ACS138HMSR-02

ACS138MS December 1997 Radiation Hardened 3-to-8 Line Decoder/Demultiplexer Description The Radiation Hardened ACS138MS is an Inverting 3-to-8 Line Decoder/Demultiplexer with three binary select inputs (A0, A1 and A2). If the device is enabled, these inputs determine which one of the eight normally high outputs will go low. Two active low and one active high enable inputs (E1, E2 and E3) are provided to make cascaded decoder designs easier to implement. The ACS138MS is fabricated on a CMOS Silicon on Sapphire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices offer significant power reduction and faster performance when compared to ALSTTL types. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the ACS138 are contained in SMD 5962-98534. A “hot-link” is provided on our homepage with instructions for downloading. http://www.intersil.com/data/sm/index.htm Features • QML Qualified Per MIL-PRF-38535 Requirements • 1.25Micron Radiation Hardened SOS CMOS • Radiation Environment - Latch-up Free Under any Conditions - Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si) - SEU Immunity . . . . . . . . . . . 100MeV/(mg/cm2) • Input Logic Levels . . . VIL = (0.3V)(VCC), VIH = (0.7V)(VCC) • Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA • Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20µA • Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . . 15ns Applications • Memory Decoding • Data Routing • Code Conversion Ordering Information SMD PART NUMBER 5962F9853401VEC N/A 5962F9853401VXC N/A N/A INTERSIL PART NUMBER ACS138DMSR-02 ACS138D/Sample-02 ACS138KMSR-02 ACS138K/Sample-02 ACS138HMSR-02 TEMP. RANGE (oC) -55 to 125 25 -55 to 125 25 25 PACKAGE 16 Ld SBDIP 16 Ld SBDIP 16 Ld Flatpack 16 Ld Flatpack Die CASE OUTLINE CDIP2-T16 CDIP2-T16 CDFP4-F16 CDFP4-F16 N/A Pinouts ACS138 (SBDIP) TOP VIEW ACS138 (FLATPACK) TOP VIEW A0 1 A1 2 A2 3 E1 4 E2 5 E3 6 Y7 7 GND 8 16 VCC 15 Y0 14 Y1 13 Y2 12 Y3 11 Y4 10 Y5 9 Y6 A0 A1 A2 E1 E2 E3 Y7 GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 File Number 4461 1 ACS138MS Die Characteristics DIE DIMENSIONS: Size: 2390µm x 2390µm (94 mils x 94 mils) Thickness: 525µm ±25µm (20.6 mils ±1 mil) Bond Pad: 110µm x 110µm (4.3 x 4.3 mils) METALLIZATION: Al Metal 1 Thickness: 0.7µm ±0.1µm Metal 2 Thickness: 1.0µm ±0.1µm SUBSTRATE POTENTIAL: Unbiased Insulator PASSIVATION Type: Phosphorous Silicon Glass (PSG) Thickness: 1.30µm ±0.15µm SPECIAL INSTRUCTIONS: Bond VCC First ADDITIONAL INFORMATION: Worst Case Density: