SMP5484TR

InterFET Product Folder Technical Support 2N5484-5-6 Order Now 2N5484, 2N5485, 2N5486 N-Channel JFET Features • • • • • • SOT23 Top View InterFET N0026S Geometry Low Noise: 4 nV/√Hz Typical Low Ciss: 4.3pF Typical Low Leakage: 10pA Typical RoHS Compliant SMT, TH, and Bare Die Package options. Source 1 3 Gate Drain 2 Applications TO-92 Bottom View • VHF/UHF Amplifiers Description The -25V InterFET 2N5484, 2N5485, and 2N5486 are targeted for low noise low leakage VHF/UHF amplifier designs. Gate leakages are typically less than 10pA at room temperatures. Gate 3 Drain 2 Source 1 Product Summary BVGSS IDSS VGS(off) GFS Parameters Gate to Source Breakdown Voltage Drain to Source Saturation Current Gate to Source Cutoff Voltage Forward Transconductance 2N5484 Min -25 1 -0.3 2500 2N5485 Min -25 4 -0.5 3000 2N5486 Min -25 8 -2 3500 Unit V mA V μS Ordering Information Custom Part and Binning Options Available Part Number 2N5484; 2N5485; 2N5486 SMP5484; SMP5485; SMP5486 SMP5484TR; SMP5485TR; SMP5486TR 2N5484COT; 2N5485COT; 2N5486COT 2N5484CFT; 2N5485CFT; 2N5486CFT Description Through-Hole Surface Mount 7“ Tape and Reel: Max 3,000 Pieces 13” Tape and Reel: Max 9,000 Pieces Chip Orientated Tray (COT Waffle Pack) Chip Face-up Tray (CFT Waffle Pack) Case TO-92 SOT23 SOT23 Packaging Bulk Bulk Minimum 1,000 Pieces Tape and Reel COT 400/Waffle Pack CFT 400/Waffle Pack Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice. IF35032.R00 InterFET Product Folder Technical Support 2N5484-5-6 Order Now Electrical Characteristics Maximum Ratings (@ TA = 25°C, Unless otherwise specified) VRGS IFG PD P TJ TSTG Parameters Reverse Gate Source and Gate Drain Voltage Continuous Forward Gate Current Continuous Device Power Dissipation Power Derating Operating Junction Temperature Storage Temperature Value -25 -25 360 3.27 -55 to 125 -65 to 200 Unit V mA mW mW/°C °C °C Static Characteristics (@ TA = 25°C, Unless otherwise specified) V(BR)GSS IGSS VGS(OFF) IDSS Parameters Gate to Source Breakdown Voltage Gate to Source Reverse Current Gate to Source Cutoff Voltage Drain to Source Saturation Current Conditions VDS = 0V, IG = 1μA 2N5484 Min Max 2N5485 Min Max 2N5486 Min Max -25 -25 -25 -1 -0.2 VGS = -20V, VDS = 0V, TA = 25°C VGS = -20V, VDS = 0V, TA = 100°C -1 -0.2 Unit V -1 -0.2 nA μA VDS = 15V, ID = 10nA -0.3 -3 -0.5 -4 -2 -6 V VDS = 15V, VGS = 0V (Pulsed) 1 5 4 10 8 20 mA Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters Forward Transconductance Output Conductance Conditions VDS = 15V, VGS = 0V, f = 100MHz VDS = 15V, VGS = 0V, f = 400MHz VDS = 15V, VGS = 0V, f = 100MHz VDS = 15V, VGS = 0V, f = 400MHz Ciss Input Capacitance VDS = 15V, VGS = 0V, f = 1MHz Crss Reverse Transfer Capacitance Coss Output Capacitance GFS GOS 2N5484-5-6 Document Number: IF35032.R00 2N5484 Min Max 2500 2N5485 Min Max 2N5486 Min Max 3000 3500 Unit μS 75 μS 100 100 5 5 5 pF VDS = 15V, VGS = 0V, f = 1MHz 1 1 1 pF VDS = 15V, VGS = 0V, f = 1MHz 2 2 2 pF 2 of 4 www.InterFET.com InterFET Corporation December, 2018 InterFET Product Folder Technical Support Order Now 2N5484-5-6 SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data 1. 2. 3. 4. 5. 6. All linear dimensions are in millimeters. Package weight approximately 0.12 grams Molded plastic case UL 94V-0 rated For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 Bulk product is shipped in standard ESD shipping material Refer to JEDEC standards for additional information. Suggested Pad Layout 1. 2. 2N5484-5-6 Document Number: IF35032.R00 3 of 4 www.InterFET.com All linear dimensions are in millimeters. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering. InterFET Corporation December, 2018 InterFET Product Folder Technical Support Order Now 2N5484-5-6 TO-92 Mechanical and Layout Data Package Outline Data 1. 2. 3. 4. 5. All linear dimensions are in millimeters. Package weight approximately 0.19 grams Molded plastic case UL 94V-0 rated Bulk product is shipped in standard ESD shipping material Refer to JEDEC standards for additional information. Suggested Through-Hole Layout 1. 2. 2N5484-5-6 Document Number: IF35032.R00 4 of 4 www.InterFET.com All linear dimensions are in millimeters. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations. InterFET Corporation December, 2018