USER’S MANUAL
ISL6420BEVAL1Z
AN1504
Rev 0.00
November 23, 2009
ISL6420B Evaluation Board
Hardware Description
The ISL6420B evaluation boards illustrates the
operation of the IC.
CAUTION: Ensure that the voltage at VCC5
terminal does not exceed >6V. This can damage
the IC.
VIN
The ISL6420B simplifies the implementation of a
complete control and protection scheme for a high
performance DC/DC buck converter. The IC can be
operated with an input voltage range from 4.5V to 5.5V
or 5.5V to 28V. It is designed to drive N-channel
MOSFETs in a synchronous rectified buck topology. The
control, output adjustment, monitoring and protection
functions are all located in a single package.
LOAD
5.5V TO 28V
ISL6420B Reference Design
Two versions of the evaluation board, based on the
package type, are listed in Table 1. Both are configured
for an output voltage of 3.3V and 10A maximum load.
TABLE 1.
BOARD NAME
IC
PACKAGE
ISL6420BEVAL1Z
ISL6420BIRZ
20 Ld QFN
ISL6420BEVAL2Z
ISL6420BIAZ
20 Ld QSSOP
FIGURE 1. POWER AND LOAD CONNECTIONS FOR 5.5V
TO 28V INPUT VOLTAGE
VIN
5V ±10%
The design criteria is listed in Table 2.
TABLE 2.
VALUES
Output voltage (VOUT)
3.3V
Output current (IOUT)
10A
Switching Frequency
LOAD
PAREMETERS
300kHz
Power and Load Connections
If using an input supply ranging from 5.5V to 28V,
connect the supply to VIN (P1) and GND (P2) posts as
shown in Figure 1. ISL6420B has an internal +5V linear
regulator, which can be used to bias the IC.
When using a 5V ±10% input supply, connect the
negative polarity to GND (P2) post and connect the
positive polarity of the power supply to both VIN (P1)
post and the VCC5 (TP7) post. This will bypass the
internal LDO and the chip will be powered by the input
power supply.
FIGURE 2. POWER AND LOAD CONNECTIONS FOR
5V±10% INPUT VOLTAGE
Start-up
The Power On Reset (POR) function initiates the
soft-start sequence. An internal 10µA current source
charges an external capacitor connected to the ENSS
pin from 0V to 3.3V. When the ENSS pin reaches 1V,
the IC is enabled; the error amplifier reference voltage
ramps from 0V to 0.6V following the slope of the ENSS
pin voltage.
There are two distinct start-up methods for the
ISL6420B. The first method is invoked through the
application of power to the IC. The soft-start feature
allows for a controlled turn-on of the output once the
POR threshold of the input voltage has been reached.
AN1504 Rev 0.00
November 23, 2009
Page 1 of 17
ISL6420BEVAL1Z
Figure 3 shows the start-up profile of the regulator in
relation to the start-up of the input supply.
VIN = 18V, VOUT = 3.3V, IOUT = 10A
VOUT
Shutdown
If the ENSS pin is pulled down and held below 1V, the
regulator will be turned off. Figure 5 shows the shutdown
profile of the regulator with the ENSS pin pulled low.
Figure 6 shows the shutdown of the regulator when
powering down the input supply
VOUT
ENSS
ENSS
VIN
VIN
PHASE
FIGURE 3. POWER-UP OF VIN
PHASE
The second method of start-up is through the use of the
enable feature. Holding the ENSS pin on the ISL6420B
below 1V will disable the regulator by forcing both the
upper and lower MOSFETs off. Releasing the pin allows
the regulator to start-up.
FIGURE 5. SHUTDOWN USING ENSS
VIN = 18V, VOUT = 3.3V, IOUT = 10A
VOUT
VOUT
ENSS
ENSS
VIN
VIN
PHASE
PHASE
FIGURE 4. ENABLE USING ENSS
AN1504 Rev 0.00
November 23, 2009
FIGURE 6. POWER-DOWN OF VIN
Page 2 of 17
ISL6420BEVAL1Z
Output Performance
3.33
VIN = 12V
The evaluation board has a 0 resistor R9 connecting RT
to VCC5 setting the free-running switching frequency to
300kHz. The frequency can be programmed to a different
value by removing R9 and populating the R5 location
with a resistor value based on the desired frequency.
Output Ripple
Figure 7 shows the ripple voltage on the output of the
regulator at the free running 300kHz frequency.
OUTPUT VOLTAGE (V)
Switching Frequency
3.32
3.31
VIN = 24V
3.30
VIN = 18V
3.29
0
1
2
3
4
5
6
7
8
9
10
OUTPUT CURRENT (A)
FIGURE 9. EVALUATION BOARD LOAD REGULATION
(VOUT = 3.3V)
VOUT
Power Good
PGOOD will be true (open drain) when the FB pin voltage
is within ±10% of the reference voltage and the softstart sequence is complete, i.e., once the soft-start
capacitor is finished charging. The assertion of PGOOD
signal can be delayed by a time proportional to a CDEL
current of 2µA and the value of the capacitor connected
between this pin and ground.The status of PGOOD can
be monitored at the PGOOD test point (TP1).
VOUT
FIGURE 7. OUTPUT RIPPLE
ENSS
Efficiency
CDEL
EFFICIENCY (%)
ISL6420B-based regulators enable the design of highly
efficient systems. The efficiency of the evaluation board
using a 12V, 18V and 24V input supply, as shown in
Figure 8.
96
94
92
90
88
86
84
82
80
78
76
74
72
70
VIN = 12V
PGOOD
VIN = 18V
VIN = 24V
FIGURE 10. PGOOD
Overcurrent Protection
1
2
3
4
5
6
7
8
OUTPUT CURRENT (A)
9
10
FIGURE 8. EVALUATION BOARD EFFICIENCY
(VOUT = 3.3V)
The load regulation of the evaluation board using a 12V,
18V and 24V input supply is shown in Figure 9.
AN1504 Rev 0.00
November 23, 2009
The overcurrent function cycles the soft-start function in
a hiccup mode to provide fault protection. Figure 11
shows the overcurrent hiccup mode.
The overcurrent function protects the converter from a
shorted output by using the upper MOSFET’s rDS(ON) to
monitor the current. This method enhances the
converter’s efficiency and reduces cost by eliminating a
current sensing resistor.
Page 3 of 17
ISL6420BEVAL1Z
The overcurrent trip point on the evaluation board has
been set to 16A.
VOUT
Transient Performance
Figure 12, 13, and 14 show the response of the output
when subjected to transient loading from 0A to 10A at
1A/µs slew rate.
IOUT
VOUT
ENSS
IOUT
FIGURE 11. OVERCURRENT HICCUP MODE
A resistor, ROCSET (R8), programs the overcurrent trip
level. The PHASE node voltage is compared to the
voltage on the OCSET pin while the upper FET is on. A
current (100µA typically) is pulled from the OCSET pin to
establish this voltage across an external resistor. If
PHASE is lower than OCSET, while the upper FET is on,
then an overcurrent condition is detected for that clock
cycle. The pulse is immediately terminated, and a
counter is incremented. If an overcurrent condition is
detected for 8 consecutive clock cycles, and the circuit is
not in soft-start, the ISL6420B enters into hiccup mode.
During hiccup, the external capacitor on the ENSS pin is
discharged and soft-start is initiated. During soft-start,
pulse termination limiting is enabled, but the 8-cycle
hiccup counter is held in reset until soft-start is
completed.
FIGURE 12. TRANSIENT RESPONSE
VOUT
IOUT
The overcurrent function will trip at a peak inductor
current (IPEAK) determined by Equation 1:
I OCSET R OCSET
I PEAK = --------------------------------------------------R DS ON
(EQ. 1)
where IOCSET is the internal OCSET current source.
The OC trip point varies mainly due to the MOSFET’s
rDS(ON) variations. To avoid overcurrent tripping in the
normal operating load range, calculate the ROCSET
resistor from Equation 1 using:
1. The maximum rDS(ON) at the highest junction
temperature
FIGURE 13. TRANSIENT RESPONSE
VOUT
2. The minimum IOCSET from the data sheet
specification table
Determine ,
I PEAK for I PEAK I OUT MAX + I 2
IOUT
(EQ. 2)
where I is the output inductor ripple current. A small
ceramic capacitor should be placed in parallel with
ROCSET to smooth the voltage across ROCSET in the
presence of switching noise on the input voltage.
FIGURE 14. TRANSIENT RESPONSE
AN1504 Rev 0.00
November 23, 2009
Page 4 of 17
ISL6420BEVAL1Z
Voltage Margining
Voltage margining mode is enabled by connecting a
margining set resistor (R6) from the VMSET pin to
ground. This resistor to ground will set a current, which is
switched to the FB pin. The current will be equal to
2.468V divided by the value of the external resistor tied
to the VMSET pin. The range of the VMSET resistor is
150k to 400k.
The GPIO1 (TP4) and GPIO2 (TP5) pins control the
current switching as per Table 3. The power supply
output increases when GPIO2 is HIGH and decreases
when GPIO1 is HIGH. Using a jumper to short the pins of
JP1 and JP2 will pull GPIO1 and GPIO2 LOW, respectively.
Remove one of the jumpers to pull GPIO1 or GPIO2 HIGH
for voltage margining. The amount that the output
voltage of the power supply changes with voltage
margining will be equal to 2.468V times the ratio of the
external feedback resistor (R1) and the external resistor
tied to VMSET (R6).
VIN = 18V, VOUT = 3.3V, NO LOAD
VOUT
CDEL
GPIO1
GPIO2
FIGURE 15. NEGATIVE VOLTAGE MARGINING SLEW
TIME
TABLE 3.
GPIO1
GPIO2
VOUT
L
L
No Change
L
H
+VOUT
H
L
-VOUT
H
H
Ignored
VIN = 18V, VOUT = 3.3V, NO LOAD
VOUT
CDEL
The evaluation board has a 330k VMSET resistor (R6)
setting a current:
I VM = 2.468V 330k = 7.48A
GP101
(EQ. 3)
GP102
and:
V = 7.48A 11.5k = 0.086V
(EQ. 4)
The slew time of the current is set by an external
capacitor (C13) on the CDEL pin, which is charged and
discharged with a 100µA current source. The change in
voltage on the capacitor is 2.5V. This same capacitor is
also used to set the PGOOD rise delay. When PGOOD is
low, the internal PGOOD circuitry uses the capacitor and
when PGOOD is high the voltage margining circuit uses
the capacitor. The slew time for voltage margining can be
in the range of 300µs to 2.5ms. The CDEL capacitor on
the evaluation board is 0.1µF leading to a voltage
margining slew rate of 2.5ms. Figures 15 and 16 show
negative and positive voltage margining with a CDEL
capacitor of 0.1µF.
AN1504 Rev 0.00
November 23, 2009
FIGURE 16. POSITIVE VOLTAGE MARGINING SLEW
TIME
Page 5 of 17
ISL6420BEVAL1Z
Layout Guidelines
References
DC to DC converter layout is extremely important to
obtain the desired attenuation to the EMI frequencies.
Poor layout practice can cause conducted emissions to
actually couple around the filter components directly into
the input conductors or cause radiated emissions. The
copper traces of power input and output and high current
paths must be sized according to the RMS current
passing through them. Keep the high current loops small
and the path defined. Use single point grounding.
Capacitor lead length must be minimized as much as
possible to reduce ESL. This includes the traces on the PC
board leading up to the capacitor pads. Based on the
layout, voltage transients may reduce the level of the
acceptable max VIN when operating close to 28V. In this
case, one can consider the use of snubbers or reduce the
max VIN. Use of a GND plane in a multilayered board is
preferred.
For Intersil documents available on the web, see
http://www.intersil.com/
AN1504 Rev 0.00
November 23, 2009
[1] ISL6420A Data Sheet, Advanced Single
Synchronous Buck Pulse-Width Modulation (PWM)
Controller, Intersil Corporation, File No. FN9169.
[2] ISL6420B Data Sheet, Advanced Single
Synchronous Buck Pulse-Width Modulation (PWM)
Controller, File No. FN6901
Page 6 of 17
VMSET REFOUT GPIO1
TP3
TP2
TP4
ISL6420BEVAL1Z
GPIO2
TP5
TP7
1
2
3
1
3
2
3 4
2
1
VOUT
1
C28
0.1uF
2
1
C27
0.1uF
C32
10uF
C29
0.1uF
2
2
C26
DNP
2
2
2
2
1
C15
0.1uF
1
C24
DNP
2
C22
330uF
2
2
C20
330uF
1
1
1
C31
10uF
C25
DNP
1
C23
DNP
2
2
1
1
C21
330uF
1
C19
330uF
1
Q4
DNP
1
1
2
5
1
2
3
VOUT 1
2
2
R17
2.2
P4
1
GND
1
1
1
1
C13
0.1uF
C10
0.1uF
2
2
2
SW1
R1
R11
11.5K
1
2
R15
2.2
C14
1000pF
VCC5
0
2
N16246185
R3
191
1
Q2
BSC018N04LS G
4
P3
2
1
1UF
C17
1
JP3
R4
2.55K
5
1 2
1 GPIO2
PGND
2
2
GPI01/REFIN
GPI02
3 OCSET
2 GPIO1
CDEL
R13
0
1
LGATE
1
R2
15K
3.3uH
1
C1
10nF
2
L1
18 PHASE
16
Q5
BSS138
GND
PHASE
TP6
2
17 PVCC
PGOOD
1
Q3
DNP
R14
0
1
GREEN
1 PGOOD 1
P10
2
2
1
19 UGATE
2
C2
220pF
PVCC
LGATE
20 BOOT
15
2
2
OCSET
5 VMSET
4 REFOUT
FB
R9
VCC5 1
PHASE
ISL6420BIR
RT
COMP
0
FB10
BOOT
RED
TP1
GND
Q1
BSC059N04LS G
4
C11
0.1uF
UGATE
U1
SGND
PGOOD
RT 9
1
R5
DNP
VIN
CDEL 14
8
VCC5
PGOOD 13
VCC5 6
REFOUT
1
VIN1 7
2
VMSET/MODE
2
1
COMP11
2
ENSS
C5
0.1uF
2
C16
1uF
ENSS 12
R18
EP
2.2
VIN 1
21
C4
10uF
1
2
R21
4.7K
P2
1
330K
0
R12
R20
4.7K
LED3
1
C18
220uF
1
BAT54C/SOT
+18V
C30
220uF
1
2
D1
C8
2.2uF
2
1.27K
1
R6
1
C7
2.2uF
R7
10K
2
2
2
R8
1
1
1000pF
1
1
1
C12 JP1
2.2uF
2
P1
VIN 1
1
1
1
2
2
2
VCC5
C6
2
JP2
VCC5
1
1
1
2
2
1
1
1
AN1504 Rev 0.00
November 23, 2009
ISL6420BEVAL1Z Schematic
1
2
C3
2
2
1
R16
1
5.6nF
0
1
2
Page 7 of 17
ISL6420BEVAL1Z
ISL6420BEVAL1Z Rev. A Bill of Materials
ID
REFERENCE
QTY
PART NUMBER
PART TYPE
DESCRIPTION
PACKAGE
VENDOR
1
U1
1
ISL6420BIRZ
PWM Controller IC
IC, Single PWM
Controller
20 Ld 4x4
QFN
Intersil
2
Q1
1
BSC059N04LS G
MOSFET, Single
N-channel, 40V
SuperSO8
Infineon
3
Q2
1
BSC018N04LS G
MOSFET, Single
N-channel, 40V
SuperSO8
Infineon
4
Q3, Q4
5
Q5
1
BSS138LT1G
MOSFET, Single
N-channel, 50V, 200mA SOT23
On Semi
6
D1
1
BAT54C
Diode, Schottky
30V, 200mA
SOT23
Fairchild
7
L1
1
HC9-3R3-R
Inductor
3.3µH, 20%, 14.3A
SMD
Coiltronics
Do not populate
CAPACITORS
8
C1
1
Capacitor, Ceramic,
X7R
0.01µF, 10%, 50V
SM_0603
Various
9
C2
1
Capacitor, Ceramic,
COG
220pF, 10%, 50V
SM_0603
Various
10 C3
1
Capacitor, Ceramic,
X7R
5600pF, 10%, 50V
SM_0603
Various
11 C4, C31, C32
3
Capacitor, Ceramic,
X7R
1µF, 10%, 25V
SM_1210
Various
12 C5, C10, C11,
C13, C15, C27,
C28, C29
8
Capacitor, Ceramic,
X7R
0.1µF, 10%, 50V
SM_0603
Various
13 C6, C14
2
Capacitor, Ceramic,
X7R
1000pF, 10%, 50V
SM_0603
Various
14 C7, C8
2
Capacitor, Ceramic,
X7R
2.2µF, 10%, 50V
SM_1210
Various
15 C12
1
Capacitor, Ceramic,
X5R
2.2µF, 10%, 16V
SM_1206
Various
16 C16
1
Capacitor, Ceramic,
X7R
1µF, 10%, 50V
SM_1206
Various
17 C17
1
Capacitor, Ceramic,
X7R
1µF, 10%, 50V
SM_0805
Various
18 C18, C30
2
EEUFC1H221S
Capacitor, Alum. Elec. 220µF, 20%, 50V,
1150mA
12.5 X 15
Panasonic
19 C19, C20, C21,
C22
4
6TPB330M9L
Capacitor, POSCAP
330µF, 20%, 6.3V,
0.009
Case D3L
SANYO
20 C23, C24, C25,
C26
Do not populate
RESISTORS
21 R1
1
Resistor, Film
11.5k, 1%, 1/10W
SM_0603
Various
22 R2
1
Resistor, Film
15k, 1%, 1/10W
SM_0603
Various
23 R3
1
Resistor, Film
191, 1%, 1/10W
SM_0603
Various
24 R4
1
Resistor, Film
2.55k, 1%, 1/10W
SM_0603
Various
25 R6
1
Resistor, Film
330k, 1%, 1/10W
SM_0603
Various
26 R7
1
Resistor, Film
10k, 1%, 1/10W
SM_0603
Various
27 R8
1
Resistor, Film
1.27k,1%,1/10W
SM_0603
Various
AN1504 Rev 0.00
November 23, 2009
Page 8 of 17
ISL6420BEVAL1Z
ISL6420BEVAL1Z Rev. A Bill of Materials (Continued)
ID
REFERENCE
QTY
PART NUMBER
PART TYPE
DESCRIPTION
PACKAGE
VENDOR
28 R9, R11, R12,
R13, R14, R16
6
Resistor, Film
0, 1/10W
SM_0603
Various
29 R15, R17, R18
3
Resistor, Film
2.2, 1%, 1/10W
SM_0603
Various
30 R20, R21
2
Resistor, Film
4.7k,1%,1/10W
SM_0603
Various
31 R5
Do not populate
OTHERS
32 P1 - P4
4
1514-2
Turrett Post
Terminal post, through PTH
hole, 1/4 inch
Keystone
33 TP1 - TP5
3
5002
TEST POINT vertical,
white
PC test jack
Keystone
34 JP1, JP2, JP3
3
69190-202HLF
Header
1X2 Break Strip GOLD
BERG/FCI
35 JP1, JP2
2
SPC02SYAN
Jumper
Connector Jumper
Sullins
36 LED3
1
SSL-LXA3025IGC
LED
LED, Red/Green
SMD3x2.5
mm
Lumex
37 SW1
1
GT11MSCBE-T
Toggle Switch
SPDT Toggle Switch
SMD
ITT
38 P10
Do not populate
39 TP6
Do not populate
PTH
ISL6420BEVAL1Z Printed Circuit Board Layers
FIGURE 17. ISL6420BEVAL1Z - TOP LAYER (SILKSCREEN)
AN1504 Rev 0.00
November 23, 2009
Page 9 of 17
ISL6420BEVAL1Z
ISL6420BEVAL1Z Printed Circuit Board Layers (Continued)
FIGURE 18. ISL6420BEVAL1Z - TOP LAYER (COMPONENT SIDE)
FIGURE 19. ISL6420BEVAL1Z - LAYER 2
FIGURE 20. ISL6420BEVAL1Z - LAYER 3
AN1504 Rev 0.00
November 23, 2009
Page 10 of 17
ISL6420BEVAL1Z
ISL6420BEVAL1Z Printed Circuit Board Layers (Continued)
FIGURE 21. ISL6420BEVAL1Z - BOTTOM LAYER (SOLDER SIDE)
FIGURE 22. ISL6420BEVAL1Z - BOTTOM LAYER (SILKSCREEN)
AN1504 Rev 0.00
November 23, 2009
Page 11 of 17
GPIO1
TP4
TP2
REFOUT
GPIO2
TP5
TP7
VCC5
R17
2.2
1
1
1
2
2
2
VCC5
R1
R11
2
0
N16246185
R3
191
1
1
2
C3
2
1
1
2
2
5
1
2
1
2
1
VOUT
C28
0.1uF
C27
0.1uF
2
C32
10uF
C29
0.1uF
2
C26
DNP
1
1
2
C24
DNP
1
C22
330uF
1
C20
330uF
C15
0.1uF
2
C31
10uF
C25
DNP
1
C23
DNP
1
1
1
1
2
1
C21
330uF
P4
1
GND
11.5K
R4
2.55K
1
2
3
C14
1000pF
C10
0.1uF
2
Q4
DNP
C19
330uF
2
1UF
C17
C13
0.1uF
1
R15
2.2
2
U1
Q2
BSC018N04LS G
4
2
1
JP3
SW1
2
2
CDEL
R13
0
1
VOUT 1
1
PGND
PGOOD
1
4 PVCC
3 LGATE
P3
2
2
ENSS
1
2
LGATE
1 2
OCSET
5 PHASE
PVCC
COMP
3.3uH
1
FB
PGOOD
L1
2
2
1
PHASE
1
Q5
BSS138
GND
PHASE
TP6
R14
0
1
20
RT
6 UGATE
1
2
R2
15K
19
UGATE
C11
0.1uF
7 BOOT
BOOT
SGND
PGOOD
C2
220pF
C1
10nF
2
2
17
COMP18
1
1
VCC5 1
FB
2
R9
ENSS
0
VIN
8
1
1
RT 16
1
R5
DNP
GPI02
GREEN
1 PGOOD 1
Q3
DNP
4
LED3
RED
TP1
P10
2
2
VCC5
9
5
15
GPI01
1
2
3
VIN1 14
10
OCSET
VMSET
2
VCC5 13
1
1
REFOUT
Q1
BSC059N04LS G
2
12
R21
4.7K
P2
1
1
2
11
2
C16
1uF
2
C5
0.1uF
2
GPIO1
R18
C18
220uF
GND
0
R12
GPIO2
2.2
VIN 1
isl6420BIA
CDEL
2
VMSET
C4
10uF
1
REFOUT
330K
2
D1
BAT54C/SOT
R7
10K
+18V
C30
220uF
2
1
R6
C8
2.2uF
2
1.27K
2
1
C7
2.2uF
2
2
2
R8
1
1
1000pF
1
1
P1
3
VIN 1
2
R20
4.7K
2
1
1
2
1
3 4
C6
C12
2.2uF
JP1
VCC5
1
1
1
JP2
2
1
1
1
2
2
TP3
VMSET
ISL6420BEVAL1Z
AN1504 Rev 0.00
November 23, 2009
ISL6420BEVAL2Z Schematic
2
1
R16
1
5.6nF
0
1
2
Page 12 of 17
ISL6420BEVAL1Z
ISL6420BEVAL2Z Rev. A Bill of Materials
ID
REFERENCE
QTY
PART NUMBER
PART TYPE
DESCRIPTION
PACKAGE
VENDOR
1
U1
1
ISL6420BIAZ
PWM Controller IC
IC, Single PWM
Controller
20 Ld
QSOP
Intersil
2
Q1
1
BSC059N04LS G
MOSFET, Single
N-channel, 40V
SuperSO8 Infineon
3
Q2
1
BSC018N04LS G
MOSFET, Single
N-channel, 40V
SuperSO8 Infineon
4
Q3, Q4
5
Q5
1
BSS138LT1G
MOSFET, Single
N-channel, 50V, 200mA SOT23
On Semi
6
D1
1
BAT54C
Diode, Schottky
30V, 200mA
SOT23
Fairchild
7
L1
1
HC9-3R3-R
Inductor
3.3µH, 20%, 14.3A
SMD
Coiltronics
Do not populate
CAPACITORS
8
C1
1
Capacitor, Ceramic,
X7R
0.01µF, 10%, 50V
SM_0603
Various
9
C2
1
Capacitor, Ceramic,
COG
220pF, 10%, 50V
SM_0603
Various
10 C3
1
Capacitor, Ceramic,
X7R
5600pF, 10%, 50V
SM_0603
Various
11 C4, C31, C32
3
Capacitor, Ceramic,
X7R
1µF, 10%, 25V
SM_1210
Various
12 C5, C10, C11,
C13, C15, C27,
C28, C29
8
Capacitor, Ceramic,
X7R
0.1µF, 10%, 50V
SM_0603
Various
13 C6, C14
2
Capacitor, Ceramic,
X7R
1000pF, 10%, 50V
SM_0603
Various
14 C7, C8
2
Capacitor, Ceramic,
X7R
2.2µF, 10%, 50V
SM_1210
Various
15 C12
1
Capacitor, Ceramic,
X5R
2.2µF, 10%, 16V
SM_1206
Various
16 C16
1
Capacitor, Ceramic,
X7R
1µF, 10%, 50V
SM_1206
Various
17 C17
1
Capacitor, Ceramic,
X7R
1µF, 10%, 50V
SM_0805
Various
18 C18, C30
2
EEUFC1H221S
Capacitor, Alum. Elec. 220µF, 20%, 50V,
1150mA
12.5 X 15 Panasonic
19 C19, C20, C21,
C22
4
6TPB330M9L
Capacitor, POSCAP
330µF, 20%, 6.3V,
0.009
Case D3L
SANYO
20 C23, C24, C25,
C26
Do not populate
RESISTORS
21 R1
1
Resistor, Film
11.5k, 1%, 1/10W
SM_0603
Various
22 R2
1
Resistor, Film
15k, 1%, 1/10W
SM_0603
Various
23 R3
1
Resistor, Film
191, 1%, 1/10W
SM_0603
Various
24 R4
1
Resistor, Film
2.55k, 1%, 1/10W
SM_0603
Various
25 R6
1
Resistor, Film
330k, 1%, 1/10W
SM_0603
Various
26 R7
1
Resistor, Film
10k, 1%, 1/10W
SM_0603
Various
27 R8
1
Resistor, Film
1.27k,1%,1/10W
SM_0603
Various
AN1504 Rev 0.00
November 23, 2009
Page 13 of 17
ISL6420BEVAL1Z
ISL6420BEVAL2Z Rev. A Bill of Materials (Continued)
ID
REFERENCE
QTY
PART NUMBER
PART TYPE
DESCRIPTION
PACKAGE
VENDOR
28 R9, R11, R12,
R13, R14, R16
6
Resistor, Film
0, 1/10W
SM_0603
Various
29 R15, R17, R18
3
Resistor, Film
2.2, 1%, 1/10W
SM_0603
Various
30 R20, R21
2
Resistor, Film
4.7k,1%,1/10W
SM_0603
Various
31 R5
Do not populate
OTHERS
32 P1 - P4
4
1514-2
Turrett Post
Terminal post, through PTH
hole, 1/4 inch
Keystone
33 TP1 - TP5
3
5002
TEST POINT vertical,
white
PC test jack
Keystone
34 JP1, JP2, JP3
3
69190-202HLF
Header
1X2 Break Strip GOLD
BERG/FCI
35 JP1, JP2
2
SPC02SYAN
Jumper
Connector Jumper
Sullins
36 LED3
1
SSL-LXA3025IGC
LED
LED, Red/Green
SMD3x2.5 Lumex
mm
37 SW1
1
GT11MSCBE-T
Toggle Switch
SPDT Toggle Switch
SMD
38 P10
Do not populate
39 TP6
Do not populate
PTH
ITT
ISL6420BEVAL2Z Printed Circuit Board Layers
FIGURE 23. ISL6420BEVAL2Z - TOP LAYER (SILKSCREEN)
AN1504 Rev 0.00
November 23, 2009
Page 14 of 17
ISL6420BEVAL1Z
ISL6420BEVAL2Z Printed Circuit Board Layers (Continued)
FIGURE 24. ISL6420BEVAL2Z - TOP LAYER (COMPONENT SIDE)
FIGURE 25. ISL6420BEVAL2Z - LAYER 2
FIGURE 26. ISL6420BEVAL2Z - LAYER 3
AN1504 Rev 0.00
November 23, 2009
Page 15 of 17
ISL6420BEVAL1Z
ISL6420BEVAL2Z Printed Circuit Board Layers (Continued)
FIGURE 27. ISL6420BEVAL2Z - BOTTOM LAYER (SOLDER SIDE)
FIGURE 28. ISL6420AEVAL2Z - BOTTOM LAYER (SILKSCREEN)
AN1504 Rev 0.00
November 23, 2009
Page 16 of 17
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2.
Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4.
You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
5.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
you or third parties arising from such alteration, modification, copying or reverse engineering.
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6.
When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9.
Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2)
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
Colophon 7.0
工商网监
湘ICP备2023018690号
