HIN237

® HIN232, HIN236, HIN237,HIN238, HIN239, HIN240, HIN241 Data Sheet August 31, 2005 FN3138.15 +5V Powered RS-232 Transmitters/Receivers The HIN232-HIN241 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where ±12V is not available. They require a single +5V power supply (except HIN239) and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The family of devices offer a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance. The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ input impedance. The receivers also feature hysteresis to greatly improve noise rejection. Features • Meets All RS-232E and V.28 Specifications • Requires Only Single +5V Power Supply - (+5V and +12V - HIN239) • High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps • Onboard Voltage Doubler/Inverter • Low Power Consumption • Low Power Shutdown Function • Three-State TTL/CMOS Receiver Outputs • Multiple Drivers - ±10V Output Swing for 5V lnput - 300Ω Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/µs Maximum Slew Rate • Multiple Receivers - ±30V Input Voltage Range - 3kΩ to 7kΩ Input Impedance - 0.5V Hysteresis to Improve Noise Rejection • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Any System Requiring RS-232 Communication Ports - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems Selection Table PART NUMBER HIN232 HIN236 HIN237 HIN238 HIN239 HIN240 HIN241 POWER SUPPLY VOLTAGE +5V +5V +5V +5V +5V and +7.5V to 13.2V +5V +5V NUMBER OF RS-232 DRIVERS 2 4 5 4 3 5 4 NUMBER OF RS-232 RECEIVERS 2 3 3 4 5 5 5 EXTERNAL COMPONENTS 4 Capacitors 4 Capacitors 4 Capacitors 4 Capacitors 2 Capacitors 4 Capacitors 4 Capacitors LOW POWER SHUTDOWN/TTL THREE-STATE No/No Yes/Yes No/No No/No No/Yes Yes/Yes Yes/Yes NUMBER OF LEADS 16 24 24 24 24 44 28 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004, 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pin Descriptions PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT EN Power Supply Input 5V ±10%. Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V. Internally generated negative supply (-10V nominal). Ground lead. Connect to 0V. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. External capacitor (+ terminal) is connected to this lead. External capacitor (- terminal) is connected to this lead. Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead. Transmitter Outputs. These are RS-232 levels (nominally ±10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in a high impedance state. Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the transmitters are shut off. No Connect. No connections are made to these leads. FUNCTION SD NC 2 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Ordering Information PART NUMBER HIN232CB HIN232CB-T HIN232CBZ (See Note) PART MARKING 232CB 232CB 232CBZ TEMP. RANGE (oC) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 PACKAGE 16 Ld SOIC Tape and Reel 16 Ld SOIC (Pb-free) M16.3 PKG. DWG. # M16.3 Ordering Information (Continued) PART NUMBER HIN239CPZ (See Note) HIN240CN HIN240CNZ (See Note) PART MARKING HIN239CPZ HIN240CN HIN240CNZ TEMP. RANGE (oC) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 PACKAGE 24 Ld PDIP* (Pb-free) 44 Ld MQFP 44 Ld MQFP (Pb-free) PKG. DWG. # E24.3 Q44.10X10 Q44.10X10 HIN232CBZ-T 232CBZ (See Note) HIN232CP HIN232CPZ (See Note) HIN232IB HIN232IB-T HIN232IBZ (See Note) HIN232IBZ-T (See Note) HIN232IP HIN232IPZ (See Note) HIN236CB HIN236CBZ (See Note) HIN237CB HIN237CB-T HIN237CBZ (See Note) HIN232CP HIN232CPZ 232IB 232IB 232IBZ 232IBZ HIN232IP HIN232IPZ 236CB 236CBZ 237CB 237CB 237CBZ Tape and Reel (Pb-free) 16 Ld PDIP 16 Ld PDIP* (Pb-free) E16.3 E16.3 M16.3 HIN240CNZ-T HIN240CNZ (See Note) HIN241CA HIN241CAZ (See Note) HIN241CB HIN241CA HIN241CAZ 241CB 241CB 241CBZ 44 Ld MQFP Tape and Reel (Pb-free) 28 Ld SSOP 28 Ld SSOP (Pb-free) 28 Ld SOIC Tape and Reel 28 Ld SOIC (Pb-free) M28.3 M28.209 M28.209 M28.3 -40 to 85 16 Ld SOIC -40 to 85 Tape and Reel -40 to 85 16 Ld SOIC (Pb-free) M16.3 HIN241CB-T HIN241CBZ (See Note) -40 to 85 Tape and Reel (Pb-free) -40 to 85 16 Ld PDIP -40 to 85 16 Ld PDIP* (Pb-free) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 24 Ld SOIC 24 Ld SOIC (Pb-free) 24 Ld SOIC Tape and Reel 24 Ld SOIC (Pb-free) M24.3 E16.3 E16.3 M24.3 M24.3 M24.3 HIN241CBZ-T 241CBZ (See Note) HIN241IB HIN241IBZ (See Note) 241IB 241IBZ Tape and Reel (Pb-free) M28.3 M28.3 -40 to 85 28 Ld SOIC -40 to 85 28 Ld SOIC (Pb-free) NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. HIN237CBZ-T 237CBZ (See Note) HIN238CB HIN238CB-T HIN238CBZ (See Note) 238CB 238CB 238CBZ Tape and Reel (Pb-free) 24 Ld SOIC Tape and Reel 24 Ld SOIC (Pb-free) M24.3 M24.3 HIN238CBZ-T 238CBZ (See Note) HIN238CP HIN238CPZ (See Note) HIN238IB HIN238IBZ (See Note) HIN239CB HIN239CB-T HIN239CBZ (See Note) HIN238CP HIN238CPZ 238IB 238IBZ 239CB 239CB 239CBZ Tape and Reel (Pb-free) 24 Ld PDIP 24 Ld PDIP* (Pb-free) E24.3 E24.3 M24.3 M24.3 M24.3 -40 to 85 24 Ld SOIC -40 to 85 24 Ld SOIC (Pb-free) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 24 Ld SOIC Tape and Reel 24 Ld SOIC (Pb-free) M24.3 HIN239CBZ-T 239CBZ (See Note) HIN239CP HIN239CP Tape and Reel (Pb-free) 24 Ld PDIP E24.3 3 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts HIN232 (PDIP, SOIC) TOP VIEW T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC 1 2 3 4 5 6 7 8 9 HIN236 (SOIC) TOP VIEW 24 T4OUT 23 R2IN 22 R2OUT 21 SD 20 EN 19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V14 C213 C2+ C1+ 1 V+ 2 C1- 3 C2+ 4 C2- 5 V6 16 VCC 15 GND 14 T1OUT 13 R1IN 12 R1OUT 11 T1IN 10 T2IN 9 R2OUT T2OUT 7 R2IN 8 C1+ 10 V+ 11 C1- 12 +5V 1 µF + 16 1 µF 1 NOTE 1 + 3 4 NOTE 1 + 5 VCC C1+ C1C2+ C2+5V TO 10V VOLTAGE DOUBLER V+ 2 + NOTE 1 1 µF +5V 9 10 VCC C1+ + +5V TO 10V 12 C1- VOLTAGE DOUBLER 13 C2+ + +10V TO -10V 14 VOLTAGE INVERTER C2+5V 400kΩ 7 +5V 400kΩ +5V 400kΩ T1 1 µF V+ 11 + V- 15 + 2 1 µF T1OUT +10V TO -10V VOLTAGE INVERTER V- 6 + NOTE 1 T1IN T2 3 T3 T2OUT T1IN 11 +5V 400kΩ T1 T2IN 14 T1OUT T3IN 6 18 1 T3OUT T4OUT R1IN T2IN 10 12 +5V 400kΩ T2 7 13 R1IN R1 5kΩ T2OUT T4IN R1OUT +5V 400kΩ 19 5 T4 24 4 R1 5kΩ 23 R2IN R2 5kΩ 16 R3IN R3 5kΩ 21 SD 8 R1OUT 22 R2OUT 9 R2 5kΩ 17 R3OUT 15 EN 20 8 R2OUT R2IN NOTE: 1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor may be terminated to VCC or to GND. 4 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts (Continued) HIN237 (SOIC) TOP VIEW T3OUT 1 T1OUT 2 T2OUT 3 R1IN 4 24 T4OUT 23 R2IN 22 R2OUT 21 T5IN 20 T5OUT 19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V14 C213 C2+ HIN238 (PDIP, SOIC) TOP VIEW T2OUT 1 T1OUT 2 R2IN 3 R2OUT 4 T1IN 5 R1OUT 6 R1IN 7 GND 8 VCC 9 C1+ 10 V+ 11 C1- 12 24 T3OUT 23 R3IN 22 R3OUT 21 T4IN 20 T4OUT 19 T3IN 18 T2IN 17 R4OUT 16 R4IN 15 V14 C213 C2+ R1OUT 5 T2IN T1IN GND VCC 6 7 8 9 C1+ 10 V+ 11 C1- 12 +5V 9 1µF 10 C1+ + 12 C113 C2+ + 14 C2VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 1 µF 1 µF 10 C1+ + 12 C113 C2+ + 14 C2- +5V 9 VCC +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 V+ 11 + 1µF 1µF V- 15 1 µF + 2 T1OUT 1 µF V- 15 + 2 1µF T1OUT T1IN +5V 400kΩ 7 +5V 400kΩ +5V 400kΩ T1IN +5V 400kΩ 5 +5V 400kΩ +5V 400kΩ T2 3 T3 T2OUT T2IN 18 T2IN 6 T2 1 T3 T2OUT T3IN T4IN T5IN R1OUT 18 1 T3OUT T4OUT T5OUT R1IN T3IN T4IN R1OUT 19 24 T3OUT T4OUT R1IN +5V 400kΩ 19 +5V 400kΩ 21 5 T4 24 T5 20 4 R1 5kΩ 23 R2IN R2 5kΩ 16 R3IN R3 5kΩ R3OUT +5V 400kΩ 21 6 T4 20 7 R1 5kΩ 3 R2IN R2 5kΩ 23 R3IN R3 5kΩ 16 R4IN R4 5kΩ 4 R2OUT 22 R2OUT 22 17 R3OUT 17 R4OUT 8 8 5 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts (Continued) R4OUT R5OUT T5OUT HIN239 (PDIP, SOIC) TOP VIEW NC SD HIN240 (MQFP) R4IN R5IN T4IN T3IN NC EN R1OUT 1 R1IN 2 GND 3 VCC 4 V+ 5 C1+ 6 C1- 7 V8 24 T1IN 23 T2IN 22 R2OUT 21 R2IN 20 T2OUT 19 T1OUT 18 R3IN 17 R3OUT 16 T3IN 15 NC 14 EN 13 T3OUT NC T5IN R3OUT R3IN T4OUT T3OUT T1OUT T2OUT NC R2IN NC 1 44 43 42 41 40 39 38 37 36 35 34 33 2 32 3 4 5 6 7 8 9 31 30 29 28 27 26 25 NC NC NC VC2C2+ C1V+ C1+ NC NC R5IN 9 R5OUT 10 R4OUT 11 R4IN 12 24 10 11 23 12 13 14 15 16 17 18 19 20 21 22 R2OUT R1OUT T2IN T1IN R1IN GND VCC NC NC NC +5V +5V 4 6 1 µF (NOTE) + 7 C1+ C1VCC +10V TO -10V VOLTAGE INVERTER T1 V+ V5 8 + 19 1 µF T1OUT 1 µF +7.5V TO +13.2V (NOTE) 1 µF 19 25 VCC C1+ + +5V TO 10V 27 C1- VOLTAGE DOUBLER 28 C2+ +10V TO -10V + 29 VOLTAGE INVERTER C2+5V T1 400kΩ 15 +5V 400kΩ 14 +5V 400kΩ 37 +5V 400kΩ T2 8 T3 T2OUT 26 + 1 µF V+ V- 30 1 µF 7 T1OUT T1IN +5V 400kΩ 24 +5V 400kΩ +5V 400kΩ T1IN T2IN T2 20 T3 T2OUT T2IN 23 T3IN R1OUT 16 1 13 2 T3OUT R1IN T3IN T4IN T5IN 6 NC T3OUT T4OUT T5OUT R1IN 38 T4 5 R1 22 R2OUT R2 17 R3OUT R3 11 R4OUT R4 10 R5OUT 14 EN 3 R5 5kΩ 21 R2IN 5kΩ 18 R3IN 5kΩ 12 R4IN 5kΩ 9 R5IN 5kΩ +5V 400kΩ 2 16 T5 41 17 R1OUT R1 13 R2OUT R2 3 R3OUT R3 39 R4OUT R4 36 R5OUT 42 EN R5 18 5kΩ 10 R2IN 5kΩ 4 R3IN 5kΩ 40 R4IN 5kΩ 35 R5IN 5kΩ 43 SD NOTE: For V+ > 11V, use C1 ≤ 0.1µF. 6 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts (Continued) HIN241 (SOIC, SSOP) TOP VIEW T3OUT 1 T1OUT 2 T2OUT 3 R2IN 4 R2OUT 5 T2IN 6 T1IN 7 R1OUT 8 R1IN 9 GND 10 VCC 11 C1+ 12 V+ 13 C1- 14 28 T4OUT 27 R3IN 26 R3OUT 25 SD 24 EN 23 R4IN 22 R4OUT 21 T4IN 20 T3IN 19 R5OUT 18 R5IN 17 V16 C215 C2+ +5V 11 12 VCC C1+ + +5V TO 10V 14 C1- VOLTAGE DOUBLER 15 C2+ + +10V TO -10V 16 VOLTAGE INVERTER C2+5V 400kΩ 7 +5V 400kΩ 6 +5V 400kΩ 20 +5V 400kΩ T1 + 1 µF 1 µF V+ 13 1 µF V- 17 + 1 µF 2 T1OUT T2OUT T1IN T2IN T2 3 T3 T3IN 1 T3OUT T4IN R1OUT 21 8 T4 28 9 T4OUT R1IN R1 5 R2OUT R2 26 R3OUT R3 22 R4OUT R4 19 R5OUT 24 EN 10 R5 5kΩ 4 R2IN 5kΩ 27 R3IN 5kΩ 23 R4IN 5kΩ 18 R5IN 5kΩ 25 SD 7 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Absolute Maximum Ratings VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V V+ to Ground (Note 2) . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V) V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Thermal Information Thermal Resistance (Typical, Note 3) θJA (oC/W) 16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . . 90 24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70 16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 100 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95 44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC, SSOP, MQFP - Lead Tips Only) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Operating Conditions Temperature Range HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF. 3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications PARAMETER SUPPLY CURRENTS Power Supply Current, ICC Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range TEST CONDITIONS MIN TYP MAX UNITS No Load, TA = 25oC HIN232 HIN236-HIN238, HIN240-HIN241 HIN239 - 5 7 0.4 5.0 1 10 15 1 15 10 mA mA mA mA µA V+ Power Supply Current, ICC No Load, TA = 25oC Shutdown Supply Current, ICC(SD) No Load, TA = 25oC TA = 25oC HIN239 LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS Input Logic Low, VlL Input Logic High, VlH TIN, EN, Shutdown TIN EN, Shutdown Transmitter Input Pullup Current, IP TTL/CMOS Receiver Output Voltage Low, VOL TTL/CMOS Receiver Output Voltage High, VOH RECEIVER INPUTS RS-232 Input Voltage Range VIN Receiver Input Impedance RIN Receiver Input Low Threshold, VlN (H-L) Receiver Input High Threshold, VIN (L-H) Receiver Input Hysteresis VHYST VIN = ±3V VCC = 5V, TA = 25oC VCC = 5V, TA = 25oC -30 3.0 0.8 0.2 5.0 1.2 1.7 0.5 +30 7.0 2.4 1.0 V kΩ V V V TIN = 0V IOUT = 1.6mA IOUT = -1.0mA 2.0 2.4 3.5 15 0.1 4.6 0.8 200 0.4 V V V µA V V 8 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Electrical Specifications PARAMETER TIMING CHARACTERISTICS Baud Rate (1 Transmitter Switching) Output Enable Time, tEN Output Disable Time, tDIS Propagation Delay, tPD Instantaneous Slew Rate SR Transition Region Slew Rate, SRT TRANSMITTER OUTPUTS Output Voltage Swing, TOUT Output Resistance, TOUT RS-232 Output Short Circuit Current, ISC NOTE: 4. Guaranteed by design. Transmitter Outputs, 3kΩ to Ground VCC = V+ = V- = 0V, VOUT = ±2V TOUT shorted to GND ±5 300 ±9 ±10 ±10 V Ω mA R L = 3k Ω HIN236, HIN239, HIN240, HIN241 HIN236, HIN239, HIN240, HIN241 RS-232 to TTL CL = 10pF, RL = 3kΩ , TA = 25oC (Note 4) RL = 3kΩ , CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching 120 400 250 0.5 3 30 kbps ns ns µs V/µs V/µs Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued) TEST CONDITIONS MIN TYP MAX UNITS VOLTAGE DOUBLER S1 VCC + GND S3 RC OSCILLATOR C1C1 + S4 C3 VCC GND S7 C1+ S2 V+ = 2VCC S5 VOLTAGE INVERTER C2+ S6 GND + C2C2 + S8 C4 V- = -(V+) FIGURE 1. CHARGE PUMP Detailed Description The HIN232 thru HIN241 family of RS-232 transmitters/receivers are powered by a single +5V power supply (except HIN239), feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver. to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200Ω, and the output impedance of the voltage inverter section (V-) is approximately 450Ω. A typical application uses 1µF capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. During shutdown mode (HIN236, HIN240 and HIN241), SHUTDOWN control line set to logic “1”, the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10µA. The transmitter outputs are disabled and the receiver outputs are placed in the high impedance state. Charge Pump An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 16kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase one, C2 is also charged to 2VCC , and then during phase two, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up 9 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Transmitters The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ -0.6V). Each transmitter input has an internal 400kΩ pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of ±5V minimum with the worst case conditions of: all transmitters driving 3kΩ minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/µs. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300Ω with ±2V applied to the outputs and VCC = 0V. V+ GND VCC 400kΩ TXIN GND < TXIN < VCC V300Ω TOUT V- < VTOUT < V+ Receivers The receiver inputs accept up to ±30V while presenting the required 3kΩ to 7kΩ input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the ±3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis to improve noise rejection. The receiver Enable line EN, when set to logic “1”, (HIN236, 239, 240, and 241) disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode. VCC RXIN -30V < RXIN < +30V 5kΩ ROUT GND < VROUT < VCC FIGURE 3. RECEIVER FIGURE 2. TRANSMITTER TIN OR RIN TOUT OR ROUT VOL VOL tPHL tPLH Average Propagation Delay = tPHL + tPLH 2 FIGURE 4. PROPAGATION DELAY DEFINITION 10 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Typical Performance Curves TA = 25oC 12 SUPPLY VOLTAGE (|V|) 1 µF V- SUPPLY VOLTAGE 10 0.47µF 8 0.10µF 6 4 2 0 3.0 12 10 8 6 4 2 0 3.5 4.0 4.5 VCC 5.0 5.5 6.0 0 5 10 15 20 |ILOAD| (mA) 25 30 35 V- (VCC = 4.5V) V- (VCC = 5V) V+ (VCC = 5V) V+ (VCC = 4.5V) TRANSMITTER OUTPUTS OPEN CIRCUIT FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING CAPACITORS FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232) Test Circuits (HIN232) +4.5V TO +5.5V INPUT 1µF C3 1 µF C1 + + 1 C1+ 2 V+ 3 C14 C2+ 5 C2VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT 9 3kΩ T1 OUTPUT RS-232 ±30V INPUT TTL/CMOS OUTPUT TTL/CMOS INPUT TTL/CMOS INPUT TTL/CMOS OUTPUT 1 C1+ 2 V+ 3 C14 C2+ 5 C26 V7 T2OUT 8 R2IN VCC 16 GND 15 T1OUT 14 R1IN 13 R1OUT 12 T1IN 11 T2IN 10 R2OUT 9 - 1µF + C2 1µF C4 3kΩ T2 OUTPUT RS-232 ±30V INPUT VIN = ±2V FIGURE 7. GENERAL TEST CIRCUIT - + 6 V7 T2OUT 8 R2IN ROUT = VIN/1 T2OUT T1OUT A FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION 11 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Applications The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where ±12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5kΩ resistor connected to V+. In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters. +5V + 1 16 2 3 HIN232 4 6 DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7) C1 + 1 µF C2 + 1 µF TD + 5 11 10 T1 T2 14 7 13 R1 8 TTL/CMOS RTS INPUTS AND 12 RD OUTPUTS R2 9 CTS 15 FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING 1 C1 + 1 µF TD TTL/CMOS INPUTS AND OUTPUTS RTS RD CTS 9 R2 R1 3 11 10 12 HIN232 T1 T2 4 5 14 7 13 8 15 16 - + C2 1 µF TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND + V- V+ 6 2 16 HIN232 1 4 5 T1 T2 14 7 13 R2 R1 8 2 µF + C4 6 2 - C3 - +5V RS-232 INPUTS AND OUTPUTS 2µF C1 + 1 µF DTR TTL/CMOS INPUTS AND OUTPUTS DSRS DCD R1 3 11 10 12 9 - + C2 1 µF DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7) 15 FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS 12 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Die Characteristics DIE DIMENSIONS 160 mils x 140 mils METALLIZATION Type: Al Thickness: 10kÅ ±1kÅ SUBSTRATE POTENTIAL V+ PASSIVATION Type: Nitride over Silox Nitride Thickness: 8kÅ Silox Thickness: 7kÅ TRANSISTOR COUNT 238 PROCESS CMOS Metal Gate Metallization Mask Layout HIN240 T2OUT T1OUT R2IN T3OUT T4OUT R3IN R3OUT T5IN SHUTDOWN R2OUT EN T2IN T5OUT T1IN R1OUT R4IN R1IN R4OUT T4IN GND T3IN R5OUT VCC R5IN C1+ V+ C1- C2+ C2- V- 13 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Dual-In-Line Plastic Packages (PDIP) N E1 INDEX AREA 12 3 N/2 E16.3 (JEDEC MS-001-BB ISSUE D) 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL -B- MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93 MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280 A E A2 L A C L -AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A1 A2 -C- B B1 C D D1 E eA eC C e C A BS eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). E1 e eA eB L N 0.100 BSC 0.300 BSC 0.115 16 0.430 0.150 2.54 BSC 7.62 BSC 2.93 16 10.92 3.81 14 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Dual-In-Line Plastic Packages (PDIP) N E1 INDEX AREA 12 3 N/2 -B-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E E24.3 (JEDEC MS-001-AF ISSUE D) 24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL A A1 -C- MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 31.24 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 32.51 8.25 7.11 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 0 12/93 MIN 0.015 0.115 0.014 0.045 0.008 1.230 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 1.280 0.325 0.280 A2 B B1 C D D1 E E1 e eA eB L N eA eC C e C A BS eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 0.100 BSC 0.300 BSC 0.115 24 0.430 0.150 - 2.54 BSC 7.62 BSC 10.92 3.81 24 2.93 15 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45° 0.25(0.010) M BM M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 10.00 0.25 0.40 16 8° 0° 8° MAX 2.65 0.30 0.51 0.32 10.50 7.60 10.65 0.75 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0926 0.0040 0.013 0.0091 0.3977 0.2914 0.394 0.010 0.016 16 0° MAX 0.1043 0.0118 0.0200 0.0125 0.4133 0.2992 0.419 0.029 0.050 A1 B C D E e H C α A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 16 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM M24.3 (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 2.35 0.10 0.33 0.23 15.20 7.40 MAX 2.65 0.30 0.51 0.32 15.60 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93 MIN 0.0926 0.0040 0.013 0.0091 0.5985 0.2914 MAX 0.1043 0.0118 0.020 0.0125 0.6141 0.2992 A1 B C D E α µ A1 0.10(0.004) C e H h L N 0.05 BSC 0.394 0.010 0.016 24 0o 8o 0.419 0.029 0.050 1.27 BSC 10.00 0.25 0.40 24 0o 10.65 0.75 1.27 e B 0.25(0.010) M C AM BS NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 17 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 2.35 0.10 0.33 0.23 17.70 7.40 MAX 2.65 0.30 0.51 0.32 18.10 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93 MIN 0.0926 0.0040 0.013 0.0091 0.6969 0.2914 MAX 0.1043 0.0118 0.0200 0.0125 0.7125 0.2992 B C D E α µ A1 0.10(0.004) C e H h L N 0.05 BSC 0.394 0.01 0.016 28 0o 8o 0.419 0.029 0.050 1.27 BSC 10.00 0.25 0.40 28 0o 10.65 0.75 1.27 e B 0.25(0.010) M C AM BS NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 18 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Shrink Small Outline Plastic Packages (SSOP) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 L GAUGE PLANE 0.25(0.010) M BM M28.209 (JEDEC MO-150-AH ISSUE B) 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D E A2 C 0.10(0.004) C AM BS MILLIMETERS MIN 0.05 1.65 0.22 0.09 9.90 5.00 7.40 0.55 28 8° 0° 8° MAX 2.00 1.85 0.38 0.25 10.50 5.60 8.20 0.95 NOTES 9 3 4 6 7 Rev. 2 6/05 MIN 0.002 0.065 0.009 0.004 0.390 0.197 0.292 0.022 28 0° MAX 0.078 0.072 0.014 0.009 0.413 0.220 0.322 0.037 α A1 e B 0.25(0.010) M e H L N 0.026 BSC 0.65 BSC NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 19 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Metric Plastic Quad Flatpack Packages (MQFP) D D1 -D- Q44.10x10 (JEDEC MS-022AB ISSUE B) 44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE INCHES SYMBOL A A1 A2 MIN 0.004 0.077 0.012 0.012 0.515 0.389 0.516 0.390 0.029 44 0.032 BSC MAX 0.096 0.010 0.083 0.018 0.016 0.524 0.399 0.523 0.398 0.040 MILLIMETERS MIN 0.10 1.95 0.30 0.30 13.08 9.88 13.10 9.90 0.73 44 0.80 BSC MAX 2.45 0.25 2.10 0.45 0.40 13.32 10.12 13.30 10.10 1.03 NOTES 6 3 4, 5 3 4, 5 7 Rev. 2 4/99 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . 4. Dimensions D1 and E1 to be determined at datum plane -H- . 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total. 7. “N” is the number of terminal positions. 0.13/0.23 0.005/0.009 -AE E1 -B- b b1 D D1 E e PIN 1 SEATING A PLANE 0.076 0.003 12o-16o 0.40 0.016 MIN 0o MIN 0o-7o A2 A1 0.20 M 0.008 C A-B S -CDS b b1 0.13/0.17 0.005/0.007 BASE METAL WITH PLATING E1 L N e -H- L 12o-16o All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 20