ISL3158AEMW

® ISL3158AE Data Sheet April 3, 2009 FN6886.0 ±16.5kV ESD (IEC61000-4-2) Protected, Large Output Swing, 5V, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceiver The ISL3158AE is a BiCMOS, IEC61000 ESD protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. Each driver output and receiver input is protected against ±16.5kV ESD strikes without latch-up. The ISL3158AE transmitter delivers exceptional differential output voltages (2.4V min), into the RS-485 required 54Ω load, for better noise immunity or to allow up to eight 120Ω terminations in “star” or other non-standard bus topologies. This device has very low bus currents (+125µA/-75µA), so it presents a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or on a terminated but undriven bus. Rx outputs feature high drive levels - typically 28mA @ VOL = 1V (to ease the design of optocoupled isolated interfaces). Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state until the power supply has stabilized, and the Tx outputs are fully short circuit protected. The ISL3158AE is a half duplex version. It multiplexes the Rx inputs and Tx outputs to allow transceivers with output disable functions in an 8 Ld package. Features • High Driver VOD . . . . . . . . . . . . . . 2.4V (Min) @ RD = 54Ω - Better Noise Immunity, or Drive Up to 8 Terminations • IEC61000 ESD Protection on RS-485 I/O Pins . . ±16.5kV - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM • Full Fail-safe (Open, Short, Terminated and Undriven) Receivers • High Rx IOL to Drive Opto-Couplers for Isolated Applications • Hot Plug Circuitry - Tx and Rx Outputs Remain Three-State During Power-up/Power-down • True 1/8 Unit Load Allows up to 256 Devices on the Bus • Specified for Single 5V, 10% Tolerance, Supplies • High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 10Mbps • Low Quiescent Supply Current . . . . . . . . . . . . . . . 600µA Ultra Low Shutdown Supply Current . . . . . . . . . . . . 70nA • -7V to +12V Common Mode Input Voltage Range • Half Duplex Pinouts • Pb-free (RoHS compliant) • Three-State Rx and Tx Outputs • Current Limiting for Driver Overload Protection Applications • Utility Meters and Automated Meter Reading Systems • High Node Count Systems • PROFIBUS® and Field Bus Networks, and Factory Automation • Security Camera Networks • Building Lighting and Environmental Control Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3158AEM ISL3158AEMW HALF/FUL L DUPLEX Half Half DATA RATE (Mbps) 10 10 SLEW-RATE # DEVICES LIMITED? HOT PLUG ON BUS No No Yes Yes 256 256 Rx/Tx ENABLE? Yes Yes QUIESCENT ICC (µA) 600 600 LOW POWER PIN SHUTDOWN? COUNT Yes Yes 8 N/A 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3158AE Pinout ISL3158AE (8 LD SOIC) TOP VIEW RO 1 RE 2 DE 3 DI 4 D 8 7 6 5 VCC B/Z A/Y GND R Ordering Information PART NUMBER (Note) ISL3158AEMBZ* ISL3158AEMW PART MARKING 3158A EMBZ TEMP. RANGE (°C) -55 to +125 -55 to +125 PACKAGE (Pb-Free) 8 Ld SOIC Wafer PKG. DWG. # M8.15 *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN6886.0 April 3, 2009 ISL3158AE Truth Tables TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X Z 0 1 High-Z High-Z* OUTPUTS Y 1 0 High-Z High-Z* 0 0 0 1 1 RE RECEIVING INPUTS DE DE Half Duplex Full Duplex 0 0 0 0 1 X X X 0 1 A-B ≥ -0.05V ≤ -0.2V Inputs Open/Shorted X X OUTPUT RO 1 0 1 High-Z* High-Z NOTE: *Shutdown Mode (See Note 7). NOTE: *Shutdown Mode (See Note 7). Pin Descriptions PIN RO RE DE DI GND A/Y FUNCTION Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. System power supply input (4.5V to 5.5V). B/Z VCC 3 FN6886.0 April 3, 2009 ISL3158AE Typical Operating Circuit ISL3158AE +5V + 8 VCC 1 RO 2 RE 3 DE 4 DI R B/Z A/Y 7 6 RT RT 7 6 B/Z A/Y 0.1µF 0.1µF + 8 VCC D DI 4 DE 3 RE 2 R GND 5 GND 5 RO 1 +5V D 4 FN6886.0 April 3, 2009 ISL3158AE Absolute Maximum Ratings VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V A/Y, B/Z (Transient Pulse Through 100Ω) . . . . . . . . . . . . . . ±25V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . See Specifications Table Thermal Information Thermal Resistance (Typical, Note 1) θJA (°C/W) 8 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS PARAMETER DC CHARACTERISTICS Driver Differential VOUT (No load) Driver Differential VOUT (Loaded) VOD1 VOD2 RL = 100Ω (RS-422) (Figure 1A) RL = 54Ω (RS-485) (Figure 1A) RL = 15Ω (Eight 120Ω terminations) (Note 10) RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full Full Full 25 Full Full 2.8 2.4 2.4 - 3.6 3.1 1.65 3 0.01 VCC VCC 0.2 V V V V V V Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage DI Input Hysteresis Voltage Logic Input Current Input Current (A/Y, B/Z) ΔVOD RL = 54Ω or 100Ω (Figure 1A) VOC ΔVOC RL = 54Ω or 100Ω (Figure 1A) RL = 54Ω or 100Ω (Figure 1A) Full Full - 0.01 3.15 0.2 V V VIH VIL VHYS IIN1 IIN2 DE, DI, RE DE, DI, RE Full Full 25 2 -2 -75 -200 VCC - 1.2 15 100 70 55 -90 20 4.3 0.25 28 0.8 2 125 ±250 -50 0.5 - V V mV µA µA µA mA mV mV V V mA DE, DI, RE DE = 0V, VCC = 0V or 5.5V VIN = 12V VIN = -7V Full Full Full Full Full 25 Full Full Full Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage Receiver Output Low Voltage Receiver Output Low Current IOSD1 VTH ΔVTH VOH VOL IOL DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4) -7V ≤ VCM ≤ 12V (Note 12) VCM = 0V IO = -8mA, VID = -50mV IO = -8mA, VID = -200mV VO = 1V, VID = -200mV 5 FN6886.0 April 3, 2009 ISL3158AE Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued) SYMBOL IOZR RIN IOSR TEST CONDITIONS 0.4V ≤ VO ≤ 2.4V -7V ≤ VCM ≤ 12V 0V ≤ VO ≤ VCC TEMP (°C) Full Full Full MIN -1 96 ±7 TYP 0.03 160 65 MAX 1 ±85 UNITS µA kΩ mA PARAMETER Three-State (High Impedance) Receiver Output Current Receiver Input Resistance Receiver Short-Circuit Current SUPPLY CURRENT No-Load Supply Current (Note 3) ICC Half Duplex Versions, DE = VCC, RE = X, DI = 0V or VCC All Versions, DE = 0V, RE = 0V, or Full Duplex Versions, DE = VCC, RE = X. DI = 0V or VCC Full Full Full - 650 550 0.07 800 700 3 µA µA µA Shutdown Supply Current ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) ISHDN DE = 0V, RE = VCC, DI = 0V or VCC IEC61000-4-2, Air-Gap Discharge Method 1/2 Duplex 25 25 25 25 25 - ±16.5 ±9 ±16.5 ±7 400 - kV kV kV kV V IEC61000-4-2, Contact Discharge Method Human Body Model, From Bus Pins to GND All Pins Human Body Model, per MIL-STD-883 Method 3015 Machine Model DRIVER SWITCHING CHARACTERISTICS (ISL3158AE) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 470pF (Figure 4), (Note 12) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 5) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 5) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Notes 7, 12) Full Full Full Full Full Full Full Full Full Full Full - 21 0.2 12 10 30 28 50 38 160 - 30 3 16 45 45 65 65 200 200 ns ns ns Mbps ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 7, 8) tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 7, 8) RECEIVER SWITCHING CHARACTERISTICS (ISL3158AE) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output Low fMAX (Figure 5) (Note 12) Full Full Full Full 10 33 2.5 8 50 5 15 Mbps ns ns ns tPLH, tPHL (Figure 5) tSKD tZL (Figure 5) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 6) 6 FN6886.0 April 3, 2009 ISL3158AE Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued) SYMBOL tZH tLZ tHZ tSHDN TEST CONDITIONS RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 6) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) (Notes 7, 12) TEMP (°C) Full Full Full Full Full Full MIN 60 TYP 7 8 8 160 MAX 15 15 15 600 200 200 UNITS ns ns ns ns ns ns PARAMETER Receiver Enable to Output High Receiver Disable from Output Low Receiver Disable from Output High Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low NOTES: tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 7, 9) tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 7, 9) 2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 3. Supply current specification is valid for loaded drivers when DE = 0V. 4. Applies to peak current. See “Typical Performance Curves” beginning on page 12 for more information. 5. Keep RE = 0 to prevent the device from entering SHDN. 6. The RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 9. Set the RE signal high time >600ns to ensure that the device enters SHDN. 10. See Figure 8 for more information, and for performance over-temperature. 11. For wafer sale, the switching test limits are established by characterization. 12. Limits established by characterization and are not production tested. Test Circuits and Waveforms VCC DE DI D Y Z VOD RL/2 VCC 375Ω DE DI D Y Z VOD RL = 60Ω VCM -7V TO +12V 375Ω RL/2 VOC FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 7 FN6886.0 April 3, 2009 ISL3158AE Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPLH OUT (Z) DE DI D Y SIGNAL GENERATOR Z RDIFF CL = 100pF DIFF OUT (Y - Z) tR 90% 10% CL = 100pF OUT (Y) tPHL VOH VOL VCC 90% 10% tF +VOD -VOD SKEW = |tPLH - tPHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI D SIGNAL GENERATOR Y CL DE NOTE 7 1.5V 1.5V 0V tHZ VOH - 0.5V OUT (Y, Z) 2.3V 0V tZL, tZL(SHDN) NOTE 7 OUT (Y, Z) tLZ VCC 2.3V OUTPUT LOW VOL + 0.5V V OL VOH SW Z 500Ω VCC GND 3V PARAMETER OUTPUT tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RE X X 0 (Note 5) 0 (Note 5) 1 (Note 8) 1 (Note 8) DI 1/0 0/1 1/0 0/1 1/0 0/1 SW GND VCC GND VCC GND VCC CL (pF) 15 15 100 100 100 100 tZH, tZH(SHDN) NOTE 7 OUTPUT HIGH FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES VCC DE + 3V DI 0V DI D Z 60Ω Y CD VOD - SIGNAL GENERATOR DIFF OUT (Y - Z) -VOD +VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE FIGURE 4B. MEASUREMENT POINTS 8 FN6886.0 April 3, 2009 ISL3158AE Test Circuits and Waveforms (Continued) RE 0V B A R 15pF RO tPLH SIGNAL GENERATOR 1.5V tPHL VCC RO 1.5V 0V A 0V 0V -1.5V +1.5V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE RE GND SIGNAL GENERATOR B A R RO 1kΩ SW 15pF RE 1.5V 1.5V 0V VCC GND NOTE 7 3V PARAMETER tHZ tLZ tZH (Note 6) tZL (Note 6) tZH(SHDN) (Note 9) tZL(SHDN) (Note 9) DE 0 0 0 0 0 0 A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC tZH, tZH(SHDN) NOTE 7 RO tHZ OUTPUT HIGH VOH - 0.5V 1.5V 0V VOH tZL, tZL(SHDN) NOTE 7 RO 1.5V tLZ VCC VOL + 0.5V V OL OUTPUT LOW FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES 9 FN6886.0 April 3, 2009 ISL3158AE Application Information RS-485 and RS-422 are differential (balanced) data transmission standards used for long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for long runs, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Outputs of the ISL3158AE driver is not limited, so faster output transition times allow data rates of at least 10Mbps High VOD Improves Noise Immunity and Flexibility The ISL3158AE driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The minimum ±2.4V VOD guarantees at least ±900mV more noise immunity than networks built using standard 1.5V VOD transmitters. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL3158AE in “star” and other multi-terminated, “non-standard” network topologies. Figure 8, details the transmitter’s VOD vs IOUT characteristic, and includes load lines for six (20Ω) and eight (15Ω) 120Ω terminations. The figure shows that the driver typically delivers 1.65/1.5V into 6/8 terminations, even at the worst case temperature of +85°C.The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL3158AE delivers RS-485 voltage levels with 3x to 4x the number of terminations. Receiver (Rx) Features This device utilizes a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Rx outputs feature high drive levels (typically 28mA @ VOL = 1V to ease the design of optically coupled isolated interfaces). Receiver input resistance of 96kΩ surpasses the RS-422 specification of 4kΩ, and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, this product is known as a “one-eighth UL” transceiver, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Rx inputs function with common mode voltages as great as ±7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages are a realistic concern. All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3158AE devices incorporate a “Hot Plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~3.4V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. DE, DI = VCC RE = GND 5.0 3.5V VCC DRIVER Y OUTPUT (V) 0 5.0 2.5 0 RL = 1kΩ RO ISL3158AE 0 5.0 2.5 RECEIVER OUTPUT (V) A /Y ISL3158AE RL = 1kΩ 3.3V 2.5 Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 2.4V across a 54Ω load (RS-485), and at least 2.8V across a 100Ω load (RS-422). The driver features low propagation delay skew to maximize bit width, and to minimize EMI, and all drivers are three-stateable via the active high DE input. 10 TIME (40µs/DIV) FIGURE 7. HOT PLUG PERFORMANCE (ISL3158AE) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY FN6886.0 April 3, 2009 VCC (V) ISL3158AE ESD Protection All pins on this device includes class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±16.5kV (1/2 duplex) IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 10Mbps devices, to minimize reflections. Terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard’s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The ISL3158AE 1/2 duplex RS-485 pins withstand ±16.5kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±9kV. The RS-485 pins of all the ISL3158AE versions survive ±9kV contact discharges. Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limit circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, even at the common mode voltage range extremes. Low Power Shutdown Mode This CMOS transceiver uses a fraction of the power required by it’s bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 70nA trickle. This device enters shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 5, 6, 7, 8 and 9, at the end of the “Electrical Specification” table on page 6, for more information. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 10Mbps are limited to lengths of less than 100’. 11 FN6886.0 April 3, 2009 ISL3158AE Typical Performance Curves 140 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 RD = 1 5Ω RD = 20Ω RD = 100Ω R D = 5 4Ω +85°C +25°C VCC = 5V, TA = +25°C; Unless Otherwise Specified. 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.8 -60 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 RDIFF = 54Ω RDIFF = 100Ω 0 1 2 3 4 DIFFERENTIAL OUTPUT VOLTAGE (V) 5 FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 150 Y OR Z = LOW OUTPUT CURRENT (mA) 100 50 0 -50 -100 Y OR Z = HIGH -150 -200 -7 ICC (µA) 700 650 600 550 500 450 400 350 300 -60 ICC DE-GND ICC DE-VCC -6 -4 -2 0 2 4 6 8 10 12 -40 -20 0 20 40 60 80 100 120 OUTPUT VOLTAGE (V) TEMPERATURE (°C) FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 11. SUPPLY CURRENT vs TEMPERATURE 0.9 31 29 27 SKEW (ns) TPLH 19 17 -60 -45 -30 -15 0.1 0 0 15 30 45 60 75 90 105 120 -60 -45 -30 -15 0 TEMPERATURE (°C) SKEW 15 30 45 60 TEMPERATURE (°C) 75 90 105 120 25 23 21 TPHL 0.8 0.7 0.6 0.5 0.4 0.3 0.2 PROPOGATION DELAY (ns) FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3158AE) FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3158AE) 12 FN6886.0 April 3, 2009 ISL3158AE Typical Performance Curves RECEIVER OUTPUT (V) VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) DRIVER INPUT (V) RECEIVER OUTPUT CURRENT (mA) RDIFF = 54Ω, CL = 100pF DI 5 0 5 RO 0 60 VOL, +25°C 50 VOL, +85°C 40 30 VOH, +25°C 20 10 0 VOH, +85°C DRIVER OUTPUT (V) 5 4 3 2 1 TIME (20ns /DIV) A /Y B /Z 0 1 2 3 4 5 FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, (ISL3158AE) RECEIVER OUTPUT VOLTAGE (V) FIGURE 15. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 13 FN6886.0 April 3, 2009 ISL3158AE Die Characteristics DIE DIMENSIONS INCLUDING 50µM SCRIBE Thickness: 19 mils 1400µm x 1530µm TABLE 2. BOND PAD FUNCTION AND COORDINATES PAD # 1 2 3 4 5 FUNCTION RO RE DE DI GND2 GND1 Y A (half duplex) Z B A (full duplex) VCC X (µm) 99.5 99.5 99.5 99.5 574.3 684.3 1054 1054 1054 1054 1054 562.55 Y (µm) 1308 1014.35 498.3 286.75 104.7 104.7 250.6 540.45 831.1 1004.65 1256.45 1385.35 Interface Materials GLASSIVATION Sandwich TEOS and Nitride TOP METALLIZATION Type: Al with 0.5% Cu Thickness: 28kÅ SUBSTRATE N/A BACKSIDE FINISH Silicon/Polysilicon/Oxide 6 7 8 9 10 11 12 Assembly Related Information SUBSTRATE POTENTIAL GND (powered up) Additional Information WORST CASE CURRENT DENSITY N/A PROCESS Si GateBiCMOS, IBM P6 TRANSISTOR COUNT 530 PAD OPENING SIZE: 90µm x 90µm WAFER SIZE: 200mm (~8 inch) 14 FN6886.0 April 3, 2009 ISL3158AE Metallization Mask Layout ISL3158AE VCC RO A RE B Z A DE DI Y G2 G1 15 FN6886.0 April 3, 2009 ISL3158AE Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45° H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.25 0.40 8 8° 0° 8° MAX 1.75 0.25 0.51 0.25 5.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 0.2284 0.0099 0.016 8 0° MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 0.2440 0.0196 0.050 B C D E e H C α A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 16 FN6886.0 April 3, 2009