SMPJ304

InterFET Product Folder Technical Support J304-5 Order Now J304, J305 N-Channel JFET Features • • • • • • InterFET N0026S Geometry Low Noise: 4 nV/√Hz Typical Low Ciss: 4.3pF Typical Low Leakage: 10pA Typical RoHS Compliant SMT, TH, and Bare Die Package options. SOT23 Top View Source 1 3 Gate Drain 2 Applications • Mixers • Oscillators • VHF/UHF Amplifiers TO-92 Bottom View 3 Gate Description Drain 2 The -30V InterFET J304 and J305 are targeted for low noise low leakage VHF/UHF amplifier designs as well as mixers and oscillators. Gate leakages are typically less than 10pA at room temperatures. Source 1 Product Summary BVGSS IDSS VGS(off) GFS Parameters Gate to Source Breakdown Voltage Drain to Source Saturation Current Gate to Source Cutoff Voltage Forward Transconductance J304 Min -30 5 -2 4500 J305 Min -30 1 -0.5 3000 Unit V mA V μS Ordering Information Custom Part and Binning Options Available Part Number J304; J305 SMPJ304; SMPJ305 SMPJ304TR; SMPJ305TR J304COT; J305COT J304CFT; J305CFT Description Through-Hole Surface Mount 7“ Tape and Reel: Max 3,000 Pieces 13” Tape and Reel: Max 9,000 Pieces Chip Orientated Tray (COT Waffle Pack) Chip Face-up Tray (CFT Waffle Pack) Case TO-92 SOT23 SOT23 COT CFT Packaging Bulk Bulk Minimum 1,000 Pieces Tape and Reel 400/Waffle Pack 400/Waffle Pack Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice. IF35033.R00 InterFET Product Folder Technical Support J304-5 Order Now Electrical Characteristics Maximum Ratings (@ TA = 25°C, Unless otherwise specified) VRGS IFG PD P TJ TSTG Parameters Reverse Gate Source and Gate Drain Voltage Continuous Forward Gate Current Continuous Device Power Dissipation Power Derating Operating Junction Temperature Storage Temperature Value -30 10 360 3.27 -55 to 125 -65 to 200 Unit V mA mW mW/°C °C °C Static Characteristics (@ TA = 25°C, Unless otherwise specified) V(BR)GSS IGSS VGS(OFF) IDSS Parameters Gate to Source Breakdown Voltage Gate to Source Reverse Current Gate to Source Cutoff Voltage Drain to Source Saturation Current Conditions Min VDS = 0V, IG = -1μA -30 J304 Typ Max Min J305 Typ Max -30 VGS = -20V, VDS = 0V Unit V -100 -100 pA VDS = 15V, ID = 1nA -2 -6 -0.5 -3 V VGS = 0V, VDS = 15V (Pulsed) 5 15 1 8 mA Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters J304 J305 Conditions Min Typ Max Min Typ Max 4500 7500 3000 VDS = 15V, VGS = 0V, f = 1kHz VDS = 15V, VGS = 0V, f = 100MHz 3000 VDS = 15V, VGS = 0V, f = 400MHz 4200 50 50 VDS = 15V, VGS = 0V, f = 1kHz VDS = 15V, VGS = 0V, f = 100MHz 60 60 VDS = 15V, VGS = 0V, f = 400MHz 80 80 80 VDS = 15V, VGS = 0V, f = 100MHz VDS = 15V, VGS = 0V, f = 400MHz 800 20 VDS = 15V, ID = 5mA, f = 100MHz VDS = 15V, ID = 5mA, f = 400MHz 11 800 800 VDS = 15V, VGS = 0V, f = 100MHz VDS = 15V, VGS = 0V, f = 400MHz 3600 2000 2000 VDS = 15V, VGS = 0V, f = 100MHz VDS = 15V, VGS = 0V, f = 400MHz 7500 Unit GFS Forward Transconductance GOS Output Conductance GIS Input Conductance GPS Power Gain BOS Output Susceptance BIS Input Susceptance Ciss Input Capacitance VDS = 15V, VGS = 0V, f = 1MHz 3 3 pF Crss Reverse Transfer Capacitance VDS = 15V, VGS = 0V, f = 1MHz 0.85 0.85 pF Coss Output Capacitance VDS = 15V, VGS = 0V, f = 1MHz 1 1 pF NF Noise Figure VDS = 15V, ID = 5mA, f = 100MHz RG = 1Ω f = 400MHz 1.7 3.8 J304-5 Document Number: IF35033.R00 2 of 4 www.InterFET.com μS μS μS dB μS μS dB InterFET Corporation June, 2019 InterFET Product Folder Technical Support Order Now J304-5 SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data 1. 2. 3. 4. 5. 6. All linear dimensions are in millimeters. Package weight approximately 0.12 grams Molded plastic case UL 94V-0 rated For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 Bulk product is shipped in standard ESD shipping material Refer to JEDEC standards for additional information. Suggested Pad Layout 1. 2. J304-5 Document Number: IF35033.R00 3 of 4 www.InterFET.com All linear dimensions are in millimeters. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering. InterFET Corporation June, 2019 InterFET Product Folder Technical Support Order Now J304-5 TO-92 Mechanical and Layout Data Package Outline Data 1. 2. 3. 4. 5. All linear dimensions are in millimeters. Package weight approximately 0.19 grams Molded plastic case UL 94V-0 rated Bulk product is shipped in standard ESD shipping material Refer to JEDEC standards for additional information. Suggested Through-Hole Layout 1. 2. J304-5 Document Number: IF35033.R00 4 of 4 www.InterFET.com All linear dimensions are in millimeters. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations. InterFET Corporation June, 2019 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: InterFET: J305 J304 SMPJ304 SMPJ305 SMPU304