HI20203JCB

August 2000 CT UCT OD U RO D E PR ITUTE P nter at T T e OL E OBS LE SU BS upport C om/tsc IB l S tersil.c SS ica .in A PO w echn FOR ct our T IL or ww nta TERS co Ultra 8-IN 1-88 ® HI20203 8-Bit, 160 MSPS, High-Speed D/A Converter Features • Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 160MHz • 8-Bit (HI20203) Resolution • Differential Linearity Error . . . . . . . . . . . . . . . . 0.5 LSB • Low Glitch Noise • Analog Multiplying Function • Low Power Consumption . . . . . . . . . . . . . . . . . . 420mW • Evaluation Board Available • Direct Replacement for the Sony CX20201-3, CX20202-3 Description The HI20203 is an 8-bit, 160MHz ultra high speed D/A converter. The converter is based on an R2R switched current source architecture that includes an input data register with a complement feature and is Emitter Coupled Logic (ECL) compatible. The HI20203 is an 8-bit accurate D/A with a linearity error of 0.5 LSB. For 10-bit resolution, please refer to the HI20201 data sheet. Part Number Information PART NUMBER HI20203JCB TEMP. RANGE ( oC) -20 to 75 PACKAGE 28 Ld SOIC PKG. NO. M28.3A-S Applications • Wireless Communications • Signal Reconstruction • Direct Digital Synthesis • High Definition Video Systems • Digital Measurement Systems • Radar Pinout HI20203 (PDIP, SOIC) TOP VIEW (MSB) D7 1 D6 2 D5 3 D4 4 D3 5 D2 6 D1 7 D0 8 NC 9 NC 10 NC 11 NC 12 CLK 13 CLK 14 28 AVSS 27 VREF 26 AVEE 25 NC 24 NC 23 NC 22 NC 21 NC 20 IOUT 19 NC 18 AVSS 17 DVSS 16 COMPL 15 DVEE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002. All Rights Reserved File Number 4096.2 1 HI20203 Typical Application Circuit HI20203 (28) AVSS 1.5kΩ (27) VREF 2kΩ (26) AVEE 0.047 µF 1kΩ D7 D6 D5 D4 DIGITAL DATA (ECL) D3 D2 D1 D0 D7 (MSB) (1) D6 (2) D5 (3) D4 (4) D3 (5) D2 (6) D1 (7) D0 (8) (9) (10) (11) (12) . ~2.7V TL431CP -5.2V 1.0 µF 75 Ω COAX CABLE (20) I OUT (18, 19, 21-25) NC D/A OUT 82Ω CLK -1.3V 131 Ω -5.2V 82Ω CLK (13) CLK (14) (17) DVSS (16) COMPL (15) DVEE 1.0µF 0.047µF -5.2V 131Ω 3.6k Ω Functional Block Diagram (LSB) D0 D1 D2 D3 D4 D5 D6 (MSB) D7 UPPER 4-BIT ENCODER 15 INPUT BUFFER 4 LSBs CURRENT CELLS R2R NETWORK 8-BIT REGISTER 15 SWITCHED CURRENT CELLS I OUT COMPL CLK CLK CLOCK BUFFER BIAS CURRENT GENERATOR VREF AVEE AVSS DVEE DVSS 2 HI20203 Absolute Maximum Ratings TA = 25oC Digital Supply Voltage DVEE to DVSS . . . . . . . . . . . . . . . . . . . -7.0V Analog Supply Voltage AV DD to AV SS . . . . . . . . . . . . . . . . . . -7.0V Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 to DVEE V Reference Input Voltage. . . . . . . . . . . . . . . . . . . . . . +0.3 to AVEE V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Thermal Information Thermal Resistance (Typical, Note 5) θJA ( oC/W) SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Reference Input Voltage, VREE . . . . . . . VEE + 0.5V to VEE + 1.4V Load Resistance, R L . . . . . . . . . . . . . . . . . . . . . . . . . . . . Above 75Ω Output Voltage, VO(FS) . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V to 1.2V Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -20oC to 75oC Operating Conditions Supply Voltage AVEE , D VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . -4.75V to -5.45V AVEE - DVEE . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.05V to +0.05V Digital Input Voltage VIH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to -0.7V VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.9V to -1.6V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications AV EE = - 5.2V, DVEE = -5.2V, AGND = 0V, DGND = 0V, RL = ∞, VOUT = -1V, TA = 25oC HI20203JCB/JCP PARAMETER SYSTEM PERFORMANCE Resolution Integral Linearity Error, INL Differential Linearity Error, DNL Offset Error, VOS (Adjustable to Zero) Full Scale Error, FSE (Adjustable to Zero) Full Scale Output Current, IFS DYNAMIC CHARACTERISTICS Throughput Rate Glitch Energy, GE REFERENCE INPUT Voltage Reference Input Range Reference Input Current Voltage Reference to Output Small Signal Bandwidth Output Rise Time, tr Output Fall Time, tf DIGITAL INPUTS Input Logic High Voltage, VIH Input Logic Low Voltage, V IL (Note 2) (Note 2) TEST CONDITION MIN TYP MAX UNITS 8 fS = 160MHz (End Point) fS = 160MHz (Note 3) (Note 3) - 1.8 - ±0.5 ±0.50 ±26 20 Bits LSB LSB LSB LSB mA See Figure 11 R OUT = 75Ω 160 - 15 - MHz pV/s With respect to AVEE V REF = - 4.58V -3dB point 1VP-P Input R LOAD = 75Ω R LOAD = 75Ω +0.5 -0.1 - -0.4 14.0 1.5 1.5 +1.4 -3.0 - V µA MHz ns ns -1.0 -0.89 -1.75 -1.6 V V 3 HI20203 Electrical Specifications AV EE = -5.2V, DV EE = -5.2V, AGND = 0V, DGND = 0V, RL = ∞, VOUT = -1V, TA = 25oC (Continued) HI20203JCB/JCP PARAMETER Input Logic Current, IIL , IIH (For D9 thru D6, COMPL) Input Logic Current, IIL , IIH (For D5 thru D0) TIMING CHARACTERISTICS Data Setup Time, tSU Data Hold Time, tHLD Propagation Delay Time, tPD Settling Time, tSET (to 1/2 LSB) See Figure 11 See Figure 11 See Figure 11 See Figure 11 5 1 3.8 4.3 ns ns ns ns TEST CONDITION VIH = - 0.89V, VIL = -1.75V (Note 2) VIH = - 0.89V, VIL = -1.75V (Note 2) MIN 0.1 0.1 TYP 1.5 0.75 MAX 6.0 3.0 UNITS µA µA POWER SUPPLY CHARACTERISITICS IEE Power Dissipation NOTES: 2. Parameter guaranteed by design or characterization and not production tested. 3. Excludes error due to reference drift. 4. Electrical specifications guaranteed only under the stated operating conditions. 75Ω load -60 -75 420 -90 470 mA mW Timing Diagram CLK CLK DATA tSU N tD 0V D/A OUT -1V 90% 50% 10% tr tf N tHD N+1 tD N+1 FIGURE 1. LADDER SETTLING TIME FULL POWER BANDWIDTH (LS) 4 HI20203 Typical Performance Curves FULL SCALE OUTPUT VOLTAGE (V) TA = 25 oC, VEE = -5.2V FULL SCALE OUTPUT VOLTAGE (RELATIVE VALUE) VO(FS) /(VO(FS) AT TA = 25oC) -2.0 1.05 LINEAR AREA RL = 10kΩ -1.0 RL = 75Ω 1.00 RL = 1 0kΩ RL = 75Ω 0 0.5 1.0 VREF - VEE (V) 1.5 0.95 -20 0 20 40 60 80 AMBIENT TEMPERATURE (oC) FIGURE 2. VO(FS) RATIO vs (V REF - VEE) FIGURE 3. FULL SCALE OUTPUT VOLTAGE vs AMBIENT TEMPERATURE 0 10.0 GAIN 0 PHASE (DEGREE) fCLK = 100MHz GLITCH ENERGY (pV/s) 8.0 GAIN (dB) PHASE -10 -90 6.0 4.0 -180 2.0 -20 10K 100K 1M 10M 100M MULTIPLYING INPUT SIGNAL FREQUENCY (Hz) -50 0 50 CASE TEMPERATURE (oC) 100 FIGURE 4. OUTPUT CHARACTERISTICS vs MULTIPLYING INPUT SIGNAL FREQUENCY FIGURE 5. GLITCH ENERGY vs CASE TEMPERATURE (FULL SCALE - 1023mV) Pin Descriptions 28 PIN SOIC 1-8 11, 12, 19, 21-25 13 14 15 16 17 18 20 26 27 PIN NAME NC CLK CLK DVEE COMPL DVSS AVSS IOUT AVEE VREF No connect, not used. Negative Differential Clock Input. Positive Differential Clock Input Digital (ECL) Power Supply -4.75V to -7V. Data Complement Pin. When set to a (ECL) logic High the input data is complemented in the input buffer. When cleared to a (ECL) logic Low the input data is not complemented. Digital Ground. Analog Ground. Current Output Pin. Analog Supply -4.75V to -7V. Input Reference Voltage used to set the output full scale range. PIN DESCRIPTION D0 (LSB) - D7 (MSB) Digital Data Bit 0, the Least Significant Bit thru Digital Data Bit 7, the Most Significant Bit. 5 HI20203 Pin Descriptions 28 PIN SOIC 28 PIN NAME AVSS Analog Ground PIN DESCRIPTION Detailed Description The HI20203 is an 8-bit, current-output D/A converter. The converter has 10 data bits but yields 8-bit performance. Architecture The HI20203 is a combined R2R/segmented current source design. The 6 least significant bits of the converter are derived by a traditional R2R network to binary weight the 1mA current sources. The upper 4 most significant bits are implemented as segmented or thermometer encoded current sources. The encoder converts the incoming 4 bits to 15 control lines to enable the most significant current sources. The thermometer encoder will convert binary to individual control lines. See Table 1. TABLE 1. THERMOMETER ENCODER THERMOMETER CODE 1 = ON, 0 = OFF I15 - I0 000 0000 0000 0000 000 0000 0000 0001 000 0000 0000 0011 000 0000 0000 0111 000 0000 0000 1111 000 0000 0001 1111 000 0000 0011 1111 000 0000 0111 1111 000 0000 1111 1111 000 0001 1111 1111 000 0011 1111 1111 000 0111 1111 1111 000 1111 1111 1111 001 1111 1111 1111 011 1111 1111 1111 111 1111 1111 1111 A (mV) GLITCH ENERGY = (a x t)/2 HI20203 (20) IOUT 75Ω 34MHz LOW PASS FILTER SCOPE 50 Ω 01 1111 1111 to 10 0000 0000. But in the HI20203 the glitch is moved to the 00 0001 1111 to 11 1110 0000 transition. This is achieved by the split R2R/segmented current source architecture. This decreases the amount of current switching at any one time and makes the glitch practically constant over the entire output range. By making the glitch a constant size over the entire output range this effectively integrates this error out of the end application. In measuring the output glitch of the HI20203 the output is terminated into a 75Ω load. The glitch is measured at the major carry’s throughout the DACs output range. The glitch energy is calculated by measuring the area under the voltage-time curve. Figure 7 shows the area considered as glitch when changing the DAC output. Units are typically specified in picoVolt/seconds (pV/s). MSB 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 6 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 5 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 4 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 FIGURE 6. HI20203 GLITCH TEST CIRCUIT The architecture of the HI20203 is designed to minimize glitch while providing a manufacturable 10-bit design that does not require laser trimming to achieve good linearity. Glitch Glitch is caused by the time skew between bits of the incoming digital data. Typically the switching time of digital inputs are asymmetrical meaning that the turn off time is faster than the turn on time (TTL designs). In an ECL system where the logic levels switch from one non-saturated level to another, the switching times can be considered close to symmetrical. This helps to reduce glitch in the D/A. Unequal delay paths through the device can also cause one current source to change before another. To minimize this the Intersil HI20203 employs an internal register, just prior to the current sources, that is updated on the clock edge. Lastly the worst case glitch usually happens at the major transition i.e., t (ns) FIGURE 7. GLITCH ENERGY Setting Full Scale The Full Scale output voltage is set by the Voltage Reference pin (27). The output voltage performance will vary as shown in Figure 2. The output structure of the HI20203 can handle down to a 75Ω load effectively. To drive a 50Ω load Figure 8 is 6 HI20203 suggested. Note the equivalent output load is ~75Ω . The temperature coefficient of the full scale output voltage and zero offset voltage depend on the load resistance connected to IOUT . The larger the load resistor the better (i.e., smaller) the temperature coefficient of the D/A. See Figure 3 in the performance curves section. Noise Reduction Digital switching noise must be minimized to guarantee system specifications. Since 1 LSB corresponds to 1mV for 10-bit resolution, care must be taken in the layout of a circuit board. Separate ground planes should be used for DV SS and AVSS . They should be connected back at the power supply. FIGURE 8. HI20203 DRIVING A 50Ω LOAD HI20203 (20) IOUT 39 Ω 50 Ω COAX CABLE D/A OUT 100Ω (18, 19, 21-25) NC Variable Attenuator Capability The HI20203 can be used in a multiplying mode with a variable frequency input on the VREF pin. In order for the part to operate correctly a DC bias must be applied and the incoming AC signal should be coupled to the VREF pin. See Figure 13 for the application circuit. The user must first adjust the DC reference voltage. The incoming signal must be attenuated so as not to exceed the maximum (+1.4V) and minimum (+0.5V) reference input. The typical output Small Signal Bandwidth is 14MHz. Integral Linearity The Integral Linearity is measured using the End Point method. In the End Point method the gain is adjusted. A line is then established from the zero point to the end point or Full Scale of the converter. All codes along the transfer curve must fall within an error band of 1 LSB of the line. Figure 10 shows the linearity test circuit. Differential Linearity The Differential Linearity is the difference from the ideal step. To guarantee monotonicity a maximum of 1 LSB differential error is allowed. When more than 1 LSB is specified the converter is considered to be missing codes. Figure 10 shows the linearity test circuit. Clock Phase Relationship The HI20203 is designed to be operated at very high speed (i.e., 160MHz). The clock lines should be driven with ECL100K logic for full performance. Any external data drivers and clock drivers should be terminated with 50 Ω to minimize reflections and ringing. Internal Data Register The HI20203 incorporates a data register as shown in the Functional Block Diagram. This register is updated on the rising edge of the CLK line. The state of the Complement bit (COMPL) will determine the data coding. See Table 2. TABLE 2. INPUT CODING TABLE OUTPUT CODE INPUT CODE 00 0000 0000 10 0000 0000 11 1111 1111 COMPL = 1 0 -0.5 -1 COMPL = 0 -1 -0.5 0 Separate power planes should be used for DVEE and AV EE . They should be decoupled with a 1µF tantalum capacitor and a ceramic 0.047µF capacitor positioned as close to the body of the IC as possible. Thermal Considerations 7 HI20203 Test Circuits and Waveforms a b a b a b a b a b a b a b a b S1 S2 S3 S4 S5 S6 S7 S8 1 2 3 4 5 6 7 8 9 10 11 12 28 27 26 25 24 23 22 21 20 19 18 17 S17 16 15 S19 1mA S20 b S16 a a b I1 5.2V a b I6 4.56V I2 S11 a -0.89V b -1.75V -0.89V OR -1.75V a b V1 -0.89V -1.75V a S14 I3 b a S15 I4 b a S12 13 b a S13 14 b a b I5 S18 a b 5.2V FIGURE 9. CURRENT CONSUMPTION, INPUT CURRENT AND OUTPUT RESISTANCE LINEARITY ERRORS ARE MEASURED AS FOLLOWS S1 0 0 0 S2 0 0 0 S3 0 0 0 •••• •••• •••• •••• • • • •••• S7 0 0 1 S8 0 1 0 D/A OUT V0 V1 V2 • • • V255 “1” “0” 0.89V 1.75V S1 S2 S3 S4 S5 S6 1 2 3 4 5 6 7 8 9 10 11 12 28 27 26 25 24 23 22 21 20 19 18 17 16 15 5.2V V0 D/A OUT * 10K 5.2V 1 1 1 1 1 8-BIT DATA INTEGRAL LINEARITY ERROR V0 V1 V2 V4 V8 V16 V32 V64 V128 • • • V255 DIFFERENTIAL LINEARITY ERROR V1 - V0 V2 - V1 V4 - V3 V8 - V7 V16 - V15 V32 - V31 V64 - V63 V128 - V127 • • • S7 S8 1.3V 1 SHOT CLK 13 14 Error at individual measurement points are calculated according to the following definition. (V255 - V0)/1023 = V0(FS) /255 ≡ 1 LSB. FIGURE 10. DIFFERENTIAL LINEARITY ERROR AND LINEARITY ERROR 8 HI20203 Test Circuits and Waveforms 1/ HD100151 6 (Continued) B 1 MSB 28 27 26 25 24 23 22 21 OUT 20 19 18 17 16 15 -5.2V 100 TO SCOPE C 50Ω -5.2V 10kΩ 82 82 2 3 D 131 Q Q 131 -5.2V 4 5 6 7 -5.2V CLKF TO PG -1.3V 50Ω 1 8 CLKF 9 10 LSB 11 470 131 1 131 131 -5.2V 131 82 82 A 12 13 CLK 14 CLK 39 HD100116 1 82 DL -1.3V DL: Delay line Capacitors are 0.047µF ceramic chip capacitors unless otherwise specified. FIGURE 11. MAXIMUM CONVERSION RATE, RISE TIME, FALL TIME, PROPAGATION DELAY, SETUP TIME, HOLD TIME AND SETTLING TIME Measuring Settling Time Settling time is measured as follows. The relationship between V and V0(FS) as shown in the D/A output waveform in Figure 12 is expressed as V = V 0(FS) (1 - e-tτ). The settling time for respective accuracy of 10, 9 and 8-bit is specified as V = 0.9995 V 0(FS) V = 0.999 V0(FS) V = 0.999 V0(FS) which results in the following: tS = 7.60τ tS = 6.93τ tS = 6.24τ for 10-bit, for 9-bit, and for 8-bit, t V V0(FS) = 1V τ Rise time (tr) and fall time (tf) are defined as the time interval to slew from 10% to 90% of full scale voltage (V0(FS)): V = 0.1 V0(FS) V = 0.9 V0(FS) FIGURE 12. D/A OUTPUT WAVEFORM and calculated as tr = tf = 2.20τ. The settling time is obtained by combining these expressions: tS = 3.45tr tS = 3.15tr tS = 6.24tr for 10-bit, for 9-bit, and for 8-bit 9 HI20203 Test Circuits and Waveforms (Continued) Adjust so that the voltage at point B becomes -1V with no AC input. “1” 1 2 3 4 5 6 7 8 9 10 11 12 CLK CLK 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 -5.2V A GND D GND B TO SCOPE 0.047 µ A -5.2V 51 10k Ω 0.1 µF OSC FIGURE 13A. WAVEFORM AT POINT A VEE -0.62V VEE -0.31V FIGURE 13B. WAVEFORM AT POINT B 1VP-P AT 1MHz -1V FIGURE 13C. FIGURE 13. MULTIPLYING BANDWIDTH 10