ISL55110, ISL55111
Data Sheet March 17, 2011 FN6228.4
Dual, High Speed MOSFET Driver
The ISL55110 and ISL55111 are dual high speed MOSFET drivers intended for applications requiring accurate pulse generation and buffering. Target applications include Ultrasound, CCD Imaging, Automotive Piezoelectric distance sensing and clock generation circuits. With a wide output voltage range and low ON-resistance, these devices can drive a variety of resistive and capacitive loads with fast rise and fall times, allowing high speed operation with low skew, as required in large CCD array imaging applications. The ISL55110 and ISL55111 are compatible with 3.3V and 5V logic families and incorporate tightly controlled input thresholds to minimize the effect of input rise time on output pulse width. The ISL55110 has a pair of in-phase drivers while the ISL55111 has two drivers operating in antiphase. The ISL55110 has a power-down mode for low power consumption during equipment standby times, making it ideal for portable products. The ISL55110 and ISL55111 are available in 16 Ld Exposed pad QFN packaging and 8 Ld TSSOP. Both devices are specified for operation over the full -40°C to +85°C temperature range.
Features
• 5V to 12V Pulse Magnitude • High Current Drive 3.5A • 6ns Minimum Pulse Width • 1.5ns Rise and Fall Times, 100pF Load • Low Skew • 3.3V and 5V Logic Compatible • In-Phase and Anti-Phase Outputs • Small QFN and TSSOP Packaging • Low Quiescent Current • Pb-Free (RoHS Compliant)
Applications
• Ultrasound MOSFET Driver • CCD Array Horizontal Driver • Automotive Piezo Driver Applications • Clock Driver Circuits
Ordering Information
PART NUMBER PART TEMP. PACKAGE (Notes 1, 2, 3) MARKING RANGE (°C) (Pb-Free) ISL55110IRZ ISL55110IVZ 55 110IRZ 55110 IVZ 55 111IRZ 55111 IVZ -40 to +85 -40 to +85 -40 to +85 -40 to +85 16 Ld QFN PKG. DWG. # L16.4x4A
Functional Block Diagram
ISL55110 AND ISL55111 DUAL DRIVER o VDD
8 Ld TSSOP M8.173 16 Ld QFN L16.4x4A
VH
o
ISL55111IRZ ISL55111IVZ
o
IN-A
OA
8 Ld TSSOP M8.173
o
NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL55110, ISL55111. For more information on MSL please see techbrief TB363.
o
HIZ-QFN*
o
IN-B *
OB
o
GND o POWER DOWN
o
*HIZ AVAILABLE IN QFN PACKAGE ONLY *ISL55111 IN-B IS INVERTING
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2006-2008, 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners.
ISL55110, ISL55111 Pinouts
ISL55110 (16 LD QFN) TOP VIEW
NC NC NC NC
ISL55111 (16 LD QFN) TOP VIEW
NC NC NC 14 NC 13 12 OB 11 GND 10 VH 9 5 IN-A 6 NC 7 NC 8 NC OA 8 OB 7 GND 6 VH 5 OA
16 VDD ENABLE PD IN-B 1 2 3 4 5 IN-A
15
14
13 12 OB 11 GND 10 VH 9 OA VDD ENABLE PD IN-B 1 2 3 4
16
15
6 NC
7 NC
8 NC
ISL55110 (8 LD TSSOP) TOP VIEW
VDD PD IN-B IN-A 1 2 3 4 8 OB 7 GND 6 VH 5 OA VDD PD IN-B IN-A 1 2 3 4
ISL55111 (8 LD TSSOP) TOP VIEW
Pin Descriptions
16 Ld QFN 1 10 11 3 2 8 Ld TSSOP 1 6 7 2 PIN VDD VH GND PD ENABLE Logic Power. Driver High Rail Supply. Ground, Return for Both VH Rail and VDD Logic Supply. Power-Down. Active Logic High Places Part in Power-Down Mode. QFN Packages Only. Provides High Speed Logic HIZ Control of Driver Outputs while Leaving Device Logic Power On. Logic Level Input that Drives OA to VH Rail or Ground. Not Inverted. Logic Level Input that Drives OB to VH Rail or Ground. Not Inverted on ISL55110, Inverted on ISL55111. Driver Output Related to IN-A. Driver Output Related to IN-B. No Connect. FUNCTION
5 4
4 3
IN-A IN-B, INB
9 12 6 through 8, 13 through 16
5 8 -
OA OB NC
2
FN6228.4 March 17, 2011
ISL55110, ISL55111
Absolute Maximum Ratings (TA = +25°C)
VH+ to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.0V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V VIN_A, VIN_V, PDN, ENABLE . . . . . . (GND - 0.5V) to (VDD + 0.5V) OA, OB. . . . . . . . . . . . . . . . . . . . . . . . . . .(GND - 0.5) to (VH + 0.5V) Maximum Peak Output Current . . . . . . . . . . . . . . . . . . . . . . (300mA) ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV
Thermal Information
Thermal Resistance θJA (°C/W) θJC (°C/W) 16 Ld (4x4) QFN Package (Notes 5, 6) 45 3.0 8 Ld TSSOP Package (Notes 4, 7) . . . 140 46 Maximum Junction Temperature (Plastic Package). . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 7. For θJC, the “case temp” location is taken at the package top center.
Recommended Operating Conditions
PARAMETER VH VDD TA TJ DESCRIPTION Driver Supply Voltage Logic Supply Voltage Ambient Temperature Junction Temperature VH = +12V, VDD = 2.7V to 5.5V, TA = +25°C, unless otherwise specified. DESCRIPTION TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS CONDITIONS MIN 5 2.7 -40 TYP 12 MAX 13.2 5.5 +85 +150 UNIT V V °C °C
DC Electrical Specifications
PARAMETER LOGIC CHARACTERISTICS VIX_LH VIX_HL VHYS VIH VIL VIH VIL IIX_H IIX_L II_H II_L II_H II_L
Logic Input Threshold - Low to High Logic Input Threshold - High to Low Logic Input Hysteresis Logic Input High Threshold Logic Input Low Threshold Logic Input High Threshold Logic Input Low Threshold Input Current Logic High Input Current Logic Low Input Current Logic High Input Current Logic Low Input Current Logic High Input Current Logic Low
lIH = 1µA: VIN_A, VIN_B lIL = 1µA: VIN_A, VIN_B VIN_A,VIN_B PDN PDN ENABLE - QFN only ENABLE - QFN only VIN_A,VIN_B = VDD VIN_A, VIN_B = 0V PDN = VDD PDN = 0V ENABLE = VDD (QFN only) ENABLE = 0V (QFN only)
1.32 1.12
1.42 1.22 0.2
1.52 1.32
V V V
2.0 0 2.0 0 10 10 10 10
VDD 0.8 VDD 0.8 20 20 20 15 12
V V V V nA nA nA nA mA nA
-25
3
FN6228.4 March 17, 2011
ISL55110, ISL55111
DC Electrical Specifications
PARAMETER DRIVER CHARACTERISTICS rDS IDC IAC VOH to VOL SUPPLY CURRENTS IDD IDD-PDN IH IH_PDN Logic Supply Quiescent Current Logic Supply Power-Down Current Driver Supply Quiescent Current Driver Supply Power-Down Current PDN = Low PDN = High PDN = Low, No resistive load DOUT PDN = High 4.0 6.0 12 15 1 mA µA µA µA Driver Output Resistance Driver Output DC Current (>2s) Peak Output Current Driver Output Swing Range Design Intent verified via simulation. VH voltage to Ground 3 OA, OB 3 100 3.5 13.2 6 Ω mA A V VH = +12V, VDD = 2.7V to 5.5V, TA = +25°C, unless otherwise specified. (Continued) DESCRIPTION TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS
AC Electrical Specifications
PARAMETER SWITCHING CHARACTERISTICS tR tF tR tF
tpdR
VH = +12V, VDD = +3.6, TA = +25°C, unless otherwise specified. DESCRIPTION TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS
Driver Rise Time Driver Fall Time Driver Rise Time Driver Fall Time Input to Output Propagation Delay Input to Output Propagation Delay Input to Output Propagation Delay Input to Output Propagation Delay Input to Output Propagation Delay Input to Output Propagation Delay Channel-to-Channel tpdR Spread with Same Loads Both Channels Channel-to-Channel tpdF Spread with Same Loads Both Channels. Maximum Operating Frequency Minimum Pulse Width Power-down to Power-on Time Power-on to Power-down Time ENABLE to ENABLE Time (HIZ Off) ENABLE to ENABLE TIme (HIZ On)
OA, OB: CL = 100pF/1k 10% to 90%, VOH - VOL = 12V OA, OB: CL = 100pF/1k 10% to 90%, VOH - VOL = 12V OA, OB CL = 1nF 10% to 90%, VOH-VOL = 12V OA, OB CL = 1nF 10% to 90%, VOH-VOL = 12V Figure 2, Load 100pF/1k
1.2 1.4 6.2 6.9 10.9 10.7
ns ns ns ns ns ns ns ns ns ns ns ns MHz ns
tpdF tpdR tpdF tpdR tpdF tSkewR tSkewF FMAX TMIN PDEN* PDDIS* TEN* TDIS* NOTE:
Figure 2, Load 330pF
12.8 12.5
Figure 2, Load 680pF
14.5 14.1
Figure 2, All Loads Figure 2, All Loads 70 6