ISL1209

® ISL1209 Real Time Clock/Calendar with Event Detection Data Sheet October 17, 2006 FN6109.4 Low Power RTC with Battery Backed SRAM and Event Detection The ISL1209 device is a low power real time clock with event detect function, timing and crystal compensation, clock/calendar, power fail indicator, periodic or polled alarm, intelligent battery backup switching and battery-backed user SRAM. NOTE: The oscillator uses an external, low-cost 32.768kHz crystal. The real time clock tracks time with separate registers for hours, minutes, and seconds. The device has calendar registers for date, month, year and day of the week. The calendar is accurate through 2099, with automatic leap year correction. Features • Real Time Clock/Calendar - Tracks Time in Hours, Minutes, and Seconds - Day of the Week, Day, Month, and Year • Security and Event Functions - Tamper detection with Time Stamp - Event Detection During Battery Packed or Normal Modes - Selectable Event Input Sampling Rates Allows Low Power Operation - Selectable Glitch Filter on Event Input Monitor • 15 Selectable Frequency Outputs Ordering Information PART NUMBER* ISL1209IU10 VDD RANGE PART (V) MARKING AGT TEMP RANGE (°C) PACKAGE PKG. DWG. # 2.7 to 5.5 -40 to +85 10 Ld MSOP M10.118 2.7 to 5.5 -40 to +85 10 Ld MSOP M10.118 (Pb-free) • Single Alarm - Settable to the Second, Minute, Hour, Day of the Week, Day, or Month - Single Event or Pulse Interrupt Mode • Automatic Backup to Battery or Super Cap • Power Failure Detection • On-Chip Oscillator Compensation • 2 Bytes Battery-Backed User SRAM • I2C Interface - 400kHz Data Transfer Rate • 400nA Battery Supply Current ISL1209IU10Z ANV (Note) *Add “-TK” suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pinout ISL1209 (10 LD MSOP) TOP VIEW • Small Package - 10 Ld MSOP • Pb-Free Plus Anneal Available (RoHS Compliant) Applications X1 X2 VBAT GND 1 2 10 9 8 VDD • Utility Meters IRQ/FOUT SCL SDA EVDET • Set Top Box/Modem • POS Equipment • Network Routers, Hubs, Switches, Bridges 3 4 5 7 6 • Cellular Infrastructure Equipment • Fixed Broadband Wireless Equipment • Test Meters/Fixtures • Vending Machine Management • Security and Anti Tampering Applications - Panel/Enclosure Status - Warranty Reporting - Time Stamping Applications - Patrol/Security Check (Fire or Light Equipment) - Automotive Applications EVIN 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL1209 Block Diagram SDA SCL SDA BUFFER SCL BUFFER I2C INTERFACE Seconds CONTROL LOGIC Minutes Hours Day of Week X1 X2 VDD CRYSTAL OSCILLATOR RTC DIVIDER Date Month POR VTRIP SWITCH VBAT INTERNAL SUPPLY FREQUENCY OUT Year ALARM CONTROL REGISTERS USER SRAM IRQ/ FOUT EVIN EVDET GND Pin Descriptions PIN NUMBER 1 2 3 4 5 6 7 8 9 10 SYMBOL X1 X2 VBAT GND EVIN EVDET SDA SCL IRQ/FOUT VDD DESCRIPTION X1. The X1 pin is the input of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz quartz crystal. X1 can also be driven directly from a 32.768kHz source. X2. The X2 pin is the output of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz quartz crystal. X2 should be left open when X1 is driven from external source. VBAT. This input provides a backup supply voltage to the device. VBAT supplies power to the device in the event that the VDD supply fails. This pin should be tied to ground if not used. Ground. Event Input (EVIN). The EVIN is an input pin that is used to detect an externally monitored event. When a high signal is present at the EVIN pin an “event” is detected. Event Detect Output, active when EVIN is triggered. Open drain output. Serial Data (SDA). SDA is a bidirectional pin used to transfer serial data into and out of the device. It has an open drain output and may be wire OR’ed with other open drain or open collector outputs. Serial Clock (SCL). The SCL input is used to clock all serial data into and out of the device. Interrupt Output IRQ, /Frequency Output FOUT. Multi-functional pin that can be used as interrupt or frequency output pin. The function is set via the configuration register. VDD. Power supply. 2 FN6109.4 October 17, 2006 ISL1209 Absolute Maximum Ratings Voltage on VDD, VBAT, SCL, SDA, and IRQ pins (respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V Voltage on X1 and X2 pins (respect to ground) . . . . . . . . . . . .-0.5V to VDD + 0.5 (VDD Mode) -0.5V to VBAT + 0.5 (VBAT Mode) Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . >±2kV CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. DC Operating Characteristics – RTC Test Conditions: VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated. SYMBOL VDD VBAT IDD1 PARAMETER Main Power Supply Battery Supply Voltage Supply Current VDD = 5V VDD = 3V IDD2 IDD3 IBAT ILI ILO VTRIP VTRIPHYS VBATHYS EVIN VIL VIH Hysteresis IEVPU EVIN Pullup Current VSUP = 3V -0.3 0.7 x VDD 0.05 x VDD 1.5 0.3 x VDD VDD + 0.3 V V V µA 5 Supply Current With I2C Active Supply Current (Low Power Mode) Battery Supply Current Input Leakage Current on SCL I/O Leakage Current on SDA VBAT Mode Threshold VTRIP Hysteresis VBAT Hysteresis 1.6 10 15 VDD = 5V VDD = 5V, LPMODE = 1 VBAT = 3V CONDITIONS MIN 2.7 1.8 2 1.2 40 1.4 400 100 100 2.2 30 50 2.6 60 100 TYP (Note 4) MAX 5.5 5.5 6 4 120 5 950 UNITS V V µA µA µA µA nA nA nA V mV mV 1, 2 1 1 1, 2 NOTES IRQ/FOUT and EVDET VOL Output Low Voltage VDD = 5V, IOL = 3mA VDD = 2.7V, IOL = 1mA 0.4 0.4 V V Power-Down Timing Test Conditions: VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated. SYMBOL VDD SRPARAMETER VDD Negative Slew rate CONDITIONS MIN TYP (Note 4) MAX 10 UNITS V/ms NOTES 3 3 FN6109.4 October 17, 2006 ISL1209 I2C Interface Specifications SYMBOL VIL VIH Hysteresis VOL Cpin fSCL tIN tAA tBUF Test Conditions:VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified. TEST CONDITIONS MIN -0.3 0.7 x VDD 0.05 x VDD VDD = 5V, IOL = 3mA TA = +25°C, f = 1MHz, VDD = 5V, VIN = 0V, VOUT = 0V 0.4 10 400 Any pulse narrower than the max spec is suppressed. SCL falling edge crossing 30% of VDD, until SDA exits the 30% to 70% of VDD window. SDA crossing 70% of VDD during a STOP condition, to SDA crossing 70% of VDD during the following START condition. Measured at the 30% of VDD crossing. Measured at the 70% of VDD crossing. SCL rising edge to SDA falling edge. Both crossing 70% of VDD. From SDA falling edge crossing 30% of VDD to SCL falling edge crossing 70% of VDD. From SDA exiting the 30% to 70% of VDD window, to SCL rising edge crossing 30% of VDD. From SCL falling edge crossing 30% of VDD to SDA entering the 30% to 70% of VDD window. From SCL rising edge crossing 70% of VDD, to SDA rising edge crossing 30% of VDD. From SDA rising edge to SCL falling edge. Both crossing 70% of VDD. From SCL falling edge crossing 30% of VDD, until SDA enters the 30% to 70% of VDD window. From 30% to 70% of VDD. From 70% to 30% of VDD. Total on-chip and off-chip Maximum is determined by tR and tF. For Cb = 400pF, max is about 2~2.5kΩ. For Cb = 40pF, max is about 15~20kΩ 1300 50 900 TYP (Note 4) MAX 0.3 x VDD VDD + 0.3 UNITS V V V V pF kHz ns ns ns PARAMETER SDA and SCL input buffer LOW voltage SDA and SCL input buffer HIGH voltage SDA and SCL input buffer hysteresis SDA output buffer LOW voltage, sinking 3mA SDA and SCL pin capacitance SCL frequency Pulse width suppression time at SDA and SCL inputs SCL falling edge to SDA output data valid Time the bus must be free before the start of a new transmission Clock LOW time Clock HIGH time START condition setup time START condition hold time Input data setup time tLOW tHIGH tSU:STA tHD:STA tSU:DAT 1300 600 600 600 100 ns ns ns ns ns tHD:DAT tSU:STO tHD:STO tDH tR tF Cb Rpu Input data hold time STOP condition setup time STOP condition hold time Output data hold time SDA and SCL rise time SDA and SCL fall time Capacitive loading of SDA or SCL SDA and SCL bus pull-up resistor off-chip 20 600 600 0 20 + 0.1 x Cb 20 + 0.1 x Cb 10 1 900 ns ns ns ns 300 300 400 ns ns pF kΩ NOTES: 1. IRQ & FOUT and EVDET Inactive. 2. LPMODE = 0 (default). 3. In order to ensure proper timekeeping, the VDD SR- specification must be followed. 4. Typical values are for T = +25°C and 3.3V supply voltage. 5. VSUP = VDD if in VDD Mode, VSUP=VBAT if in VBAT Mode. 4 FN6109.4 October 17, 2006 ISL1209 SDA vs SCL Timing tF tHIGH tLOW tR SCL tSU:STA tHD:STA SDA (INPUT TIMING) tSU:DAT tHD:DAT tSU:STO tAA SDA (OUTPUT TIMING) tDH tBUF Symbol Table WAVEFORM INPUTS Must be steady OUTPUTS Will be steady May change from LOW to HIGH May change from HIGH to LOW Don’t Care: Changes Allowed N/A Will change from LOW to HIGH Will change from HIGH to LOW Changing: State Not Known Center Line is High Impedance 5 FN6109.4 October 17, 2006 ISL1209 VDD Typical Performance Curves 1E-6 900E-9 800E-9 700E-9 IBAT (A) Temperature is 25°C unless otherwise specified 1E-6 800E-9 500E-9 400E-9 300E-9 200E-9 100E-9 000E+0 1.5 2.0 2.5 3.0 3.5 4.0 VBAT (V) 4.5 5.0 5.5 IBAT(A) 600E-9 600E-9 400E-9 200E-9 000E+0 -40 -20 0 20 40 TEMPERATURE (°C) 60 80 FIGURE 1. IBAT vs VBAT FIGURE 2. IBAT vs TEMPERATURE AT VBAT = 3V 2.4E-06 2.2E-06 VDD = 5V 2.0E-06 IDD1 (A) 1.8E-06 1.6E-06 VDD = 3.3V 1.4E-06 1.2E-06 1.0E-06 -40 -20 0 20 40 60 80 IDD1 (A) 2.4E-6 2.2E-6 2.0E-6 1.8E-6 1.6E-6 1.4E-6 1.2E-6 1.0E-6 800.0E-9 600.0E-9 400.0E-9 2.5 3.0 3.5 4.0 VDD (V) 4.5 5.0 5.5 LPMODE = 1 LPMODE = 0 TEMPERATURE (°C) FIGURE 3. IDD1 vs TEMPERATURE FIGURE 4. IDD1 vs VDD WITH LPMODE ON AND OFF 2.1E-6 2.0E-6 1.9E-6 IDD1 (A) 1.8E-6 1.7E-6 1.6E-6 1.5E-6 1.4E-6 1.3E-6 1/4 1/2 1 1/32 1/16 1/8 2 4 8 16 32 64 1024 4096 32768 1.2E-6 IDD1 (A) 1/32 1/16 1/4 1/2 1 1/8 2 4 8 16 32 64 1024 4096 FOUT (Hz) FOUT (Hz) FIGURE 5. IDD1 vs FOUT AT VDD = 3.3V FIGURE 6. IDD1 vs FOUT AT VDD = 5V 6 FN6109.4 October 17, 2006 32768 3.0E-6 2.9E-6 2.8E-6 2.7E-6 2.6E-6 2.5E-6 2.4E-6 2.3E-6 2.2E-6 2.1E-6 2.0E-6 1.9E-6 1.8E-6 ISL1209 EQUIVALENT AC OUTPUT LOAD CIRCUIT FOR VDD = 5V 5.0V 1533Ω SDA AND IRQ/FOUT 100pF FOR VOL= 0.4V AND IOL = 3mA Pin Description X1, X2 The X1 and X2 pins are the input and output, respectively, of an inverting amplifier. An external 32.768kHz quartz crystal is used with the ISL1209 to supply a timebase for the real time clock. Internal compensation circuitry provides high accuracy over the operating temperature range from -40°C to +85°C. This oscillator compensation network can be used to calibrate the crystal timing accuracy over temperature either during manufacturing or with an external temperature sensor and microcontroller for active compensation. The device can also be driven directly from a 32.768kHz source at pin X1. FIGURE 7. STANDARD OUTPUT LOAD FOR TESTING THE DEVICE WITH VDD = 5.0V General Description The ISL1209 device is a low power Real Time Clock with Security and Event function timing and crystal compensation, clock/calendar, power fail indicator, periodic or polled alarm, intelligent battery backup switching, and battery-backed user SRAM. The Event Detection function can be used for tamper detection, security or other chassis or generic system monitoring. Upon a valid event detection, the ISL1209 sets the Event Detection bit (EVT bit) in the status register and, can optionally: 1) Issue an Event Output signal (EVDET pin), 2) At the time the event occurred, stop the RTC registers from advancing. The event monitor can function in both main VDD and battery back up modes. The event monitor can also be configured for various input detection rates to optimize power consumption for the application. In addition, the Event Monitor pin (EVIN) has a selectable glitch filter to avoid switch de-bouncing. The oscillator uses an external, low-cost 32.768kHz crystal. The real time clock tracks time with separate registers for hours, minutes, and seconds. The device has calendar registers for date, month, year and day of the week. The calendar is accurate through 2099, with automatic leap year correction. The ISL1209's powerful alarm can be set to any clock/calendar value for a match. For example, every minute, every Tuesday or at 5:23 AM on March 21. The alarm status is available by checking the Status Register, or the device can be configured to provide a hardware interrupt via the IRQ pin. There is a repeat mode for the alarm allowing a periodic interrupt every minute, every hour, every day, etc. The device also offers a backup power input pin. This VBAT pin allows the device to be backed up by battery or SuperCap with automatic switchover from VDD to VBAT. The entire ISL1209 device is fully operational from VDD = 2.7V to 5.5V and the clock/calendar portion of the device remains fully operational in battery backup mode down to 1.8V (Standby Mode). X1 X2 FIGURE 8. RECOMMENDED CRYSTAL CONNECTION VBAT This input provides a backup supply voltage to the device. VBAT supplies power to the device in the event that the VDD supply fails. This pin can be connected to a battery, a Super Cap or tied to ground if not used. EVIN (Event Input) The EVIN pin is an input that is used to detect an externally monitored event. When a high signal is present at the EVIN pin, an “event” is detected. This input may be used for various monitoring functions, such as the opening of a detection switch on a chassis or door. The event detection circuit can be user enabled or disabled (see EVEN bit) and provides the option to be operational in battery backup modes (see EVBATB bit). When the event detection is disabled the EVIN pin is gated OFF. See functional Description for more details. EVDET (Event Detect Output) The EVDET is an open drain output which will go low when an event is detected at the EVIN pin. If the event detection function is enabled, the EVDET output will go low and stay low until the EVT bit is cleared (see EVIN pin description). IRQ/FOUT (Interrupt Output/Frequency Output) This dual function pin can be used as an interrupt or frequency output pin. The IRQ/FOUT mode is selected via the frequency out control bits of the control/status register. • Interrupt Mode. The pin provides an interrupt signal output. This signal notifies a host processor that an alarm has occurred and requests action. It is an open drain active low output. 7 FN6109.4 October 17, 2006 ISL1209 • Frequency Output Mode. The pin outputs a clock signal which is related to the crystal frequency. The frequency output is user selectable and enabled via the I2C bus. It is an open drain active low output. Condition 1: VDD > VBAT + VBATHYS where VBATHYS ≈ 50mV Condition 2: VDD > VTRIP + VTRIPHYS where VTRIPHYS ≈ 30mV These power control situations are illustrated in Figures 9 and 10. Serial Clock (SCL) The SCL input is used to clock all serial data into and out of the device. The input buffer on this pin is always active (not gated). It is disabled when the backup power supply on the VBAT pin is activated to minimize power consumption. Serial Data (SDA) SDA is a bidirectional pin used to transfer data into and out of the device. It has an open drain output and may be ORed with other open drain or open collector outputs. The input buffer is always active (not gated) in normal mode. An open drain output requires the use of a pull-up resistor. The output circuitry controls the fall time of the output signal with the use of a slope controlled pull-down. The circuit is designed for 400kHz I2C interface speeds. It is disabled when the backup power supply on the VBAT pin is activated. VDD VTRIP VBAT VBAT - VBATHYS BATTERY BACKUP MODE 2.2V 1.8V VBAT + VBATHYS FIGURE 9. BATTERY SWITCHOVER WHEN VBAT < VTRIP VDD, GND Chip power supply and ground pins. The device will operate with a power supply from VDD = 2.7V to 5.5VDC. A 0.1µF capacitor is recommended on the VDD pin to ground. Functional Description Power Control Operation The power control circuit accepts a VDD and a VBAT input. Many types of batteries can be used with Intersil RTC products. For example, 3.0V or 3.6V Lithium batteries are appropriate, and battery sizes are available that can power the ISL1209 for up to 10 years. Another option is to use a Super Cap for applications where VDD is interrupted for up to a month. See the Applications Section for more information. VDD VBAT VTRIP BATTERY BACKUP MODE 3.0V 2.2V VTRIP VTRIP + VTRIPHYS FIGURE 10. BATTERY SWITCHOVER WHEN VBAT > VTRIP Normal Mode (VDD) to Battery Backup Mode (VBAT) To transition from the VDD to VBAT mode, both of the following conditions must be met: Condition 1: VDD < VBAT - VBATHYS where VBATHYS ≈ 50mV Condition 2: VDD < VTRIP where VTRIP ≈ 2.2V The I2C bus is deactivated in battery backup mode to provide lower power. Aside from this, all RTC functions are operational during battery backup mode. Except for SCL and SDA, all the inputs and outputs of the ISL1209 are active during battery backup mode unless disabled via the control register. The User SRAM is operational in battery backup mode down to 1.8V. Power Failure Detection The ISL1209 provides a Real Time Clock Failure Bit (RTCF) to detect total power failure. It allows users to determine if the device has powered up after having lost all power to the device (both VDD and VBAT). Battery Backup Mode (VBAT) to Normal Mode (VDD) The ISL1209 device will switch from the VBAT to VDD mode when one of the following conditions occurs: Low Power Mode The normal power switching of the ISL1209 is designed to switch into battery backup mode only if the VDD power is lost. This will ensure that the device can accept a wide range of backup voltages from many types of sources while reliably switching into backup mode. Another mode, called Low 8 FN6109.4 October 17, 2006 ISL1209 Power Mode, is available to allow direct switching from VDD to VBAT without requiring VDD to drop below VTRIP. Since the additional monitoring of VDD vs. VTRIP is no longer needed, that circuitry is shut down and less power is used while operating from VDD. Power savings are typically 600nA at VDD = 5V. Low Power Mode is activated via the LPMODE bit in the control and status registers. Low Power Mode is useful in systems where VDD is normally higher than VBAT at all times. The device will switch from VDD to VBAT when VDD drops below VBAT, with about 50mV of hysteresis to prevent any switchback of VDD after switchover. In a system with a VDD = 5V and backup lithium battery of VBAT = 3V, Low Power Mode can be used. However, it is not recommended to use Low Power Mode in a system with VDD = 3.3V ±10%, VBAT ≥ 3.0V, and when there is a finite I-R voltage drop in the VDD line. Event Detect Timing Diagram With Sampling Mode Enabled Case 1, Switched Opened Before Ipu 15 clks (8x) Ipu ON OFF OPEN EXT. SWITCH CLOSED HIGH EVIN LOW HIGH EVDET LOW 8 clks (8x) InterSeal™ Battery Saver The ISL1209 has the InterSeal™ Battery Saver which prevents initial battery current drain before it is first used. For example, battery-backed RTCs are commonly packaged on a board with a battery connected. In order to preserve battery life, the ISL1209 will not draw any power from the battery source until after the device is first powered up from the VDD source. Thereafter, the device will switchover to battery backup mode whenever VDD power is lost. Case 2, Switched Opened After Ipu 15 clks (8x) Ipu ON OFF OPEN EXT. SWITCH CLOSED HIGH Event/Tamper Monitor and Detection The ISL1209 provides an event detection and alarm function to be used in a wide variety of applications ranging from security, warranty monitoring, data collection and recording. The tamper detect input pin, EVIN, can be used as a event or tamper detection input of an external switch (mechanical or electronic). When the EVIN pin is a valid HIGH, the ISL1209 sets the EVT bit in the status register and, can optionally: 1) Issue an Event output signal (EVDET pin), 2) At the time event occurred, stop the RTC registers from advancing. To allow for flexibility of external switches used at the EVIN pin, the internal pull-up (~1µA in full on mode) can be disabled/enabled. This will allow more flexibility depending on the capacitive and resistive loading at the EVIN pin. A noise filter option is also provided for the event monitor circuit. The EVIN pin has a time based filter where the EVIN signal must be stable for a period of time to trigger a valid detection. The time hysteresis filter can vary from 0, 3.9ms, 15.2ms or 31.25ms. For low power applications the event monitor can be sampled at a user selectable rate. The EVIN pin can be always ON or periodically sampled with a frequency of 1/4, 1 or 2Hz. EVIN LOW HIGH EVDET LOW 8 clks (8x) Case 3, Switched Bounced 15 clks (8x) ON OFF OPEN EXT. SWITCH CLOSED HIGH EVIN LOW HIGH EVDET LOW Ipu 8 clks (8x) The ISL1209 can operate independently or in conjunction with a microcontroller for low power operation modes or in battery backup modes. The event detection circuits operate in either main VDD power or battery backup mode. 9 FN6109.4 October 17, 2006 ISL1209 Users have the option to connect EVIN (see EVINEB bit) to an internal pull up current source that operates at 1µA (always on mode). User selectable event sampling modes are also available which will effectively reduce power consumption with 1/4-Hz, 1-Hz and 2-Hz sample detection rates. The EVIN input is pulsed ON/OFF when in sampling mode for power savings advantages (See tables below). The EVIN also has a user selectable time based hysteresis filter (see EHYS bits) to implement switch de-bouncing during an event detection. The EVIN signal must be high for the duration of the selected time period. The time periods available are 0 times delay (no time based hysteresis) to 3.9ms, 15.625ms or 31.25ms (see Table 1, 2, 3, and 4). TABLE 1. ∆IDD (VDD=3V, tHYS=3.9ms) fSMP 1/4Hz 1Hz 2Hz DELTA IDD 20.5nA 82nA 164nA Accuracy of the Real Time Clock The accuracy of the Real Time Clock depends on the frequency of the quartz crystal that is used as the time base for the RTC. Since the resonant frequency of a crystal is temperature dependent, the RTC performance will also be dependent upon temperature. The frequency deviation of the crystal is a function of the turnover temperature of the crystal from the crystal’s nominal frequency. For example, a ~20ppm frequency deviation translates into an accuracy of ~1 minute per month. These parameters are available from the crystal manufacturer. The ISL1209 provides on-chip crystal compensation networks to adjust load capacitance to tune oscillator frequency from -94ppm to +140ppm. For more detailed information see the Application Section. Single Event and Interrupt The alarm mode is enabled via the ALME bit. Choosing single event or interrupt alarm mode is selected via the IM bit. Note that when the frequency output function is enabled, the alarm function is disabled. The standard alarm allows for alarms of time, date, day of the week, month, and year. When a time alarm occurs in single event mode, an IRQ pin will be pulled low and the alarm status bit (ALM) will be set to “1”. The pulsed interrupt mode allows for repetitive or recurring alarm functionality. Hence, once the alarm is set, the device will continue to alarm for each occurring match of the alarm and present time. Thus, it will alarm as often as every minute (if only the nth second is set) or as infrequently as once a year (if at least the nth month is set). During pulsed interrupt mode, the IRQ pin will be pulled low for 250ms and the alarm status bit (ALM) will be set to “1”. The ALM bit can be reset by the user or cleared automatically using the auto reset mode (see ARST bit). The alarm function can be enabled/disabled during battery backup mode using the FOBATB bit. For more information on the alarm, please see the Alarm Registers Description. TABLE 2. ∆IDD (VDD=5.0V, tHYS=3.9ms) fSMP 1/4Hz 1Hz 2Hz DELTA IDD 65.8nA 263.3nA 526.5nA TABLE 3. ∆IDD (VDD=3.0V, tHYS=15.625ms) fSMP 1/4Hz 1Hz 2Hz DELTA IDD 82nA 328nA 656.3nA TABLE 4. ∆IDD (VDD=5.0V, tHYS=15.625ms) fSMP 1/4Hz 1Hz 2Hz DELTA IDD 264nA 1.05µA 2.1µA Frequency Output Mode The ISL1209 has the option to provide a frequency output signal using the IRQ/FOUT pin. The frequency output mode is set by using the FO bits to select 15 possible output frequency values from 0 to 32kHz. The frequency output can be enabled/disabled during battery backup mode using the FOBATB bit. Real Time Clock Operation The Real Time Clock (RTC) uses an external 32.768kHz quartz crystal to maintain an accurate internal representation of second, minute, hour, day of week, date, month, and year. The RTC also has leap-year correction. The clock also corrects for months having fewer than 31 days and has a bit that controls 24 hour or AM/PM format. When the ISL1209 powers up after the loss of both VDD and VBAT, the clock will not begin incrementing until at least one byte is written to the clock register. General Purpose User SRAM The ISL1209 provides 2 bytes of user SRAM. The SRAM will continue to operate in battery backup mode. However, it should be noted that the I2C bus is disabled in battery backup mode. 10 FN6109.4 October 17, 2006 ISL1209 I2C Serial Interface The ISL1209 has an I2C serial bus interface that provides access to the control and status registers and the user SRAM. The I2C serial interface is compatible with other industry I2C serial bus protocols using a bidirectional data signal (SDA) and a clock signal (SCL). A register can be read by performing a random read at any address at any time. This returns the contents of that register location. Additional registers are read by performing a sequential read. For the RTC and Alarm registers, the read instruction latches all clock registers into a buffer, so an update of the clock does not change the time being read. A sequential read will not result in the output of data from the memory array. At the end of a read, the master supplies a stop condition to end the operation and free the bus. After a read, the address remains at the previous address +1 so the user can execute a current address read and continue reading the next register. It is not necessary to set the WRTC bit prior to writing into the control and status, alarm, and user SRAM registers. Oscillator Compensation The ISL1209 provides the option of timing correction due to temperature variation of the crystal oscillator for either manufacturing calibration or active calibration. The total possible compensation is typically -94ppm to +140ppm. Two compensation mechanisms that are available are as follows: 1. An analog trimming (ATR) register that can be used to adjust individual on-chip digital capacitors for oscillator capacitance trimming. The individual digital capacitor is selectable from a range of 9pF to 40.5pF (based upon 32.758kHz). This translates to a calculated compensation of approximately -34ppm to +80ppm. (See ATR description.) 2. A digital trimming register (DTR) that can be used to adjust the timing counter by ±60ppm. (See DTR description.) Also provided is the ability to adjust the crystal capacitance when the ISL1209 switches from VDD to battery backup mode. (See Battery Mode ATR Selection for more details.) Register Descriptions The battery-backed registers are accessible following a slave byte of “1101111x” and reads or writes to addresses [00h:13h]. The defined addresses and default values are described in the Table 1. Address 09h is not used. Reads or writes to 09h will not affect operation of the device but should be avoided. REGISTER ACCESS The contents of the registers can be modified by performing a byte or a page write operation directly to any register address. The registers are divided into 4 sections. These are: 1. Real Time Clock (7 bytes): Address 00h to 06h. 2. Control and Status (5 bytes): Address 07h to 0Bh. 3. Alarm (6 bytes): Address 0Ch to 11h. 4. User SRAM (2 bytes): Address 12h to 13h. There are no addresses above 13h. Write capability is allowable into the RTC registers (00h to 06h) only when the WRTC bit (bit 4 of address 07h) is set to “1”. A multi-byte read or write operation is limited to one section per operation. Access to another section requires a new operation. A read or write can begin at any address within the section. 11 FN6109.4 October 17, 2006 ISL1209 TABLE 5. REGISTER MEMORY MAP REG ADDR. SECTION NAME 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh Alarm 0Fh 10h 11h 12h User 13h USR2 USR27 USR26 USR25 USR24 USR23 USR22 USR21 USR20 N/A 00h DTA MOA DWA USR1 EDTA EMOA EDWA USR17 0 0 0 USR16 ADT21 0 0 USR15 ADT20 AMO20 0 USR14 ADT13 AMO13 0 USR13 ADT12 AMO12 ADW12 USR12 ADT11 AMO11 ADW11 USR11 ADT10 AMO10 ADW10 USR10 1-31 1-12 0-6 N/A 00h 00h 00h 00h Control and Status RTC SC MN HR DT MO YR DW SR INT EV ATR DTR SCA MNA HRA BIT 7 0 0 MIL 0 0 YR23 0 ARST IM EVIENB BMATR1 Reserved ESCA EMNA EHRA ASC22 AMN22 0 ASC21 AMN21 AHR21 ASC20 AMN20 AHR20 ASC13 AMN13 AHR13 6 SC22 MN22 0 0 0 YR22 0 5 SC21 MN21 HR21 DT21 0 YR21 0 4 SC20 MN20 HR20 DT20 MO20 YR20 0 WRTC FOBATB EVEN ATR4 3 SC13 MN13 HR13 DT13 MO13 YR13 0 EVT FO3 EHYS1 ATR3 2 SC12 MN12 HR12 DT12 MO12 YR12 DW2 ALM FO2 EHYS0 ATR2 DTR2 ASC12 AMN12 AHR12 1 SC11 MN11 HR11 DT11 MO11 YR11 DW1 BAT FO1 ESMP1 ATR1 DTR1 ASC11 AMN11 AHR11 0 SC10 MN10 HR10 DT10 MO10 YR10 DW0 RTCF FO0 ESMP0 ATR0 DTR0 ASC10 AMN10 AHR10 RANGE 0-59 0-59 0-23 1-31 1-12 0-99 0-6 N/A N/A N/A N/A N/A 00-59 00-59 0-23 DEFAULT 00h 00h 00h 00h 00h 00h 00h 01h 00h 00h 00h 00h 00h 00h 00h XTOSCB Reserved ALME EVBATB BMATR0 LPMODE RTCHLT ATR5 12 FN6109.4 October 17, 2006 ISL1209 Real Time Clock Registers Addresses [00h to 06h] RTC REGISTERS (SC, MN, HR, DT, MO, YR, DW) These registers depict BCD representations of the time. As such, SC (Seconds) and MN (Minutes) range from 0 to 59, HR (Hour) can either be a 12-hour or 24-hour mode, DT (Date) is 1 to 31, MO (Month) is 1 to 12, YR (Year) is 0 to 99, and DW (Day of the Week) is 0 to 6. The DW register provides a Day of the Week status and uses three bits DW2 to DW0 to represent the seven days of the week. The counter advances in the cycle 0-1-2-3-4-5-6-0-12-… The assignment of a numerical value to a specific day of the week is arbitrary and may be decided by the system software designer. The default value is defined as “0”. 24 HOUR TIME If the MIL bit of the HR register is “1”, the RTC uses a 24hour format. If the MIL bit is “0”, the RTC uses a 12-hour format and HR21 bit functions as an AM/PM indicator with a “1” representing PM. The clock defaults to 12-hour format time with HR21 = “0”. LEAP YEARS Leap years add the day February 29 and are defined as those years that are divisible by 4. Years divisible by 100 are not leap years, unless they are also divisible by 400. This means that the year 2000 is a leap year, the year 2100 is not. The ISL1209 does not correct for the leap year in the year 2100. REAL TIME CLOCK FAIL BIT (RTCF) This bit is set to a “1” after a total power failure. This is a read only bit that is set by hardware (ISL1209 internally) when the device powers up after having lost all power to the device (both VDD and VBAT go to 0V). The bit is set regardless of whether VDD or VBAT is applied first. The loss of only one of the supplies does not set the RTCF bit to “1”. On power up after a total power failure, all registers are set to their default states and the clock will not increment until at least one byte is written to the clock register. The first valid write to the RTC section after a complete power failure resets the RTCF bit to “0” (writing one byte is sufficient). BATTERY BIT (BAT) This bit is set to a “1” when the device enters battery backup mode. This bit can be reset either manually by the user or automatically reset by enabling the auto-reset bit (see ARST bit). A write to this bit in the SR can only set it to “0”, not “1”. ALARM BIT (ALM) These bits announce if the alarm matches the real time clock. If there is a match, the respective bit is set to “1”. This bit can be manually reset to “0” by the user or automatically reset by enabling the auto-reset bit (see ARST bit). A write to this bit in the SR can only set it to “0”, not “1”. NOTE: An alarm bit that is set by an alarm occurring during an SR read operation will remain set after the read operation is complete. EVENT DETECT BIT (EVT) The event detect bit indicates status of the event input pin (EVIN). When the EVIN pin is triggered, the EVT bit is set to “1” to indicate a detection of an event input. This bit can be reset by enabling the auto-reset bit (see ARST bit). A write to this bit in the SR can only set it to “0” not “1”. When a high signal is present at the EVIN pin, an “event” is detected. On detection a corresponding bit in the status register (EVT bit) is set high and the open drain EVDET pin is asserted (pulled low). WRITE RTC ENABLE BIT (WRTC) The WRTC bit enables or disables write capability into the RTC Timing Registers. The factory default setting of this bit is “0”. Upon initialization or power up, the WRTC must be set to “1” to enable the RTC. Upon the completion of a valid write (STOP), the RTC starts counting. The RTC internal 1Hz signal is synchronized to the STOP condition during a valid write cycle. CRYSTAL OSCILLATOR ENABLE BIT (XTOSCB) This bit enables/disables the internal crystal oscillator. When the XTOSCB is set to “1”, the oscillator is disabled, and the X1 pin allows for an external 32kHz signal to drive the RTC. The XTOSCB bit is set to “0” on power up. Control and Status Registers Addresses [07h to 0Bh] The Control and Status Registers consist of the Status Register, Interrupt and Alarm Register, Analog Trimming and Digital Trimming Registers. Status Register (SR) The Status Register is located in the memory map at address 07h. This is a volatile register that provides either control or status of RTC failure, battery mode, alarm trigger, event detection, write protection of clock counter, crystal oscillator enable and auto reset of status bits. TABLE 6. STATUS REGISTER (SR) ADDR 07h Default 7 6 5 4 3 EVT 2 1 0 ARST XTOSCB reserved WRTC ALM BAT RTCF 0 0 0 0 0 0 0 0 13 FN6109.4 October 17, 2006 ISL1209 AUTO RESET ENABLE BIT (ARST) This bit enables/disables the automatic reset of the BAT and ALM status bits only. When ARST bit is set to “1”, these status bits are reset to “0” after a valid read of the respective status register (with a valid STOP condition). When the ARST is cleared to “0”, the user must manually reset the BAT and ALM bits. INTERRUPT CONTROL REGISTER (INT) TABLE 7. INTERRUPT CONTROL REGISTER (INT) ADDR 08h Default 7 IM 0 6 5 4 3 2 1 0 LOW POWER MODE BIT (LPMODE) This bit enables/disables low power mode. With LPMODE = “0”, the device will be in normal mode and the VBAT supply will be used when VDD < VBAT - VBATHYS and VDD < VTRIP. With LPMODE = “1”, the device will be in low power mode and the VBAT supply will be used when VDD < VBAT - VBATHYS. There is a supply current saving of about 600nA when using LPMODE = “1” with VDD = 5V. (See Typical Performance Curves: IDD vs VDD with LPMODE ON & OFF.) ALARM ENABLE BIT (ALME) This bit enables/disables the alarm function. When the ALME bit is set to “1”, the alarm function is enabled. When the ALME is cleared to “0”, the alarm function is disabled. The alarm function can operate in either a single event alarm or a periodic interrupt alarm (see IM bit). NOTE: When the frequency output mode is enabled, the alarm function is disabled. ALME LPMODE FOBATB FO3 FO2 FO1 FO0 0 0 0 0 0 0 0 FREQUENCY OUT CONTROL BITS (FO ) These bits enable/disable the frequency output function and select the output frequency at the IRQ/FOUT pin. See Table 8 for frequency selection. When the frequency mode is enabled, it will override the alarm mode at the IRQ/FOUT pin. TABLE 8. FREQUENCY SELECTION OF FOUT PIN FREQUENCY, UNITS FOUT 0 32768 4096 1024 64 32 16 8 4 2 1 1/2 1/4 1/8 1/16 1/32 Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz FO3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 FO2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 FO1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 FO0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 INTERRUPT/ALARM MODE BIT (IM) This bit enables/disables the interrupt mode of the alarm function. When the IM bit is set to “1”, the alarm will operate in the interrupt mode, where an active low pulse width of 250ms will appear at the IRQ/FOUT pin when the RTC is triggered by the alarm as defined by the alarm registers (0Ch to 11h). When the IM bit is cleared to “0”, the alarm will operate in standard mode, where the IRQ/FOUT pin will be tied low until the ALM status bit is cleared to “0”. TABLE 9. IM BIT 0 1 INTERRUPT/ALARM FREQUENCY Single Time Event Set By Alarm Repetitive/Recurring Time Event Set By Alarm EVENT DETECTION REGISTER (EV) The ISL1209 provides an easy to use event and tamper detection circuit. The Event Detection Register configures the functionality of the event detection circuits. EVENT INPUT SAMPLING SELECTION BITS (ESMP) These two bits select the rate of sampling of the EVIN pin to trigger an event detection. For example, a 2Hz sampling rate would configure the ISL1209 to check the status of the EV pin twice a second. Slower sampling significantly reduces the supply current drain. TABLE 10. ESMP1 0 0 1 1 ESMP0 0 1 0 1 EVENT SAMPLING RATE Always ON 2Hz 1Hz 1/4Hz FREQUENCY OUTPUT AND INTERRUPT BIT (FOBATB) This bit enables/disables the FOUT/IRQ pin during battery backup mode (i.e. VBAT power source active). When the FOBATB is set to “1” the FOUT/IRQ pin is disabled during battery backup mode. This means that both the frequency output and alarm output functions are disabled. When the FOBATB is cleared to “0”, the FOUT/IRQ pin is enabled during battery backup mode. 14 FN6109.4 October 17, 2006 ISL1209 EVENT INPUT TIME BASE HYSTERESIS SELECTION BITS (EHYS) These two bits select the time base hysteresis of the EVIN pin to filter bouncing or noise of external event detection circuits. The time filter can be set between 0 to 31.25 ms. TABLE 11. EHYS1 0 0 1 1 EHYS0 0 1 0 1 Time Base Hysteresis 0 (pullup always on) 3.9ms 15.625ms 31.25ms FIGURE 11. DIAGRAM OF ATR X2 X1 CX1 Crystal Oscillator CX2 NOTE: In order to use time-based hysteresis, the sampling mode must be enabled. EVENT DETECT ENABLE BIT (EVEN) This bit enables/disables the Event Detect function of the ISL1209. When this bit is set to “1”, the Event Detect is active. When this bit is cleared to “0”, the Event Detect is disabled. RTC HALT ON EVENT DETECT BIT (RTCHLT) This bit sets the RTC registers to continue or halt counting upon an Event Detect triggered by the EV pin. The time keeping function will cease when RTCHLT is set to “1”, the RTC will discontinue incrementing if an event is detected. Counting will resume when there is a valid write to the to the RTC registers (i.e. time set). The RTCHLT is cleared to “0” after the write to the RTC registers. Note: This function requires that the event detection is enabled (see EVEN bit). EVENT OUTPUT IN BATTERY MODE ENABLE BIT (EVBATB) This bit enables/disables the EVDET pin during battery backup mode (i.e. VBAT pin supply ON). When the EVBATB is set to “1”, the Event Detect Output is disabled in battery backup mode. When the EVBATB is cleared to “0”, the Event Detect output is enabled in battery backup mode.This feature can be used to save power during battery mode. EVENT CURRENT SOURCE ENABLE BIT (EVIENB) This bit enables/disables the internal pullup current source used for the EVIN pin. When the EVIENB bit is set to “1”, the pullup current source is always disabled. When the EVIENB bit is cleared to “0”, the pullup current source is enabled (current source is approximately 1µA). Citizen CFS-206 crystal with different ATR bit combinations provides an estimated ppm adjustment range from -34 to +80ppm to the nominal frequency compensation. The combination of analog and digital trimming can give up to -94 to +140ppm of total adjustment. The effective on-chip series load capacitance, CLOAD, ranges from 4.5pF to 20.25pF with a mid-scale value of 12.5pF (default). CLOAD is changed via two digitally controlled capacitors, CX1 and CX2, connected from the X1 and X2 pins to ground (see Figure 11). The value of CX1 and CX2 is given by the following formula: C X = ( 16 ⋅ b5 + 8 ⋅ b4 + 4 ⋅ b3 + 2 ⋅ b2 + 1 ⋅ b1 + 0.5 ⋅ b0 + 9 ) pF The effective series load capacitance is the combination of CX1 and CX2: C LOAD = ---------------------------------X1 X2 1 1 1 ⎛ ---------- + ---------- ⎞ ⎝C C⎠ C LOAD 16 ⋅ b5 + 8 ⋅ b4 + 4 ⋅ b3 + 2 ⋅ b2 + 1 ⋅ b1 + 0.5 ⋅ b0 + 9 = ⎛ ---------------------------------------------------------------------------------------------------------------------------- ⎞ pF ⎝ 2 ⎠ For example, CLOAD(ATR=00000) = 12.5pF, CLOAD(ATR=100000) = 4.5pF, and CLOAD(ATR=011111) = 20.25pF. The entire range for the series combination of load capacitance goes from 4.5pF to 20.25pF in 0.25pF steps. Note that these are typical values. BATTERY MODE ATR SELECTION (BMATR ) Since the accuracy of the crystal oscillator is dependent on the VDD/VBAT operation, the ISL1209 provides the capability to adjust the capacitance between VDD and VBAT when the device switches between power sources. Analog Trimming Register ANALOG TRIMMING REGISTER (ATR) Six analog trimming bits, ATR0 to ATR5, are provided in order to adjust the on-chip load capacitance value for frequency compensation of the RTC. Each bit has a different weight for capacitance adjustment. For example, using a 15 FN6109.4 October 17, 2006 ISL1209 TABLE 12. DELTA CAPACITANCE (CBAT TO CVDD) 0pF -0.5pF (≈ +2ppm) +0.5pF (≈ -2ppm) +1pF (≈ -4ppm) between the alarm registers and the RTC registers. Any one alarm register, multiple registers, or all registers can be enabled for a match. There are two alarm operation modes: Single Event and periodic Interrupt Mode: • Single Event Mode is enabled by setting the ALME bit to “1”, the IM bit to “0”, and disabling the frequency output. This mode permits a one-time match between the alarm registers and the RTC registers. Once this match occurs, the ALM bit is set to “1” and the IRQ output will be pulled low and will remain low until the ALM bit is reset. This can be done manually or by using the auto-reset feature. • Interrupt Mode is enabled by setting the ALME bit to “1”, the IM bit to “1”, and disabling the frequency output. The IRQ output will now be pulsed each time an alarm occurs. This means that once the interrupt mode alarm is set, it will continue to alarm for each occurring match of the alarm and present time. This mode is convenient for hourly or daily hardware interrupts in microcontroller applications such as security cameras or utility meter reading. To clear an alarm, the ALM bit in the status register must be set to “0” with a write. Note that if the ARST bit is set to 1 (address 07h, bit 7), the ALM bit will automatically be cleared when the status register is read. Below are examples of both Single Event and periodic Interrupt Mode alarms. Example 1 – Alarm set with single interrupt (IM=”0”) A single alarm will occur on January 1 at 11:30am. A. Set Alarm registers as follows: ALARM REGISTER 7 SCA MNA HRA DTA MOA DWA 0 1 1 1 1 0 BIT 6 0 0 0 0 0 0 5 0 1 0 0 0 0 4 0 1 1 0 0 0 3 0 0 0 0 0 0 2 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 1 1 1 0 HEX DESCRIPTION BMATR1 0 0 1 1 BMATR0 0 1 0 1 DIGITAL TRIMMING REGISTER (DTR ) The digital trimming bits DTR0, DTR1, and DTR2 adjust the average number of counts per second and average the ppm error to achieve better accuracy. • DTR2 is a sign bit. DTR2 = “0” means frequency compensation is >0. DTR2 = “1” means frequency compensation is