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ISL21400IU8Z

ISL21400IU8Z

  • 厂商:

    INTERSIL(Intersil)

  • 封装:

  • 描述:

    ISL21400IU8Z - Programmable Temperature Slope Voltage Reference - Intersil Corporation

  • 数据手册
  • 价格&库存
ISL21400IU8Z 数据手册
® ISL21400 Data Sheet December 14, 2006 FN8091.0 Programmable Temperature Slope Voltage Reference The ISL21400 features a precision voltage reference combined with a temperature sensor whose output voltage varies linearly with temperature. The precision 1.20V reference has a very low temperature coefficient (tempco), and its output voltage is scaled by an internal DAC (VREF) to produce a temperature stable output voltage that is programmable from 0V to 1.20V. The output voltage from the temperature sensor (VTS) is summed with VREF to produce a temperature dependent output voltage. The slope of the VTS portion of the output voltage can be programmed to be positive or negative in the range -2.1mV/°C to +2.1mV/°C. A programmable gain amplifier (PGA) sums the VTS and the VREF voltages and provides gains of 1x, 2x, and 4x to scale the output up to 4.8V and the slope to ±8.4mV/°C. The VREF and VTS terms are programmable with 8 bits of resolution via an I2C bus and the values are stored in nonvolatile registers. The PGA gain is also set via the I2C bus and the value is stored in a non-volatile register. Non-volatile memory storage assures the programmed settings are retained on power-down, eliminating the need for software initialization at device power-up. Features • Programmable reference voltage • Programmable temperature slope • Programmable Gain Amplifier • Non-volatile storage of programming registers • I2C serial interface • 2% total accuracy over temperature and VCC range • 200µA typical active supply current • Operating temperature range = -40°C to +85°C • 8 Ld MSOP package Applications • RF power amplifier bias compensation • LCD bias compensation • Laser diode bias compensation • Sensor bias and linearization • Data acquisition systems • Variable DAC reference • Amplifier biasing Temperature Characteristics Curve 3.0 2.5 2.0 VREF (V) TS = 0 1.5 1.0 TS = 0 0.5 0.0 -40 TS = 255 TS = 127 AV = 1 TS = 127 AV = 2 Pinout ISL21400 (8 LD MSOP) TOP VIEW TS = 255 A2 A1 A0 VSS 1 2 3 4 8 7 6 5 VCC VOUT SDA SCL -15 10 35 60 85 TEMPERATURE (°C) Ordering Information PART NUMBER (Note) ISL21400IU8Z ISL21400IU8Z-TK PART MARKING DEW DEW VDD RANGE (V) 2.7 to 5.5 2.7 to 5.5 TEMP RANGE (°C) -40 to +85 -40 to +85 PACKAGE 8 Ld MSOP (Pb-free) 8 Ld MSOP (Pb-free) PKG. DWG. # M8.118 M8.118 NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL21400 Pin Description MSOP 1 2 3 4 5 6 7 8 SYMBOL A2 A1 A0 VSS SCL SDA VOUT VCC DESCRIPTION Hardwire slave address pin for I2C serial bus Hardwire slave address pin for I2C serial bus Hardwire slave address pin for I2C serial bus Ground pin Serial bus clock input Serial bus data input/output Output voltage Device power supply Block Diagram VCC TEMP SENSE VTS(n) DAC VREF(m) Σ A GAIN SELECT AV = 1,2,4 VOUT VREF DAC BIAS SCL COMMUNICATIONS AND REGISTERS SDA EEPROM 8x8 n = 0 to 255 m = 0 to 255 VSS A0 A1 A2 2 FN8091.0 December 14, 2006 ISL21400 Absolute Maximum Ratings Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 6.5V Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage on VOUT Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to VCC Voltage on All Other Pins . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3V Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V Thermal Information Thermal Resistance (Typical, Note 15) θJA (°C/ W) 8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 130 Moisture Sensitivity for MSOP Package (See Technical Brief TB363) . . . . . . . . . . . . . . . . . . . . . . . Level 2 Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C Recommended Operating Conditions Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Analog Specifications SYMBOL POWER SUPPLY VCC IQ VCC = 5.5V, TA = 25°C to +85°C, unless otherwise noted TEST CONDITIONS MIN TYP (Note 2) MAX UNITS PARAMETER Supply Voltage Range Supply VCC = 2.7V VCC = 5.5V Standby, SDA = SCL = VCC Standby, SDA = SCL = VCC Nonvolatile write Nonvolatile write 2.7 3.0 5.5 V 200 235 400 500 µA µA IQ(NV) Non-Volatile Supply VCC = 2.7V VCC = 5.5V 500 1.3 2.0 750 1.6 2.6 µA mA V Vpor Power-on Recall Voltage Minimum VCC at which memory recall occurs VCC Ramp Rate Power-Up Delay VCC above Vpor, time delay to Register recall, and I2C Interface in standby state VCC Ramp tD 0.2 3 V/ms ms OUTPUT VOLTAGE PERFORMANCE SPECIFICATIONS GE1 GE2 K Gain Error Gain Error Temperature Sensor Coefficient Absolute Output Voltage (Swing) Range Absolute Output Voltage (Swing) Range TS1 TS2 TS3 TS4 TSNL DNL INL Temperature Sensor Slope Temperature Sensor Slope Temperature Sensor Slope Incremental Temperature Sensor Slope Temperature Slope Non-Linearity AV = 2 (Notes 1, 3, 12) AV = 4 (Notes 1, 3, 12) (Notes 1, 8) Unloaded, TA = +25°C (Note 3) Loaded, IOUT = ±500µA (Note 3) AV = 1, n = 255, m = 255 (Notes 1, 6) AV = 2, n = 255, m = 255 (Notes 1, 6) AV = 4, n = 255, m = 255 (Notes 1, 6) AV = 1, n = 255, m = 0 to 255 (Notes 1, 10) n = 255, m = 0 to 255, T = -40°C to +85°C (Notes 1, 11) -1.0 -3.0 -1 -1 -2.2 VCC 0.100 VCC 0.250 -2.1 -4.2 -8.4 8.2 ±0.5 ±1.0 +1.0 +3.0 -2.1 +1 +1 -2.0 GND + 0.100 GND + 0.250 % % mV/°C V V mV/°C mV/°C mV/°C μV/°C per Code % LSB LSB DAC Relative Linearity (VCC =2.7 to 5.5V) VREF and Temp Sense; AV = 1 (Note 13) DAC Absolute Linearity (VCC = 2.7 to 5.5V) VREF and Temp Sense; AV = 1 (Note 13) 3 FN8091.0 December 14, 2006 ISL21400 Analog Specifications SYMBOL VCC = 5.5V, TA = 25°C to +85°C, unless otherwise noted TEST CONDITIONS (Notes 1, 8, 9) AV = 1, n = 255, m = 128, TA = +25°C, VCC = 5.5V AV = 2, n = 255, m = 128, TA = +25°C, VCC = 5.5V AV = 4, n = 255, m = 128, TA = +25°C, VCC = 5.5V AV = 1, n = 255, m = 0, TA = +85°C (Note 3) AV = 1, n = 255, m = 128, TA = +85°C (Note 3) AV = 1, n = 255, m = 255, TA = +85°C (Note 3) AV = 1, n = 255, m = 0, TA = -40°C, (Note 3) AV = 1, n = 255, m = 128, TA = -40°C, (Note 3) AV = 1, n = 255, m = 255, TA = -40°C, (Note 3) 1.189 2.378 4.756 1.315 1.188 1.063 1.052 1.189 1.336 MIN TYP (Note 2) ±1 1.2 2.40 4.80 1.326 1.199 1.074 1.063 1.200 1.325 MAX ±2 1.211 2.422 4.844 1.337 1.210 1.085 1.074 1.211 1.347 UNITS % V V V V V V V V V PARAMETER VOUT(TE) Total Error for VOUT VOUT1 VOUT2 VOUT3 VOUT4 VOUT5 VOUT6 VOUT7 VOUT8 VOUT9 Output Voltage VREF, Gain = 1 Output Voltage VREF, Gain = 2 Output Voltage VREF, Gain = 4 Output Voltage VREF + TS Output Voltage VREF + TS Output Voltage VREF + TS Output Voltage VREF + TS Output Voltage VREF + TS Output Voltage VREF + TS OUTPUT VOLTAGE DC SPECIFICATIONS PSRR ROUT ISC Power Supply Rejection Ratio Output Impedance (load regulation) Short Circuit, Sourcing Short Circuit, Sinking CL Load Capacitance AV = 1, n = 255, m = 128, (Note 7) Given by ROUT = (ΔVOUT/ΔIOUT) , TA = +25°C, IOUT = ±500µA VCC = 5.5V, VOUT = 0V VCC = 5.5V, VOUT = 5.5V Reference output stable for all CL up to specifications 50 60 2 5 6 5 5 9 9 dB Ω mA mA nF OUTPUT VOLTAGE AC SPECIFICATIONS VN Output Voltage Noise 0.1Hz to 10Hz, AV =1 10Hz to 10kHz, CL = 0, AV = 1 Power On Response Line Ripple Rejection 1% Settling VCC = 5V ±100mV, f = 120Hz 90 TBD 500 60 µVp-p mVRMS µs dB Serial Interface Specification (for SCL, SDA, A0, A1, A2 unless specified otherwise) SYMBOL ILI VIL VIH Hysteresis VOL Cpin fSCL PARAMETER Input Leakage Input LOW Voltage Input HIGH Voltage SDA and SCL Input Buffer Hysteresis SDA Output Buffer LOW Voltage Pin Capacitance SCL Frequency IOL = 3mA (Note 3) (Note 3) TEST CONDITIONS VIN = GND to VCC -0.3 0.7 x VCC 0.05 x VCC 0 10 400 0.4 MIN TYP (Note 2) MAX 1 0.3 x VCC VCC + 0.3 UNITS V V V V V pF kHz 4 FN8091.0 December 14, 2006 ISL21400 Serial Interface Specification (for SCL, SDA, A0, A1, A2 unless specified otherwise) (Continued) SYMBOL tsp PARAMETER Pulse Width Suppression Time at SDA and SCL Inputs SCL Falling Edge to SDA Output Data Valid TEST CONDITIONS Any pulse narrower than the max spec is suppressed (Note 3) SCL falling edge crossing 30% of VCC, until SDA exits the 30% to 70% of VCC window (Note 3) SDA crossing 70% of VCC during a STOP condition, to SDA crossing 70% of VCC during the following START condition (Note 3) Measured at the 30% of VCC crossing (Note 3) Measured at the 70% of VCC crossing (Note 3) SCL rising edge to SDA falling edge; both crossing 70% of VCC (Note 3) From SDA falling edge crossing 30% of VCC to SCL falling edge crossing 70% of VCC (Note 3) From SDA exiting the 30% to 70% of VCC window, to SCL rising edge crossing 30% of VCC (Note 3) From SCL rising edge crossing 70% of VCC to SDA entering the 30% to 70% of VCC window (Note 3) From SCL rising edge crossing 70% of VCC, to SDA rising edge crossing 30% of VCC (Note 3) From SDA rising edge to SCL falling edge; both crossing 70% of VCC (Note 3) From SCL falling edge crossing 30% of VCC, until SDA enters the 30% to 70% of VCC window (Note 3) From 30% to 70% of VCC (Note 3) From 70% to 30% of VCC (Note 3) Total on-chip and off-chip (Note 4) 1300 MIN TYP (Note 2) MAX 50 UNITS ns tAA 900 ns tBUF Time the Bus Must be Free Before the Start of a New Transmission ns tLOW tHIGH tSU:STA Clock LOW Time Clock HIGH Time START Condition Setup Time 1300 600 600 ns ns ns tHD:STA START Condition Hold Time 600 ns tSU:DAT Input Data Setup Time 100 ns tHD:DAT Input Data Hold Time 0 ns tSU:STO STOP Condition Setup Time 600 ns tHD:STO STOP Condition Hold Time for Read, or Volatile Only Write Output Data Hold Time 1300 ns tDH 0 ns tR tF Cb SDA and SCL Rise Time SDA and SCL Fall Time Capacitive Loading of SDA or SCL 20 + 0.1 x Cb 20 + 0.1 x Cb 10 250 250 400 ns ns pF 5 FN8091.0 December 14, 2006 ISL21400 Serial Interface Specification (for SCL, SDA, A0, A1, A2 unless specified otherwise) (Continued) SYMBOL Rpu PARAMETER TEST CONDITIONS MIN 1 TYP (Note 2) MAX UNITS kΩ SDA and SCL Bus Pull-up Resistor Maximum is determined by tR and tF Off-chip For Cb = 400pF, max is about 2~2.5kΩ For Cb = 40pF, max is about 15~20kΩ Output Leakage Current (SDA only) VOUT = GND to VCC A1, A0, SHDN, SDA, and SCL Input Buffer LOW Voltage A1, A0, SHDN, SDA, and SCL Input Buffer HIGH Voltage SDA Output Buffer LOW Voltage Capacitive Loading of SDA or SCL EEPROM Endurance EEPROM Retention Temperature T ≤ +55°C IOL = 100µA (Note 3), at 3mA sink Total on-chip and off-chip (Note 3) ILO VIL VIH VOL CL 1 -0.3 VCC x 0.7 0 10 1,000,000 50 12 20 VCC x 0.3 VCC 0.4 400 µA V V V pF Cycles Years ms tWC (Note 14) Non-Volatile Write Cycle Time Timing Diagrams Bus Timing tF tHIGH tLOW tR tsp tHD:STO SCL tSU:STA tHD:STA SDA (INPUT TIMING) tSU:DAT tHD:DAT tSU:STO tAA SDA (OUTPUT TIMING) tDH tBUF Write Cycle Timing SCL SDA 8th BIT OF LAST BYTE ACK tWC STOP CONDITION START CONDITION NOTES: 1. Equation 1 governs the output voltage and is stated as follows: ⎧ n ( 2 • m ) – 255 ⎫ V OUT = A V • ⎨ V REF • --------- + K ( T – T 0 ) ------------------------------- ⎬, n = 0 to 255, m = 0 to 255, K = -2.1mV/C(typ), T0 = +25 ° C 255 255 ⎩ ⎭ 2. Typical values are for TA = +25°C and VCC = 5.5V. 6 FN8091.0 December 14, 2006 ISL21400 3. This parameter is not 100% tested. 4. Cb = total capacitance of one bus line in pF. 5. tWC is the time from a valid stop condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It is the minimum cycle time to be allowed for any nonvolatile write by the user. 6. Over the specified temperature range. Temperature slope (TS) is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40°C to +85°C = +125°C. TS1, TS2, TS3 =. V OUT ( Tmin ) – V OUT ( Tmax ) TS = ------------------------------------------------------------------------------Tmin – Tmax 7. Given by PSRR (dB) = 20 * log10 (ΔVout/ΔVCC) at DC. 8. Test +25°C and +85°C only. 9. Total error of Equation 1 @ AV =1, K = -2.1mV/°C, VREF = 1.20V, m = 255, n = 255 to 0, VCC = 3.0V V OUT ( measured ) – V OUT ( Equation1 ) V OUT ( TE ) = ------------------------------------------------------------------------------------------------------------ x100% V OUT ( Equation1 ) 10. Over the specified temperature range. Temperature slope (TS) is measured by the box method whereby the change in VOUT is divided by the temperature range. Incremental TS is the temperature slope at m = 255 minus the temperature slope at m = 0 divided by 255 with AV = 1, n = 255 ⎛ V OUT ( Tmin ) – V OUT ( Tmax ) ⎞ ⎛ V OUT ( Tmin ) – V OUT ( Tmax ) ⎞ TS4 = ⎜ ------------------------------------------------------------------------------⎟ – ⎜ ------------------------------------------------------------------------------⎟ ÷ 255 ( Tmin – Tmax ) ( Tmin – Tmax ) ⎝ m = 255⎠ ⎝ m = 0⎠ 11. Temperature Slope Non- linearity is measured over the specified temperature range. The actual change in output voltage is subtracted from the expected change in output voltage, and then divided by the expected change to normalize before converting to percent. ( T S y ( Δ T ) ) – Δ VOUT TSNL = --------------------------------------------------------- x100%; y = 1, 2, 3 TS y × Δ T 12. For codes n = 8 to 255 13. Guaranteed monotonic 14. tWC is the time from a valid STOP condition at the end of a Write sequence of I2C serial interface, to the end of the self-timed internal nonvolatile write cycle. 15. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Typical Performance Curves 3.0 2.5 2.0 VREF (V) TS = 0 1.5 1.0 TS = 0 0.5 0.0 -40 TS = 255 TS = 127 3.5 3.0 -40 AV = 1 TS = 127 AV = 2 6.0 AV = 4 5.5 5.0 VREF (V) 4.5 TS = 127 4.0 TS = 0 TS = 255 TS = 255 -15 10 35 60 85 -15 10 35 60 85 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 1. VOUT vs TEMPERATURE (AV = 1, 2) FIGURE 2. VOUT vs TEMPERATURE (AV = 4) 7 FN8091.0 December 14, 2006 ISL21400 Typical Performance Curves 1.22 VREF REGISTER = 255d TS REGISTER = 127d (Continued) 0.4 VREF REGISTER = 255d 0.35 TS REGISTER = 127d 0.3 ICC (mA) 0.25 0.2 0.15 0.1 0.05 +85°C 1.21 VREF (V) +25°C 1.20 -40×C -40°C 1.19 1.18 2.0 2.5 3.0 3.5 4.0 VCC (V) 4.5 5.0 5.5 6.0 0 2 3 4 VCC (V) 5 6 7 FIGURE 3. VOUT vs VCC (VCC = +2.7V to +5.5V) FIGURE 4. SUPPLY VOLTAGE vs SUPPLY CURRENT NO LOAD AV = 1 100µV/DIV (VOUT x 1000) NO LOAD AV = 4 50µV/DIV (VOUT x 1000) FIGURE 5. VOUT VOLTAGE NOISE (AV = 1, NO LOAD) FIGURE 6. VOUT VOLTAGE NOISE (AV = 4, NO LOAD) 1.22 CH1 = VCC 1.21 VREF (V) CH2 = VOUT 1.20 1.19 VREF REGISTER = 255d TS REGISTER = 127d 1.18 -40 -15 10 35 60 85 TEMPERATURE (°C) FIGURE 7. ACCURACY vs TEMPERATURE (-40°C TO +85°C) FIGURE 8. POWER ON 8 FN8091.0 December 14, 2006 ISL21400 Typical Performance Curves 3 2 1 INL IN LSB 0 AT +25°C -1 -2 -3 DNL IN LSB (Continued) 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 240 255 CODE -1.0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 240 255 CODE AT +25°C FIGURE 9. INL, VREF AND TEMP SLOPE DAC FIGURE 10. DNL, VREF AND TEMP SLOPE DAC 1.4 1.2 1.0 VREF (V) 0.8 0.6 0.4 At +25°C TS REGISTER = 127d 1.40 1.35 1.30 VREF (V) 1.25 +85°C 1.20 1.15 1.10 VREF REGISTER = 255d -40°C 0.2 0.0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 240 255 VREF REGISTER CODE (m) 1.05 1.00 0 15 30 45 60 75 90 105 120 135 15 0 165 180 195 210 225 240 255 TS REGISTER CODE (n) FIGURE 11. VOUT vs VREF CODE (m) FIGURE 12. VOUT vs TEMP SENSE CODE (n), TA = -40°C AND +85°C 1.209 1.208 1.207 1.206 VREF (V) 1.205 1.204 1.203 1.202 1.201 1.2 -1 -0.5 0 IOUT (mA) 0.5 1 VREF REGISTER = 255d TS REGISTER = 127d At +25°C FIGURE 13. VOUT vs IOUT (±1mA) 9 FN8091.0 December 14, 2006 ISL21400 Pin Descriptions VOUT Programmable voltage output pin. Absolute voltage is determined by device temperature and Equation 1. Drive capability is limited to ±500μA output current and 5000pF output capacitance. Reference Sections Referring to the Block Diagram on page 2, the VREF and Temperature Sense (VTS) outputs are summed together (Σ) and then passed through the output gain stage (A). The voltage output is programmable and is determined by the following equation: ⎧ n ( 2 • m ) – 255 ⎫ V OUT = A V • ⎨ V REF • --------- + V TS ------------------------------- ⎬ 255 255 ⎩ ⎭ (EQ. 1) A2, A1, A0 Hardware slave address pins that can be used to provide several ISL21400 with a unique physical address to allow for multiple devices off one I2C bus. where • AV = 1, 2, 4 • VREF = 1.200 (not temperature dependent) • 0 ≤ n ≤ 255 (setting contained in Register 0, VREF) • VTS = K(T-T0) • K = dVTS/ dT = -2.1mV/C • T = device temperature • T0 = +25°C • 0 ≤ m ≤ 255 (setting contained in Register 1, TS) See the Applications Information for ways to use Equation 1 and methods for output voltage calculations. GND This is the circuit ground pin. It is common for the VOUT and control signal inputs. SDA Serial Data Input/Output. Bidirectional pin used for serial data transfer. As an output, it is open drain and may be wire-ored with any number of open drain or open collector outputs. A pullup resistor is required and the value is dependent on the speed of the serial data bus and the number of outputs tied together. SCL Serial Clock Input. Accepts a clock signal for clocking serial data into and out of the device. The SCL line requires a pullup resistor whose value is dependent on the speed of the serial clock bus and the number of inputs tied together. DACs Section The ISL21400 contains two 8-bit DACs whose registers can be programmed via the I2C serial bus. The DAC registers are non-volatile such that the values are restored during the VCC power-up cycle of the device. One DAC (VREF)is dedicated to scale the bandgap voltage reference (Temperature invariant) and the other DAC (VTS) is dedicated to scale the Temperature Sensor. Both of these DACs can determine the output voltage as defined by Equation 1 (See Register Information). VCC Positive Power Supply. Connect to a voltage supply in the range of 2.7V < VCC < 5.5V, with minimum noise and ripple. For best performance, bypass with a 0.1µF capacitor to ground. If the AV gain is set to 4 and VOUT approaches 5.0V, then VCC must be set to >5.2V for best output performance. Output Gain Amplifier Section Functional Description Functional Overview Refer to the Functional Block Diagram on page 2. The ISL21400 provides a programmable output voltage which combines both a temperature independent term and a temperature dependent term. The temperature independent term uses a bandgap voltage reference, and the temperature dependent term uses a Proportional To Absolute Temperature (PTAT) reference, or Temperature Sensor. Each voltage source is scalable using two DACs via the I2C serial bus. The resulting output voltage can vary from 0V to over 5V and has a variable, programmable Temperature Slope (TS). The ISL21400 contains an output gain amplifier (A) that is programmed via the I2C serial bus. The gain amplifier is the last stage before the output and therefore controls the overall gain for the device. The gain can be programmed for 1x, 2x, or 4x amplification. This gain factor is used to program the output voltage as determined by Equation 1 (See Register Description). There are 5 registers in the ISL21400 device, all nonvolatile (see Table 2). All registers are accessible for reading or writing through the I2C serial bus. 10 FN8091.0 December 14, 2006 ISL21400 Register Descriptions TABLE 1. ISL21400 REGISTER BIT MAP Addr 0 1 2 3 4 D7 (MSB) VREF7 TS7 D7 D7 D7 D6 VREF6 TS6 D6 D6 D6 D5 VREF5 TS5 D5 D5 D5 D4 VREF4 TS4 D4 D4 D4 D3 VREF3 TS3 D3 D3 D3 D2 VREF2 TS2 D2 D2 D2 D1 VREF1 TS1 GAIN1 D1 D1 D0 (LSB) VREF0 TS0 GAIN0 D0 D0 TABLE 2. REGISTER DESCRIPTIONS REG 0 1 2 3 4 NONVOLATILE Y Y Y Y Y DESCRIPTION Reference setting Temperature Sensor setting Gain and storage Storage Storage and the resulting output gain. Note that two states produce the same gain (Gain 1:0 set to 01b and 10b) of x2. The other 6 bits in the register can be used for general purpose memory (nonvolatile) or left alone. Registers 3 and 4: general purpose data (nonvolatile) These two registers are one byte each and can be used for general purpose nonvolatile memory. Register 0: Bandgap Reference Gain (Nonvolatile) Register 0 sets the output voltage of the bandgap reference (VREF). Referring to Equation 1, the number “n” is the setting from Register 0 as follows: n V REF • --------- , for n=0 to 255 255 I2C Serial Interface The ISL21400 supports a bidirectional bus oriented protocol. The protocol defines any device that sends data onto the bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is the master and the device being controlled is the slave. The master always initiates data transfers and provides the clock for both transmit and receive operations. Therefore, the ISL21400 operates as a slave device in all applications. All communication over the I2C interface is conducted by sending the MSB of each byte of data first. This term of Equation 1 can vary from 0 to 1.20V. Register 1: Temperature Slope Gain (Nonvolatile) Register 1 sets the Temperature Slope (TS) of the temperature sensor. Referring to Equation 1, the number “m” is the setting from Register 1 as follows: ( 2 • m ) – 255 V TS ------------------------------255 Protocol Conventions Data states on the SDA line can change only during SCL LOW periods. SDA state changes during SCL HIGH are reserved for indicating START and STOP conditions (See Figure 10). On power-up of the ISL21400 the SDA pin is in the input mode. All I2C interface operations must begin with a START condition, which is a HIGH to LOW transition of SDA while SCL is HIGH. The ISL21400 continuously monitors the SDA and SCL lines for the START condition and does not respond to any command until this condition is met (See Figure 10). A START condition is ignored during the powerup sequence and during non-volatile write cycles for the device. All I2C interface operations must be terminated by a STOP condition, which is a LOW to HIGH transition of SDA while SCL is HIGH (See Figure 10) A STOP condition at the end of a read operation, or at the end of a write operation places the device in its standby mode. A STOP condition at the end of a write operation to a non-volatile byte initiates an internal VTS is the temperature dependent term and varies from +136mV at -40°C to -126mV at +85°C. The other term varies from -1 to +1 and scales the temperature term before adding to the VREF portion. Register 2: Device Gain and Storage (nonvolatile) TABLE 3. REGISTER 2 OUTPUT GAIN (NONVOLATILE): OUTPUT GAIN GAIN1 0 0 1 1 GAIN0 0 1 0 1 OUTPUT GAIN, AV x1 x2 x2 x4 Register 2 contains 2 bits (2 LSB’s) which control the output gain of the device. Table 3 shows the state of these two bits 11 FN8091.0 December 14, 2006 ISL21400 non-volatile write cycle. The device enters its standby state when the internal, non-volatile write cycle is completed. An ACK, Acknowledge, is a software convention used to indicate a successful data transfer. The transmitting device, either master or slave, releases the SDA bus after transmitting eight bits. During the ninth clock cycle, the receiver pulls the SDA line LOW to acknowledge the reception of the eight bits of data (See Figure 11). The ISL21400 responds with an ACK after recognition of a START condition followed by a valid Identification Byte, and once again after successful receipt of an Address Byte. The ISL21400 also responds with an ACK after receiving a Data Byte of a write operation. The master must respond with an ACK after receiving a Data Byte of a read operation. A valid Identification Byte contains 0101 A2 A1 A0 as the seven MSBs. The A2 A1 A0 bits must correspond to the logic levels at those pins of the ISL21400 device. The LSB in the Read/Write bit. Its value is “1” for a Read operation, and “0” for a Write operation (See Table 4) Read Operation A Current Address Read operation is shown in Figure 13. It consists of a minimum 2 bytes: a START followed by the ID byte from the master with the R/W bit set to 1, then an ACK followed by the data byte or bytes sent by the slave. The master terminates the Read operation by not responding with an ACK and then issuing a STOP condition. This operation is useful if the master knows the current address and desires to read one or more data bytes. A Random Address Read operation consists of a three byte “dummy write” instruction followed by a Current Address Read operation (See Figure 14). The master initiates the operation issuing the following sequence: a START, the identification byte with the R/W bit set to "0", an Address Byte, a second START, and a second Identification byte with the R/W bit set to "1". After each of the three bytes, the ISL21400 responds with an ACK. The ISL21400 then transmits Data Bytes as long as the master responds with an ACK during the SCL cycle following the eighth bit of each byte. The master terminates the Read operation (issuing a STOP condition) following the last bit of the last Data Byte (See Figure 13). The Data Bytes are from the registers indicated by an internal pointer. This pointer initial’s value is determined by the Address Byte in the Read operation instruction, and increments by one during transmission of each Data Byte. Address 04h is the last valid data byte, higher addresses are not available. Data from addresses higher than memory location 04h will be invalid. Write Operation TABLE 4. IDENTIFICATION BYTE FORMAT 0 (MSB) 1 0 1 A2 A1 A0 R/W (LSB) A Write operation requires a START condition, followed by a valid Identification Byte, a valid Address Byte, a Data Byte, and a STOP condition. After each of the three bytes, the ISL21400 responds with an ACK. The master will then send a STOP and at this time the device begins its internal nonvolatile write cycle. During this time, the device ignores transitions at the SDA and SCL pins, and the SDA output is at a high impedance state. When the internal non-volatile write cycle is completed, the ISL21400 enters its standby state (see Figure 12). STOP conditions that terminate write operations must be sent by the master after sending at least 1 full data byte and its associated ACK signal. If a STOP byte is issued in the middle of a data byte, or before 1 full data byte + ACK is sent, then the ISL21400 resets itself without performing the write. The contents of the array are not affected. Data Protection A valid Identification Byte, Address Byte, and total number of SCL pulses act as a protection for the registers. A STOP condition also acts as a protection for non-volatile memory. During a Write sequence, the Data Byte is loaded into an internal shift register as it is received. The presence of the STOP condition after the rest of the bits are received then triggers the non-volatile write. 12 FN8091.0 December 14, 2006 ISL21400 SCL SDA START DATA STABLE DATA CHANGE DATA STABLE STOP FIGURE 14. VALID DATA CHANGES, START AND STOP CONDITIONS SCL FROM MASTER SDA OUTPUT FROM TRANSMITTER 1 8 9 HIGH SDA OUTPUT FROM RECEIVER START HIGH ACK FIGURE 15. ACKNOWLEDGE RESPONSE FROM RECEIVER WRITE SIGNALS FROM THE MASTER S T A R T IDENTIFICATION BYTE WITH R/W = 0 S T O P ADDRESS BYTE DATA BYTE SIGNAL AT SDA SIGNALS FROM THE ISL21400 01 0 1 A2 A1 A0 0 0000 0 A C K A C K A C K FIGURE 16. BYTE WRITE SEQUENCE READ SIGNALS FROM THE MASTER S T A R T IDENTIFICATION BYTE WITH R/W = 1 A C K A C K S T O P SIGNAL AT SDA SIGNALS FROM THE SLAVE 0 1 0 1 A2 A1 A0 1 A C K FIRST READ DATA BYTE LAST READ DATA BYTE FIGURE 17. ADDRESS READ SEQUENCE SIGNALS FROM THE MASTER S T A IDENTIFICATION R BYTE WITH R/W = 0 T 0 1 0 1 A AA0 ADDRESS BYTE S T A R IDENTIFICATION T BYTE WITH R/W = 1 0 1 0 1 AAA1 A C K A C K S T O P SIGNAL AT SDA SIGNALS FROM THE SLAVE 00000 A C K A C K A C K FIRST READ DATA BYTE LAST READ DATA BYTE FIGURE 18. RANDOM ADDRESS READ SEQUENCE 13 FN8091.0 December 14, 2006 ISL21400 Applications Information Power-Up Considerations The ISL21400 has on-chip EEPROM memory storage for the DAC and gain settings of the device. These settings must be recalled correctly on power-up for proper operation. Normally there are no issues with recall, although it is always best to provide a smooth, glitch-free power-up waveform on VCC. Adding a small 0.1μF capacitor at the device VCC will help with power-up as well as VOUT load changes. with VCC = 5.5V). The Resolution of VOUT(DC) control changes with AV, so that with a 4.80V full scale output (AV = 4), the resolution is 4.80/255 or 18.8mV/bit. With AV = 1, the resolution is 4.7mV/bit. TEMP SENSE CONTROL DISCUSSION The equation above yields this expression, Equation 3, for Temp Slope: V OUT ( TS ) = A V • V TS • A TS (EQ. 3) Noise Performance The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 90µVP-P. The noise measurement is made with a bandpass filter made of a 1 pole high-pass filter with a corner frequency at 0.1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Load capacitance up to 5000pF can be added but will result in only marginal improvements in output noise and transient response. The output stage of the ISL21400 is not designed to drive heavily capacitive loads. For high impedance loads, an R-C network can be added to filter high frequency noise and preserve DC control. Since VTS = K(T-T0), the slope term is dependent on the base temp slope of the device, K (-2.1mV/°C), and the gain terms AV and ATS. This gives a formula for the portion of VOUT at a specific temperature: V OUT ( TS ) = A V • K • A TS • ( T – T 0 ) (EQ. 4) The product AV*ATS ranges from -4 to 4, so the Temperature Slope can range from -8.4 to +8.4mV/°C, which is independent of the output DC voltage. The resolution of Slope control is determined by this range (±8.4mV/°C) and the gain terms, and will vary from 65.8μV/°C/bit (AV = 4) down to 16.2μV/°C/bit (AV = 1). At T = T0 = +25°C, VOUT(TS) = zero, no changes in ATS will cause a change in VOUT, and VOUT will only vary with the VOUT(DC) control. As temperature increases or decreases, from T = +25°C, VOUT will then change according to the programmed Temp Slope. In many cases a form of Equation 4 is needed which yields a VOUT change with respect to temperature. By rearranging, we get: V OUT ( TS ) V OUT ( T ) = ---------------------------- = A V • K • A TS ,(in mV/ ° C ) ( T – T0 ) (EQ. 5) Output Voltage Programming Considerations Setting and controlling the output voltage of the ISL21400 can be done easily by breaking down the components into temperature variant and invariant, and setting them separately. Let’s use Equation (1) above to derive separate Reference Output and Output Temp Slope equations: ⎧ ( 2 • m ) – 255 ⎫ n⎫ ⎧ V OUT = ⎨ A V • V REF • --------- ⎬ + ⎨ A V • V • ⎛ ----------------------------------⎞ ⎬ ⎠ TS ⎝ 255 255 ⎭ ⎩ ⎭ ⎩ = { A V • V REF • A REF } + { A V • V • A TS } ,Eq. 2 TS Reference Term + Temp Slope Term The first term controls the output DC value, and the second term controls the Temp slope, where nA REF = --------- (ranges from 0 to 1) 255 ( 2 • m ) – 255 A TS = ⎛ ----------------------------------⎞ ⎝ ⎠ 255 (ranges from -1 to +1) EXAMPLE 1: PROGRAMMED TEMPERATURE COMPENSATION EXAMPLE The ISL21400 can easily compensate for known temperature drift by programming the device for the initial VOUT setting and Tempco using standard equations and some simple steps. The accuracy of the final programmed output will be limited to the data sheet specs (typically 1% accuracy for VOUT and Slope). In this example, an N-channel MOSFET gate has a -2.8mV/°C Tempco from -10°C to +85°C. A constant bias drain current is desired, with a target Vgs range derived from the data sheet of 2.5V to 3.5V at +25°C. Offset Setting: Using Equation 2 and targeting VOUT = 3.0VDC, V OUT ( DC ) = ( A V • V REF • A REF ) = 3.00V V REF = 1.20V A V • A OS = 2.50 DC OUTPUT CONTROL DISCUSSION The equation above yields this expression, Equation 2, for Reference output: V OUT (DC) = A • V REF • A REF V (EQ. 2) Note that the DC term is dependent on the 1.20V reference voltage, which is constant, the overall gain, AV, and the Reference gain, AREF. Since the product AV * AREF ranges from 0 to 4, the total reference DC output can range from 0.0V to 4.8V. In order to get the 4.8V output, VCC must be greater than 4.8V by the output dropout plus any overhead for output loading (the specification for VOUT = 5.0V is listed 14 FN8091.0 December 14, 2006 ISL21400 Note that AREF varies from 0 to 1, so to get 2.40, AV = 4. 2.50 n A ( REF ) = ---------- = 0.625 = --------4 255 n = 159 decimal = 9F hex Also, to solve for overall temp slope of the output: 6 0.8812mV ⁄ ° C --------------------------------------- • 10 = 1010ppm ⁄ ° C 872.5mV Note that Equation 1 can be used directly to solve for output voltage at a given temperature, in this case +85°C: ⎧ n ( 2 • m ) – 255 ⎫ V OUT = A V • ⎨ V REF • --------- + K ( T – T 0 ) ------------------------------- ⎬ 255 255 ⎩ ⎭ ⎧ 178 ( 2 • 74 ) – 255 ⎫ V OUT ( 85 ° C ) = 1 • ⎨ 1.20 • --------- + ( – 0.0021 ) ( 85 – 25 ) --------------------------------- ⎬ 255 255 ⎩ ⎭ = 0.8905V Temperature Slope Setting: Using Equation 5, which can solve for Slope directly: V OUT ( TS ) = A V • K • A PTAT = – 2.8mV ⁄ ° C – 2.8 A PTAT = ------------------4 • – 2.1 ( 2 • m ) – 255 A PTAT = 0.333 = ---------------------------------255 m = 170 decimal = A9 hex Typical Applications Circuits LDMOS RF Power Amplifier (RFPA). The ISL21400 is used to set the gate bias for the LDMOS transistor in a single stage of an RFPA. Normally this is done with a DAC or digital potentiometer with some discrete temperature compensation circuitry. The ISL21400 simplifies this control and allows a full range of DC bias and tempco control. A typical circuit can be calibrated for correct bias at room temperature (+25°C) on power-up using a microcontroller or direct I2C control. The temperature of the unit can then be increased to the highest operating range, and the Temperature Slope setting can then be adjusted to bring the amplifier back to correct bias. Since the Temp Slope setting has a negligible effect on the room temperature setting, the amplifier will be biased correctly over the operating temperature of the unit. The ISL21400 device can be programmed with these calculated parameters and perform temperature compensation or direct control in the target circuit. If parameters change for some reason, then the device can be reprogrammed with new values and the circuit retested. EXAMPLE 2. CALCULATING THE VOUT TEMPERATURE SLOPE In some applications, it may be desirable to calculate what the output voltage and temp slope are, given the programmed register settings. Such an application could be a closed loop system with internal calibration procedure. By reading the registers of the ISL21400, then calculating the VOUT parameters, the system characteristics can be recorded. For the example below, let’s determine the voltage output, VOUT(DC) at +25°C, and also the change due to temperature variation (ppm) from +25°C to +85°C. Equations 2 and 5 above will be used to calculate the answers. Given, the contents of the registers: AV = 1 n = 178 decimal m = 74 decimal Using Equation 2: V OUT ( DC ) = ( A V • V REF • A REF ) 178 = ⎛ 1 • 1.20 • ---------⎞ ⎝ 255⎠ = 0.8376V Using Equation 5: V OUT ( T ) = ( A V • K • A TS ) m V ⁄ ° C ( 2 • 74 ) – 255 = 1 • – 2.1 • ----------------------------------255 = 0.8812mV ⁄ ° C 15 FN8091.0 December 14, 2006 ISL21400 +28V U2 1 IN OUT 3 2 GND +5V REGULATOR +28V I2C BUS 5 6 1 2 3 SCL SDA A0 A1 A2 A2 VCC VOUT 8 7 R1 1k R2 100 C1 100pF RF OUTPUT L1 GND 4 ISL21400 C2 RF INPUT Q1 LDMOS FIGURE 19. LDMOS RFPA BIAS CONTROL 16 FN8091.0 December 14, 2006 ISL21400 Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 -BE INCHES SYMBOL A ABC MILLIMETERS MIN 0.94 0.05 0.75 0.25 0.09 2.95 2.95 4.75 0.40 8 0.07 0.07 5o 0o 15o 6o MAX 1.10 0.15 0.95 0.36 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 Rev. 2 01/03 MIN 0.037 0.002 0.030 0.010 0.004 0.116 0.116 0.187 0.016 8 0.003 0.003 5o 0o MAX 0.043 0.006 0.037 0.014 0.008 0.120 0.120 0.199 0.028 INDEX AREA 12 TOP VIEW 0.20 (0.008) A1 A2 4X θ 0.25 (0.010) GAUGE PLANE SEATING PLANE -C- R1 R b c D E1 A A2 4X θ L L1 e E L L1 N R 0.026 BSC 0.65 BSC A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE 0.037 REF 0.95 REF C a C L E1 C R1 0 SIDE VIEW 15o 6o α -B- 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 17 FN8091.0 December 14, 2006
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