ISL3178AEMW

ISL3178AE ® Data Sheet May 6, 2009 FN6887.1 ±15kV ESD Protected, 3.3V, Full Fail-Safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers The Intersil ISL3178AE is ±15kV IEC61000 ESD Protected, 3.3V-powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. This device has very low bus currents (+125mA/-100mA), which presents a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an RS-485 network, so the high allowed node count minimizes the number of repeaters required. Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. The ISL3178AE is a half duplex version. It multiplexes the Rx inputs and Tx outputs to allow transceivers with output disable functions in an 8 Ld package. Features • IEC61000 ESD Protection on RS-485 I/O Pins . . . . ±15kV - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM • Full Fail-safe (Open, Short, Terminated/Floating) Receivers • Hot Plug - Tx and Rx Outputs Remain Three-state During Power-up (Only Versions with Output Enable Pins) • True 1/8 Unit Load Allows up to 256 Devices on the Bus • Single 3.3V Supply • High Data Rates . . . . . . . . . . . . . . . . . . . . . . up to 10Mbps • Low Quiescent Supply Current . . . . . . . . . . .800µA (Max) - Ultra Low Shutdown Supply Current . . . . . . . . . . .10nA • -7V to +12V Common Mode Input/Output Voltage Range • Half Duplex Pinouts • Three State Rx and Tx Outputs Available • Current Limiting for Driver Overload Protection • Pb-Free (RoHS Compliant) Applications • Automated Utility Meter Reading Systems • High Node Count Systems • Field Bus Networks • Security Camera Networks Pinout ISL3178AE (8 LD SOIC) TOP VIEW RO 1 RE 2 DE 3 DI 4 D 8 7 6 5 VCC B/Z A/Y GND R • Building Environmental Control/ Lighting Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3178AEM ISL3178AEMW HALF/FUL L DUPLEX HALF HALF DATA RATE (Mbps) 10 10 SLEWRATE LIMITED? NO NO HOT PLUG? YES YES # DEVICES ON BUS 256 256 RX/TX ENABLE? YES YES QUIESCENT ICC (µA) 510 510 LOW POWER SHUTDOWN? YES YES PIN COUNT 8 N/A 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3178AE Ordering Information PART NUMBER (Note) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # M8.15 RE 0 0 0 1 1 Truth Tables (continued) RECEIVING INPUTS DE DE Half Duplex Full Duplex 0 0 0 0 1 X X X 0 1 A-B ≥ -0.05V ≤ -0.2V Inputs Open/Shorted X X OUTPUT RO 1 0 1 High-Z * High-Z ISL3178AEMBZ* 3178A EMBZ -55 to +125 8 Ld SOIC ISL3178AEMW -55 to +125 Wafer *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. NOTE: *Shutdown Mode (see Note 7) Truth Tables TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X Z 0 1 High-Z High-Z * OUTPUTS Y 1 0 High-Z High-Z * NOTE: *Shutdown Mode (see Note 7) Pin Descriptions PIN RO RE FUNCTION Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable function isn’t required, connect DE to VCC through a 1kΩ to 3kΩ resistor. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. System power supply input (3.0V to 3.6V). DE DI GND A/Y B/Z VCC 2 FN6887.1 May 6, 2009 ISL3178AE Typical Application Circuit ISL3178AE +3.3V + 8 VCC 1 RO 2 RE 3 DE 4 DI R B/Z A/Y 7 6 RT RT 7 6 B/Z A/Y 0.1µF 0.1µF + 8 VCC D DI 4 DE 3 RE 2 R GND 5 GND 5 RO 1 +3.3V D 3 FN6887.1 May 6, 2009 ISL3178AE Absolute Maximum Ratings VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Information Thermal Resistance (Typical, Note 1) θJA (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 120 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 2). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS PARAMETER DC CHARACTERISTICS Driver Differential VOUT VOD RL = 100Ω (RS-422) (Figure 1A, Note 11) RL = 54Ω (RS-485) (Figure 1A) No Load RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full Full 2 1.5 - 2.3 2 2.2 0.01 VCC VCC 0.2 V V Full Full 1.5 - V V Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage Logic Input Hysteresis Logic Input Current Input Current (A/Y, B/Z) ΔVOD RL = 54Ω or 100Ω (Figure 1A) VOC ΔVOC RL = 54Ω or 100Ω (Figure 1A) RL = 54Ω or 100Ω (Figure 1A) Full Full - 2 0.01 3 0.2 V V VIH VIL VHYS IIN1 IIN2 DI, DE, RE DI, DE, RE DE, RE (Note 12) DI = DE = RE = 0V or VCC (Note 13) DE = 0V, VCC = 0V or 3.6V VIN = 12V VIN = -7V Full Full 25 Full Full Full Full Full 25 Full Full Full Full Full 2 -2 -100 -200 VCC - 0.6 -1 96 ±7 100 80 -50 -125 15 0.17 0.015 150 30 0.8 2 125 ±250 -50 0.4 1 ±60 V V mV µA µA µA mA mV mV V V µA kΩ mA Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage Receiver Output Low Voltage Three-State (high impedance) Receiver Output Current Receiver Input Resistance Receiver Short-Circuit Current IOSD1 VTH ΔVTH VOH VOL IOZR RIN IOSR DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4) -7V ≤ VCM ≤ 12V (Note 12) VCM = 0V IO = -4mA, VID = -50mV IO = -4mA, VID = -200mV 0.4V ≤ VO ≤ 2.4V -7V ≤ VCM ≤ 12V 0V ≤ VO ≤ VCC 4 FN6887.1 May 6, 2009 ISL3178AE Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 2). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS PARAMETER SUPPLY CURRENT No-Load Supply Current (Note 3) ICC DI = 0V or VCC DE = VCC, RE = 0V or VCC DE = 0V, RE = 0V Full Full Full - 510 480 0.01 800 700 12 µA µA µA Shutdown Supply Current ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) ISHDN DE = 0V, RE = VCC, DI = 0V or VCC IEC61000-4-2, Air-Gap Discharge Method IEC61000-4-2, Contact Discharge Method Human Body Model, From Bus Pins to GND 25 25 25 25 25 - ±15 ±8 ±15 ±7 200 - kV kV kV kV V All Pins HBM, per MIL-STD-883 Method 3015 Machine Model DRIVER SWITCHING CHARACTERISTICS (ISL3178AE) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Output Skew, Part-to-Part Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low fMAX tDD tSKEW ΔtDSKEW tR, tF tZH tZL tHZ tLZ tSHDN VOD = ±1.5V, CD = 350pF (Figure 4, Note 12) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2, Notes 10, 12) RDIFF = 54Ω, CD = 50pF (Figure 2) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 5) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 5) RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) Full Full Full Full Full Full Full Full Full Full Full Full 50 10 27 1 9 17 16 25 28 200 180 90 40 3 11 15 50 40 40 50 600 700 700 Mbps ns ns ns ns ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 8) tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 8) RECEIVER SWITCHING CHARACTERISTICS (ISL3178AE) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Skew, Part-to-Part Receiver Enable to Output High Receiver Enable to Output Low Receiver Disable from Output High Receiver Disable from Output Low Time to Shutdown fMAX VID = ±1.5V (Note 12) Full Full Full Full Full Full Full Full Full 25 5 5 4 4 50 10 33 1.5 11 11 7 7 180 65 10 15 17 17 15 15 600 Mbps ns ns ns ns ns ns ns ns tPLH, tPHL (Figure 5) tSKD ΔtRSKEW tZH tZL tHZ tLZ tSHDN (Figure 5) (Figure 5, Notes 10, 12) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 6) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 6,) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 7, 12) 5 FN6887.1 May 6, 2009 ISL3178AE Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 2). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. SYMBOL TEST CONDITIONS TEMP (°C) Full Full MIN TYP 240 240 MAX 500 500 UNITS ns ns PARAMETER Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low NOTES: tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 7, 9) tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 7, 9) 2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 3. Supply current specification is valid for loaded drivers when DE = 0V. 4. Applies to peak current. See “Typical Performance Curves” starting on page 10 for more information. 5. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 6. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 9. Set the RE signal high time >600ns to ensure that the device enters SHDN. 10. ΔtSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). 11. VCC ≥ 3.15V 12. Limits established by characterization and are not production tested. 13. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 2) through a 1kΩ to 3kΩ resistor. 14. For wafer sale the switching test limits are established by characterization. Test Circuits and Waveforms VCC DE DI D Y Z VOD RL/2 VCC 375Ω DE DI D Y Z VOD RL = 60 Ω VCM -7V TO +12V 375Ω RL/2 VOC FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 6 FN6887.1 May 6, 2009 ISL3178AE Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V VCC DE DI D Y Z RDIFF CD OUT (Y) OUT (Z) tPLH tPHL VOH VOL SIGNAL GENERATOR DIFF OUT (Y to Z) tR 90% 10% 90% 10% tF +VOD -VOD SKEW = |tPLH - tPHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI D SIGNAL GENERATOR Y 50pF SW Z 500Ω VCC GND 3V DE NOTE 9 tZH, tZH(SHDN) NOTE 9 OUTPUT HIGH VOH - 0.25V 50% 0V tZL, tZL(SHDN) NOTE 9 OUT (Y, Z) 50% VOL + 0.25V V OUTPUT LOW OL 1.5V 1.5V 0V tHZ VOH PARAMETER tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) OUTPUT Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RE X X 0 (Note 5) 0 (Note 5) 1 (Note 8) 1 (Note 8) DI 1/0 0/1 1/0 0/1 1/0 0/1 SW GND VCC GND VCC GND VCC OUT (Y, Z) tLZ VCC FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES DE + VCC 3V Z D Y 54Ω CD VOD - DI 0V DI SIGNAL GENERATOR DIFF OUT (Y to Z) -VOD +VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE FIGURE 4B. MEASUREMENT POINTS 7 FN6887.1 May 6, 2009 ISL3178AE Test Circuits and Waveforms (Continued) RE GND B A R 15pF RO tPLH SIGNAL GENERATOR RO 1.5V tPHL VCC 1.5V 0V +1.5V A 0V 0V -1.5V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY RE GND SIGNAL GENERATOR B A R RO 1kΩ SW 15pF tZH, tZH(SHDN) NOTE 9 OUTPUT HIGH 1.5V 0V tZL, tZL(SHDN) NOTE 9 RO 1.5V VOL + 0.25V V OUTPUT LOW OL VCC GND RE NOTE 9 3V 1.5V 1.5V 0V tHZ V VOH - 0.25V OH PARAMETER tHZ tLZ tZH (Note 6) tZL (Note 6) tZH(SHDN) (Note 9) tZL(SHDN) (Note 11) DE X X 0 0 0 0 A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC RO tLZ VCC FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for long runs, thus the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Receiver Features This device utilizes a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Receiver input resistance of 96kΩ surpasses the RS-422 spec of 4kΩ and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages and ground potential differences are realistic concerns. All the receivers include a “Full Fail-Safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or shorted. Fail-safe with shorted inputs is achieved by setting the Rx upper switching point to -50mV, thereby ensuring that the Rx sees 0V differential as a high input level. 8 FN6887.1 May 6, 2009 ISL3178AE Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are tri-statable via the active low RE input. meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. The ISL3178AE RS-485 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. The ISL3178AE survives ±8kV contact discharges on the RS-485 pins. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. The drivers is tri-statable via the active high DE input. Outputs of the ISL3178AE drivers are not limited, so faster output transition times allow data rates of at least 10Mbps. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL3178AE versions with output enable pins incorporate a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. Data Rate, Cables, and Terminations RS-485/422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. The device operates at 10Mbps are limited to lengths less than 100’. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receiver to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. ESD Protection All pins on this device includes class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM and ±15kV IEC61000. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Built-In Driver Overload Protection As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limit circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment 9 FN6887.1 May 6, 2009 ISL3178AE thus the power dissipation, whenever the contending voltage exceeds either supply. and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 50ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 5 through 9, at the end of the “Electrical Specification table” on page 6, for more information. Low Power Shutdown Mode This CMOS transceiver all uses a fraction of the power required by its bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. This device enters shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC Typical Performance Curves 120 DRIVER OUTPUT CURRENT (mA) VCC = 3.3V, TA = +25°C; Unless Otherwise Specified DIFFERENTIAL OUTPUT VOLTAGE (V) 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 -60 RDIFF = 54Ω RDIFF = 120Ω 100 80 60 40 20 0 0 0.5 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 3.5 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 150 OUTPUT CURRENT (mA) Y OR Z = LOW 100 50 0 -50 Y OR Z = HIGH -100 -150 -7 -6 600 550 ICC DE-VCC 500 ICC (µA) 450 ICC DE-GND 400 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 350 -60 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 10. SUPPLY CURRENT vs TEMPERATURE 10 FN6887.1 May 6, 2009 ISL3178AE Typical Performance Curves 40 35 TPHL PROPAGATION DELAY (ns) 30 TPLH SKEW (ns) 0 15 30 45 60 75 90 105 120 25 20 15 10 1.1 5 0 -60 -45 -30 -15 1 -60 -45 -30 -15 1.4 VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 1.6 1.5 1.3 1.2 0 TEMPERATURE (°C) 15 30 45 60 TEMPERATURE (°C) 75 90 105 120 FIGURE 11. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE) FIGURE 12. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE DRIVER INPUT (V) RECEIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DI 5 0 5 RO 0 RDIFF = 54Ω, CD = 50pF DI 5 0 5 0 RO DRIVER OUTPUT (V) DRIVER OUTPUT (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 TIME (10ns/DIV) A/Y B/Z 3.0 2.5 2.0 1.5 1.0 0.5 0 TIME (10ns/DIV) B/Z A/Y FIGURE 13. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH 35 RECEIVER OUTPUT CURRENT (mA) 30 25 FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW VOL, +25°C VOL, +85°C 20 15 VOH, +85°C 10 5 0 VOH, +25°C 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 RECEIVER OUTPUT VOLTAGE (V) FIGURE 15. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 11 FN6887.1 May 6, 2009 DRIVER INPUT (V) ISL3178AE Die Characteristics DIE DIMENSIONS Thickness: 19 mils 1295µm x 1350µm TABLE 2. BOND PAD FUNCTION AND COORDINATES PAD # 1 2 FUNCTION RO RE DE DI GND2 GND1 Y A (half duplex) Z B A (full duplex) VCC X (µm) 54.5 54.5 54.5 53.0 398.55 508.55 931.70 916.25 921.2 892.1 887.2 517.55 Y (µm) 1086.2 800.2 476.8 318.35 59.7 59.7 70.5 382.45 694.4 830.35 1075.2 1163.55 Interface Materials GLASSIVATION Sandwich TEOS & Nitride TOP METALLIZATION: Type: Al with 0.5% Cu Thickness: 28kA SUBSTRATE N/A BACKSIDE FINISH Silicon/Polysilicon/Oxide 3 4 5 6 7 8 9 10 11 12 Assembly Related Information SUBSTRATE POTENTIAL GND (powered up) Additional Information WORST CASE CURRENT DENSITY N/A PROCESS Si GateBiCMOS TRANSISTOR COUNT 535 PAD OPENING SIZE 90µm x 90µm WAFER SIZE 200mm (~8 inch) TRANSISTOR COUNT 535 12 FN6887.1 May 6, 2009 ISL3178AE Metallization Mask Layout ISL3178AE VCC RO A B RE Z DE A D1 G2 G1 Y 13 FN6887.1 May 6, 2009 ISL3178AE Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45° H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.25 0.40 8 8° 0° 8° MAX 1.75 0.25 0.51 0.25 5.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 0.2284 0.0099 0.016 8 0° MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 0.2440 0.0196 0.050 B C D E e H C α A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 14 FN6887.1 May 6, 2009