ISL3294E

® ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Data Sheet September 19, 2007 FN6544.0 ±16.5kV ESD Protected, +125°C, 3.0V to 5.5V, SOT-23/TDFN Packaged, Low Power, RS-485/RS-422 Transmitters The Intersil ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV IEC61000 contact), 3.0V to 5.5V powered, single transmitters for balanced communication using the RS-485 and RS-422 standards. These drivers have very low bus currents (±40mA), so they present less than a “1/8 unit load” to the RS-485 bus. This allows more than 256 transmitters on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. Hot Plug circuitry ensures that the Tx outputs remain in a high impedance state while the power supply stabilizes. The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or from unterminated stubs in multidrop and multipoint applications. Drivers on the ISL3295E and ISL3298E are not limited, so they can achieve the 20Mbps data rate. All versions are offered in Industrial and Extended Industrial (-40°C to +125°C) temperature ranges. A 26% smaller footprint is available with the ISL3296E, ISL3297E, ISL3298E’s TDFN package. These devices also feature a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E data sheet. Features • High ESD Protection on RS-485 Outputs . . ±16.5kV HBM - IEC61000-4-2 Contact Test Method . . . . . . . . . . . . ±7kV - Class 3 ESD Level on all Other Pins . . . . . . >8kV HBM • Specified for +125°C Operation (VCC ≤ 3.6V Only) • Logic Supply Pin (VL) Eases Operation in Mixed Supply Systems (ISL3296E through ISL3298E Only) • Hot Plug - Tx Outputs Remain Three-state During Power-up • Low Tx Leakage Allows >256 Devices on the Bus • High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 20Mbps • Low Quiescent Supply Current . . . . . . . . . . .150µA (Max) - Very Low Shutdown Supply Current . . . . . . . 1µA (Max) • -7V to +12V Common Mode Output Voltage Range (VCC ≤ 3.6V Only) • Current Limiting and Thermal Shutdown for Driver Overload Protection (VCC ≤ 3.6V Only) • Tri-statable Tx Outputs • 5V Tolerant Logic Inputs When VCC ≤5V • Pb-Free (RoHS Compliant) Applications • Clock Distribution • High Node Count Systems • Space Constrained Systems • Security Camera Networks • Building Environmental Control/Lighting Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3293E ISL3294E ISL3295E ISL3296E ISL3297E ISL3298E DATA RATE SLEW-RATE (Mbps) LIMITED? 0.25 0.5 20 0.25 0.5 20 YES YES NO YES YES NO HOT PLUG? YES YES YES YES YES YES TX ENABLE? (Note 10) YES YES YES YES YES YES MAXIMUM QUIESCENT ICC (µA) 150 150 150 150 150 150 LOW POWER SHUTDOWN? YES YES YES YES YES YES PIN COUNT 6 Ld SOT 6 Ld SOT 6 Ld SOT 8 Ld TDFN 8 Ld TDFN 8 Ld TDFN FUNCTION 1 Tx 1 Tx 1 Tx 1 Tx 1 Tx 1 Tx VL PIN? NO NO NO YES YES YES 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Pinouts ISL3293E, ISL3294E, ISL3295E (6 LD SOT-23) TOP VIEW DI 1 VCC 2 D 6 5 4 Y GND Z ISL3296E, ISL3297E, ISL3298E (8 LD TDFN) TOP VIEW VL DE DI GND 1 2 3 4 D 8 7 6 5 VCC Z Y GND DE 3 NOTE: BOTH GND PINS MUST BE CONNECTED Ordering Information PART PART NUMBER MARKING (Note 3) (Notes 1, 2) ISL3293EFHZ-T ISL3293EIHZ-T ISL3294EFHZ-T ISL3294EIHZ-T ISL3295EFHZ-T ISL3295EIHZ-T 293F 293I 294F 294I 295F 295I TEMP. RANGE (°C) PACKAGE (Tape and Reel) PKG. (Pb-Free) DWG. # P6.064 P6.064 P6.064 P6.064 P6.064 P6.064 L8.2x3A L8.2x3A L8.2x3A L8.2x3A L8.2x3A L8.2x3A Truth Tables TRANSMITTING INPUTS DE (Note 10) 1 1 0 DI 1 0 X Z 0 1 High-Z * OUTPUTS Y 1 0 High-Z * -40 to +125 6 Ld SOT-23 -40 to +85 6 Ld SOT-23 -40 to +125 6 Ld SOT-23 -40 to +85 6 Ld SOT-23 -40 to +125 6 Ld SOT-23 -40 to +85 6 Ld SOT-23 -40 to +125 8 Ld TDFN -40 to +85 8 Ld TDFN -40 to +125 8 Ld TDFN -40 to +85 8 Ld TDFN -40 to +125 8 Ld TDFN -40 to +85 8 Ld TDFN NOTE: *Shutdown Mode ISL3296EFRTZ-T 96F ISL3296EIRTZ-T 96I ISL3297EFRTZ-T 97F ISL3297EIRTZ-T 97I ISL3298EFRTZ-T 98F ISL3298EIRTZ-T 98I NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pbfree material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Please refer to TB347 for details on reel specifications. 3. SOT-23 “PART MARKING” is branded on the bottom side. 2 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Pin Descriptions PIN DE FUNCTION Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. This is also the potential of the TDFN thermal pad. ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, noninverting transmitter output. ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, inverting transmitter output. System power supply input (3.0V to 5.5V). On devices with a VL pin, power-up VCC first. Logic-Level supply which sets the VIL/VIH levels for the DI and DE pins (ISL3296E, ISL3297E, ISL3298E only). Power-up this supply after VCC, and keep VL ≤ VCC. DI GND Y Z VCC VL 3 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Operating Circuits NETWORK WITH ENABLES +3.3V TO 5V + 1 VCC ISL3281E 3 RO 5 RE A R B 6 4 RT 6 4 Y Z D DI 1 DE 3 0.1µF 0.1µF + 2 VCC ISL329xE +3.3V GND 2 GND 5 NETWORK WITHOUT ENABLE +3.3V TO 5V + 1 VCC ISL3280E 3 RO A R B 5 4 RT 6 4 Y Z D 0.1µF 0.1µF + 2 VCC ISL329xE DE DI 1 3 +3.3V 1kΩ TO 3kΩ (NOTE 10) GND 2 GND 5 NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES 2.5V 6 VCC LOGIC DEVICE (µP, ASIC, UART) VL +3.3V TO 5V + 4 VCC ISL3282E 1 RO 7 RE A R B 5 8 RT 6 7 Y Z D DI 3 DE 2 0.1µF 0.1µF + 8 VCC ISL3298E 1 VL VCC LOGIC DEVICE (µP, ASIC, UART) +3.3V 1.8V GND 2 GND 4, 5 4 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Absolute Maximum Ratings VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V VL to GND (ISL3296E thru ISL3298E Only) . . -0.3V to (VCC +0.3V) Input Voltages DI, DE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V Y, Z (VCC > 3.6V) . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V Short Circuit Duration Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Y, Z (VCC > 3.6V, Note 12) . . . . . . . . . . . . . . . . . . . 1s at 3.6V (Note 12) Thermal Shutdown Threshold SUPPLY CURRENT No-Load Supply Current Shutdown Supply Current ESD PERFORMANCE RS-485 Pins (Y, Z) TSD ICC ISHDN DI = 0V or VCC DE = VCC Full Full - 120 0.01 150 1 µA µA DE = 0V, DI = 0V or VCC Human Body Model, From Bus Pins to GND IEC61000 Contact, From Bus Pins to GND 25 25 25 25 - ±16.5 ±7 ±8 ±400 - kV kV kV V All Pins HBM, per MIL-STD-883 Method 3015 Machine Model DRIVER SWITCHING CHARACTERISTICS (ISL3293E, ISL3296E, 250kbps) Maximum Data Rate Driver Single Ended Output Delay Part-to-Part Output Delay Skew Driver Single Ended Output Skew Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low fMAX tSD tSKPP tSSK tDD tDSK tR, tF VOD = ±1.5V, CD = 820pF (Figure 4) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) VCC ≤ 3.6V VCC = 5V Full Full Full Full Full Full Full 25 Full Full Full Full 250 400 400 400 1350 600 1100 4, 1 960 1300 100, 60 60, 35 30, 22 25, 20 1700 900 750 1500 30 1500 250 250 60 60 kbps ns ns ns ns ns ns ns ns ns ns ns tZH tZL tHZ tLZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) 6 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C; Unless Otherwise Specified. (Note 7) (Continued) SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 11) TYP (Note 13) MAX (Note 11) UNITS PARAMETER DRIVER SWITCHING CHARACTERISTICS (ISL3294E, ISL3297E, 500kbps) Maximum Data Rate Driver Single Ended Output Delay Part-to-Part Output Delay Skew Driver Single Ended Output Skew Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low fMAX tSD tSKPP tSSK tDD tDSK tR, tF tZH tZL tHZ tLZ VOD = ±1.5V, CD = 820pF (Figure 4) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full Full Full Full Full Full Full Full Full Full Full 500 200 200 200 340 30, 80 345 2 350 100, 60 60, 35 30, 22 25, 20 500 300 150 500 30 800 250 250 60 60 kbps ns ns ns ns ns ns ns ns ns ns DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps) Maximum Data Rate Driver Single Ended Output Delay fMAX tSD VOD = ±1.5V, CD = 360pF (Figure 4) RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC VL ≥ 1.8V VL = 1.5V VL = 1.35V Part-to-Part Output Delay Skew Driver Single Ended Output Skew tSKPP tSSK RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC VL ≥ 1.8V VL = 1.5V VL = 1.35V Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC VL ≥ 1.8V VL = 1.5V VL = 1.35V Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC ≤ 3.6V VL = VCC = 5V VL ≥ 1.8V VL ≥ 1.5V VL = 1.35V Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low tR, tF RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC VL ≥ 1.35V Full Full 25 25 25 Full Full 25 25 25 Full 25 25 25 Full 25 25 25 25 Full 25 Full Full 20 15 29, 23 32 36 40 3 3 4 5 29, 22 32 36 42 0.5 2 0.5, 1 1, 2 2, 4 9 9 100, 60 60, 35 42 25 7 42 3 15 250 250 Mbps ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns tZH tZL RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) 7 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C; Unless Otherwise Specified. (Note 7) (Continued) SYMBOL tHZ tLZ TEST CONDITIONS RL = 500Ω, CL = 50pF, SW = GND (Figure 3) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) TEMP (°C) Full Full MIN (Note 11) TYP (Note 13) 30, 22 25, 20 MAX (Note 11) 60 60 UNITS ns ns PARAMETER Driver Disable from Output High Driver Disable from Output Low NOTES: 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Applies to peak current. See “Typical Performance Curves” on page 12 for more information. 9. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). 10. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. 11. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested. 12. Due to the high short circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To prevent excessive power dissipation that may damage the output, the short circuit current should be limited to ≤ 300mA during testing. It is best to use an external resistor for this purpose, since the current limiting on the VO supply may respond too slowly to protect the output. 13. Typicals are measured at VCC = 3.3V for parameters specified with 3V ≤ VCC ≤ 3.6V, and are measured at VCC = 5V for parameters specified with 4.5V ≤ VCC ≤ 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a comma refer to VCC = 3.3V and 5V, respectively. Test Circuits and Waveforms VCC OR VL DE DI D Y Z VOD RL/2 VCC OR VL 375Ω DE DI D Y Z VOD RL = 60Ω VCM -7V TO +12V 375Ω RL/2 VOC FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 8 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Test Circuits and Waveforms (Continued) 3V OR VL DI 50% 50% 0V VCC OR VL DE DI D Y Z RDIFF CD OUT (Y) tDDLH DIFF OUT (Y - Z) OUT (Z) tSD1 50% tSD2 VOH 50% VOL tDDHL SIGNAL GENERATOR 90% 50% 10% tR 90% 50% 10% tF +VOD -VOD tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)| tDSK = |tDDLH - tDDHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI D SIGNAL GENERATOR Y 50pF tZH OUTPUT HIGH VOH - 0.25V tHZ VOH 0V tZL OUT (Y, Z) tLZ VCC 50% VOL + 0.25V V OUTPUT LOW OL Z 500Ω SW VCC GND 3V OR VL DE 50% 50% 0V PARAMETER tHZ tLZ tZH tZL OUTPUT Y/Z Y/Z Y/Z Y/Z DI 1/0 0/1 1/0 0/1 SW GND VCC GND VCC OUT (Y, Z) 50% FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES VCC OR VL DE + 3V OR VL Z D Y 54Ω CD VOD - DI 0V DI SIGNAL GENERATOR DIFF OUT (Y - Z) -VOD +VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE FIGURE 4B. MEASUREMENT POINTS 9 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transmitters and receivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. VCC = +3.3V VCC = +2V VIH ≥ 2V DI VOH ≤ 2V VIH ≥ 2V VOH ≤ 2V TXD DE GND DEN GND ISL3293E VCC = +3.3V UART/PROCESSOR VCC = +2V VL DI VIH = 1.4V VOH ≤ 2V VIH = 1.4V VOH ≤ 2V TXD DE GND DEN GND Driver Features These RS-485/RS-422 drivers are differential output devices that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. All drivers are tri-statable via the active high DE input. If the Tx enable function isn’t needed, tie DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL3295E and ISL3298E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. ISL3296E UART/PROCESSOR FIGURE 5. USING VL PIN TO ADJUST LOGIC LEVELS Logic Supply (VL Pin, ISL3296E through ISL3298E) Note: Power-up VCC before powering up the VL supply. The ISL3296E through ISL3298E include a VL pin that powers the logic inputs (DI and DE). These pins interface with “logic” devices such as UARTs, ASICs, and µcontrollers, and today most of these devices use power supplies significantly lower than 3.3V. Thus, the logic device’s low VOH might not exceed the VIH of a 3.3V or 5V powered DI or DE input. Connecting the VL pin to the power supply of the logic device (as shown in Figure 5) reduces the DI and DE input switching points to values compatible with the logic device’s output levels. Tailoring the logic pin input switching points and output levels to the supply voltage of the UART, ASIC, or µcontroller eliminates the need for a level shifter/translator between the two ICs. VL can be anywhere from VCC down to 1.35V, but the input switching points may not provide enough noise margin, and 20Mbps data rates may not be achievable, when VL < 1.5V. Table 2 indicates typical VIH and VIL values for various VL settings so the user can ascertain whether or not a particular VL voltage meets his needs. Wide Supply Range The ISL3293E through ISL3298E are optimized for 3.3V operation, but can be operated with supply voltages as high as 5.5V. These devices meet the RS-422 and RS-485 specifications for supply voltages less than 4V, and are RS-422 and RS-485 compatible for supplies greater than 4V. Operation at +125°C requires VCC ≤ 3.6V, while 5V operation requires adding output current limiting resistors (as described in the “Driver Overload Protection” on page 11) if output short circuits (e.g., from bus contention) are a possibility. 5.5V Tolerant Logic Pins Logic input pins (DI, DE) contain no ESD nor parasitic diodes to VCC (nor to VL), so they withstand input voltages exceeding 5.5V regardless of the VCC and VL voltages. 10 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V VL (V) 1.35 1.5 1.8 2.3 2.7 3.3 5.0 (i.e., VCC) VIH (V) 0.7 0.8 0.9 1.1 1.3 1.5 2.7 VIL (V) 0.4 0.5 0.7 1.0 1.1 1.4 2.3 Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transmitter or receiver to the main cable should be kept as short as possible. The VL supply current (IL) is typically much less than 20µA, as shown in Figure 9, when DE and DI are above/below VIH/VIL. Hot Plug Function When a piece of equipment powers-up, there is a period of time where the processor or ASIC driving the RS-485 control line (DE) is unable to ensure that the RS-485 Tx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL329xE family incorporates a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx outputs remain disabled for a period of time, regardless of the state of DE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These drivers meet this requirement, for VCC ≤ 3.6V, via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, for VCC ≤ 3.6V, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either VCC or GND. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about +20°C. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. At VCC > 3.6V, the instantaneous short circuit current is high enough that output stage damage may occur during short circuit conditions to voltages outside of GND to VCC, before the short circuit limiting and thermal shutdown activate. For VCC = 5V operation, if output short circuits are a possibility (e.g., due to bus contention), it is recommended that a 5Ω resistor be inserted in series with each output. This resistor limits the instantaneous current below levels that can cause damage. The driver VOD at VCC = 5V is so large that this small added resistance has little impact. ESD Protection All pins on these devices include class 3 (8kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±7kV to the IEC61000 contact test method. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 250kbps versions can operate at full data rates with lengths of several 1000’. 11 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E High Temperature Operation Due to power dissipation and instantaneous output short circuit current levels at VCC = 5V, these transmitters may not be operated at +125°C with VCC > 3.6V. At VCC = 3.6V, even the SOT-23 versions may be operated at +125°C, while driving a 100’, double terminated, CAT 5 cable at 20Mbps, without triggering the thermal SHDN circuit. Low Power Shutdown Mode These BiCMOS transmitters all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 1µA trickle. These devices enter shutdown whenever the driver disables (DE = GND). Typical Performance Curves 110 DRIVER OUTPUT CURRENT (mA) 100 90 +85°C 80 70 60 50 40 30 20 10 0 0 0.5 +125°C +25°C VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified 2.4 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 -40 -15 10 60 35 TEMPERATURE (°C) 85 110 125 RDIFF = 54Ω RDIFF = 100Ω +25°C 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 3.5 FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 100 90 80 40 VCC = 3.3V 35 VL = 3.3V 30 70 ICC (µA) 60 IL (µA) 50 40 30 10 20 10 DE = VCC = VL 0 -40 -15 10 35 60 85 110 125 TEMPERATURE (°C) 0 0 1 2 5 VL ≤ 2V 3 4 5 6 7 7.5 25 20 15 VL = 2.5V DI VOLTAGE (V) FIGURE 8. SUPPLY CURRENT vs TEMPERATURE FIGURE 9. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE 12 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Performance Curves 1250 VL = 1.35V TO VCC 1225 PROPAGATION DELAY (ns) 1200 1175 1150 1125 1100 1075 1050 -40 tDDLH 600 tSSK tDDHL SKEW (ns) 500 400 VL = 1.35V TO VCC 300 200 100 tDSK 0 -15 10 35 60 85 110 125 -40 -15 10 35 60 85 110 125 TEMPERATURE (°C) TEMPERATURE (°C) VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 700 FIGURE 10. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3293E, ISL3296E) 390 VL = 1.35V TO VCC 380 PROPAGATION DELAY (ns) FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL3293E, ISL3296E) 60 VL = 1.35V to VCC 50 370 SKEW (ns) 40 tSSK 30 360 350 tDDHL 340 20 10 tDDLH 0 -40 tDSK 10 35 60 85 110 125 -15 10 35 60 85 110 125 330 -40 -15 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3294E, ISL3297E) 50 FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL3294E, ISL3297E) 4.5 4.0 45 PROPAGATION DELAY (ns) VL = 1.35V, tDDLH VL = 1.35V, tDDHL SKEW (ns) VL = 1.5V, tDDLH, tDDHL 3.5 3.0 2.5 2.0 1.5 VL = 1.5V 1.0 VL = 1.35V 40 35 30 VL = 1.8V, tDDLH, tDDHL 25 VL = VCC, tDDLH, tDDHL 0.5 0 -40 VL ≥ 1.8V -15 10 35 60 85 110 125 20 -40 -15 10 35 60 85 110 125 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3295E, ISL3298E) FIGURE 15. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3295E, ISL3298E) 13 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Performance Curves 6 VL = 1.35V 5 OUTPUT CURRENT (mA) 150 OTHER ISL329xE 100 Y OR Z = LOW 50 0 -50 Y OR Z = HIGH 4 SKEW (ns) VL = 1.5V VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 200 ISL3295E/ISL3298E 3 VL ≥ 1.8V 2 1 -100 -150 -15 10 35 60 85 110 125 TEMPERATURE (°C) ISL329xE -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 0 -40 FIGURE 16. DRIVER SINGLE ENDED SKEW vs TEMPERATURE (ISL3295E, ISL3298E) DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF DI 3 0 3.0 1.5 0 3 2 1 0 -1 -2 -3 TIME (400ns/DIV) Y-Z Y FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) DI 3 0 3.0 Y 1.5 0 3 2 1 0 -1 -2 -3 Y-Z Z DRIVER INPUT (V) DRIVER INPUT (V) DRIVER OUTPUT (V) Z DRIVER OUTPUT (V) DRIVER OUTPUT (V) TIME (400ns/DIV) FIGURE 18. DRIVER WAVEFORMS, LOW TO HIGH (ISL3293E, ISL3296E) DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF DI 3 0 3.0 1.5 0 3 2 1 0 -1 -2 -3 TIME (200ns/DIV) Y-Z Y FIGURE 19. DRIVER WAVEFORMS, HIGH TO LOW (ISL3293E, ISL3296E) RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) DI 3 0 3.0 Y 1.5 0 3 2 1 0 -1 -2 -3 Y-Z Z DRIVER OUTPUT (V) Z DRIVER OUTPUT (V) DRIVER OUTPUT (V) TIME (200ns/DIV) FIGURE 20. DRIVER WAVEFORMS, LOW TO HIGH (ISL3294E, ISL3297E) FIGURE 21. DRIVER WAVEFORMS, HIGH TO LOW (ISL3294E, ISL3297E) 14 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Performance Curves DRIVER OUTPUT (V) VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) DI 3 0 3.0 1.5 0 3 2 1 0 -1 -2 -3 TIME (10ns/DIV) Y-Z Z DRIVER INPUT (V) DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF DI 3 0 3.0 1.5 0 3 2 1 0 -1 -2 -3 TIME (10ns/DIV) Y-Z Y Z Y DRIVER OUTPUT (V) FIGURE 22. DRIVER WAVEFORMS, LOW TO HIGH (ISL3295E, ISL3298E) VL = 1.35V DRIVER OUTPUT (V) DI RDIFF = 54Ω, CD = 50pF 3 0 DRIVER INPUT (V) DRIVER OUTPUT (V) FIGURE 23. DRIVER WAVEFORMS, HIGH TO LOW (ISL3295E, ISL3298E) DRIVER OUTPUT (V) VL = 1.35V DI RDIFF = 54Ω, CD = 50pF 3 0 3.0 1.5 0 3 2 1 0 -1 -2 -3 Y Z 3.0 1.5 0 3 2 1 0 -1 -2 -3 Z Y DRIVER OUTPUT (V) Y-Z DRIVER OUTPUT (V) Y-Z TIME (10ns/DIV) TIME (10ns/DIV) FIGURE 24. DRIVER WAVEFORMS, LOW TO HIGH (ISL3295E, ISL3298E) FIGURE 25. DRIVER WAVEFORMS, HIGH TO LOW (ISL3295E, ISL3298E) Die Characteristics SUBSTRATE AND TDFN THERMAL PAD POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 516 PROCESS: Si Gate BiCMOS 15 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Small Outline Transistor Plastic Packages (SOT23-6) 0.20 (0.008) M C L b e C VIEW C P6.064 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES SYMBOL MIN 0.036 0.000 0.036 0.012 0.012 0.003 0.003 0.111 0.103 0.060 MAX 0.057 0.0059 0.051 0.020 0.018 0.009 0.008 0.118 0.118 0.068 A MILLIMETERS MIN 0.90 0.00 0.90 0.30 0.30 0.08 0.08 2.80 2.60 1.50 MAX 1.45 0.15 1.30 0.50 0.45 0.22 0.20 3.00 3.00 1.75 6 6 3 3 4 NOTES - 6 C L 1 5 4 C L E E1 A1 A2 b b1 c 2 3 e1 D C L C c1 D E E1 A A2 A1 SEATING PLANE -C- e e1 L L1 L2 N R R1 0.0374 Ref 0.0748 Ref 0.014 0.022 0.024 Ref. 0.010 Ref. 6 0.004 0.004 0o 0.010 8o 0.95 Ref 1.90 Ref 0.35 0.55 0.60 Ref. 0.25 Ref. 6 0.10 0.10 0o 0.25 8o 0.10 (0.004) C WITH PLATING c b b1 c1 5 α NOTES: Rev. 3 9/03 BASE METAL 1. Dimensioning and tolerance per ASME Y14.5M-1994. 4X θ1 R1 R GAUGE PLANE SEATING PLANE L C 4X θ1 VIEW C L1 2. Package conforms to EIAJ SC-74 and JEDEC MO178AB. 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlength L measured at reference to gauge plane. 5. “N” is the number of terminal positions. 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only α L2 16 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Thin Dual Flat No-Lead Plastic Package (TDFN) 2X 0.15 C A A D 2X 0.15 C B L8.2x3A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A E MIN 0.70 - NOMINAL 0.75 0.20 REF MAX 0.80 0.05 NOTES - A1 A3 b D 6 INDEX AREA B 0.20 0.25 2.00 BSC 0.32 5,8 - TOP VIEW D2 E // 0.10 C 1.50 1.65 3.00 BSC 1.75 7,8 - E2 A 0.08 C 1.65 1.80 0.50 BSC 1.90 7,8 - e k L N 0.20 0.30 C SEATING PLANE SIDE VIEW A3 0.40 8 4 0.50 8 2 3 Rev. 0 6/04 D2 (DATUM B) 1 2 D2/2 7 8 Nd NOTES: 6 INDEX AREA (DATUM A) NX k 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. E2 E2/2 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N N-1 NX b 8 e (Nd-1)Xe REF. BOTTOM VIEW (A1) NX (b) 5 SECTION "C-C" CC e FOR EVEN TERMINAL/SIDE TERMINAL TIP L C L 5 0.10 M C AB 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 17 FN6544.0 September 19, 2007