HIP1030AS

TM February 2000 NS ESIG EW D ENT R N CEM IL D FO NDE D REPLA -INTERS E 88 om OM M E N D E -8 RE C M .c ns 1 NOT RECOM plicatio intersil p@ Ap NO ral ntap Cent : ce Call or email HIP1030 1A High Side Driver with Overload Protection Features • Over Operating Temperature Range . . -40oC to 125oC - Max VSAT at 1A . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V - Current Switching Capability . . . . . . . . . . . . . . . . . 1A - Power Supply Range . . . . . . . . . . . . . . . . 4.5V to 25V • Over-Voltage Shutdown Protected • Over-Current Limiting • Thermal Limiting Protection • Negative Output Voltage Clamp • CMOS/TTL Logic Level Control Input • Load Dump . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60VPEAK • Reverse Battery Protection to -16V Description The HIP1030 is a High Side Driver Power Integrated Circuit designed to switch power supply voltage to an output load. It is the equivalent of a PNP pass transistor operated as a protected high side current switch in the saturated ON state with low forward voltage drop at the maximum rated current. The HIP1030 has low output leakage and low idle current in the OFF state. The Functional Block Diagram for the HIP1030 shows the protection control circuit functions of over-current, overvoltage and over-temperature. A small metal resistor senses overcurrent in the power supply path of the pass transistor and load. Overvoltage detection and shutdown of the output driver occurs when a comparator determines that the supply voltage has exceeded a comparator reference level. Over-temperature is sensed from a VBE differential sense element that is thermally close to the output drive transistor. In addition to the input detected overvoltage protection, negative peak voltage of a switched inductive load is clamped with an internal zener diode. An internal bandgap voltage source provides a stable voltage reference over the operating temperature range, providing bias and reference control for the protection circuits. The HIP1030 is particularly well suited for driving lamps, relays, and solenoids in automotive and industrial control applications where voltage and current overload protection at high temperatures is required. The HIP1030 is supplied in a 5 lead TS-001AA Power SIP package. Applications • Motor Driver/Controller • Driver for Solenoids, Relays and Lamps • MOSFET and IGBT Driver • Driver for Temperature Controller Ordering Information PART NUMBER HIP1030AS TEMP. RANGE (oC) -40 to 125 PACKAGE PKG. NO. 5 Ld TS-001AA SIP Z5.067C Pinout HIP1030 (SIP) TOP VIEW 5 VIN (CONTROL) 4 GND 3 TAB GND 2 VOUT (LOAD) 1 VCC (SUPPLY) Functional Block Diagram VCC 1 VBATT SUPPLY RS NEG. CLAMP ZENER VOUT 2 LOAD OVERVOLTAGE SHUTDOWN CURRENT LIMIT THERMAL LIMIT CONTROL CIRCUIT VIN 5 CONTROL 3 TAB 4 HIP1030 GND GND CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002. All Rights Reserved FN2788.8 1 TM FN 2 HIP1030 Absolute Maximum Ratings Maximum Supply Voltage VCC . . .See O.V. Shutdown Limit, VOVSD Input Voltage, VIN (Note 1). . . . . . . . . . . . . . . . . -1V to (VCC - 0.5V) Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . . . Internal Limiting Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . . ±60VPEAK Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V Thermal Information Thermal Resistance (Typical, Note 2) θJA ( oC/W) θJC (oC/W) Plastic SIP Package . . . . . . . . . . . . . . 50 4 Maximum Power Dissipation (Note 3) At TA = 125oC, Infinite Heat Sink . . . . . . . . . . . . . . . . . . . . 6.25W Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -40oC to 150oC Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The Input Control Voltage, V IN shall not be greater than (V CC - 0.5V) and shall not exceed +7V when VCC is greater than 7.5V. 2. θJA is measured with the component mounted on an evaluation PC board in free air. 3. The worst case thermal resistance, θJC for the SIP TS-001AA 5 lead package is 4oC/W. The calculation for dissipation and junction temperature rise due to dissipation is: PD = (VCC-V OUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX ) - (VOUT)(IOUT) TJ = TAMBIENT + (PD) (θJC) for an infinite Heat Sink. Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal resistance, θJC + θHS . For example: Where θJC = 4oC/W and given θHS = 6oC/W as the thermal resistance of an external Heat Sink, the junction-to-air thermal resistance, θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree from TAMB to the maximum rated junction temperature of 150oC. If TAMB = 100oC, the maximum P D is (150 - 100) x 0.1W/oC = 5W. Electrical Specifications PARAMETER Operating Voltage Range Over-Voltage Shutdown Over-Temperature Limiting Negative Pulse Output Clamp Voltage Short Circuit Current Limiting Input Control ON Input Control OFF Input Current High Input Current Low Supply Current, Full Load Input Control ON Supply Current, No Load Input Control OFF Input-Output Forward Voltage Drop (VCC - VOUT) Output Leakage Turn ON Time Turn OFF Time NOTES: TA = -40oC to 125oC, VIN = 2V, VCC = +12V, Unless Otherwise Specified SYMBOL VCC V OVSD TSD VCL ISC VIH VIL IIH IIL ICCMAX ICCMIN VSAT IOUT_LK tON tOFF VIN = 5.5V, VCC = 6V to 24V VIN = 0.8V, VCC = 6V to 24V VIN = 2V; IOUT = 1.0A; VIN = 0V; IOUT = 0A; IOUT = 1A; VCC = 4.5V to 25V VIN = 0.8V; VCC = 6V to 24V RL = 80Ω ; (Note 5) RL = 80Ω ; (Note 5) ICL = -100mA; VCC = 4.5V to 25V (Note 4) RL = 1KΩ ; VIN = 2V TEST CONDITIONS MIN 4.5 26 (VCC - 35) 1.1 2.0 6 6 TYP 33 150 (VCC - 30.5) 1.6 1.05 MAX 25 38 (VCC - 28) 2.5 0.8 40 30 1.1 UNITS V V oC V A V V µA µA A µA - 55 100 - 0.6 1 V µA µs µs - 4 5 25 50 20 65 4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse. See Figure 7. 5. Refer to Figures 3A and 3B for typical switching speeds with a 20Ω Load. 3 HIP1030 Typical Applications 0.47µF HIP1030 HIGH SIDE DRIVER VBATT POWER SUPPLY 1 VCC OVERVOLTAGE SHUTDOWN CURRENT LIMIT THERMAL LIMIT CONTROL CIRCUIT NEG. CLAMP ZENER TYPICAL LOAD LOADS: RELAYS SOLENOIDS LAMPS MOTORS RS VOUT 2 VCC VIN 5 CMOS/TTL INPUT LOGIC SWITCH TO VIN 3 HIP1030 TAB GND 4 GND VCLAMP VCL GND VOUT VSAT Typical Performance Curves 16 WITH EXT. 0oC/W H.S. (INFINITE HEAT SINK) WITH EXT. 6 oC/W H. S. 8 1.5 RL = 10Ω , VCC = VSAT + IL RL ; VSAT = (VCC - VOUT) INPUT: VIN = 5V DATA TAKEN USING 110CM x 110CM FLAT ALUM. HEAT SINK 1.0 IL = 1 .25A DISSIPATION WATTS (W) VOLTAGE DROP (V) 12 0.5 IL = 1.0 A 4 IL = 0.5A 0 -50 0 -50 0 50 100 150 0 50 100 150 AMBIENT TEMPERATURE (oC) AMBIENT TEMPERATURE (oC) FIGURE 1. DISSIPATION DERATING CURVES FIGURE 2. TYPICAL FORWARD VOLTAGE DROP, VSAT CHARACTERISTICS vs AMBIENT OPERATING TEMPERATURE 15 OUTPUT PULSE VOLTAGE (V) 15 OUTPUT PULSE VOLTAGE (V) VCC = 12V, LOAD = 20Ω IN PARALLEL WITH 2200pF; TA = 2 5oC INPUT: VIN = 0V to 2V STEP, 1ms PERIOD, 500µs PULSE tON VCC = 12V, LOAD = 20 Ω IN PARALLEL WITH 2200pF; T A = 2 5oC INPUT: VIN = 2V to 0V STEP, 1ms PERIOD, 500µs PULSE 10 10 5 5 tOFF 0 0 1 2 0 0 10 20 FIGURE 3A. OUTPUT TURN-ON TIME (µs) FIGURE 3B. OUTPUT TURN-OFF TIME (µs) 4 HIP1030 Typical Performance Curves (Continued) FIGURE 3. TYPICAL RISE TIME AND FALL TIME CHARACTERISTICS OF THE HIP1030 WITH A RESISTIVE AND CAPACITIVE LOAD. THE TURN-ON TIME OF APPROXIMATELY 1.1µs IS PRIMARILY DETERMINED BY THE VCC SUPPLY. THE OUTPUT FALL TIME IS LIMITED BY RC TIME CONSTANT OF THE LOAD. 15 OUTPUT PULSE VOLTAGE (V) VCC = 12V, LOAD = 16Ω; TA = 2 5oC INPUT: VIN = 0V to 2V STEP, 50% DUTY CYCLE PULSE OUTPUT PULSE VOLTAGE (V) 15 10 5 0 -5 -10 -15 0 VCC = 1 5V, LOAD = 70mH + 22.3Ω IN SERIES; TA = 25oC INPUT: VIN = 0V to 2V STEP, 50% DUTY CYCLE PULSE 10 5 NEGATIVE INDUCTIVE SWITCHING PULSE 0 0 0.4 0.8 1.2 1.6 2.0 SWITCHING TIME (ms) 1 2 3 4 INDUCTIVE PULSE SWITCHING TIME (ms) 5 FIGURE 4. TYPICAL SWITCHING CHARACTERISTIC OF THE HIP1030 WITH AN OUTPUT RESISTIVE LOAD FIGURE 5. TYPICAL OUTPUT INDUCTIVE LOAD SWITCHING PULSE. THE NEGATIVE CLAMP VOLTAGE (VCC -31V) FOR THE INDUCTIVE KICK PULSE IS REFERENCED TO THE VCC SUPPLY INPUT 6 OUTPUT PULSE VOLTAGE (V) INPUT: VIN = 0V to 2V STEP, 1ms PERIOD, 500µs PULSE tON 4 OUTPUT PULSE VOLTAGE (V) VCC = 4.5V, LOAD = 8Ω , TA = 25 oC 6 VCC = 4.5V, LOAD = 8Ω , TA = 2 5oC INPUT: VIN = 0V to 2V STEP, 1ms PERIOD, 500µs PULSE 4 2 2 tOFF 0 0 4 8 12 16 20 0 0 1 2 3 4 5 FIGURE 6A. TURN-ON TIME (µs) FIGURE 6B. TURN-OFF TIME (µs) FIGURE 6. TYPICAL LOW SUPPLY VOLTAGE SWITCHING CHARACTERISTICS OF THE HIP1030. THE TURN-ON AND TURN-OFF CHARACTERISTICS ARE SHOWN FOR VCC = 4.5V. 5 HIP1030 Typical Performance Curves 3 OUTPUT PULSE VOLTAGE (V) VCC = 24V, LOAD = 1 Ω ; TA = 25 oC INPUT: VIN = 2V, 1ms PERIOD, 100µs PULSE SUPPLY CURRENT (mA) 2 CURRENT LIMITING (Continued) VCC VARIED FROM 4V TO 36V, NO LOAD 25 INPUT: VIN = 2V (DC); TA = 25oC 20 15 10 5 0 OVER-VOLTAGE SHUTDOWN 1 0 0 40 80 120 160 200 OUTPUT PULSE TIME (µs) 0 5 10 15 20 25 30 35 40 45 50 SUPPLY VOLTAGE (V) FIGURE 7. TYPICAL OUTPUT CURRENT PULSE WHEN SWITCHING INTO A LOW IMPEDANCE (1Ω), OR SHORTED LOAD. FOR THE CONDITIONS SHOWN, OUTPUT CURRENT LIMITING IS ~1.7A FIGURE 8. TYPICAL IDLE CURRENT vs SUPPLY VOLTAGE WITH NO LOAD 6 HIP1030 Single-In-Line Plastic Packages (SIP) ØP E A A1 Q H1 Z5.067C (ALTERNATE VERSION) 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE INCHES SYMBOL A MIN 0.170 0.048 0.030 0.031 0.018 0.590 0.395 MAX 0.180 0.052 0.034 0.041 0.022 0.610 0.405 MILLIMETERS MIN 4.32 1.22 0.77 0.79 0.46 14.99 10.04 MAX 4.57 1.32 0.86 1.04 0.55 15.49 10.28 NOTES 3, 4 3, 4 3, 4 3, 4 5 5 6 2 Rev. 1 4/96 NOTES: 1. These dimensions are within allowable dimensions of Rev. A of JEDEC TS-001AA outline dated 8-89. 2. Solder finish uncontrolled in this area. 3. Lead dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder plating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 7. Controlling dimension: Inch. D A1 b b1 c L1 b1 c D E e e1 L 0.067 TYP 0.268 BSC 0.235 0.095 0.530 0.110 0.149 0.105 0.255 0.105 0.550 0.130 0.153 0.115 1.70 TYP 6.80 BSC 5.97 2.42 13.47 2.80 3.79 2.66 6.47 2.66 13.97 3.30 3.88 2.92 60o 12345 H1 e e1 J1 J1 L L1 ØP Q b All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 7