USER’S MANUAL
ISL8117DEMO2Z
UG021
Rev 0.00
April 20, 2015
Demonstration Board User Guide
Description
Key Features
The ISL8117DEMO2Z demonstration board (shown in Figure 1)
features the ISL8117. The ISL8117 is a 60V high voltage
synchronous buck controller that offers external soft-start,
independent enable functions and integrates UV/OV/OC/OT
protection. Its current mode control architecture and internal
compensation network keep peripheral component count
minimal. Programmable switching frequency ranging from
100kHz to 2MHz helps to optimize inductor size while the
strong gate driver delivers up to 30A for the buck output.
• Small, compact design
Specifications
• PGOOD indicator
The ISL8117DEMO2Z demonstration board is designed for
high current applications. The current rating of the
ISL8117DEMO2Z is limited by the FETs and inductor selected.
The ISL8117 gate driver is capable of delivering up to 20A for
the buck output as long as the proper FETs and inductor are
provided. The electrical ratings of ISL8117DEMO2Z are shown
in Table 1.
TABLE 1. ELECTRICAL RATINGS
PARAMETER
Input Voltage
RATING
18V to 60V
Switching Frequency 200kHz
Output Voltage
12V
Output Current
20A
OCP Set Point
Minimum 25A at ambient room temperature
• Wide input range: 18V to 60V
• High light-load efficiency in pulse skipping DEM operation
• Programmable soft-start
• Optional DEM/CCM operation
• Supports prebias output with SR soft-start
• External frequency sync
• OCP, OVP, OTP, UVP protection
References
• The ISL8117 datasheet
Ordering Information
PART NUMBER
ISL8117DEMO2Z
DESCRIPTION
High Voltage PWM Step-Down
Synchronous Buck Controller
Recommended Testing
Equipment
The following materials are recommended to perform testing:
• 0V to 60V power supply with at least 30A source current
capability
• Electronic loads capable of sinking current up to 30A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
FIGURE 1. ISL8117DEMO2Z DEMONSTRATION BOARD TOP
UG021 Rev 0.00
April 20, 2015
FIGURE 2. ISL8117DEMO2Z DEMONSTRATION BOARD BOTTOM
Page 1 of 13
ISL8117DEMO2Z
Quick Test Guide
The rated load current is 20A with the OCP point set at minimum
25A at room temperature ambient conditions.
1. Jumper J5 provides the option to select CCM or DEM. Please
refer to Table 2 for the desired operating option. Ensure that
the circuit is correctly connected to the supply and electronic
loads prior to applying any power. Please refer to Figure 4 for
proper set-up.
2. Turn on the power supply.
3. Adjust input voltage VIN within the specified range and
observe output voltage. The output voltage variation should
be within 3%.
4. Adjust load current within the specified range and observe
output voltage. The output voltage variation should be
within 3%.
5. Use an oscilloscope to observe output voltage ripple and
phase node ringing. For accurate measurement, please refer
to Figure 3 for proper test set-up.
TABLE 2.
JUMPER #
J5
J6
POSITION
FUNCTION
CCM (pins 1-2)
Continuous current mode
DEM (pins 2-3)
Diode emulation mode
(Pins 1-2)
Disable the PWM
The temperature operating range is -40°C to +125°C.
Please note that air flow is needed for higher temperature
ambient conditions.
Evaluating the Other Output
Voltages
The ISL8117DEMO2Z kit output is preset to 12V, however, the
output can be adjusted from 5V to 24V. The output voltage
programming resistor, R2 , will depend on the desired output
voltage of the regulator and the value of the feedback resistor
R1, as shown in Equation 1.
0.6
R 2 = R 1 ------------------------------
V
– 0.6
(EQ. 1)
OUT
Table 3 shows the component selection that should be used for
the respective VOUT of 5V, 12V and 24V.
TABLE 3. EXTERNAL COMPONENT SELECTION
VOUT
R2
5V
5.9k
R4
R7
L1
C6
36k 7.5k IHLP6767GZER3R3M11, 150pF
3.3µH/35A
VIN
MAX
RANGE IOUT
8V~60V 20A
12V 2.26k 90.9k 7.5k IHLP6767GZER5R6M11, 220pF 18V~60V 20A
5.6µH/28A
24V 1.1k 150k 3.3k IHLP6767GZER100M11, 470pF 28V~60V 10A
10µH/19A
OUTPUT
CAP
OUTPUT
OUTPUT
CAP
CAP
OR
ORMOSFET
MOSFET
FIGURE 3. PROPER PROBE SET-UP TO MEASURE OUTPUT RIPPLE
AND PHASE NODE RINGING
Functional Description
The ISL8117DEMO2Z is a compact design with high efficiency
and high power density.
As shown in Figure 4 on page 3, 18V to 60V VIN is supplied to J1
(+) and J2 (-). The regulated 12V output on J3 (+) and J4 (-) can
supply up to 20A to the load. Due to high thermal efficiency, the
demonstration board can run at 20A continuously without air
flow in room temperature ambient condition.
As shown in Table 2, connector J5 provides selection of either
CCM mode (shorting pin 1 and pin 2) or DEM mode (shorting
pin 2 and pin 3). Connector J6 provides an option to disable the
converter by shorting its pin 1 and pin 2.
Operating Range
The input voltage range is from 18V to 60V for an output voltage
of 12V. If the output voltage is set to a lower value, the minimum
VIN can be reset to a lower value by changing the ratio of R4 and
R5. The minimum EN threshold that VIN can be set to is 4.5V.
UG021 Rev 0.00
April 20, 2015
Layout Guidelines
Careful attention to layout requirements is necessary for
successful implementation of an ISL8117 based DC/DC
converter. The ISL8117 switches at a very high frequency and
therefore the switching times are very short. At these switching
frequencies, even the shortest trace has significant impedance.
Also, the peak gate drive current rises significantly in an
extremely short time. Transition speed of the current from one
device to another causes voltage spikes across the
interconnecting impedances and parasitic circuit elements.
These voltage spikes can degrade efficiency, generate EMI and
increase device overvoltage stress and ringing. Careful
component selection and proper PC board layout minimizes the
magnitude of these voltage spikes.
There are three sets of critical components in a DC/DC converter
using the ISL8117: the controller, the switching power
components and the small signal components. The switching
power components are the most critical from a layout point of
view because they switch a large amount of energy which tends
to generate a large amount of noise. The critical small signal
components are those connected to sensitive nodes or those
supplying critical bias currents. A multilayer printed circuit board
is recommended.
Page 2 of 13
ISL8117DEMO2Z
Layout Considerations
1. The input capacitors, upper FET, lower FET, inductor and
output capacitor should be placed first. Isolate these power
components on dedicated areas of the board with their
ground terminals adjacent to one another. Place the input
high frequency decoupling ceramic capacitors very close to
the MOSFETs.
2. If signal components and the IC are placed in a separate area
to the power train, it is recommend to use full ground planes
in the internal layers with shared SGND and PGND to simplify
the layout design. Otherwise, use separate ground planes for
power ground and small signal ground. Connect the SGND
and PGND together close to the IC. DO NOT connect them
together anywhere else.
3. The loop formed by the input capacitor, the top FET and the
bottom FET must be kept as small as possible.
4. Ensure the current paths from the input capacitor to the
MOSFET, to the output inductor and the output capacitor are
as short as possible with maximum allowable trace widths.
5. Place the PWM controller IC close to the lower FET. The LGATE
connection should be short and wide. The IC can be best
placed over a quiet ground area. Avoid switching ground loop
currents in this area.
6. Place VCC5V bypass capacitor very close to the VCC5V pin of
the IC and connect its ground to the PGND plane.
7. Place the gate drive components - optional BOOT diode and
BOOT capacitors - together near the controller IC.
8. The output capacitors should be placed as close to the load as
possible. Use short wide copper regions to connect output
capacitors to load to avoid inductance and resistances.
9. Use copper filled polygons or wide but short trace to connect
the junction of upper FET, lower FET and output inductor. Also
keep the PHASE node connection to the IC short. DO NOT
unnecessarily oversize the copper islands for the PHASE
node. Since the phase nodes are subjected to very high dv/dt
voltages, the stray capacitor formed between these islands
and the surrounding circuitry will tend to couple switching
noise.
10. Route all high speed switching nodes away from the control
circuitry.
11. Create a separate small analog ground plane near the IC.
Connect the SGND pin to this plane. All small signal grounding
paths including feedback resistors, current limit setting
resistor, soft starting capacitor and EN pull-down resistor
should be connected to this SGND plane.
12. Separate the current sensing trace from the PHASE node
connection.
13. Ensure the feedback connection to the output capacitor is
short and direct.
VO
+
+
LOAD
A
VIN
-
V
+
-
A
-
FIGURE 4. PROPER TEST SET-UP
.
UG021 Rev 0.00
April 20, 2015
Page 3 of 13
ISL8117DEMO2Z
Typical Demonstration Board Performance Curves
VIN = 48V, VOUT = 12V, unless
100
100
95
95
90
90
EFFICIENCY (%)
EFFICIENCY (%)
otherwise noted.
VIN = 24V
85
80
VIN = 48V
75
80
70
65
65
0
2
4
6
8
10
12
14
16
18
60
20
VIN = 48V
75
70
60
VIN = 24V
85
0
2
4
6
8
IOUT (A)
10
12
14
16
18
20
IOUT (A)
FIGURE 5. CCM EFFICIENCY vs LOAD, VOUT = 5V
FIGURE 6. DEM EFFICIENCY vs LOAD, VOUT = 5V
5.090
5.085
VOUT (V)
5.080
VIN = 24V
5.075
5.070
5.065
VIN = 48V
5.060
5.055
5.050
0
2
4
6
8
10
12
14
16
18
20
IOUT (A)
FIGURE 7. LOAD REGULATION, VOUT = 5V
1.00
1.00
0.95
0.95
VIN = 48V
VIN = 36V
0.85
VIN = 24V
0.80
VIN = 18V
0.75
VIN = 18V
0.80
0.75
0.70
0.65
0.65
0
2
4
6
8
10
12
14
IOUT (A)
FIGURE 8. CCM EFFICIENCY vs LOAD
UG021 Rev 0.00
April 20, 2015
16
18
20
VIN = 60V
VIN = 24V
0.85
0.70
0.60
VIN = 48V
VIN = 36V
0.90
EFFICIENCY
EFFICIENCY
0.90
VIN = 60V
0.60
0
2
4
6
8
10
12
14
16
18
IOUT (A)
FIGURE 9. DEM EFFICIENCY vs LOAD
Page 4 of 13
20
ISL8117DEMO2Z
Typical Demonstration Board Performance Curves
VIN = 48V, VOUT = 12V, unless
otherwise noted. (Continued)
12.29
12.29
12.27
12.27
VOUT (V)
12.23
VIN = 36V
IO = 10A
VIN = 48V
VIN = 60V
12.21
12.23
IO = 20A
12.21
12.19
12.19
12.17
12.17
12.15
2
4
6
8
10
12
14
IO = 0A
12.25
VOUT (V)
VIN = 24V
12.25
VIN = 18V
16
18
20
IOUT (A)
12.15
18
23
28
33
38
43
48
53
VIN (V)
FIGURE 10. CCM MODE LOAD REGULATION
FIGURE 11. CCM MODE LINE REGULATION
10.00
PHASE 50V/DIV
LGATE 5V/DIV
IIN (A)
1.00
CLKOUT 5V/DIV
CCM
0.10
IL 5A/DIV
DEM
0.01
0.01
0.1
1
10
2µs/DIV
IOUT (A)
FIGURE 12. INPUT CURRENT COMPARISON WITH MODE = CCM/DEM
VOUT 50mV/DIV, VIN = 48V, IO = 0A
FIGURE 13. PHASE, LGATE, CLKOUT AND INDUCTOR CURRENT
WAVEFORMS, VIN = 48V, IO = 0A
VOUT 50mV/DIV, VIN = 48V, IO = 0A
1ms/DIV
VOUT 50mV/DIV, VIN = 48V, IO = 20A
VOUT 50mV/DIV, VIN = 48V, IO = 20A
4µs/DIV
4µs/DIV
FIGURE 14. OUTPUT RIPPLE, CCM MODE
FIGURE 15. OUTPUT RIPPLE, DEM MODE
UG021 Rev 0.00
April 20, 2015
Page 5 of 13
58
ISL8117DEMO2Z
Typical Demonstration Board Performance Curves
VIN = 48V, VOUT = 12V, unless
otherwise noted. (Continued)
VOUT 5V/DIV
VOUT 5V/DIV
LGATE 5V/DIV
LGATE 5V/DIV
CLKOUT 5V/DIV
CLKOUT 5V/DIV
IL 10A/DIV
4ms/DIV
IL 10A/DIV
4ms/DIV
FIGURE 16. CCM START-UP WAVEFORMS: VIN = 48V, IO = 0A
FIGURE 17. DEM START-UP WAVEFORMS: VIN = 48V, IO = 0A
VOUT 5V/DIV
VOUT 5V/DIV
SS 1V/DIV
SS 1V/DIV
EN 5V/DIV
EN 5V/DIV
PGOOD 5V/DIV
PGOOD 5V/DIV
20ms/DIV
20ms/DIV
FIGURE 18. CCM START-UP WAVEFORMS: VIN = 48V, IO = 0A
FIGURE 19. DEM START-UP WAVEFORMS: VIN = 48V, IO = 0A
SYNC 5V/DIV
SS 500mV/DIV
LGATE 5V/DIV
CLKOUT 5V/DIV
VOUT 10V/DIV
IL 5A/DIV
PGOOD 5V/DIV
1ms/DIV
FIGURE 20. TRACKING WAVEFORMS, VIN = 48V, IO = 0A
UG021 Rev 0.00
April 20, 2015
2µs/DIV
FIGURE 21. FREQUENCY SYNCHRONIZATION WAVEFORMS, VIN = 48V,
IO = 0A
Page 6 of 13
ISL8117DEMO2Z
Typical Demonstration Board Performance Curves
VIN = 48V, VOUT = 12V, unless
otherwise noted. (Continued)
VOUT 500mV/DIV
VOUT 10V/DIV
SS 5V/DIV
IOUT 10A/DIV
PGOOD 5V/DIV
IL 20A/DIV
400µs/DIV
40ms/DIV
FIGURE 22. LOAD TRANSIENT; VIN = 48V, IO = 0A TO 20A, 1A/µs,
CCM MODE
FIGURE 23. SHORT-CIRCUIT WAVEFORMS, VIN = 48V
UG021 Rev 0.00
April 20, 2015
Page 7 of 13
ISL8117DEMO2Z
J1
4
3
2
1
1
SPST
0.1u/25V
C5
R4
R5
J6
10k
90.9k
4.7u/100V
4.7u/100V
C39
C40
10u/100V 10u/100V
10u/100V
10u/100V 10u/100V
10u/100V
10u/100V 10u/100V
VIN
10u/10V
C4
0.1u/100V
C17
2
UG021 Rev 0.00
April 20, 2015
Schematic
C12
C23
C24
C25
C26
C27
C28
C29
J2
R9 20
C21
0.1u/100V
vout
U3
2
4
3
2
1
vin
IN
OUT
14
exbi
exbi
vcc5
D1
R23
R19
GND
1A/100V
en
R20
0
1
13
14
15
0.1u/25V
clk
Q1
DNP
BOOT
VIN
10k
ISL80138
U2
EXTBIAS
15
8
C20
16
R21
10k
EN
ADJ
17
EN
12
SGND
en
GND
30.9k
7
CLKOUT
Q2
NMOS
C2
1u/50V
UG
12
ug
11
ph
J3
vout
22U/25V
2
mod
MOD/SYNC
PHASE
R14 100k
R7 7.5k
R6
200K
7
5
SYNC
FB
RT
6
4
LGATE/OCS
PGOOD
SS/TRK
rt
3
1u/50V
22U/25V
VOUT
22U/25V
330u/35V
ISL8117
pg
JMP
L1
10
ISEN
5.6u/28A
isen
C22
C8
C9
C10
C11
R15
9
VCC5V
vcc5
10u/10V
20
Q3
NMOS
Q4
NMOS
J4
6
5
4
3
2
1
C1
8
3
2
1
PGND
J5
6
5
4
3
2
1
lg
GND
ss
C3
C6
R3
3.6k
0.047u/25V
VCC5
220p/50V
R1
43.2k
fb
R2
2.26k
22U/25V
22U/25V
22U/25V
22U/25V
22U/25V
22U/25V
22U/25V
22U/25V
22U/25V
vout
Page 8 of 13
C30
C31
C32
C33
C34
C35
C36
C37
C38
Title
FIGURE 24. ISL8117DEMO2Z SCHEMATIC
d
Size
A
ISL8117DEMO2Z
Document Number
Vin:18V~55V
Vout:12V 20A 200K
Rev
A
ISL8117DEMO2Z
ISL8117DEMO2Z Bill of Materials
MANUFACTURER
PART
REFERENCE
DESIGNATOR
QTY UNITS
DESCRIPTION
ISL8117DEMO2ZREVAPCB
1
ea
CGA9N3X7S2A106K230KB
8
ea
C12, C23, C24, C25, C26, CAP, SMD, 2220, 10µF, 100V, 10%, X7S, AECC27, C28, C29
Q200, ROHS
TDK
GRM32ER71E226KE15L
12
ea
a) C8, C9, C10, C30, C31, CAP, SMD, 1210, 22µF, 25V, 10%, X7R, ROHS
C32, C33, C34, C35
MURATA
GRM32ER71E226KE15L
0
ea
b) C36, C37, C38
CAP, SMD, 1210, 22µF, 25V, 10%, X7R, ROHS
MURATA
C0603X7R101-104KNE
2
ea
C4, C21
CAP, SMD, 0603, 0.1µF, 100V, 10%, X7R, ROHS VENKEL
GRM39X7R104K025AD
2
ea
C5, C20
CAP, SMD, 0603, 0.1µF, 25V, 10%, X7R, ROHS MURATA
C1608X5R1H105K
2
ea
C2, C22
CAP, SMD, 0603, 1µF, 50V, 10%, X5R, ROHS
ECJ-1VB1A106M
2
ea
C1, C17
CAP, SMD, 0603, 10µF, 10V, 20%, X5R, ROHS PANASONIC
GRM188R71H221KA01D
1
ea
C6
CAP, SMD, 0603, 220pF, 50V, 10%, X7R, ROHS MURATA
GRM188R71E473KA01D
1
ea
C3
CAP, SMD, 0603, 0.047µF, 25V, 10%, X7R,
ROHS
CGA6M3X7S2A475K200AB
2
ea
C39, C40
CAP, SMD, 1210, 4.7µF, 100V, 10%, X7S, ROHS TDK
EEE-FP1V331AP
1
ea
C11
CAP, SMD, 10x10.2mm, 330µF, 35V, 20%,
ALUM.ELEC., ROHS
IHLP6767GZER5R6M11
1
ea
L1
COIL-PWR INDUCTOR, SMD, 17.15mm2, 5.6µH, VISHAY
20%, 28A, ROHS
68000-236HLF
1
ea
J5
CONN-HEADER, 1x3, BREAKAWY 1X36,
2.54mm, ROHS
BERG/FCI
69190-202HLF
1
ea
J6
CONN-HEADER, 1X2, RETENTIVE, 2.54mm,
0.230X 0.120, ROHS
BERG/FCI
SPC02SYAN
2
ea
J5, J6
CONN-JUMPER, SHORTING, 2PIN, BLACK,
GOLD, ROHS
SULLINS
MBR1H100SFT3G
1
ea
D1
DIODE-RECTIFIER, SMD, 2P, S0D-123FL, 100V, ON SEMICONDUCTOR
1A, ROHS
ISL80138IVEAJZ
1
ea
U3
IC-40V LDO ADJ. LINEAR REGULATOR, 14P,
HTSSOP, ROHS
INTERSIL
ISL8117FRZ
1
ea
U2
IC-55V SWITCHING CONTROLLER, 16P, QFN,
ROHS
INTERSIL
BSC067N06LS3G
3
ea
Q2, Q3, Q4
TRANSISTOR-MOS, N-CHANNEL, 8P,
PG-TDSON-8, 60V, 50A, ROHS
INFINEON TECHNOLOGY
ERJ-3EKF20R0V
2
ea
R9, R15
RES, SMD, 0603, 20Ω, 1/10W, 1%, TF, ROHS
PANASONIC
CR0603-10W-000T
1
ea
R23
RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS
VENKEL
RK73H1JT1002F
3
ea
R5, R19, R21
RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS
KOA
CR0603-10W-1003FT
1
ea
R14
RES, SMD, 0603, 100k, 1/10W, 1%, TF, ROHS VENKEL
CR0603-10W-2003FT
1
ea
R6
RES, SMD, 0603, 200k, 1/10W, 1%, TF, ROHS VENKEL
RC0603FR-072K26L
1
ea
R2
RES, SMD, 0603, 2.26k, 1/10W, 1%, TF, ROHS YAGEO
RC0603FR-0730K9L
1
ea
R20
RES, SMD, 0603, 30.9k, 1/10W, 1%, TF, ROHS YAGEO
CR0603-10W-3601FT
1
ea
R3
RES, SMD, 0603, 3.6k, 1/10W, 1%, TF, ROHS
RC0603FR-0743K2L(Pb-free)
1
ea
R1
RES, SMD, 0603, 43.2k, 1/10W, 1%, TF, ROHS YAGEO
CR0603-10W-7501FT
1
ea
R7
RES, SMD, 0603, 7.5k, 1/10W, 1%, TF, ROHS
UG021 Rev 0.00
April 20, 2015
PWB-PCB, ISL8117DEMO2Z, REVA, ROHS
MANUFACTURER
SHENZHEN MULTILAYER PCB
TECHNOLOGY CO., LTD
TDK
MURATA
PANASONIC
VENKEL
VENKEL
Page 9 of 13
ISL8117DEMO2Z
ISL8117DEMO2Z Bill of Materials
MANUFACTURER
PART
REFERENCE
DESIGNATOR
QTY UNITS
(Continued)
DESCRIPTION
MANUFACTURER
ERJ-3EKF9092V
1
ea
R4
RES, SMD, 0603, 90.9k, 1/10W, 1%, TF, ROHS PANASONIC
7795
2
ea
J1, J2
HDWARE, TERMINAL, M4 METRIC SCREW, TH, KEYSTONE
4P, SNAP-FIT, ROHS
7798
2
ea
J3, J4
HDWARE, TERMINAL, M4 METRIC SCREW, TH, KEYSTONE
6P, SNAP-FIT, ROHS
SJ-5003SPBL
4
ea
Bottom four corners
BUMPONS, 0.44inW x 0.20inH, DOMETOP,
BLACK
0
ea
Q1
DO NOT POPULATE OR PURCHASE
UG021 Rev 0.00
April 20, 2015
3M
Page 10 of 13
ISL8117DEMO2Z
UG021 Rev 0.00
April 20, 2015
ISL8117DEMO2Z PCB Layout
Page 11 of 13
FIGURE 25. TOP LAYER
FIGURE 26. SECOND LAYER (SOLID GROUND)
FIGURE 27. THIRD LAYER
FIGURE 28. BOTTOM LAYER
ISL8117DEMO2Z
UG021 Rev 0.00
April 20, 2015
ISL8117DEMO2Z PCB Layout
(Continued)
FIGURE 29. SILKSCREEN TOP
FIGURE 30. SILKSCREEN BOTTOM
Page 12 of 13
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2.
Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4.
You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
5.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
you or third parties arising from such alteration, modification, copying or reverse engineering.
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6.
When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9.
Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2)
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
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