the value 32 n where n e 1 3 5 or 7 the operand will be shifted 32 times This should have resulted in no shift taking place DATA SHEET REVISION HISTORY This data sheet (270946-004) is valid for devices with a ‘‘B’’ at the end of the topside tracking number Data sheets are changed as new device information becomes available Verify with your local Intel sales office that you have the latest version before finalizing a design or ordering devices The following important differences exist between this data sheet (270946-002) and the previous version (270946-003) 1 The data sheet was reorganized to standard format 2 Added 83C196MC device 3 Added package thermal characteristics 4 Added note on missing pins on SDIP package 5 Removed SFR maps (now in user’s manual) 6 Added note on TLLYV and TLLGV specifications 7 Changed 10-bit mode TCONV (MIN) to 10 0 ms from 15 0 ms 8 Changed 10-bit mode TCONV (MAX) to 20 0 ms from 18 0 ms 9 Changed VREF (MIN) in 8- and 10-bit mode to 4 0V from 4 5V The following important differences exist between data sheet 270946-003 and the previous version (270946-002) 1 The data sheet title was changed to better reflect the purpose of the 87C196MC as an AC Inverter DC Brushless Motor Control Microcontroller 2 The standard temperature range for this part now covers b 40 C to a 85 C 22