MS5201-XD

MS5201-XD (RoHS*) • • • • • • DESCRIPTION SMD PRESSURE SENSOR 1 bar gage pressure range Uncompensated Piezoresistive silicon micromachined sensor Miniature surface mount 7.6 x 7.6 mm Low noise, high sensitivity, high linearity RoHS-compatible & Pb-free* The MS5201-XD is a gage type SMD pressure sensor, suitable for applications which require relative (gage) pressure measurements. The device consists of a silicon micromachined pressure sensor die mounted on a 7.6 x 7.6 mm ceramic carrier protected by a plastic cap with a port to connect plastic tube. The MS5201-XD can be delivered in a highly sensitive version giving a maximal output voltage or in a highly linear version giving a linear output voltage directly proportional to the applied pressure. Full Scale Pressure 1 bar High Sensitivity Version Product Code MS5201-AD High Linearity Version Product Code MS5201-BD Full Scale Span / Linearity 240 mV / ±0.2% FS Full Scale Span / Linearity 150 mV / ±0.05% FS FEATURES • • Low cost SMD ceramic package High reliability, low drift • • -40° to +125 ° operation range C C Gel protection APPLICATION • Medical instrumentation • Pneumatic controls PIN CONFIGURATION 3: VS+ 4: OUT+ 1: OUT- 2: GND Bottom Top (Pressure to be applied from the top) * The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). DA5201-D_005 00005201637 ECN 1043 February 5th, 2008 1 PIN DESCRIPTION Pin Name OUTGND VS+ OUT+ Pin No. 1 2 3 4 Function Negative output voltage of Wheatstone bridge Ground Supply voltage of Wheatstone bridge Positive output voltage of Wheatstone bridge ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure MS5201-AD MS5201-BD Symbol VS+ TS P Ta = 25 C Ta = 25 C o o Conditions Min -40 - Max 20 +125 5 10 Unit o V C bar DA5201-D_005 00005201637 ECN 1043 February 5th, 2008 2 ELECTRICAL CHARACTERISTICS (VS+ = 5 V; Ta = 25° C) Parameter MS5201-AD High Sensitivity MS5201-BD High Linearity Operating pressure range Full-scale span (FS) Sensitivity Linearity Operating pressure range Full-scale span (FS) Sensitivity Linearity Operating temperature range Zero pressure offset Pressure hysteresis All Types Temperature hysteresis Repeatability Bridge resistance Temperature coefficient of resistance Temperature coefficient of span Temperature coefficient of offset Min 0 190 190 0 120 120 -40 -40 3.0 +2’400 -1’500 -80 Typ 240 240 ±0.15 150 150 ±0.05 0 ±0.05 ±0.05 3.4 2’900 -1’900 Max 1 290 290 ±0.4 1 180 180 ±0.2 125 40 ±0.15 0.3 ±0.15 3.8 +3’300 -2’300 +80 Unit bar g mV mV/bar % FS bar g mV mV/bar % FS ° C mV % FS % FS % FS kΩ ppm/°C ppm/°C µV/°C Notes 1, 6 1 2, 6 3, 6 4, 6 5, 6 5, 6 5, 6 NOTES 1) Deviation at one half full-scale pressure from the least squares best line fit over pressure range. 2) Maximum difference of output voltage after 1 pressure cycle at any pressure within the operating pressure range. 3) Maximum difference in offset after one thermal cycle from -40° to +125° C C. 4) Same as 2) after 10 pressure cycles. 5) Slope of the endpoint straight line from 25° to 60° C C. 6) Not 100% tested. DA5201-D_005 00005201637 ECN 1043 February 5th, 2008 3 APPLICATION INFORMATION GENERAL The MS5201-XD is a miniaturised gage pressure sensor series which has been designed for surface mounting applications. Its main advantages are the high reliability of the semiconductor sensor and a design which makes it suitable for applications requiring small-scale and cost-efficient solutions. The sensor element of the MS5201-XD consists of a silicon micromachined membrane with a Pyrex glass and a backside vent hole. Implanted resistors make use of the piezo-resistive effect. The sensor is mounted in a special process allowing best-offset stability making the part suitable for direct PCB assembly. Typical applications for this miniaturised pressure sensor MS5201-XD are blood pressure monitors or vacuum measurement equipment. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB to connect it. This can be important for certain applications, and will also reduce mechanical stress on the device. For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the solder junctions by covering the rim or the corners of MS5201-XD ceramic substrate with glue or Globtop-like material. SOLDERING Please refer to the application note AN808 for all soldering issues. CLEANING The MS5201-XD has been manufactured under cleanroom conditions. Each device has been inspected for the homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” shall be used. Cleaning might damage the sensor. DA5201-D_005 00005201637 ECN 1043 February 5th, 2008 4 PACKAGE OUTLINES Device package outlines of MS5201-XD (plastic cap, gel protection of bonding wires) DA5201-D_005 00005201637 ECN 1043 February 5th, 2008 5 RECOMMENDED PAD LAYOUT Recommended pad layout for soldering of the MS5201-XD on a printed circuit board ORDERING INFORMATION Product Code MS5201-AD MS5201-BD Product Pressure sensor 1 bar High sensitivity Pressure sensor 1 bar High linearity Art.-Nr. 325201001 325201003 Package SMD hybrid with solder bumps, plastic cap, drop of gel on sensor, no gel protection of the bonding wires Comment FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-des-Prés 11 CH-2022 BEVAIX SWITZERLAND Tel. 032 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: http://www.intersema.ch NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Intersema makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. DA5201-D_005 00005201637 ECN 1043 February 5th, 2008 6