ISL12027IB27Z-T

ISL12027IB27Z-T

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC-8

  • 描述:

    Real Time Clock (RTC) IC Clock/Calendar I²C, 2-Wire Serial 8-SOIC (0.154", 3.90mm Width)

  • 数据手册
  • 价格&库存
ISL12027IB27Z-T 数据手册
OBSOLETE PRODUCT NO RECOMMENDED REPLACEMENT contact our Technical Support Center at 1-888-INTERSIL or www.intersil.com/tsc DATASHEET ISL12027, ISL12027A FN8232 Rev 9.00 September 23, 2015 Real Time Clock/Calendar with EEPROM The ISL12027 device is a low power real time clock with timing and crystal compensation, clock/calender, power-fail indicator, two periodic or polled alarms, intelligent battery backup switching, CPU Supervisor and integrated 512x8-bit EEPROM, in 16 Byte per page format. Features The oscillator uses an external, low-cost 32.768kHz crystal. The real time clock tracks time with separate registers for hours, minutes, and seconds. The device has calendar registers for date, month, year and day of the week. The calendar is accurate through 2099, with automatic leap year correction. • Two Non-Volatile Alarms - Settable on the Second, Minute, Hour, Day of the Week, Day, or Month - Repeat Mode (Periodic Interrupts) The ISL12027 and ISL12027A Power Control Settings are different. The ISL12027 uses the Legacy Mode Setting, and the ISL12027A uses the Standard Mode Setting. Applications that have VBAT > VDD will require only the ISL12027A. Please refer to“Power Control Operation” on page 15 for more details. Also, please refer to “I2C Communications During Battery Backup and LVR Operation” on page 24 for important details. Pinouts VDD X1 X2 8 SCL 2 7 SDA 3 6 GND 4 5 RESET 1 X2 1 2 • On-Chip Oscillator Compensation - Internal Feedback Resistor and Compensation Capacitors - 64 Position Digitally Controlled Trim Capacitor - 6 Digital Frequency Adjustment Settings to ±30ppm • 512x8-Bits of EEPROM - 16-Byte Page Write Mode (32 total pages) - 8 Modes of BlockLock™ Protection - Single Byte Write Capability • I2C-bus™ Interface - 400kHz Data Transfer Rate • 800nA Battery Supply Current • Package Options - 8 Ld SOIC and 8 Ld TSSOP Packages ISL12027, ISL12027A (8 LD SOIC) TOP VIEW X1 • Automatic Backup to Battery or SuperCap • High Reliability - Data Retention: 50 years - Endurance: >2,000,000 Cycles Per Byte ISL12027, ISL12027A (8 LD TSSOP) TOP VIEW VBAT • Real Time Clock/Calendar - Tracks Time in Hours, Minutes and Seconds - Day of the Week, Day, Month and Year • Pb-Free (RoHS Compliant) Applications 8 VDD • Utility Meters 7 VBAT • HVAC Equipment • Audio/Video Components • Modems RESET 3 6 SCL GND 4 5 SDA • Network Routers, Hubs, Switches, Bridges • Cellular Infrastructure Equipment • Fixed Broadband Wireless Equipment • Pagers/PDA • POS Equipment • Test Meters/Fixtures • Office Automation (Copiers, Fax) • Home Appliances • Computer Products • Other Industrial/Medical/Automotive FN8232 Rev 9.00 September 23, 2015 Page 1 of 29 ISL12027, ISL12027A Pin Descriptions PIN NUMBER SOIC TSSOP SYMBOL BRIEF DESCRIPTION 1 3 X1 The X1 pin is the input of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz quartz crystal. X1 can also be driven directly from a 32.768kHz source. 2 4 X2 The X2 pin is the output of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz quartz crystal. 3 5 RESET RESET. This is a reset signal output. This signal notifies a host processor that the “watchdog” time period has expired or that the voltage has dropped below a fixed VTRIP threshold. It is an open drain active LOW output. Recommended value for the pull-up resistor is 5k. If unused, connect to ground. 4 6 GND Ground. 5 7 SDA Serial Data (SDA) is a bidirectional pin used to transfer serial data into and out of the device. It has an open drain output and may be wire OR’ed with other open drain or open collector outputs. 6 8 SCL The Serial Clock (SCL) input is used to clock all serial data into and out of the device. The input buffer on this pin is always active (not gated). 7 1 VBAT This input provides a backup supply voltage to the device. VBAT supplies power to the device in the event that the VDD supply fails. This pin should be tied to ground if not used. 8 2 VDD Power Supply. Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING VBAT TRIP POINT (V) BSW BIT DEFAULT SETTING VRESET VOLTAGE (V) TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL12027IB27Z 12027 IB27Z VDD < VBAT BSW = 1 2.63 -40 to +85 8 Ld SOIC M8.15 ISL12027IB27AZ 12027 IB27AZ VDD < VBAT BSW = 1 2.92 -40 to +85 8 Ld SOIC M8.15 ISL12027IB30AZ 12027 IB30AZ VDD < VBAT BSW = 1 3.09 -40 to +85 8 Ld SOIC M8.15 ISL12027IBZ 12027 IBZ VDD < VBAT BSW = 1 4.38 -40 to +85 8 Ld SOIC M8.15 ISL12027IBAZ 12027 IBAZ VDD < VBAT BSW = 1 4.64 -40 to +85 8 Ld SOIC M8.15 ISL12027IV27Z 2027 I27Z VDD < VBAT BSW = 1 2.63 -40 to +85 8 Ld TSSOP M8.173 ISL12027IV27AZ 2027 27AZ VDD < VBAT BSW = 1 2.92 -40 to +85 8 Ld TSSOP M8.173 ISL12027IV30AZ 2027 30AZ VDD < VBAT BSW = 1 3.09 -40 to +85 8 Ld TSSOP M8.173 2027 IVZ ISL12027IVZ (No longer available or supported) VDD < VBAT BSW = 1 4.38 -40 to +85 8 Ld TSSOP M8.173 ISL12027IVAZ (No 2027 IVAZ longer available or supported) VDD < VBAT BSW = 1 4.64 -40 to +85 8 Ld TSSOP M8.173 12027A IB27Z ISL12027AIB27Z (No longer available or supported) VDD < VBAT BSW = 0 2.63 -40 to +85 8 Ld SOIC M8.15 2027A I27Z ISL12027AIV27Z (No longer available or supported) VDD < VBAT BSW =0 2.63 -40 to +85 8 Ld TSSOP M8.173 NOTES: 1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL12027, ISL12027A. For more information on MSL please see techbrief TB363. FN8232 Rev 9.00 September 23, 2015 Page 2 of 29 ISL12027, ISL12027A Block Diagram OSC COMPENSATION X1 OSCILLATOR X2 SCL SDA CONTROL SERIAL INTERFACE DECODE LOGIC DECODER CONTROL/ REGISTERS (EEPROM) TIMER FREQUENCY 1Hz CALENDAR DIVIDER LOGIC STATUS REGISTERS (SRAM) 8 RESET FN8232 Rev 9.00 September 23, 2015 WATCHDOG TIMER LOW VOLTAGE RESET TIME KEEPING REGISTERS (SRAM) BATTERY SWITCH CIRCUITRY VDD VBAT COMPARE ALARM MASK 32.768kHZ ALARM REGS (EEPROM) 4k EEPROM ARRAY Page 3 of 29 ISL12027, ISL12027A Absolute Maximum Ratings Thermal Information Voltage on VDD, VBAT, SCL, SDA, and RESET pins (respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V Voltage on X1 and X2 pins (respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.5V Latchup (Note 4) . . . . . . . . . . . . . . . . . . . Class II, Level B @ +85°C ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175V Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 8 Ld SOIC Package (Notes 5, 6) . . . . . 115 50 8 Ld TSSOP Package (Notes 5, 6) . . . 140 40 Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: Using a max positive pulse of 8.35V on all pins except X1 and X2, Using a max positive pulse of 2.75V on X1 and X2, and using a max negative pulse of -1V for all pins. 5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For JC, the “case temp” location is taken at the package top center. DC Electrical Specifications SYMBOL Unless otherwise noted, VDD = +2.7V to +5.5V, TA = -40°C to +85°C, Typical values are at TA = +25°C and VDD = 3.3V. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER CONDITIONS MIN (Note 16) TYP MAX (Note 16) UNIT VDD Main Power Supply 2.7 5.5 V VBAT Backup Power Supply 1.8 5.5 V Electrical Specifications IDD2 IDD3 IBAT Boldface limits apply over the operating temperature range, -40°C to +85°C. MAX (Note 16) UNIT NOTES VDD = 2.7V 500 µA 7, 8, 9 VDD = 5.5V 800 µA VDD = 2.7V 2.5 mA VDD = 5.5V 3.5 mA Supply Current for Main Timekeeping (Low Power Mode) VDD = VSDA = VSCL = 2.7V 10 µA VDD = VSDA = VSCL = 5.5V 20 µA Battery Supply Current VBAT = 1.8V, VDD = VSDA = VSCL= VRESET = 0V 800 1000 nA VBAT = 3.0V, VDD = VSDA = VSCL= VRESET = 0V 850 1200 nA 100 nA 2.6 V 11 SYMBOL IDD1 NOTES PARAMETER Supply Current with I2C Active Supply Current for Non-Volatile Programming IBATLKG Battery Input Leakage VTRIP VBAT Mode Threshold CONDITIONS VDD = 5.5V, VBAT = 1.8V MIN (Note 16) TYP -100 1.8 2.2 7, 8, 9 9 7, 10, 11 VTRIPHYS VTRIP Hysteresis 30 mV 11, 14 VBATHYS VBAT Hysteresis 50 mV 11, 14 VDD SR- VDD Negative Slew rate 10 V/ms 12 VDD = 5.5V IOL = 3mA 0.4 V VDD = 2.7V IOL = 1mA 0.4 V 400 nA RESET OUTPUT VOL ILO Output Low Voltage Output Leakage Current FN8232 Rev 9.00 September 23, 2015 VDD = 5.5V VOUT = 5.5V 100 Page 4 of 29 ISL12027, ISL12027A Watchdog Timer/Low Voltage Reset Parameters SYMBOL tRPD PARAMETER CONDITIONS MIN (Note 16) TYP (Note 5) VDD Detect to RESET LOW MA (Note 16) 500 UNITS NOTES ns 13 tPURST Power-up Reset Time-Out Delay 100 VRVALID Minimum VDD for Valid RESET Output 1.0 VRESET ISL12027-4.5A Reset Voltage Level 4.59 4.64 4.69 V ISL12027 Reset Voltage Level 4.33 4.38 4.43 V ISL12027-3 Reset Voltage Level 3.04 3.09 3.14 V ISL12027-2.7A Reset Voltage Level 2.87 2.92 2.97 V ISL12027-2.7 Reset Voltage Level 2.58 2.63 2.68 V 1.70 1.75 1.801 s 725 750 775 ms 225 250 275 ms 225 250 275 ms tWDO Watchdog Timer Period tRST Watchdog Timer Reset Time-Out Delay tRSP I2C Interface Minimum Restart Time 32.768kHz crystal between X1 and X2 32.768kHz crystal between X1 and X2 250 400 ms V 1.2 µs >2,000,000 Cycles 50 Years EEPROM SPECIFICATIONS EEPROM Endurance EEPROM Retention Temperature 75°C Serial Interface (I2C) Specifications SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIL SDA, and SCL Input Buffer LOW Voltage SBIB = 1 (Under VDD mode) -0.3 0.3xVDD V VIH SDA, and SCL Input Buffer HIGH Voltage SBIB = 1 (Under VDD mode) 0.7xVDD VDD + 0.3 V SBIB = 1 (Under VDD mode) 0.05xVDD Hysteresis SDA and SCL Input Buffer Hysteresis VOL SDA Output Buffer LOW Voltage IOL = 4mA ILI Input Leakage Current on SCL VIN = 5.5V ILO I/O Leakage Current on SDA VIN = 5.5V NOTES V 0 0.4 V 0.1 10 µA 0.1 10 µA 400 kHz TIMING CHARACTERISTICS fSCL SCL Frequency tIN Pulse Width Suppression Time at SDA and SCL Inputs Any pulse narrower than the max spec is suppressed. 50 ns tAA SCL Falling Edge to SDA Output Data Valid SCL falling edge crossing 30% of VDD, until SDA exits the 30% to 70% of VDD window. 900 ns tBUF Time the Bus Must be Free Before the Start of a New Transmission SDA crossing 70% of VDD during a STOP condition, to SDA crossing 70% of VDD during the following START condition. 1300 ns tLOW Clock LOW Time Measured at the 30% of VDD crossing. 1300 ns tHIGH Clock HIGH Time Measured at the 70% of VDD crossing. 600 ns FN8232 Rev 9.00 September 23, 2015 Page 5 of 29 ISL12027, ISL12027A Serial Interface (I2C) Specifications (Continued) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES tSU:STA START Condition Set-up Time SCL rising edge to SDA falling edge. Both crossing 70% of VDD. 600 ns tHD:STA START Condition Hold Time From SDA falling edge crossing 30% of VDD to SCL falling edge crossing 70% of VDD. 600 ns tSU:DAT Input Data Set-up Time From SDA exiting the 30% to 70% of VDD window, to SCL rising edge crossing 30% of VDD. 100 ns tHD:DAT Input Data Hold Time From SCL falling edge crossing 70% of VDD to SDA entering the 30% to 70% of VDD window. 0 ns tSU:STO STOP Condition Set-up Time From SCL rising edge crossing 70% of VDD, to SDA rising edge crossing 30% of VDD. 600 ns tHD:STO STOP Condition Hold Time for Read, or Volatile Only Write From SDA rising edge to SCL falling edge. Both crossing 70% of VDD. 600 ns Output Data Hold Time From SCL falling edge crossing 30% of VDD, until SDA enters the 30% to 70% of VDD window. 0 ns tR SDA and SCL Rise Time From 30% to 70% of VDD 20 + 0.1xCb 250 ns tF SDA and SCL Fall Time From 70% to 30% of VDD 20 + 0.1xCb 250 ns 10 pF 20 ms 14 tDH Cpin SDA, and SCL Pin Capacitance tWC Non-Volatile Write Cycle Time 12 tR SDA and SCL Rise Time From 30% to 70% of VDD 20 + 0.1xCb 250 ns 15 tF SDA and SCL Fall Time From 70% to 30% of VDD 20 + 0.1xCb 250 ns 15 Cb Capacitive Loading of SDA or SCL Total on-chip and off-chip 10 400 pF 15 SDA and SCL Bus Pull-up Resistor Maximum is determined by tR and tF. Off-chip For Cb = 400pF, max is about 2k~2.5k. For Cb = 40pF, max is about 15k~20k 1 k 15 RPU NOTES: 7. RESET Inactive (no reset). 8. VIL = VDD x 0.1, VIH = VDD x 0.9, fSCL = 400kHz. 9. VRESET = 2.63V (VDD must be greater than VRESET), VBAT = 0V. 10. Bit BSW = 0 (Standard Mode), ATR = 00h, VBAT ≥1.8V. 11. Specified at +25°C. 12. In order to ensure proper timekeeping, the VDD SR- specification must be followed. 13. Parameter is not 100% tested. 14. tWC is the minimum cycle time to be allowed for any non-volatile Write by the user, it is the time from valid STOP condition at the end of Write sequence of a serial interface Write operation, to the end of the self-timed internal non-volatile write cycle. 15. These are I2C specific parameters and are not directly tested, however they are used during device testing to validate device specification. 16. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. FN8232 Rev 9.00 September 23, 2015 Page 6 of 29 ISL12027, ISL12027A Timing Diagrams tF SCL tHIGH tLOW tHD:STO tR tSU:DAT tSU:STA tHD:DAT tHD:STA SDA (INPUT TIMING) tSU:STO tAA tDH tBUF SDA (OUTPUT TIMING) FIGURE 1. BUS TIMING SCL 8TH BIT OF LAST BYTE SDA ACK tWC STOP CONDITION START CONDITION FIGURE 2. WRITE CYCLE TIMING tRSP tRSP>tWDO tRSP>tWDO tRSP20ppm frequency deviation translates into an accuracy of >1 minute per month. These parameters are available from the crystal manufacturer. Intersil’s RTC family provides on-chip crystal compensation networks to adjust load-capacitance to tune oscillator frequency from -34ppm to +80ppm when using a 12.5pF load crystal. For more detailed information see “Application Section” on page 22. FN8232 Rev 9.00 September 23, 2015 CCR Access The CCR is divided into 5 sections. These are: 1. Alarm 0 (8 bytes; non-volatile) 2. Alarm 1 (8 bytes; non-volatile) 3. Control (5 bytes; non-volatile) 4. Real Time Clock (8 bytes; volatile) 5. Status (1 byte; volatile) Each register is read and written through buffers. The non-volatile portion (or the counter portion of the RTC) is updated only if RWEL is set and only after a valid write operation and stop bit. A sequential read or page write operation provides access to the contents of only one section of the CCR per operation. Access to another section requires a new operation. A read or write can begin at any address in the CCR. It is not necessary to set the RWEL bit prior to writing the status register. Section 5 (status register) supports a single byte read or write only. Continued reads or writes from this section terminates the operation. The state of the CCR can be read by performing a random read at any address in the CCR at any time. This returns the contents of that register location. Additional registers are read by performing a sequential read. The read instruction latches all Clock registers into a buffer, so an update of the clock does not change the time being read. A sequential read of the CCR will not result in the output of data from the memory array. At the end of a read, the master supplies a stop condition to end the operation and free the bus. After a read of the CCR, the address remains at the previous address +1 so the user can execute a current address read of the CCR and continue reading the next Register. Real Time Clock Registers (Volatile) SC, MN, HR, DT, MO, YR: Clock/Calendar Registers These registers depict BCD representations of the time. As such, SC (Seconds) and MN (Minutes) range from 00 to 59, HR (Hour) is 1 to 12 with an AM or PM indicator (H21 bit) or 0 Page 10 of 29 ISL12027, ISL12027A to 23 (with MIL = 1), DT (Date) is 1 to 31, MO (Month) is 1 to 12, YR (Year) is 0 to 99. DW: Day of the Week Register This register provides a Day of the Week status and uses three bits DY2 to DY0 to represent the seven days of the week. The counter advances in the cycle 0-1-2-3-4-5-6-0-1-2-… The assignment of a numerical value to a specific day of the week is arbitrary and may be decided by the system software designer. The default value is defined as ‘0’. Y2K: Year 2000 Register Can have value 19 or 20. As of the date of the introduction of this device, there would be no real use for the value 19 in a true real time clock, however. 24 Hour Time If the MIL bit of the HR register is 1, the RTC uses a 24-hour format. If the MIL bit is 0, the RTC uses a 12-hour format and H21 bit functions as an AM/PM indicator with a ‘1’, representing PM. The clock defaults to standard time with H21 = 0. Leap Years Leap years add the day February 29 and are defined as those years that are divisible by 4. Status Register (SR) (Volatile) The Status Register is located in the CCR memory map at address 003Fh. This is a volatile register only and is used to control the WEL and RWEL write enable latches, read power status and two alarm bits. This register is separate from both the array and the Clock/Control Registers (CCR). TABLE 1. STATUS REGISTER (SR) ADDR 7 6 003Fh BAT AL1 Default 0 0 5 4 AL0 OSCF 0 0 3 2 1 0 0 RWEL WEL RTCF 0 0 0 1 BAT: Battery Supply This bit set to “1” indicates that the device is operating from VBAT, not VDD. It is a read-only bit and is set/reset by hardware (ISL12027 internally). Once the device begins operating from VDD, the device sets this bit to “0”. OSCF: Oscillator Fail Indicator This bit is set to “1” if the oscillator is not operating, or is operating but has clock jitter which does not affect the accuracy of RTC counting. The bit is set to “0” if the oscillator is functioning and does not have clock jitter. This bit is read only, and is set/reset by hardware. RWEL: Register Write Enable Latch This bit is a volatile latch that powers up in the LOW (disabled) state. The RWEL bit must be set to “1” prior to any writes to the Clock/Control Registers. Writes to RWEL bit do not cause a non-volatile write cycle, so the device is ready for the next operation immediately after the stop condition. A write to the CCR requires both the RWEL and WEL bits to be set in a specific sequence. WEL: Write Enable Latch The WEL bit controls the access to the CCR during a write operation. This bit is a volatile latch that powers up in the LOW (disabled) state. While the WEL bit is LOW, writes to the CCR address will be ignored, although acknowledgment is still issued. The WEL bit is set by writing a “1” to the WEL bit and zeroes to the other bits of the Status Register. Once set, WEL remains set until either reset to 0 (by writing a “0” to the WEL bit and zeroes to the other bits of the Status Register) or until the part powers up again. Writes to WEL bit do not cause a non-volatile write cycle, so the device is ready for the next operation immediately after the stop condition. RTCF: Real Time Clock Fail Bit This bit is set to a “1” after a total power failure. This is a read only bit that is set by hardware (ISL12027 internally) when the device powers up after having lost all power to the device (both VDD and VBAT go to 0V). The bit is set regardless of whether VDD or VBAT is applied first. The loss of only one of the supplies does not set the RTCF bit to “1”. On power up after a total power failure, all registers are set to their default states and the clock will not increment until at least one byte is written to the clock register. The first valid write to the RTC section after a complete power failure resets the RTCF bit to “0” (writing one byte is sufficient). Unused Bits: Bit 3 in the SR is not used, but must be zero. The Data Byte output during a SR read will contain a zero in this bit location. AL1, AL0: Alarm Bits These bits announce if either alarm 0 or alarm 1 match the real time clock. If there is a match, the respective bit is set to ‘1’. The falling edge of the last data bit in a SR Read operation resets the flags. Note: Only the AL bits that are set when an SR read starts will be reset. An alarm bit that is set by an alarm occurring during an SR read operation will remain set after the read operation is complete. FN8232 Rev 9.00 September 23, 2015 Page 11 of 29 ISL12027, ISL12027A REG NAME 7 6 Status SR BAT AL1 AL0 RTC (SRAM) Y2K 0 0 Y2K21 ADDR. TYPE 003F 0037 5 4 3 2 1 0 OSCF 0 RWEL WEL RTCF Y2K20 Y2K13 0 0 Y2K10 RANG E 19/20 ISL12027A DEFAULT BIT ISL12027 DEFAULT TABLE 2. CLOCK/CONTROL MEMORY MAP 01h 01h 20h 20h DW 0 0 0 0 0 DY2 DY1 DY0 0-6 00h 00h 0035 YR Y23 Y22 Y21 Y20 Y13 Y12 Y11 Y10 0-99 00h 00h 0034 MO 0 0 0 G20 G13 G12 G11 G10 1-12 00h 00h 0033 DT 0 0 D21 D20 D13 D12 D11 D10 1-31 01h 01h 0032 HR MIL 0 H21 H20 H13 H12 H11 H10 0-23 00h 00h 0031 MN 0 M22 M21 M20 M13 M12 M11 M10 0-59 00h 00h 0-59 0036 0030 0014 0013 0012 Control (EEPROM ) SC 0 S22 S21 S20 S13 S12 S11 S10 PWR SBIB BSW 0 0 0 VTS2 VTS1 VTS0 00h 00h 4Xh 0Xh DTR 0 0 0 0 0 DTR2 DTR1 DTR0 00h 00h ATR 0 0 ATR5 ATR4 ATR3 ATR2 ATR1 ATR0 00h 00h 0011 INT IM AL1E AL0E 0 0 0 0 0 00h 00h 0010 BL BP2 BP1 BP0 WD1 WD0 0 0 0 18h 18h Y2K1 0 0 0 0 A1Y2K10 19/20 20h 20h DWA1 EDW1 0 DY2 DY1 DY0 0-6 00h 00h 000F 000E 000D Alarm1 (EEPROM ) 000C YRA1 MOA1 A1Y2K21 A1Y2K20 A1Y2K13 0 0 0 Unused - Default = RTC Year value (No EEPROM) - Future expansion EMO1 0 0 A1G20 A1G13 A1G12 A1G11 A1G10 1-12 00h 00h 000B DTA1 EDT1 0 A1D21 A1D20 A1D13 A1D12 A1D11 A1D10 1-31 00h 00h 000A HRA1 EHR1 0 A1H21 A1H20 A1H13 A1H12 A1H11 A1H10 0-23 00h 00h 0009 MNA1 EMN1 A1M22 A1M21 A1M20 A1M13 A1M12 A1M11 A1M10 0-59 00h 00h 0008 SCA1 ESC1 A1S22 A1S21 A1S20 A1S13 A1S12 A1S11 A1S10 0-59 00h 00h Y2K0 0 0 0 0 A0Y2K10 19/20 20h 20h DWA0 EDW0 0 DY2 DY1 DY0 0-6 00h 00h 0007 0006 0005 0004 Alarm0 (EEPROM ) YRA0 MOA0 A0Y2K21 A0Y2K20 A0Y2K13 0 0 0 Unused - Default = RTC Year value (No EEPROM) - Future expansion EMO0 0 0 A0G20 A0G13 A0G12 A0G11 A0G10 1-12 00h 00h 0003 DTA0 EDT0 0 A0D21 A0D20 A0D13 A0D12 A0D11 A0D10 1-31 00h 00h 0002 HRA0 EHR0 0 A0H21 A0H20 A0H13 A0H12 A0H11 A0H10 0-23 00h 00h 0001 MNA0 EMN0 A0M22 A0M21 A0M20 A0M13 A0M12 A0M11 A0M10 0-59 00h 00h 0000 SCA0 ESC0 A0S22 A0S21 A0S20 A0S13 A0S12 A0S11 A0S10 0-59 00h 00h NOTE: (Shaded cells indicate that NO other value is to be written to that bit. X indicates the bits are set according to the product variation, see device “Ordering Information” on page 2). FN8232 Rev 9.00 September 23, 2015 Page 12 of 29 ISL12027, ISL12027A Alarm Registers (Non-Volatile) Alarm0 and Alarm1 The alarm register bytes are set up identical to the RTC register bytes, except that the MSB of each byte functions as an enable bit (enable = “1”). These enable bits specify which alarm registers (seconds, minutes, etc.) are used to make the comparison. Note that there is no alarm byte for year. Six analog trimming bits, ATR0 to ATR5, are provided in order to adjust the on-chip load capacitance value for frequency compensation of the RTC. Each bit has a different weight for capacitance adjustment. For example, using a Citizen CFS206 crystal with different ATR bit combinations provides an estimated ppm adjustment range from -34ppm to +80ppm to the nominal frequency compensation. The alarm function works as a comparison between the alarm registers and the RTC registers. As the RTC advances, the alarm will be triggered once a match occurs between the alarm registers and the RTC registers. Any one alarm register, multiple registers, or all registers can be enabled for a match. See “Device Operation” on page 14 and “Application Section” on page 22 for more information. X1 CX1 CRYSTAL OSCILLATOR X2 CX2 Control Registers (Non-Volatile) The Control Bits and Registers described in the following section are non-volatile. BL Register BP2, BP1, BP0 - Block Protect Bits The Block Protect Bits, BP2, BP1 and BP0, determine which blocks of the array are write protected. A write to a protected block of memory is ignored. The block protect bits will prevent write operations to one of eight segments of the array. The partitions are described in Table 3. FIGURE 12. DIAGRAM OF ATR The effective on-chip series load capacitance, CLOAD, ranges from 4.5pF to 20.25pF with a mid-scale value of 12.5pF (default). CLOAD is changed via two digitally controlled capacitors, CX1 and CX2, connected from the X1 and X2 pins to ground (see Figure 12). The value of CX1 and CX2 is given Equation 1: C X =  16  b5 + 8  b4 + 4  b3 + 2  b2 + 1  b1 + 0.5  b0 + 9 pF (EQ. 1) The effective series load capacitance is the combination of CX1 and CX2: BP2 BP1 BP0 TABLE 3. PROTECTED ADDRESSES ISL12027 0 0 0 None (Default) None 0 0 1 180h – 1FFh Upper 1/4 0 1 0 100h – 1FFh Upper 1/2 0 1 1 000h – 1FFh Full Array 1 0 0 000h – 03Fh First 4 Pages 1 0 1 000h – 07Fh First 8 Pages 1 1 0 000h – 0FFh First 16 Pages 1 1 1 000h – 1FFh Full Array ARRAY LOCK Oscillator Compensation Registers There are two trimming options. • ATR. Analog Trimming Register 1 1 1  ---------- + ----------- C C  C LOAD = ----------------------------------X1 (EQ. 2) X2 16  b5 + 8  b4 + 4  b3 + 2  b2 + 1  b1 + 0.5  b0 + 9 C LOAD =  ----------------------------------------------------------------------------------------------------------------------------- pF  2  For example, CLOAD(ATR = 00000) = 12.5pF, CLOAD(ATR = 100000) = 4.5pF, and CLOAD(ATR = 011111) = 20.25pF. The entire range for the series combination of load capacitance goes from 4.5pF to 20.25pF in 0.25pF steps. Note that these are typical values. DTR Register - DTR2, DTR1, DTR0: Digital Trimming Register The digital trimming Bits DTR2, DTR1 and DTR0 adjust the number of counts per second and average the ppm error to achieve better accuracy. • DTR. Digital Trimming Register DTR2 is a sign bit. DTR2 = 0 means frequency compensation is >0. DTR2 = 1 means frequency compensation is
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