HI-509A

® HI-506A, HI-507A, HI-508A, HI-509A Data Sheet November 22, 2004 FN3143.5 16-Channel, 8-Channel, Differential 8-Channel and Differential 4-Channel, CMOS Analog MUXs with Active Overvoltage Protection The HI-506A, HI-507A, HI-508A and HI-509A are analog multiplexers with active overvoltage protection. Analog input levels may greatly exceed either power supply without damaging the device or disturbing the signal path of other channels. Active protection circuitry assures that signal fidelity is maintained even under fault conditions that would destroy other multiplexers. Analog inputs can withstand constant 70VP-P levels with ±15V supplies. Digital inputs will also sustain continuous faults up to 4V greater than either supply. In addition, signal sources are protected from short circuiting should multiplexer supply loss occur. Each input presents 1kΩ of resistance under this condition. These features make the HI-506A, HI-507A, HI-508A and HI-509A ideal for use in systems where the analog inputs originate from external equipment, or separately powered circuitry. All devices are fabricated with 44V dielectrically isolated CMOS technology. The HI-506A is a single 16-channel multiplexer, the HI-507A is an 8-channel differential multiplexer, the HI-508A is a single 8-channel multiplexer and the HI-509A is a differential 4-channel multiplexer. If input overvoltage protection is not needed the HI-506/507/508/509 multiplexers are recommended. For further information see Application Notes AN520 and AN521. Features • Analog Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . 70VP-P • No Channel Interaction During Overvoltage • Maximum Power Supply. . . . . . . . . . . . . . . . . . . . . . . 44V • Fail Safe with Power Loss (No Latch-Up) • Break-Before-Make Switching • Analog Signal Range . . . . . . . . . . . . . . . . . . . . . . . . ±15V • Access Time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns • Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 7.5mW • Pb-Free Available (RoHS Compliant) Applications • Data Acquisition Systems • Industrial Controls • Telemetry Ordering Information PART NUMBER HI1-0506A-2 HI1-0506A-5 HI1-0506A-8 HI3-0506A-5 HI3-0506A-5Z (See Note) HI3-0507A-5 HI3-0507A-5Z (See Note) HI1-0508A-8 HI3-0508A-5 HI1-0509A-2 HI1-0509A-5 HI1-0509A-8 HI3-0509A-5 HI3-0509A-5Z (See Note) TEMP. RANGE (oC) -55 to 125 0 to 75 PACKAGE 28 Ld CERDIP 28 Ld CERDIP PKG. DWG. # F28.6 F28.6 F28.6 E28.6 E28.6 E28.6 E28.6 F16.3 E16.3 F16.3 F16.3 F16.3 E16.3 E16.3 -55 to 125 28 Ld CERDIP + 160 Hour Burn-In 0 to 75 0 to 75 0 to 75 0 to 75 28 Ld PDIP 28 Ld PDIP (Pb-free) 28 Ld PDIP 28 Ld PDIP (Pb-free) -55 to 125 16 Ld CERDIP + 160 Hour Burn-In +0 to 75 -55 to 125 0 to 75 16 Ld PDIP 16 Ld CERDIP 16 Ld CERDIP -55 to 125 16 Ld CERDIP + 160 Hour Burn-In 0 to 75 0 to 75 16 Ld PDIP 16 Ld PDIP (Pb-free) NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2003, 2004. All Rights Reserved HI-506A, HI-507A, HI-508A, HI-509A Pinouts HI-506A (CERDIP, PDIP) TOP VIEW +VSUPPLY 1 NC 2 NC 3 IN 16 4 IN 15 5 IN 14 6 IN 13 7 IN 12 8 IN 11 9 IN 10 10 IN 9 11 GND 12 VREF 13 ADDRESS A3 14 28 OUT 27 -VSUPPLY 26 IN 8 25 IN 7 24 IN 6 23 IN 5 22 IN 4 21 IN 3 20 IN 2 19 IN 1 18 ENABLE 17 ADDRESS A0 16 ADDRESS A1 15 ADDRESS A2 +VSUPPLY 1 OUT B 2 NC 3 IN 8B 4 IN 7B 5 IN 6B 6 IN 5B 7 IN 4B 8 IN 3B 9 IN 2B 10 IN 1B 11 GND 12 VREF 13 NC 14 HI-507A (PDIP) TOP VIEW 28 OUT A 27 -VSUPPLY 26 IN 8A 25 IN 7A 24 IN 6A 23 IN 5A 22 IN 4A 21 IN 3A 20 IN 2A 19 IN 1A 18 ENABLE 17 ADDRESS A0 16 ADDRESS A1 15 ADDRESS A2 HI-508A (CERDIP, PDIP) TOP VIEW A0 1 ENABLE 2 -VSUPPLY 3 IN 1 4 IN 2 5 IN 3 6 IN 4 7 OUT 8 16 A1 15 A2 14 GND 13 +VSUPPLY 12 IN 5 11 IN 6 10 IN 7 9 IN 8 HI-509A (CERDIP, PDIP) TOP VIEW A0 1 ENABLE 2 -VSUPPLY 3 IN 1A 4 IN 2A 5 IN 3A 6 IN 4A 7 OUT A 8 16 A1 15 GND 14 +VSUPPLY 13 IN 1B 12 IN 2B 11 IN 3B 10 IN 4B 9 OUT B 2 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Truth Tables HI-506A A3 X L L L L L L L L H H H H H H H H A2 X L L L L H H H H L L L L H H H H A1 X L L H H L L H H L L H H L L H H A0 X L H L H L H L H L H L H L H L H EN L H H H H H H H H H H H H H H H H “ON” CHANNEL None 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A1 X L L H H A0 X L H L H HI-509A EN L H H H H “ON” CHANNEL PAIR None 1 2 3 4 A2 X L L L L H H H H A1 X L L H H L L H H A0 X L H L H L H L H HI-508A EN L H H H H H H H H “ON” CHANNEL None 1 2 3 4 5 6 7 8 HI-507A A2 X L L L L H H H H A1 X L L H H L L H H A0 X L H L H L H L H EN L H H H H H H H H “ON” CHANNEL PAIR None 1 2 3 4 5 6 7 8 3 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Functional Diagrams HI-506A 1K IN 1A 1K IN 8A DECODER/ DRIVER 1K IN 16 IN 8B OVERVOLTAGE CLAMP AND SIGNAL ISOLATION 5V REF LEVEL SHIFT OVERVOLTAGE CLAMP AND SIGNAL ISOLATION 5V REF LEVEL SHIFT 1K DECODER/ DRIVER 1K IN 1B OUT B HI-507A OUT A 1K IN 1 1K IN 2 OUT ††††† † DIGITAL INPUT PROTECTION VREF A0 A1 A2 A3 EN † † DIGITAL INPUT PROTECTION † † † VREF A0 A1 A2 EN HI-508A 1K IN 1A 1K IN 4A DECODER/ DRIVER 1K IN 8 IN 4B OVERVOLTAGE CLAMP AND SIGNAL ISOLATION 5V REF LEVEL SHIFT OVERVOLTAGE CLAMP AND SIGNAL ISOLATION 1K 1K IN 1B HI-509A OUT A 1K IN 1 1K IN 2 OUT OUT B DECODER/ DRIVER † † DIGITAL INPUT PROTECTION A0 † † † 5V REF LEVEL SHIFT A1 A2 EN † † DIGITAL INPUT PROTECTION A0 † † A1 EN 4 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Schematic Diagrams ADDRESS INPUT BUFFER AND LEVEL SHIFTER TTL REFERENCE CIRCUIT V+ R10 R9 VREF Q1 Q4 D3 GND LEVEL SHIFTER V+ P P P P P P P P P OVERVOLTAGE PROTECTION V+ D2 P N R2 R5 R3 N N R4 R6 N N N N R8 N N R7 LEVEL SHIFTED ADDRESS TO DECODE R1 200 Ω D1 N GND V- VADD IN ADDRESS DECODER V+ P P P P P P P N A 0 O R A0 N N TO P-CHANNEL DEVICE OF THE SWITCH N A1 O R A1 N A2 O R A2 TO N-CHANNEL DEVICE OF THE SWITCH N A 3 O R A3 N ENABLE DELETE A3 OR A3 INPUT FOR HI-507A, HI-508A, HI-509A DELETE A2 OR A2 INPUT FOR HI-509A V- 5 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Schematic Diagrams (Continued) MULTIPLEX SWITCH FROM DECODE OVERVOLTAGE PROTECTION N V+ P Q5 R11 1K IN D6 D7 D4 D5 N OUT N Q6 VP FROM DECODE 6 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Absolute Maximum Ratings V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44V V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+22V V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V Digital Input Voltage (VEN , VA) . . . . . . . . . . . . . (V-) -4V to (V+) +4V or 20mA, Whichever Occurs First Analog Signal (VIN, VOUT). . . . . . . . . . . . . . . (V-) -20V to (V+) +20V Continuous Current, IN or OUT . . . . . . . . . . . . . . . . . . . . . . . . 20mA Peak Current, IN or OUT, Pulsed 1ms, 10% Duty Cycle (Max). . . 40mA Thermal Information Thermal Resistance (Typical, Note 1) θJA (oC/W) θJC (oC/W) 28 Ld CERDIP Package. . . . . . . . . . . . 55 18 16 Ld CERDIP Package. . . . . . . . . . . . 75 22 28 Ld PDIP Package . . . . . . . . . . . . . . 60 N/A 16 Ld PDIP Package . . . . . . . . . . . . . . 90 N/A Maximum Junction Temperature CERDIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175oC PDIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC Operating Conditions Temperature Ranges HI-506A/507A/508A/509A-2, -8 . . . . . . . . . . . . . . -55oC to 125oC HI-506A/507A/508A/509A-5. . . . . . . . . . . . . . . . . . . . 0oC to 75oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Supplies = +15V, -15V; VREF Pin = Open; VAH (Logic Level High) = 4V; VAL (Logic Level Low) = 0.8V, Unless Otherwise Specified. For Test Conditions, Consult Test Circuits Section TEST CONDITIONS TEMP (oC) -2, -8 MIN TYP MAX MIN -5 TYP MAX UNITS PARAMETER DYNAMIC CHARACTERISTICS Access Time, tA Note 2 25 Full 25 - 0.5 80 300 300 - 1.0 500 1000 500 1000 25 - 0.5 80 300 300 - 1.0 1000 1000 µs µs ns ns ns ns ns µs µs µs µs dB pF Break-Before-Make Delay, tOPEN Enable Delay (ON), tON(EN) Note 2 Note 2 25 25 Full Enable Delay (OFF), tOFF(EN) Note 2 25 Full Settling Time, tS HI-506A and HI-507A To 0.1% To 0.01% HI-508A and HI-509A To 0.1% To 0.01% Off Isolation Channel Input Capacitance, CS(OFF) Channel Output Capacitance, CD(OFF) HI-506A HI-507A HI-508A HI-509A Digital Input Capacitance, CA Input to Output Capacitance, CDS(OFF) DIGITAL INPUT CHARACTERISTICS Input Low Threshold, TTL Drive, VAL Input High Threshold, VAH (Note 9) Input Leakage Current (High or Low), IA Note 2 Note 2 Notes 2, 6 Full Full Full 4.0 0.8 1.0 4.0 0.8 1.0 V V µA 25 25 25 25 25 25 52 30 25 12 10 0.1 52 30 25 12 10 0.1 pF pF pF pF pF pF Note 7 25 25 25 25 25 25 50 1.2 3.5 1.2 3.5 68 10 50 1.2 3.5 1.2 3.5 68 10 - 7 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Electrical Specifications Supplies = +15V, -15V; VREF Pin = Open; VAH (Logic Level High) = 4V; VAL (Logic Level Low) = 0.8V, Unless Otherwise Specified. For Test Conditions, Consult Test Circuits Section (Continued) TEST CONDITIONS VREF = +10V VREF = +10V TEMP (oC) 25 25 -2, -8 MIN 6.0 TYP MAX 0.8 MIN 6.0 -5 TYP MAX 0.8 UNITS V V PARAMETER MOS Drive, VAL , HI-506A/HI-507A MOS Drive, VAH , HI-506A/HI-507A ANALOG CHANNEL CHARACTERISTICS Analog Signal Range, VIN On Resistance, rON Note 2 Notes 2, 3 Full 25 Full -15 - 1.2 1.5 0.03 0.1 4.0 0.1 - +15 1.5 1.8 50 300 200 200 100 2.0 300 200 200 100 50 -15 - 1.5 1.8 0.03 0.1 4.0 0.1 - +15 1.8 2.0 50 300 200 200 100 300 200 200 100 50 V kΩ kΩ nA nA nA nA nA nA nA nA µA nA nA nA nA nA nA Off Input Leakage Current, IS(OFF) Notes 2, 4 25 Full Off Output Leakage Current, ID(OFF) HI-506A HI-507A HI-508A HI-509A ID(OFF) With Input Overvoltage Applied Notes 2, 4 25 Full Full Full Full Note 5 25 Full On Channel Leakage Current, ID(ON) HI-506A HI-507A HI-508A HI-509A Differential Off Output Leakage Current, IDIFF , (HI-507A, HI-509A Only) POWER SUPPLY CHARACTERISTICS Current, I+ Current, IPower Dissipation, PD NOTES: Notes 2, 4 25 Full Full Full Full Full Notes 2, 8 Notes 2, 8 Full Full Full - 0.5 0.02 7.5 2.0 1.0 - - 0.5 0.02 7.5 2.0 1.0 - mA mA mW 2. 100% tested for Dash 8. Leakage currents not tested at -55oC. 3. VOUT = ±10V, IOUT = +100µA. 4. 10nA is the practical lower limit for high speed measurement in the production test environment. 5. Analog Overvoltage = ±33V. 6. Digital input leakage is primarily due to the clamp diodes (see Schematic). Typical leakage is less than 1nA at 25oC. 7. VEN = 0.8V, RL = 1K, CL = 15pF, VS = 7VRMS , f = 100kHz. 8. VEN , VA = 0V or 4V. 9. To drive from DTL/TTL Circuits, 1kΩ pull-up resistors to +5V supply are recommended. 8 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Test Circuits and Waveforms TA = 25oC, VSUPPLY = ±15V, VAH = 4V, VAL = 0.8V, VREF = Open, Unless Otherwise Specified 100µA V2 IN OUT V2 100µA VIN rON = FIGURE 1A. TEST CIRCUIT 1.4 NORMALIZED RESISTANCE (REFERRED TO VALUE AT ±15V) 1.3 ON RESISTANCE (kΩ) 1.2 1.1 25oC 1.0 0.9 0.8 0.7 0.6 -10 -55oC 125oC 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 -8 -6 -4 -2 0 2 4 ANALOG INPUT (V) 6 8 10 5 6 7 8 9 10 11 12 13 14 15 SUPPLY VOLTAGE (±V) -55oC TO 125oC VIN = +5V FIGURE 1B. ON RESISTANCE vs ANALOG INPUT VOLTAGE FIGURE 1C. NORMALIZED ON RESISTANCE vs SUPPLY VOLTAGE FIGURE 1. ON RESISTANCE 100nA 10nA LEAKAGE CURRENT OFF OUTPUT CURRENT ID(OFF) EN OUT +0.8V ON LEAKAGE CURRENT ID(ON) 1nA A ID(OFF) 100pA OFF INPUT LEAKAGE CURRENT IS(OFF) 10pA 25 50 75 100 125 TEMPERATURE (oC) FIGURE 2A. LEAKAGE CURRENT vs TEMPERATURE FIGURE 2B. ID(OFF) TEST CIRCUIT (NOTE 10) 9 FN3143.5 November 22, 2004 ± ±10V 10V HI-506A, HI-507A, HI-508A, HI-509A Test Circuits and Waveforms TA = 25oC, VSUPPLY = ±15V, VAH = 4V, VAL = 0.8V, VREF = Open, Unless Otherwise Specified (Continued) OUT A IS(OFF) EN ± 10V +0.8V A0 A1 EN OUT A ID(ON) FIGURE 2C. IS(OFF) TEST CIRCUIT (NOTE 10) NOTE: 10. Two measurements per channel: ±10V and +10V. (Two measurements per device for ID(OFF) ±10V and +10V.) FIGURE 2. LEAKAGE CURRENTS 18 ANALOG INPUT CURRENT (mA) 15 12 9 6 3 0 15 18 21 24 27 30 33 36 ANALOG INPUT OVERVOLTAGE (±V) OUTPUT OFF LEAKAGE CURRENT ID(OFF) ANALOG INPUT CURRENT (IIN) 6 5 4 3 2 1 0 OUTPUT OFF LEAKAGE CURRENT (nA) FIGURE 3A. ANALOG INPUT OVERVOLTAGE CHARACTERISTICS ±14 -55oC ±12 SWITCH CURRENT (mA) ±10 ±8 ±6 ±4 ±2 0 0 2 4 6 8 10 12 14 VOLTAGE ACROSS SWITCH (±V) ±VIN A 25oC FIGURE 4A. ON CHANNEL CURRENT vs VOLTAGE FIGURE 4. ON CHANNEL CURRENT ± ±10V ±10V 10V 4V FIGURE 2D. ID(On) TEST CIRCUIT (NOTE 10) 7 A IIN A ID(OFF) ±VIN FIGURE 3B. TEST CIRCUIT FIGURE 3. ANALOG INPUT OVERVOLTAGE CHARACTERISTICS 125oC FIGURE 4B. TEST CIRCUIT 10 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Test Circuits and Waveforms 8 A TA = 25oC, VSUPPLY = ±15V, VAH = 4V, VAL = 0.8V, VREF = Open, Unless Otherwise Specified (Continued) +15V/+10V +ISUPPLY SUPPLY CURRENT (mA) 6 A3 VSUPPLY = ±15V VA VSUPPLY = ±10V 2 +4V V+ IN 1 HI-506A † A2 IN 2 THRU A1 IN 7/IN 15 A0 EN GND IN 8/IN 16 OUT V±10V/±5V 4 50Ω 10V/ 10 MΩ 0 1K 10K 100K TOGGLE FREQUENCY (Hz) 1M 10M A -ISUPPLY -15V/-10V FIGURE 5A. SUPPLY CURRENT vs TOGGLE FREQUENCY † Similar connection for HI-507A/HI-508A/HI-509A FIGURE 5B. TEST CIRCUIT FIGURE 5. DYNAMIC SUPPLY CURRENT 900 800 ACCESS TIME (ns) 700 600 500 +4V 400 300 3 4 5 6 7 8 9 10 11 12 LOGIC LEVEL (HIGH) (V) 13 14 15 VA 50Ω VREF = OPEN FOR LOGIC HIGH LEVEL ≤ 6V VREF = LOGIC HIGH FOR LOGIC HIGH LEVELS > 6V A3 A2 A1 A0 EN GND VREF +15V V+ IN 1 ±10V IN 2 THRU IN 7/IN 15 ± HI-506A † IN 16 OUT V10V 10 kΩ -15V FIGURE 6A. ACCESS TIME vs LOGIC LEVEL (HIGH) † Similar connection for HI-507A/HI-580A/HI-509A FIGURE 6B. TEST CIRCUIT VAH = 4.0V 1/ V 2 AH ADDRESS DRIVE (VA) 0V VA INPUT 2V/DIV. S1 ON +10V OUTPUT 10% tA OUTPUT 5V/DIV. -10V S16 ON 200ns/DIV. FIGURE 6C. MEASUREMENT POINTS FIGURE 6. ACCESS TIME FIGURE 6D. WAVEFORMS 11 FN3143.5 November 22, 2004 ± ± 5V 14 pF 50 pF HI-506A, HI-507A, HI-508A, HI-509A Test Circuits and Waveforms TA = 25oC, VSUPPLY = ±15V, VAH = 4V, VAL = 0.8V, VREF = Open, Unless Otherwise Specified (Continued) A3 A2 HI-506A † IN 1 IN 2 THRU +5V VAH = 4.0V VA 50Ω A1 A0 IN 7/IN 15 IN 8/IN 16 OUT GND VOUT 1kΩ 50pF 50% 50% 0V ADDRESS DRIVE (VA) +4.0V EN OUTPUT † Similar connection for HI-507A/HI-508A/HI-509A FIGURE 7A. TEST CIRCUIT tOPEN FIGURE 7B. MEASUREMENT POINTS VA INPUT 2V/DIV. S1 ON S16 ON OUTPUT 0.5V/DIV. 100ns/DIV. FIGURE 7C. WAVEFORMS FIGURE 7. BREAK-BEFORE-MAKE DELAY 12 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Test Circuits and Waveforms TA = 25oC, VSUPPLY = ±15V, VAH = 4V, VAL = 0.8V, VREF = Open, Unless Otherwise Specified (Continued) A3 A2 HI-506A † IN 1 IN 2 THRU IN 7/IN 15 IN 8 /IN 16 +10V VAH = 4.0V 50% 50% ENABLE DRIVE (VA) 0V OUT GND 1kΩ VOUT 50pF A1 A0 EN VA 50Ω 90% OUTPUT 10% 0V tON(EN) † Similar connection for HI-507A//HI-508A/HI-509A FIGURE 8A. TEST CIRCUIT tOFF(EN) FIGURE 8B. MEASUREMENT POINTS ENABLE DRIVE 2V/DIV. DISABLED ENABLED (S1 ON) OUTPUT 2V/DIV. 100ns/DIV. FIGURE 8C. WAVEFORMS FIGURE 8. ENABLE DELAYS 13 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Die Characteristics DIE DIMENSIONS: 159 mils x 83.9 mils METALLIZATION: Type: CuAl Thickness: 16kÅ ±2kÅ SUBSTRATE POTENTIAL (NOTE): -VSUPPLY PASSIVATION: Silox: 12kÅ ±2kÅ Nitride: 3.5kÅ ±1kÅ NOTE: The substrate appears resistive to the -VSUPPLY terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a conductor at -VSUPPLY potential. WORST CASE CURRENT DENSITY: 1.4 x 105 A/cm2 TRANSISTOR COUNT: 485 PROCESS: CMOS-DI Metallization Mask Layouts HI-506A EN (18) A0 (17) A1 A2 (16) (15) A3 VREF (14) (13) GND (12) EN (18) A0 (17) HI-507A A1 A2 (16) (15) NC VREF (14) (13) GND (12) IN 1 (19) IN 2 (20) IN 9 (11) IN 10 (10) IN 1A (19) IN 2A (20) IN 1B (11) IN 2B (10) IN 3 (21) IN 4 (22) IN 11 (9) IN 12 (8) IN 3A (21) IN 4A (22) IN 3B (9) IN 4B (8) IN 5 (23) IN 6 (24) IN 13 (7) IN 14 (6) IN 5A (23) IN 6A (24) IN 5B (7) IN 6B (6) IN 7 (25) IN 8 (26) IN 15 (5) IN 16 (4) IN 7A (25) IN 8A (26) IN 7B (5) IN 8B (4) V- (27) OUT (28) +V (1) NC (2) V- (27) OUT A (28) +V (1) OUT B(2) 14 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Die Characteristics DIE DIMENSIONS: 108 mils x 83 mils METALLIZATION: Type: CuAl Thickness: 16kÅ ±2kÅ SUBSTRATE POTENTIAL (NOTE): -VSUPPLY PASSIVATION: Silox: 12kÅ ±2kÅ Nitride: 3.5kÅ ±1kÅ NOTE: The substrate appears resistive to the -VSUPPLY terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a conductor at -VSUPPLY potential. WORST CASE CURRENT DENSITY: 1.4 x 105 A/cm2 TRANSISTOR COUNT: 253 PROCESS: CMOS-DI Metallization Mask Layouts HI-508A HI-509A IN 6 (11) IN 7 IN 8 (10) (9) OUT (8) IN 4 IN 3 (7) (6) IN 3B IN 4B OUT B (11) (10) (9) OUT A (8) IN 4A IN 3A (7) (6) IN 5 (12) +V (13) GND (14) IN 2 (5) IN 1 (4) -V (3) IN 2B (12) IN 1B (13) +V (14) IN 2A (5) IN 1A (4) -V (3) A2 (15) A1 (16) A0 (1) EN (2) GND (15) A1 (16) A0 (1) EN (2) 15 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Ceramic Dual-In-Line Frit Seal Packages (CERDIP) c1 -A-DBASE METAL E b1 M -Bbbb S BASE PLANE SEATING PLANE S1 b2 b ccc M C A-B S AA C A-B S D Q -CA L DS M (b) SECTION A-A (c) LEAD FINISH F28.6 MIL-STD-1835 GDIP1-T28 (D-10, CONFIGURATION A) 28 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE INCHES SYMBOL A b b1 b2 b3 c MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.500 MAX 0.232 0.026 0.023 0.065 0.045 0.018 0.015 1.490 0.610 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 12.70 MAX 5.92 0.66 0.58 1.65 1.14 0.46 0.38 37.85 15.49 NOTES 2 3 4 2 3 5 5 6 7 2, 3 8 Rev. 0 4/94 α eA c1 D E e eA eA/2 L Q S1 e DS eA/2 c 0.100 BSC 0.600 BSC 0.300 BSC 0.125 0.015 0.005 90o 28 0.200 0.060 105o 0.015 0.030 0.010 0.0015 2.54 BSC 15.24 BSC 7.62 BSC 3.18 0.38 0.13 90o 28 5.08 1.52 105o 0.38 0.76 0.25 0.038 aaa M C A - B S D S NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. α aaa bbb ccc M N 16 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Dual-In-Line Plastic Packages (PDIP) N E1 INDEX AREA 12 3 N/2 E28.6 (JEDEC MS-011-AB ISSUE B) 28 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL -B- MILLIMETERS MIN 0.39 3.18 0.356 0.77 0.204 35.1 0.13 15.24 12.32 MAX 6.35 4.95 0.558 1.77 0.381 39.7 15.87 14.73 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 1 12/00 MIN 0.015 0.125 0.014 0.030 0.008 1.380 0.005 0.600 0.485 MAX 0.250 0.195 0.022 0.070 0.015 1.565 0.625 0.580 A E A2 L A C L -AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A1 A2 -C- B B1 C D D1 E E1 e eA eB L N eA eC C e C A BS eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 0.100 BSC 0.600 BSC 0.115 28 0.700 0.200 2.54 BSC 15.24 BSC 2.93 28 17.78 5.08 17 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Ceramic Dual-In-Line Frit Seal Packages (CERDIP) c1 -A-DBASE METAL E b1 M -Bbbb S BASE PLANE SEATING PLANE S1 b2 b ccc M C A-B S AA C A-B S D Q -CA L DS M (b) SECTION A-A (c) LEAD FINISH F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A) 16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE INCHES SYMBOL A b b1 b2 b3 c MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.220 MAX 0.200 0.026 0.023 0.065 0.045 0.018 0.015 0.840 0.310 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 5.59 MAX 5.08 0.66 0.58 1.65 1.14 0.46 0.38 21.34 7.87 NOTES 2 3 4 2 3 5 5 6 7 2, 3 8 Rev. 0 4/94 α eA c1 D E e eA eA/2 L Q S1 e DS eA/2 c 0.100 BSC 0.300 BSC 0.150 BSC 0.125 0.015 0.005 90o 16 0.200 0.060 105o 0.015 0.030 0.010 0.0015 2.54 BSC 7.62 BSC 3.81 BSC 3.18 0.38 0.13 90o 16 5.08 1.52 105o 0.38 0.76 0.25 0.038 aaa M C A - B S D S NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. α aaa bbb ccc M N 18 FN3143.5 November 22, 2004 HI-506A, HI-507A, HI-508A, HI-509A Dual-In-Line Plastic Packages (PDIP) N E1 INDEX AREA 12 3 N/2 E18.3A (JEDEC MS-001-AC ISSUE D) 18 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL -B- MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 33.27 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 34.65 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 5/00 MIN 0.015 0.115 0.014 0.045 0.008 0.880 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 0.920 0.325 0.280 -AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E A A1 A2 B B1 C D D1 E -C- eA eC C e C A BS eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). E1 e eA eB L N 0.100 BSC 0.300 BSC 0.115 18 0.430 0.150 - 2.54 BSC 7.62 BSC 10.92 3.81 18 2.93 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 19 FN3143.5 November 22, 2004