ISL3158E

±16.5kV ESD, Large Output Swing, 5V, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceivers ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E The ISL315xE are IEC61000 ESD protected, 5V powered transceivers that meet the RS-485 and RS-422 standards for balanced communication. Driver outputs and receiver inputs are protected against ±16.5kV ESD strikes without latch-up. Transmitters in this family deliver exceptional differential output voltages (2.4V min), into the RS-485 required 54Ω load, for better noise immunity, or to allow up to eight 120Ω terminations in “star” topologies. These devices have very low bus currents so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without using repeaters. Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or on a terminated but undriven bus. Rx outputs feature high drive levels - typically 28mA @ VOL = 1V (to ease the design of optocoupled isolated interfaces). Half duplex (Rx inputs and Tx outputs multiplexed together) and full duplex pinouts are available. See Table 1 on page 2 for key features and configurations by device number. ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Features • High Driver VOD . . . . . . . 2.4V (Min) @ RD = 54Ω Better Noise Immunity, or Drive Up to 8 Terminations • ±16.5kV IEC61000 ESD Protection on I/O Bus Pins • High Transient Overvoltage Tolerance . . . . ±100V • Full Fail-safe (Open, Short, Terminated) Receivers • High Rx IOL for Opto-Couplers in Isolated Designs • Hot Plug Circuitry - Tx and Rx Outputs Remain Three-State During Power-up/Power-down • True 1/8 Unit Load for up to 256 Devices on the Bus • High Data Rates . . . . . . . . . . . . . . up to 20Mbps • Low Quiescent Supply Current . . . . . . . . . 600µA Ultra Low Shutdown Supply Current . . . . . . 70nA Applications*(see page 17) • Utility Meters/Automated Meter Reading Systems • High Node Count Systems • PROFIBUS® and Field Bus Networks, and Factory Automation • Security Camera Networks • Building Lighting and Environmental Control Systems • Industrial/Process Control Networks Exceptional Tx Drives Up To 8 Terminations While Still Delivering 1.5V VOD 140 130 120 DRIVER OUTPUT CURRENT (mA) 110 100 90 80 70 60 50 40 30 20 10 0 8 TERMS 6 TERMS 1 TERM 2 TERMS Large VOD Delivers Superior Signal At Cable End For Enhanced Noise Immunity 3 ISL3158E 2 OUTPUT VOLTAGE (V) 1 0 -1 STANDARD 1.5V TX -2 -3 20Mbps, 150’ UTP, DOUBLE 120Ω TERMS 20ns/DIV 0 1 2 3 4 1.5 DIFFERENTIAL OUTPUT VOLTAGE (V) 5 July 30, 2009 FN6363.2 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2006-2009 All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3150E ISL3152E ISL3153E ISL3155E ISL3156E ISL3158E HALF/FULL DUPLEX Full Half Full Half Full Half DATA RATE (Mbps) 0.115 0.115 1 1 20 20 SLEWRATE LIMITED? Yes Yes Yes Yes No No HOT PLUG Yes Yes Yes Yes Yes Yes # DEVICES ON BUS 256 256 256 256 256 256 Rx/Tx ENABLE? Yes Yes Yes Yes Yes Yes QUIESCENT LOW POWER PIN ICC (µA) SHUTDOWN? COUNT 600 600 600 600 600 600 Yes Yes Yes Yes Yes Yes 10, 14 8 10, 14 8 10, 14 8 Ordering Information PART NUMBER ISL3150EIBZ (Notes 1, 3) ISL3150EIUZ (Notes 1, 3) ISL3152EIBZ (Notes 1, 3) ISL3152EIPZ (Notes 2, 3) ISL3152EIUZ (Notes 1, 3) ISL3153EIBZ (Notes 1, 3) ISL3153EIUZ (Notes 1, 3) ISL3155EIBZ (Notes 1, 3) ISL3155EIUZ (Notes 1, 3) ISL3156EIBZ (Notes 1, 3) ISL3156EIUZ (Notes 1, 3) ISL3158EIBZ (Notes 1, 3) ISL3158EIUZ (Notes 1, 3) PART MARKING 3150EIBZ 3150Z 3152EIBZ ISL3152 EIPZ 3152Z 3153EIBZ 3153Z 3155EIBZ 3155Z 3156EIBZ 3156Z 3158EIBZ 3158Z TEMP. RANGE (°C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld PDIP 8 Ld MSOP 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP PKG. DWG. # M14.15 M10.118 M8.15 E8.3 M8.118 M14.15 M10.118 M8.15 M8.118 M14.15 M10.118 M8.15 M8.118 1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), please see device information pages for ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E and ISL3158E. For more information on MSL please see techbrief TB363. Pin Configurations ISL3152E, ISL3155E, ISL3158E (8 LD MSOP, 8 LD SOIC, 8 LD PDIP) TOP VIEW RO 1 RE 2 DE 3 DI 4 D R 8 VCC 7 B/Z 6 A/Y 5 GND ISL3150E, ISL3153E, ISL3156E (10 LD MSOP) TOP VIEW RO 1 RE 2 DE 3 DI 4 GND 5 D R 10 VCC 9A 8B 7Z 6Y ISL3150E, ISL3153E, ISL3156E (14 LD SOIC) TOP VIEW NC 1 RO 2 RE 3 DE 4 DI 5 GND 6 GND 7 D R 14 VCC 13 NC 12 A 11 B 10 Z 9Y 8 NC 2 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Pin Descriptions PIN RO RE DE DI GND A/Y B/Z A B Y Z VCC NC FUNCTION Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and non inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting driver output. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting driver output. System power supply input (4.5V to 5.5V). No Connection. Truth Tables TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X Z 0 1 High-Z High-Z* OUTPUTS Y 1 0 High-Z High-Z* 1 1 0 1 0 0 0 RE DE Half Duplex 0 0 0 RECEIVING INPUTS DE Full Duplex X X X 0 1 A-B OUTPUT RO ≥ -0.05V ≤ -0.2V Inputs Open/Shorted X X 1 0 1 High-Z* High-Z NOTE: *Shutdown Mode (See Note 11). NOTE: *Shutdown Mode (See Note 11). 3 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Operating Circuit ISL3152E, ISL3155E, ISL3158E +5V 8 1 RO 2 RE 3 DE 4 DI D GND 5 GND 5 VCC R B/Z 7 A/Y 6 RT RT 7 6 B/Z A/Y R + 0.1µF + 0.1µF +5V 8 VCC D DI 4 DE 3 RE 2 RO 1 ISL3150E, ISL3153E, ISL3156E (SOIC PIN NUMBERS SHOWN) +5V 14 VCC 2 RO 3 RE 4 DE 5 DI Z 10 D GND 6, 7 Y9 RT 11 B 12 A GND 6, 7 R R + 0.1µF A 12 B 11 RT + 0.1µF 9Y 10 Z +5V 14 VCC D DI 5 DE 4 RE 3 RO 2 4 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Absolute Maximum Ratings VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . -9V to +13V A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω, Note 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100V RO . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . See Specification Table Thermal Information Thermal Resistance (Typical, Note 5) θJA (°C/W) Recommended Operating Conditions Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V Temperature Range . . . . . . . . . . . . . . . . -40°C to +85°C Bus Pin Common Mode Voltage Range . . . . . -7V to +12V 8 Ld SOIC . . . . . . . . . . . . . . . . . 105 8 Ld MSOP, PDIP* . . . . . . . . . . . . 140 10 Ld MSOP . . . . . . . . . . . . . . . . 130 14 Ld SOIC . . . . . . . . . . . . . . . . 130 Maximum Junction Temperature (Plastic Package) . +150°C Maximum Storage Temperature Range . . -65°C to +150°C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp *Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. TEST CONDITIONS TEMP MIN (°C) (Note 14) TYP MAX (Note 14) UNITS PARAMETER DC CHARACTERISTICS Driver Differential VOUT (No load) Driver Differential VOUT (Loaded) SYMBOL VOD1 VOD2 RL = 100Ω (RS-422) (Figure 1A) RL = 54Ω (RS-485) (Figure 1A) RL = 15Ω (Eight 120Ω terminations) (Note 15) RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full Full Full 25 Full Full 2.8 2.4 2.4 - 3.6 3.1 1.65 3 0.01 VCC VCC 0.2 V V V V V V Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage DI Input Hysteresis Voltage Logic Input Current Input Current (A, B, A/Y, B/Z) ΔVOD RL = 54Ω or 100Ω (Figure 1A) VOC ΔVOC RL = 54Ω or 100Ω (Figure 1A) RL = 54Ω or 100Ω (Figure 1A) Full Full - 0.01 3.15 0.2 V V VIH VIL VHYS IIN1 IIN2 DE, DI, RE DE, DI, RE Full Full 25 2 -2 -75 100 70 55 0.8 2 125 - V V mV µA µA µA DE, DI, RE DE = 0V, VCC = 0V or 5.5V VIN = 12V VIN = -7V Full Full Full 5 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEST CONDITIONS RE = 0V, DE = 0V, VCC = 0V or 5.5V RE = VCC, DE = 0V, VCC = 0V or 5.5V VIN = 12V VIN = -7V VIN = 12V VIN = -7V TEMP MIN (°C) (Note 14) Full Full Full Full Full Full 25 Full Full Full Full -40 -20 -200 VCC - 1.2 20 -1 TYP 1 -9 1 -9 -90 20 4.3 0.25 28 0.03 MAX (Note 14) UNITS 40 20 ±250 -50 0.4 1 µA µA µA µA mA mV mV V V mA µA PARAMETER Output Leakage Current (Y, Z) (Full Duplex Versions Only) Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex) Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage Receiver Output Low Voltage Receiver Output Low Current Three-State (High Impedance) Receiver Output Current Receiver Input Resistance Receiver Short-Circuit Current SUPPLY CURRENT No-Load Supply Current (Note 7) SYMBOL IIN3 IIN4 IOSD1 VTH ΔVTH VOH VOL IOL IOZR DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 8) -7V ≤ VCM ≤ 12V VCM = 0V IO = -8mA, VID = -50mV IO = -8mA, VID = -200mV VO = 1V, VID = -200mV 0.4V ≤ VO ≤ 2.4V RIN IOSR -7V ≤ VCM ≤ 12V 0V ≤ VO ≤ VCC Full Full 96 ±7 160 65 ±85 kΩ mA ICC Half Duplex Versions, DE = VCC, RE = X, DI = 0V or VCC All Versions, DE = 0V, RE = 0V, or Full Duplex Versions, DE = VCC, RE = X. DI = 0V or VCC Full Full - 650 550 800 700 µA µA Shutdown Supply Current ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) ISHDN DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.07 3 µA IEC61000-4-2, Air-Gap Discharge Method 1/2 Duplex Full Duplex 25 25 25 25 25 25 - ±16.5 ±10 ±9 ±16.5 ±7 400 - kV kV kV kV kV V IEC61000-4-2, Contact Discharge Method Human Body Model, From Bus Pins to GND All Pins Human Body Model, per MIL-STD-883 Method 3015 Machine Model 6 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEST CONDITIONS TEMP MIN (°C) (Note 14) TYP MAX (Note 14) UNITS PARAMETER SYMBOL DRIVER SWITCHING CHARACTERISTICS (115kbps Versions; ISL3150E, ISL3152E) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN tZH(SHDN) tZL(SHDN) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 820pF (Figure 4) (Note 17) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 9) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 9) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Note 11) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 11, 12) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 11, 12) Full Full Full Full Full Full Full Full Full Full Full 500 700 115 60 970 12 1100 2000 300 130 50 35 160 1300 50 1600 600 500 65 60 600 250 250 ns ns ns kbps ns ns ns ns ns ns ns DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL3153E, ISL3155E) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN tZH(SHDN) tZL(SHDN) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 820pF (Figure 4) (Note 17) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 9) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 9) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Note 11) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 11, 12) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 11, 12) Full Full Full Full Full Full Full Full Full Full Full 150 150 1 60 270 3 325 8 110 60 50 35 160 400 10 450 200 200 65 60 600 250 250 ns ns ns Mbps ns ns ns ns ns ns ns 7 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEST CONDITIONS TEMP MIN (°C) (Note 14) TYP MAX (Note 14) UNITS PARAMETER SYMBOL DRIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN tZH(SHDN) tZL(SHDN) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 470pF (Figure 4) (Note 17) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 9) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 9) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Note 11) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 11, 12) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 11, 12) Full Full Full Full Full Full Full Full Full Full Full 20 60 21 0.2 12 55 30 28 50 38 160 30 3 16 45 45 65 60 600 200 200 ns ns ns Mbps ns ns ns ns ns ns ns RECEIVER SWITCHING CHARACTERISTICS (115kbps and 1Mbps Versions; ISL3150E through ISL3155E) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output Low Receiver Enable to Output High Receiver Disable from Output Low Receiver Disable from Output High Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low fMAX tPLH, tPHL tSKD tZL tZH tLZ tHZ tSHDN tZH(SHDN) tZL(SHDN) (Figure 5) (Note 17) (Figure 5) (Figure 5) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 10) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 10) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) (Note 11) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 11, 13) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 11, 13) Full Full Full Full Full Full Full Full Full Full 1 60 12 100 4 9 7 8 8 160 150 10 20 20 15 15 600 200 200 Mbps ns ns ns ns ns ns ns ns ns RECEIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E) Maximum Data Rate Receiver Input to Output Delay fMAX tPLH, tPHL (Figure 5) (Note 17) (Figure 5) Full Full 20 30 33 45 Mbps ns 8 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEST CONDITIONS (Figure 5) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 10) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 10) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) (Note 11) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 11, 13) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 11, 13) TEMP MIN (°C) (Note 14) Full Full Full Full Full Full Full Full 60 TYP 2.5 8 7 8 8 160 MAX (Note 14) UNITS 5 15 15 15 15 600 200 200 ns ns ns ns ns ns ns ns PARAMETER Receiver Skew | tPLH - tPHL | Receiver Enable to Output Low Receiver Enable to Output High Receiver Disable from Output Low Receiver Disable from Output High Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low NOTES: SYMBOL tSKD tZL tZH tLZ tHZ tSHDN tZH(SHDN) tZL(SHDN) 6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 7. Supply current specification is valid for loaded drivers when DE = 0V. 8. Applies to peak current. See “Typical Performance Curves” beginning on page 14 for more information. 9. Keep RE = 0 to prevent the device from entering SHDN. 10. The RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 13. Set the RE signal high time >600ns to ensure that the device enters SHDN. 14. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 15. See Figure 8 for more information, and for performance over-temperature. 16. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle). 17. Limits established by characterization and are not production tested. Test Circuits and Waveforms RL/2 Z D Y RL/2 VOC VOD 375Ω Z D Y VOD R L = 60 Ω VCM -7V TO +12V 375Ω VCC DE DI VCC DE DI FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 9 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPLH OUT (Z) DE DI D Y SIGNAL GENERATOR Z RDIFF CL = 100pF 90% DIFF OUT (Y - Z) 10% tR SKEW = |tPLH - tPHL| 90% 10% tF +VOD -VOD CL = 100pF OUT (Y) tPHL VOH VOL VCC FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI SIGNAL GENERATOR Z D Y CL 500Ω SW VCC GND DE NOTE 10 1.5V 1.5V 0V tHZ VOH - 0.5V VOH 0V tZL, tZL(SHDN) NOTE 10 OUT (Y, Z) 2.3V OUTPUT LOW VOL + 0.5V V OL tLZ VCC 3V tZH, tZH(SHDN) PARAMETER OUTPUT tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RE X X 0 (Note 9) 0 (Note 9) 1 (Note 12) 1 (Note 12) DI 1/0 0/1 1/0 0/1 1/0 0/1 SW GND VCC GND VCC GND VCC CL (pF) 15 15 100 100 100 100 NOTE 10 OUT (Y, Z) OUTPUT HIGH 2.3V FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES 3V Z D Y SIGNAL GENERATOR 60Ω CD + VCC DE DI VOD - DI 0V DIFF OUT (Y - Z) +VOD -VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER DATA RATE 10 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Test Circuits and Waveforms (Continued) RE 0V B A R RO tPLH SIGNAL GENERATOR RO 1.5V tPHL VCC 1.5V 0V +1.5V 15pF A 0V 0V -1.5V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE RE GND SIGNAL GENERATOR B A R RO 1kΩ 15pF SW VCC GND RE NOTE 10 1.5V 1.5V 0V 3V PARAMETER tHZ tLZ tZH (Note 10) tZL (Note 10) tZH(SHDN) (Note 13) tZL(SHDN) (Note 13) DE 0 0 0 0 0 0 A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC tZH, tZH(SHDN) NOTE 10 RO tHZ OUTPUT HIGH 1.5V VOH - 0.5V VOH 0V tZL, tZL(SHDN) NOTE 10 RO 1.5V tLZ VCC VOL + 0.5V V OL OUTPUT LOW FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES 11 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards used for long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. The 115kbps and 1Mbps driver outputs are slew rate limited to minimize EMI, and to minimize reflections in unterminated or improperly terminated networks. Outputs of the ISL3156E and ISL3158E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. HIGH VOD IMPROVES NOISE IMMUNITY AND FLEXIBILITY The ISL315xE driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The minimum ±2.4V VOD guarantees at least ±900mV more noise immunity than networks built using standard 1.5V VOD transmitters. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL315xE in “star” and other multi-terminated, “nonstandard” network topologies. Figure 8, details the transmitter’s VOD vs IOUT characteristic, and includes load lines for six (20Ω) and eight (15Ω) 120Ω terminations. The figure shows that the driver typically delivers 1.65/1.5V into 6/8 terminations, even at the worst case temperature of +85°C. The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL315xE delivers RS-485 voltage levels with 3x to 4x the number of terminations. Receiver (Rx) Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Rx outputs feature high drive levels (typically 28mA @ VOL = 1V) to ease the design of optically coupled isolated interfaces. Receiver input resistance of 96kΩ surpasses the RS-422 specification of 4kΩ, and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Rx inputs function with common mode voltages as great as ±7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages are a realistic concern. All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL315xE devices incorporate a “Hot Plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~3.4V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. DE, DI = VCC RE = GND 5.0 3.5V DRIVER Y OUTPUT (V) VCC 0 5.0 RL = 1kΩ A/Y ISL315xE RECEIVER OUTPUT (V) 2.5 0 3.3V 2.5 Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 2.4V across a 54Ω load (RS-485), and at least 2.8V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI, and all drivers are three-statable via the active high DE input. RL = 1kΩ RO ISL315xE 5.0 2.5 0 TIME (40µs/DIV) FIGURE 7. HOT PLUG PERFORMANCE (ISL315xE) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY FN6363.2 July 30, 2009 12 VCC (V) ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E ESD Protection All pins on these devices include class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±16.5kV (1/2 duplex) IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 115kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard’s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The ISL315xE 1/2 duplex RS-485 pins withstand ±16.5kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±9kV. The RS-485 pins of all the ISL315xE versions survive ±9kV contact discharges. Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, even at the common mode voltage range extremes. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15°C. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode These CMOS transceivers all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 70nA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 9, 10, 11, 12 and 13, at the end of the “Electrical Specification” table on page 9, for more information. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 115kbps versions can operate at full data rates with lengths of several 1000’. 13 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Performance Curves 140 DRIVER OUTPUT CURRENT (mA) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 RD = 15Ω R D = 20Ω +25°C +85°C VCC = 5V, TA = +25°C; Unless Otherwise Specified. DIFFERENTIAL OUTPUT VOLTAGE (V) 3.7 3.6 RDIFF = 100Ω 3.5 3.4 3.3 3.2 3.1 3.0 2.9 -40 -25 0 25 50 75 85 RDIFF = 54Ω RD = 54Ω RD = 100Ω 0 1 2 3 4 DIFFERENTIAL OUTPUT VOLTAGE (V) 5 TEMPERATURE (°C) FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 150 OUTPUT CURRENT (mA) Y OR Z = LOW 100 50 0 -50 660 640 DE = VCC, RE = X 620 600 580 560 540 Y OR Z = HIGH 520 500 -40 -100 -150 -200 -7 -6 ICC (µA) DE = GND, RE = GND -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 1010 1005 PROPAGATION DELAY (ns) 1000 995 990 985 980 975 970 965 960 -40 -25 0 50 25 TEMPERATURE (°C) 75 85 tPHL tPLH FIGURE 11. SUPPLY CURRENT vs TEMPERATURE 4 |CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑| 5 6 SKEW (ns) 7 8 9 10 11 12 -40 -25 0 25 50 TEMPERATURE (°C) 75 85 FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3150E, ISL3152E) FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3150E, ISL3152E) 14 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Performance Curves 290 288 PROPAGATION DELAY (ns) 286 284 VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) 1.0 1.5 SKEW (ns) 282 280 278 276 274 272 270 -40 -25 25 0 50 TEMPERATURE (°C) 75 85 2.0 2.5 3.0 |CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑| 3.5 -40 -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3153E, ISL3155E) 24 23 PROPAGATION DELAY (ns) 22 21 20 19 FIGURE 15. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3153E, ISL3155E) 0.10 0.12 0.14 0.16 SKEW (ns) -25 25 0 50 TEMPERATURE (°C) 75 85 DRIVER INPUT (V) 0.18 0.20 0.22 0.24 18 17 -40 0.26 |CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑| 0.28 -40 -25 0 25 50 75 85 TEMPERATURE (°C) FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3156E, ISL3158E) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DI 5 0 5 0 RO FIGURE 17. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3156E, ISL3158E) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DI 5 0 5 0 RO 5 4 3 2 1 TIME (1μs / DIV) A/Y B/Z 5 4 3 2 1 TIME (400ns / DIV) A/Y B/Z FIGURE 18. DRIVER AND RECEIVER WAVEFORMS, (ISL3150E, ISL3152E) FIGURE 19. DRIVER AND RECEIVER WAVEFORMS, (ISL3153E, ISL3155E) 15 FN6363.2 July 30, 2009 DRIVER INPUT (V) ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Performance Curves DRIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DI 5 0 5 0 RO VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) 60 RECEIVER OUTPUT CURRENT (mA) VOL, +25°C 50 VOL, +85°C 40 DRIVER INPUT (V) 30 VOH, +25°C 20 VOH, +85°C 10 5 4 3 2 1 TIME (20ns / DIV) A/Y B/Z 0 0 1 2 3 4 RECEIVER OUTPUT VOLTAGE (V) 5 FIGURE 20. DRIVER AND RECEIVER WAVEFORMS, (ISL3156E, ISL3158E) FIGURE 21. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 530 PROCESS: Si Gate BiCMOS 16 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE 6/30/09 REVISION FN6363.2 CHANGE Converted to New Intersil Template. Rev 2 Changes are as follows: Page 1 - Introduction was reworded in order to fit graphs. Features Section by listing only key features. Added performance graphs. Page 2 - Updated Ordering information by numbering all notes and referencing them on each part. Added MSL Note as new standard with linked parts to device info page. Updated Pinout name to Pin Configurations with Pin Descriptions following on page 3. Page 5 - Added Boldface limit verbiage in Elect. spec table and bolded Min and Max over-temp limits. Page 17 - Added Revision History and Products information with all links included. Added 8 Ld PDIP to ordering information, POD and Thermal resistance. Applied Intersil Standards as follows: Updated ordering information with Notes for tape and reel reference, pb-free PDIP and lead finish. Added pb-free reflow link and pb-free note to Thermal Information. Added E8.3 POD. Cosmetic edit to the ISL315xE data sheet, no rev, no date change, no formal per Denise Scarborough. Removed both commas in this sentence in the first paragraph: "Each driver output, and receiver input, is protected against ±16.5kV ESD strikes without latch-up." Initial Release to web 1/17/08 FN6363.1 2/20/07 FN6363.0 12/14/06 FN6363.0 Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php 17 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 -BE INCHES SYMBOL A ABC MILLIMETERS MIN 0.94 0.05 0.75 0.25 0.09 2.95 2.95 4.75 0.40 8 0.07 0.07 5o 0o 15o 6o MAX 1.10 0.15 0.95 0.36 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 Rev. 2 01/03 MIN 0.037 0.002 0.030 0.010 0.004 0.116 0.116 0.187 0.016 8 0.003 0.003 5o 0o MAX 0.043 0.006 0.037 0.014 0.008 0.120 0.120 0.199 0.028 INDEX AREA 12 TOP VIEW 0.20 (0.008) A1 A2 4X θ 0.25 (0.010) GAUGE PLANE SEATING PLANE -C- R1 R b c D E1 A A2 4X θ L L1 e E L L1 N R 0.026 BSC 0.65 BSC A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE 0.037 REF 0.95 REF C a C L E1 C R1 0 SIDE VIEW 15o 6o α -B- 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 18 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Mini Small Outline Plastic Packages (MSOP) N M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 -B12 TOP VIEW 0.25 (0.010) GAUGE PLANE SEATING PLANE -CL L1 4X θ R1 R 0.20 (0.008) ABC E INCHES SYMBOL A A1 A2 b c D 4X θ MILLIMETERS MIN 0.94 0.05 0.75 0.18 0.09 2.95 2.95 4.75 0.40 10 0.07 0.07 5o 0o 15o 6o MAX 1.10 0.15 0.95 0.27 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 Rev. 0 12/02 MIN 0.037 0.002 0.030 0.007 0.004 0.116 0.116 0.187 0.016 10 0.003 0.003 5o 0o MAX 0.043 0.006 0.037 0.011 0.008 0.120 0.120 0.199 0.028 INDEX AREA E1 e E L L1 N R R1 θ -B- A A2 0.020 BSC 0.50 BSC A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE 0.037 REF 0.95 REF C a C L E1 C SIDE VIEW 15o 6o α 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only 19 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM M14.15 (JEDEC MS-012-AB ISSUE C) 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 1.35 0.10 0.33 0.19 8.55 3.80 5.80 0.25 0.40 14 0o MAX 1.75 0.25 0.51 0.25 8.75 4.00 6.20 0.50 1.27 8o NOTES 9 3 4 5 6 7 Rev. 0 12/93 MIN 0.0532 0.0040 0.013 0.0075 0.3367 0.1497 0.2284 0.0099 0.016 14 0o MAX 0.0688 0.0098 0.020 0.0098 0.3444 0.1574 0.2440 0.0196 0.050 8o A1 B C D E e C α A1 0.10(0.004) e B 0.25(0.010) M C AM BS 0.050 BSC 1.27 BSC H h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 20 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Dual-In-Line Plastic Packages (PDIP) N INDEX AREA E1 12 3 N/2 -B-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 -CA2 L A C L E E8.3 (JEDEC MS-001-BA ISSUE D) 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B B1 C D D1 E E1 e eA eB L N eA eC C A BS C MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 9.01 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 10.16 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93 MIN 0.015 0.115 0.014 0.045 0.008 0.355 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 0.400 0.325 0.280 e A1 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 0.100 BSC 0.300 BSC 0.115 8 0.430 0.150 - 2.54 BSC 7.62 BSC 10.92 3.81 8 2.93 21 FN6363.2 July 30, 2009 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45° H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.25 0.40 8 8° 0° 8° MAX 1.75 0.25 0.51 0.25 5.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 0.2284 0.0099 0.016 8 0° MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 0.2440 0.0196 0.050 B C D E e H C α A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 22 FN6363.2 July 30, 2009