ISL21070CIH333Z-TK

25µA Micropower Voltage References ISL21070 The ISL21070 voltage references are analog voltage references featuring low supply voltage operation at ultra-low 25µA max operating current. Additionally, the ISL21070 family features guaranteed initial accuracy as low as ±0.2% and 30ppm/°C temperature coefficient. These references are ideal for general purpose applications for performance at lower cost. The ISL21070 is provided in an industry standard 3 Ld SOT-23 pinout. The ISL21070 offers output voltages that can be used as precision voltage sources for control loops, standby voltages for low power states for DSP, FPGA, Datapath Controllers, Microcontrollers and other core voltages: 1.024V, 2.048V, 2.5V, and 3.3V. ISL21070 Features • Reference Output Voltage . . . . . . . 1.024V, 2.048V, 2.500V, 3.300V • Initial Accuracy: 1.024V . . . . . . . . . . . . . . . ±0.5% • Initial Accuracy: 2.048V . . . . . . . . . . . . . .±0.25% • initial Accuracy: 2.5V, 3.3V . . . . . . . . . . . . .±0.2% • Input Voltage Range - ISL21070-10 (Coming Soon) . . . . . . 2.7V to 5.5V - ISL21070-20 (Coming Soon) . . . . . . 2.7V to 5.5V - ISL21070-25. . . . . . . . . . . . . . . . . . 2.7V to 5.5V - ISL21070-33 (Coming Soon) . . . . . . 3.5V to 5.5V • Output Voltage Noise . . . . 30µVP-P (0.1Hz to 10Hz) • Supply Current. . . . . . . . . . . . . . . . . . 25µA (Max) • Tempco . . . . . . . . . . . . . . . . . . . . . . . . 30ppm/°C • Output Current Capability . . . . . . . . . . . . . ±10mA • Operating Temperature Range . . . . -40°C to +85°C • Package . . . . . . . . . . . . . . . . . . . . . . 3 Ld SOT-23 • Pb-Free (RoHS compliant) Applications*(see page 11) • Battery Management/Monitoring • Low Power Standby Voltages • Portable Instrumentation • Consumer/Medical Electronics • Wearable Electronics • Lower Cost Industrial and Instrumentation • Power Regulation Circuits • Control Loops and Compensation Networks • LED/Diode Supply Related Literature*(see page 11) • AN1533, “X-Ray Effects on Intersil FGA References” • AN1494, “Reflow and PC Board Assembly Effects on Intersil FGA References” 2.5020 NORMALIZED TO +25°C 2.5015 2.5010 2.5005 2.5000 2.4995 LOW TYP VOUT (V) HIGH 10 20 30 40 50 60 70 80 2.4990 -40 -30 -20 -10 0 TEMPERATURE (°C) FIGURE 1. VOUT vs TEMPERATURE NORMALIZED to +25°C March 19, 2010 FN7599.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2010. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL21070 Typical Application Circuit 2.7V TO 5.5V 0.1µF 10µF VIN VOUT ISL21070 GND + – LOAD VOUT SENSE Pin Configuration ISL21070 (3 LD SOT-23) TOP VIEW VIN 1 3 GND VOUT 2 Pin Descriptions PIN NUMBER 1 2 3 PIN NAME VIN VOUT GND DESCRIPTION Input Voltage Connection. Range: 2.7 to 5.5V Voltage Reference Output. Ground Connection Ordering Information PART NUMBER (Notes 1, 2, 3) ISL21070CIH310Z-TK ISL21070CIH320Z-TK ISL21070CIH325Z-TK ISL21070CIH333Z-TK NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21070. For more information on MSL please see techbrief TB363. PART MARKING BCGA BCHA BCJA BCKA VOUT OPTION (V) 1.024 2.048 2.5 3.3 GRADE ±0.5%, 30ppm/°C ±0.25%, 30ppm/°C ±0.2%, 30ppm/°C ±0.2%, 30ppm/°C TEMP. RANGE (°C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 3 Ld SOT-23 3 Ld SOT-23 3 Ld SOT-23 3 Ld SOT-23 PKG. DWG. # P3.064 P3.064 P3.064 P3.064 2 FN7599.0 March 19, 2010 ISL21070 Absolute Voltage Ratings Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V VOUT (pin) to GND (10s). . . . . . . . . . . -0.5V to VOUT + 1V ESD Ratings Human Body Model (Tested per JESD22-A114) . . . . 6000V Machine Model (Tested per JESD22-A115) . . . . . . . . 500V Charged Device Model (Tested per JESD22-C101) . . . . 2kV Latch Up (Tested Per JESD-78) . . . . . . . . . . . . . . . . 100mA Thermal Information Thermal Resistance (Typical) θJA (°C/W) 3 Ld SOT-23 (Note 5) . . . . . . . . . . . . . . . . . 371 Continuous Power Dissipation (TA = +85°C). . . . . . . . 99mW Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile (Note 6) . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Temperature Range (Industrial) . . . . . . . . . -40°C to +85°C Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Environmental Operating Conditions X-Ray Exposure (Note 4). . . . . . . . . . . . . . . . . . . .10mRem CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 8. 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. Post-reflow drift for the ISL21070 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4 double sided boards. The design engineer must take this into account when considering the reference voltage after assembly. Electrical Specifications (ISL21070-xx, VOUT = 1.024V to 2.048V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. CONDITIONS MIN (Note 10) TYP 1.024 2.048 MAX (Note 10 UNITS V V +0.5 +0.25 30 2.7 16 2.7V < VIN < 5.5V Sourcing: 0mA ≤ IOUT ≤ 10mA Sinking: -10mA ≤ IOUT ≤ 0mA 50 6 10 50 150 -20 30 10 100 50 5.5 25 250 100 100 % % ppm/°C V µA µV/V µV/mA µV/mA mA µs dB µVP-P µVRMS ppm ppm SYMBOL VOUT PARAMETER Output Voltage VOA VOUT Accuracy @ TA = +25°C ISL21070 C-grade: 1.024 ISL21070 C-grade: 2.048 -0.5 -0.25 TC VOUT VIN IIN ΔVOUT/ΔVIN Output Voltage Temperature Coefficient (Note 7) Input Voltage Range Supply Current Line Regulation ISL21070 C-grade ΔVOUT/ΔIOUT Load Regulation ISC tR Short Circuit Current Turn-on Settling Time Ripple Rejection TA = +25°C, VOUT tied to GND VOUT = ±0.1% f = 10kHz 0.1Hz ≤ f ≤ 10Hz 10Hz ≤ f ≤ 10kHz ΔTA = +125°C TA = +25°C eN VN ΔVOUT/ΔTA ΔVOUT/Δt Output Voltage Noise Broadband Voltage Noise Thermal Hysteresis (Note 8) Long Term Stability (Note 9) 3 FN7599.0 March 19, 2010 ISL21070 Electrical Specifications (ISL21070-25, VOUT = 2.5V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. CONDITIONS MIN MAX (Note 10) TYP (Note 10 2.5 ISL21070 C-grade ISL21070 C-grade 2.7 VEN = VIN 2.7V < VIN < 5.5V Sourcing: 0mA ≤ IOUT ≤ 7mA Sourcing: 0mA ≤ IOUT ≤ 10mA (TA = +70°C) Sinking: -10mA ≤ IOUT ≤ 0mA ISC tR Short Circuit Current Turn-on Settling Time Ripple Rejection eN VN ΔVOUT/ΔTA ΔVOUT/Δt Output Voltage Noise Broadband Voltage Noise Thermal Hysteresis (Note 8) Long Term Stability (Note 9) TA = +25°C, VOUT tied to GND VOUT = ±0.1% f = 10kHz 0.1Hz ≤ f ≤ 10Hz 10Hz ≤ f ≤ 10kHz ΔTA = +125°C TA = +25°C 11 15 6 133 10 30 150 -20 30 10 20 50 100 -0.2 +0.2 30 5.5 25 250 100 UNIT V % ppm/°C V µA µV/V µV/mA µV/mA µV/mA mA µs dB µVP-P µVRMS ppm ppm SYMBOL VOUT VOA TC VOUT VIN IIN ΔVOUT/ΔVIN ΔVOUT/ΔIOUT PARAMETER Output Voltage VOUT Accuracy @ TA = +25°C Output Voltage Temperature Coefficient (Note 7) Input Voltage Range Supply Current Line Regulation Load Regulation 4 FN7599.0 March 19, 2010 ISL21070 Electrical Specifications (ISL21070-33, VOUT = 3.3V) VIN = 5V, TA = -40°C to +85°C, IOUT = 0, unless otherwise specified.Boldface limits apply over the operating temperature range, -40°C to +85°C. CONDITIONS MIN MAX (Note 10) TYP (Note 10) 3.3 ISL21070 C-grade ISL21070 C-grade 3.5 VEN = VIN 3.5V < VIN < 5.5V Sourcing: 0mA ≤ IOUT ≤ 10mA Sinking: -10mA ≤ IOUT ≤ 0mA ISC tR Short Circuit Current Turn-on Settling Time Ripple Rejection eN VN ΔVOUT/ΔTA ΔVOUT/Δt NOTES: 7. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40°C to +85°C = +125°C. 8. Thermal Hysteresis is the change of VOUT measured @ TA = +25°C after temperature cycling over a specified range, ΔTA. VOUT is read initially at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For Δ TA = +125°C, the device under test is cycled from +25°C to +85°C to -40°C to +25°C. 9. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/√1khrs 10. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. Output Voltage Noise Broadband Voltage Noise Thermal Hysteresis (Note 8) Long Term Stability (Note 9) TA = +25°C, VOUT tied to GND VOUT = ±0.1% f = 10kHz 0.1Hz ≤ f ≤ 10Hz 10Hz ≤ f ≤ 10kHz ΔTA = +125°C TA = +25°C 50 20 20 30 150 -20 30 10 100 50 -0.2 +0.2 50 5.5 25 100 70 70 µV/mA µV/mA mA µs dB µVP-P µVRMS ppm ppm UNIT V % ppm/° C V µA SYMBOL VOUT VOA TC VOUT VIN IIN ΔVOUT/ΔVIN ΔVOUT/ΔIOUT PARAMETER Output Voltage VOUT Accuracy @ TA = +25°C Output Voltage Temperature Coefficient (Note 7) Input Voltage Range Supply Current Line Regulation Load Regulation 5 FN7599.0 March 19, 2010 ISL21070 Typical Performance Characteristics Curves 20 18 16 14 IIN (µA) 10 8 6 4 2 0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 LOW IIN (µA) 12 HIGH TYP 13 12 11 10 9 8 2.7 14 VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C unless otherwise specified. +25°C -85°C -40°C 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VIN (V) VIN (V) FIGURE 2. IIN vs VIN, 3 UNITS FIGURE 3. IIN vs VIN OVER-TEMPERATURE VOUT (V) NORMALIZED TO 2.5V AT VIN = 3.0V 2.50030 2.50025 2.50020 2.50015 2.50010 2.50005 2.50000 2.49995 2.49990 2.7 LOW 3.1 3.5 HIGH 3.9 4.3 VIN (V) 4.7 5.1 5.5 TYP VOUT (µV) NORMALIZED TO VIN = 3.0V 200 150 100 50 0 -50 -100 -150 2.7 3.1 3.5 3.9 4.3 VIN (V) 4.7 5.1 5.5 -40°C -85°C +25°C FIGURE 4. LINE REGULATION, 3 UNITS FIGURE 5. LINE REGULATION OVER-TEMPERATURE 2.5020 NORMALIZED TO +25°C 2.5015 VOUT (mV) 2.5010 2.5005 2.5000 2.4995 LOW TYP 25 20 15 10 5 0 -5 ΔVIN = -0.3V ΔVIN = +0.3V VOUT (V) -10 -15 -20 -25 0 50 HIGH 10 20 30 40 50 60 70 80 2.4990 -40 -30 -20 -10 0 100 150 200 250 300 350 400 450 500 TIME (µs) TEMPERATURE (°C) FIGURE 6. VOUT vs TEMPERATURE NORMALIZED to +25°C FIGURE 7. LINE TRANSIENT RESPONSE, WITH 1nF CAPACITIVE LOAD 6 FN7599.0 March 19, 2010 ISL21070 Typical Performance Characteristics Curves 25 20 15 VOUT (mV) 10 5 0 -5 -10 -15 -20 -25 0 50 100 150 200 250 300 350 400 450 500 TIME (µs) ΔVIN = -0.3V ΔVIN = +0.3V VOUT (µV) 100 80 60 40 20 0 -20 -40 -60 -80 VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued) +25°C -40°C -85°C -100 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 SINKING LOAD (mA) SOURCING FIGURE 8. LINE TRANSIENT RESPONSE, WITH NO CAPACITIVE LOAD FIGURE 9. LOAD REGULATION OVER-TEMPERATURE 500 400 300 VOUT (mV) 200 100 0 -100 -200 -300 -400 -500 0 20 40 ILOAD = -10mA 60 80 100 120 140 160 180 200 TIME (µs) ILOAD = +10mA VOUT (mV) 200 160 120 80 40 0 -40 -80 ILOAD = -50mA ILOAD = +50mA -120 -160 -200 0 20 40 60 80 100 120 140 160 180 200 TIME (µs) FIGURE 10. LOAD TRANSIENT RESPONSE FIGURE 11. LOAD TRANSIENT RESPONSE 2.510 2.508 2.506 2.504 VOUT (V) 2.502 2.500 2.498 2.496 2.494 2.492 2.490 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 VIN (V) NO LOAD 10mA LOAD VOUT (V) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 50 HIGH 100 LOW TYP VDD 150 TIME (µs) 200 250 300 FIGURE 12. DROPOUT FIGURE 13. TURN-ON TIME 7 FN7599.0 March 19, 2010 ISL21070 Typical Performance Characteristics Curves 120 100 80 60 40 20 0 1 100nF LOAD NO LOAD 1nF LOAD 10nF LOAD PSRR (dB) ZOUT (Ω) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 10 100 1k 10k 100k 1M -100 1 VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued) NO LOAD 1nF LOAD 10nF LOAD 100nF LOAD 10 100 1k 10k 100k 1M 10M FREQUENCY (Hz) FREQUENCY (Hz) FIGURE 14. ZOUT vs f vs CL FIGURE 15. PSRR vs FREQUENCY Applications Information FGA Technology The ISL21070 series of voltage references use the floating gate technology to create references with very low drift and supply current. Essentially, the charge stored on a floating gate cell is set precisely in manufacturing. The reference voltage output itself is a buffered version of the floating gate voltage. The resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). The process used for these reference devices is a floating gate CMOS process, and the amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While providing excellent accuracy, there are limitations in output noise level and load regulation due to the MOS device characteristics. These limitations are addressed with circuit techniques discussed in other sections. X-rayed, care should be taken to shield the FGA reference device. Board Mounting Considerations For applications requiring the highest accuracy, board mounting location should be reviewed. Placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. It is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. Obviously, mounting the device on flexprint or extremely thin PC material will likewise cause loss of reference accuracy. Board Assembly Considerations FGA references provide high accuracy and low temperature drift but some PC board assembly precautions are necessary. Normal Output voltage shifts of 100µV to 1mV can be expected with Pb-free reflow profiles or wave solder on multi-layer FR4 PC boards. Precautions should be taken to avoid excessive heat or extended exposure to high reflow or wave solder temperatures, this may reduce device initial accuracy. Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or avoided. If x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. If large amounts of shift are observed, it is best to add an X-ray shield consisting of thin zinc (300µm) sheeting to allow clear imaging, yet block x-ray energy that affects the FGA reference. Handling and Board Mounting FGA references provide excellent initial accuracy and low temperature drift at the expense of very little power drain. There are some precautions to take to insure this accuracy is not compromised. Excessive heat during solder reflow can cause excessive initial accuracy drift, so the recommended +260°C max temperature profile should not be exceeded. Expect up to 1mV drift from the solder reflow process. FGA references are susceptible to excessive X-radiation like that used in PC board manufacturing. Initial accuracy can change 10mV or more under extreme radiation. If an assembled board needs to be Special Applications Considerations In addition to post-assembly examination, there are also other X-ray sources that may affect the FGA reference long term accuracy. Airport screening machines contain X-rays and will have a cumulative effect on the voltage reference output accuracy. Carry-on luggage screening uses low level X-rays and is not a major source of output voltage shift, however, if a product is expected to pass 8 FN7599.0 March 19, 2010 ISL21070 through that type of screening over 100 times, it may need to consider shielding with copper or aluminum. Checked luggage X-rays are higher intensity and can cause output voltage shift in much fewer passes, thus devices expected to go through those machines should definitely consider shielding. Note that just two layers of 1/2 ounce copper planes will reduce the received dose by over 90%. The leadframe for the device which is on the bottom also provides similar shielding. If a device is expected to pass through luggage X-ray machines numerous times, it is advised to mount a 2-layer (minimum) PC board on the top, and along with a ground plane underneath will effectively shield it from 50 to 100 passes through the machine. Since these machines vary in X-ray dose delivered, it is difficult to produce an accurate maximum pass recommendation. ISL21070 Used as a Low Cost Precision Current Source Using an N-JET and the ISL21070, a precision, low cost, high impedance current source can be created. The precision of the current source is largely dependent on the tempco and accuracy of the reference. The current setting resistor contributes less than 20% of the error. +8V TO 28V ISET = VOUT RSET IL = ISET + IRSET VIN 0.01µF VOUT ZOUT > 100MΩ RSET 1kΩ 0.1% 10ppm/°C ISL21070-2.5 VOUT = 2.5V GND Noise Performance and Reduction The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 30µVP-P. The noise measurement is made with a bandpass filter made of a 1 pole high-pass filter with a corner frequency at 0.1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Wideband noise is reduced by adding capacitor to the output, but the value should be limited to 1nF or less to insure stability. ISY ~ 11µA ISET IL AT 0.1% ACCURACY ~2.5011mA FIGURE 16. ISL21070 USED AS A LOW COST PRECISION CURRENT SOURCE Temperature Drift The limits stated for output accuracy over-temperature are governed by the method of measurement. For the -40°C to 85°C temperature range, measurements are made at +25°C and the two extremes. This measurement method combined with the fact that FGA references have a fairly linear temperature drift characteristic insures that the limits stated will not be exceeded over the temperature range. Typical Application Circuits VIN = 3.0V R = 200Ω 2N2905 VIN ISL21070VOUT GND 2.5V/50mA 0.001µF FIGURE 17. PRECISION 2.5V 50mA REFERENCE 9 FN7599.0 March 19, 2010 ISL21070 Typical Application Circuits (Continued) 2.7V TO 5.5V 0.1µF 10µF VIN VOUT ISL21070 GND 0.001µF VCC SDA SCL VSS RL RH + – VOUT (BUFFERED) VOUT X9119 2-WIRE BUS FIGURE 18. 2.5V FULL SCALE LOW-DRIFT 10-BIT ADJUSTABLE VOLTAGE SOURCE 2.7V TO 5.5V 0.1µF 10µF VIN VOUT ISL21070 GND + – LOAD VOUT SENSE FIGURE 19. KELVIN SENSED LOAD 10 FN7599.0 March 19, 2010 ISL21070 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE 3/19/10 REVISION FN7599.0 Initial release. CHANGE Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL21070 To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN7599.0 March 19, 2010 ISL21070 Package Outline Drawing P3.064 3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE (SOT23-3) Rev 2, 9/09 2.92±0.12 4 DETAIL "A" 0.13±0.05 C L 2.37±0.27 C L 1.30±0.10 4 0.950 0.435±0.065 0.20 M C TOP VIEW 0 - 8 deg. 10° TYP (2 plcs) 0.91±0.03 1.00±0.12 0.25 GAUGE PLANE SEATING PLANE C SEATING PLANE 0.10 C 0.013(MIN) 0.100(MAX) SIDE VIEW DETAIL "A" 0.31±0.10 5 (0.60) NOTES: (2.15) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. Dimensioning and tolerancing conform to AMSEY14.5m-1994. Reference JEDEC TO-236. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Footlength is measured at reference to gauge plane. 2. (1.25) 3. 4. 5. (0.95 typ.) TYPICAL RECOMMENDED LAND PATTERN 12 FN7599.0 March 19, 2010