User’s Manual
ISL8225MEVAL2Z
User’s Manual: Evaluation Board
Industrial Analog and Power
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
Renesas Electronics Corporation
www.renesas.com
Rev.2.00 Jun.25.19
User’s Manual
ISL8225MEVAL2Z
Evaluation Board
The ISL8225M is a complete, dual step-down switching mode DC/DC module. The dual outputs can easily be
paralleled for single-output, high-current use. It is easy to apply this high-power, current-sharing DC/DC power
module to power-hungry datacom, telecom, and FPGA applications. All that is needed to have a complete, dual
15A design ready for use are the ISL8225M, a few passive components, and VOUT setting resistors.
The ease of use virtually eliminates design and manufacturing risks while dramatically improving time to market. If
more output current is needed, parallel up to six ISL8225M modules to scale up to a 180A solution.
The ISL8225M has a thermally enhanced, compact QFN package that operates at full load and over-temperature
without requiring forced-air cooling. Easy access to all pins, with few external components, reduces PCB design
to a component layer and a simple ground layer.
The ISL8225MEVAL2Z evaluation board allows for a single 6-phase paralleled output, which delivers high current
up to 90A. The input voltage is 4.5V to 20V and the default output voltage is set at 1.2V. The current level is 90A
with no extra cooling required.
Key Features
• Up to 300W output for 3 modules in parallel operation
• Up to 90A load capability for 3 modules in parallel operation
• 4.5V to 20V input range
• 0.6V to 5.5V output range
• 1.5% output voltage accuracy
• Up to 95% conversion efficiency
• Lower output ripple and input ripple due to multiple phases interleave
Specifications
This board is configured and optimized for the following operating conditions:
• VIN = 4.5V to 20V
• VO = 1.2V
• IO = 90A
• fSW = 500kHz
Ordering Information
Part Number
ISL8225MEVAL2Z
Description
6-Phase, 90A Evaluation Board
Related Literature
For a full list of related documents, visit our website:
• ISL8225M device page
Related Resources
• Evaluation Board Video
AN1789 Rev.2.00
Jun.25.19
Page 2 of 18
ISL8225MEVAL2Z
+
VIN V 4.5V to 20V
-
+
Load
(0A~90A)
Note 1
-
+
V
-
VOUT
Note:
1. Multiple loads can be paralleled to
reach 90A (For example, two 45A
loads paralleled together).
Figure 1. ISL8225MEVAL2Z Board Image
AN1789 Rev.2.00
Jun.25.19
Page 3 of 18
ISL8225MEVAL2Z
1.
1.1
1. Functional Description
Functional Description
Recommended Equipment
• 0V to 20V power supply with at least 10A source current capability
• Electronic load capable of sinking current up to 90A (multiple electronic current loads can be used in parallel to
sink more current)
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
1.2
Quick Start
The inputs are J3 (VIN) and J4 (GND). The outputs are J1 and J5 (VOUT), J2 and J6 (GND), and J6 (VOUT2).
See Figure 1. This 90A evaluation board can be easily modified to 30A (one module) or 60A (two modules)
operation.
1. Connect a power supply capable of sourcing at least 10A to the input (VIN J3 and GND J4) of the
ISL8225MEVAL2Z, with a voltage between 4.5V to 20V. Connect an electronic load or the device to be
powered to the output (VOUT (J1, J5) and GND (J2, J6)) of the board. All connections, especially the low
voltage, high current VOUT lines, should be able to carry the desired load current and should be made as short
as possible. Duplicate tab connections on VOUT (J1, J5) and GND (J2, J6) to carry large current.
2. Ensure the jumpers for EN2 and EN3 are in the “ON” position and EN is open. Turn on the power supply. If the
board is working properly, the green LED illuminates; if not, the red LED illuminates (recheck the wire/jumper
connections in this case). Measure the output voltage, VOUT, which should be at 1.2V.
3. The ISL8225MEVAL2Z is manufactured with a VOUT default value of 1.2V; if different output voltages are
needed, board resistors can be exchanged to provide the desired VOUT. See Table 1 on page 4 for R2/R64
resistor values, which can be used to produce different output voltages.
For 12V VIN and VOUT more than 1.5V, the switching frequency needs to be adjusted, as shown in Table 1. The
resistor RFSET can be adjusted for the desired frequency. No frequency adjustments are necessary for VOUT
below 1.5V. For 5V VIN, the frequency does not need to be adjusted and the module default frequency can be
used at any allowed VOUT. If the output voltage is set to more than 1.8V, the output current needs to be derated to
allow for safe operation. See the derating curves in the ISL8225M datasheet.
Table 1.
Value of Bottom Resistor for Different Output Voltages (R1 = 1k)
VOUT (V)
R2 /R64 (Ω)
Frequency (kHz)
RFSET (Ω) (VIN = 12V)
0.6
0/0
Default
Default
0.8
3010/1500
Default
Default
1.0
1500750
Default
Default
1.2
1000/500
Default
Default
1.5
665/332
Default
Default
2.5
316/158
650
249k
3.3
221/110
800
124k
5.0
137/68.1
950
82.5k
5.5
121/60.4
950
82.5k
AN1789 Rev.2.00
Jun.25.19
Page 4 of 18
ISL8225MEVAL2Z
1.3
1. Functional Description
Board Setting
If low current applications are needed, this 90A evaluation board can be easily programmed to 30A and 60A use.
1.3.1
30A Application (1 Module)
• EN -- Open, EN2-- OFF, EN3 -- OFF
In this mode, only module 1 is running and modules 2 and 3 are disabled.
1.3.2
60A Application (2 Modules)
• EN -- Open, EN2-- ON, EN3 -- OFF
• EN -- Open, EN2-- OFF, EN3 -- ON
In this mode, only modules 1 and 2 (or 3) are running and module 3 (or 2) is disabled.
1.3.3
90A Application (3 Modules)
• EN -- Open, EN2-- ON, EN3 -- ON
In this mode, all modules are running.
1.3.4
Disable All Modules and Use the EN Pin to Start the Modules
EN -- Connected
In this mode, all modules are disabled and EN can be used to control all modules to startup.
1.4
Evaluation Board Information
The evaluation board size is 150mm x 130mm. It is a 6-layer board, containing 2 oz. copper on the top and bottom
layers and 1 oz. copper on all internal layers. The board can be used as a 90A reference design. See “Board
Layout” on page 10. The board is made of FR4 material and all components, including the solder attachment, are
Pb-free.
1.4.1
Current Sharing Check
The evaluation board allows you to measure the current sharing accuracy. Four 0Ω resistors (such as R59~R62
for M1 Channel 2 in Figure 2) are put serially on each output with two on each side of the evaluation board. To
measure the output current of each phase, remove all four resistors and put looped wires or sensing resistors on
correct positions.
Although the assembled resistors have zero resistance, there is still small resistance (< 50mΩ) on each resistor.
At large output current, the efficiency can be decreased by 1~3% due to the power loss on those 0Ω resistors.
The efficiency curves are shown in Figures 16 and 17 with 0Ω resistors, while Figures 18 and 19 show the
efficiency curves by replacing those resistors with short copper straps.
1.4.2
Thermal Considerations and Current Derating
For high current applications, board layout is very critical to make the module operate safely and deliver maximum
allowable power. To carry large currents, the board layout needs to be designed carefully to maximize thermal
performance. To achieve this, select enough trace width, copper weight, and the proper connectors.
This evaluation board is designed for running 90A at 1.2V at room temperature without additional cooling systems
needed. However, if the output voltage is increased or the board is operated at elevated temperatures, the
available current is derated. See the derated current curves in the ISL8225M datasheet to determine the output
current available.
For layout of designs using the ISL8225M, the thermal performance can be improved by adhering to the following
design tips:
1. Use the top and bottom layers to carry the large current. VOUT1, VOUT2, Phase 1, Phase 2, PGND, VIN1, and
VIN2 should have large, solid planes. Place enough thermal vias to connect the power planes in different
layers under and around the module.
AN1789 Rev.2.00
Jun.25.19
Page 5 of 18
ISL8225MEVAL2Z
1. Functional Description
2. Phase 1 and Phase 2 pads are switching nodes that generate switching noise. Keep these pads under the
module. For noise-sensitive applications, Renesas recommends keeping phase pads only on the top and inner
layers of the PCB; do not place phase pads exposed to the outside on the bottom layer of the PCB. To improve
the thermal performance, the phase pads can be extended in the inner layer, as shown in Phase 1 and 2 pads
on layer 3 (Figure 11) for this 90A evaluation board. Make sure that layer 2 and layer 4 have the GND layers
to cover the extended areas of phase pads at layer 3 to avoid noise coupling.
3. To avoid noise coupling, Renesas recommends adding 1nF capacitors on all COMP and ISHARE pins of each
module for multiple module operations.
4. Place the modules evenly on the board and leave enough space between modules. If the board space is
limited, try to put the modules with low power loss closely together (such as low VOUT or IOUT) while still
separating the module with high power loss.
5. If the ambient temperature is high or the board space is limited, airflow is needed to dissipate more heat from
the modules. A heat sink can also be applied to the top side of the module to further improve the thermal
performance (heat sink recommendation: Aavid Thermalloy, part number 375424B00034G, www.aavid.com).
1.4.3
Remote Sensing
The ISL8225MEVAL2Z board allows you to apply the remote sensing function to loads to achieve good output
regulation accuracy. To make use of this function, remove resistors R7 and R8 and connect the Kelvin sensing
lines through the jumper JP4 (RS) to the point of load.
1.4.4
Phase-Shift Programming
In current sharing mode, the phase-shift is needed to interleave the different phases to lower the input and output
ripples. As shown in Table 2, there are different sharing modes from 2-phase (180° phase-shift) and 4-phase (90°
phase-shift) to 6-phase (60° phase-shift). The master module sends the CLKOUT signal to the SYNC pin of the
second module with the phase-shift to its own clock signal. Then the second module synchronizes to the CLKOUT
signal of the master module and sends its CLKOUT signal to the third module’s SYNC pin. The individual 2
phases of each module are set as a 180° phase-shift by default. This evaluation board is set to mode 5B with 60°
phase-shift between phases.
If the MODE pin is not tied to VCC (5A or 5B), all VMON pins of different modules can be tied together, except the
VMON pin of the master phase. If mode 7A is needed to allow for 90° phase-shift, the MODE pin has to tie to
VCC. In this case, the VMON pin of the associated module needs to be separated by connecting a 953Ω resistor
and a 22nF capacitor to SGND, as shown in the ISL8225M datasheet.
Table 2.
ISL8225M 3-Module Board Operation Modes
1st Module (I = Input; O = Output; I/O = Input and Output, Bi-Direction)
CLKOUT/
VSEN2 REFIN WRT 1st
(I OR O)
+ (I)
ISHARE
(I/O)
Represents
Which
Channel(S)
Current
Modes of Operation
2nd Channel
WRT 1ST (O)
Operation
Mode
of 2nd
Module
Operation
Mode
of 3rd
Module
Output
Mode
EN2
(I)
EN3
(I)
VSEN2
- (I)
Mode
(I)
5A
0
0
VCC
GND
-
60°
Both
Channels
180°
-
-
2-Phase
5B
1
1
VCC
GND
-
60°
Both
Channels
180°
5B
5B
6-Phase
7A
1
0
VCC
VCC
VCC
90°
Both
Channels
180°
5A or 7A
-
4-Phase
8
Cascaded Module Operation MODEs 5A+5A+7A+5A+5A+5A/7A, No External Clock Required
AN1789 Rev.2.00
Jun.25.19
12-Phase
Page 6 of 18
PCB Layout Guidelines
ISL8225MEVAL2Z Board Schematics
R22
IN
OUT
DNP
S1
S1
20
19
18
17
16
15
14
13
1000PF
1000PF
Page 7 of 18
OPEN
1000PF
C29
OUT
S1
S1
C08
330UF
OPEN
C07
DNP
C08A
C04
330UF
OPEN
E
SGND1
E
S1
TIM KLEMANN
RELEASED BY:
UPDATED BY:
DATE:
ENGINEER:
08/23/2012
DATE:
TIM KLEMANN
S1
DATE:
ISL8225M
EVALUATION BOARD
11/01/2012
$CDS_IMAGE|intersil_color_sm.jpg|1194|282
DATE:
JIAN YIN
TITLE:
SCHEMATIC
TESTER
2N7002-7-F
2
EGND
IN
DRAWN BY:
C10
4
Q1
VMON
100PF
C6
CLKOUT1
3
1
GND
GND_S1
R13
S1
IN
J2
0
C35
0
C4
C5
1000PF
I00000213
S3
R8
OUT
3
GRN
RED
S3
-
0.01UF
DNP
LED1
C01
C40
1000PF
0
R10
DNP
R2
RS
ISHARE
S1
1K
R6
JP8
EN
0
1K
MASK#
HRDWR ID
REV.
D
ISL8225MEVAL2Z
E
FILENAME:
Figure 2. ISL8225MEVAL2Z Board Schematic
SHEET
1
3
2. PCB Layout Guidelines
3.32K
OPEN
C06
R7
+
J6
R18
OUT
E
0
S1
EN/FF
3.32K
1
0
47UF
R1
OUT
0
2
R39
TP10
E
C03
21
COMP
R9
PGOOD
R53
IN
C11
DNP
R56
R12
0
0
C02
OPEN
R10B
PHASE2U1
PHASE1U1
3K
R5
22
GND
R38
PGOOD
OUT
C12
E
R11
IN
TP9
R40
1K
IN
VCC1
47UF
2
3
4
5
6
7
8
9
22UF
CIN4
22UF
CIN2
1000PF
C19
22UF
CIN3
22UF
CIN1
470UF
CINA
CINB
470UF
0
24
COMP1
R47
VOUT1
VMON1
ISHARE
CLKOUT
EN/FF1
VIN1
EN/FF2
PGND
S1
IN
IN
23
VSEN1+
V1SEN2+
DNP
0
0
26
VCC1
IN
R60
TP8
PGOOD
VSEN1-
S1
R16
R61
V1SEN2+
PHASE1
IN
0
0
25
ISL8225MIRZ
N/C
12
MODE1
R59
VCC1
R9B
1
VOUT2
E
VCC1
R62
IN
VSEN2+
M1
TP4
DNP
J5
OUT
COMP2
MODE
VMON2
SYNC
SGND
VCC
VIN2
PHASE2
10
11
E
0
VSEN2-
GND
1000PF
IN
COMP
S1
PGND
IN
499
E
GND
R15
499
C8
VOUT
S1
R42
0
VCC1
R82
C05
S1
E
J4
OUT
R64
1.2V @ 90A
TP1
OPEN
VIN
OUT
VMON
MODE1
C1
4.7UF
J3
R14
C7
100PF
249K
RFSET
TP7
OUT
TP6
J1
VOUT
IN
0
C32
C18
TP3
VCC1
OPEN
4.5V TO 20V
SYNC
IN
JP4
SYNC
TP5
OPEN
2.1
ISL8225MEVAL2Z
AN1789 Rev.2.00
Jun.25.19
2.
MODE2
VCC2
DNP
R28
DNP
C14
0
100PF
R35
0
R25
R23
0
C33
R54
OPEN
OUT
OUT
R43
S2
COMP2
E
C26
1000PF
0
IN
R45
S2
COMP
OUT
0
OUT
R67
25
C25
3
OUT
330UF
C016
OPEN
OPEN
47UF
C010
ISHARE
1000PF
IN
C30
C16
1000PF
0
R19
VMON1
C13
C17
1000PF
CLKOUT2
S2
DRAWN BY:
OUT
OPEN
C15
TIM KLEMANN
DATE:
RELEASED BY:
DATE:
UPDATED BY:
DATE:
S2
Figure 3. ISL8225MEVAL2Z Board Schematic
TIM KLEMANN
ENGINEER:
08/23/2012
TITLE:
11/01/2012
TESTER
DATE:
JIAN YIN
ISL8225M
EVALUATION BOARD
SCHEMATIC
Page 8 of 18
2. PCB Layout Guidelines
S2
SGND2
S2
100PF
S2
EGND
E
1000PF
DNP
R57
1
0
R27
0
S2
S2
E
R52
S2
OFF
DNP
C47
OPEN
2
J8
GND_S2
OUT
COMP2
ON
EN2
R87
S2
E
OUT
S2
C0
DNP
C42
DNP
R20
OPEN
R86
DNP
DNP
EN/FF
0
R4
R3
IN
OUT
R70
C011
20
19
18
17
16
15
IN
DNP
14
13
VCC2
VOUT
0
OPEN
V2SEN2+
R17
0
R20B
COMP1
VMON1
ISHARE
CLKOUT
EN/FF1
VIN1
EN/FF2
IN
PGND
0
OPEN
21
C36
PHASE1U2
0
R49
22
VSEN1+
VSEN1-
S2
R66
C37
E
R69
PGOOD
23
VOUT1
PHASE1
12
VCC2
OUT
47UF
0
24
PGOOD
IN
DNP
47UF
R65
OPEN
ISL8225MIRZ
N/C
C015
V2SEN2+
VOUT2
11
C013
IN
OPEN
0
26
VSEN2+
M2
0
VCC2
C012
PHASE2U2
COMP2
MODE
VMON2
SYNC
SGND
VCC
10
R72
R28B
1
VSEN2-
PHASE2
IN
0
R68
0
E
R48
R71
2
3
4
5
VIN2
6
PGND
7
8
22UF
E
9
22UF
22UF
CIN8
CIN7
22UF
CIN6
S2
IN
CIN5
0
C09
4.7UF
MODE2
IN
OUT
C2
VCC2
VMON
VMON1
OUT
VIN
ISL8225MEVAL2Z
AN1789 Rev.2.00
Jun.25.19
CLKOUT1
R36
0
0
OUT
R31
C21
DNP
R30
C34
VCC3
MODE3
DNP
R33
0
100PF
R55
OPEN
OUT
ISL8225MEVAL2Z
VMON1
IN
VMON2
OUT
OUT
C3
COMP3
E
C28
1000PF
R73
0
2
COMP2
M3
0
0
0
R80
COMP3
1000PF
C27
E
ISHARE
OUT
S3
1000PF
0
VMON2
C31
C23
3
1000PF
2
J7
EN3
OPEN
IN
S3
C22
S3
OUT
TIM KLEMANN
RELEASED BY:
ENGINEER:
08/23/2012
DATE:
UPDATED BY:
ISL8225M
EVALUATION BOARD
11/01/2012
SCHEMATIC
TESTER
$CDS_IMAGE|intersil_color_sm.jpg|1194|282
DATE:
JIAN YIN
TITLE:
DATE:
TIM KLEMANN
S3
E
DATE:
MASK#
HRDWR ID
ISL8225MEVAL2Z
FILENAME:
Page 9 of 18
Figure 4. ISL8225MEVAL2Z Board Schematic
SHEET
REV.
2. PCB Layout Guidelines
EGND
S3
DRAWN BY:
CLKOUT3
OPEN
S3
1000PF
C24
TP11
100PF
S3
C20
C9
1
R81
S3
0
OUT
IN
OFF
R26
ON
EN/FF
S3
OPEN
DNP
S3
GND_S3
47UF
C018
C019
OPEN
OUT
OUT
E
CLKOUT3
TP2
330UF
VOUT
OPEN
C44
E
R24
IN
20
19
18
17
16
15
14
13
DNP
R58
DNP
DNP
R37B
R51
PHASE1U3
VCC3
IN
R79
R29
V3SEN2+
DNP
0
R76
0
OPEN
21
COMP1
VMON1
IN
R21
ISHARE
VCC3
CLKOUT
EN/FF1
VIN1
EN/FF2
PGND
C39
22
VSEN1+
VSEN1-
S3
PGOOD
R37
IN
DNP
0
12
OUT
23
VOUT1
PHASE1
IN
R75
24
PGOOD
MODE3
R50
DNP
VCC3
ISL8225MIRZ
N/C
C024
25
VOUT2
11
C021
IN
V3SEN2+
C017
PHASE2U3
PHASE2
E
26
VSEN2+
VCC3
OPEN
0
R44B
1
VSEN2-
10
R78
C014
MODE
VMON2
SYNC
SGND
VCC
VIN2
0
47UF
3
4
5
6
7
8
9
22UF
0
E
PGND
R77
R74
S3
CIN12
22UF
22UF
CIN11
22UF
CIN10
IN
OUT
IN
CIN9
COMP2
0
OPEN
0
VIN
R46
S3
S3
C023
R44
4.7UF
IN
AN1789 Rev.2.00
Jun.25.19
CLKOUT2
ISL8225MEVAL2Z
2.2
2. PCB Layout Guidelines
Board Layout
OFF
ON
Figure 5. Top Assembly
Figure 6. Top Silk Screen
Figure 7. Top Layer Component Side
Figure 8. Layer 2
AN1789 Rev.2.00
Jun.25.19
Page 10 of 18
ISL8225MEVAL2Z
AN1789 Rev.2.00
Jun.25.19
2. PCB Layout Guidelines
Figure 9. Layer 3
Figure 10. Layer 4
Figure 11. Layer 5
Figure 12. Bottom Layer Solder Side
Page 11 of 18
ISL8225MEVAL2Z
Figure 13. Bottom Silk Screen
2. PCB Layout Guidelines
Figure 14. Bottom Silk Screen Mirrored
Figure 15. Bottom Assembly
AN1789 Rev.2.00
Jun.25.19
Page 12 of 18
Bill of Materials
Part Number
Ref Des
Qty.
Value
Tol.
Voltage
10TPB330M
C04, C08, C016,
C024, C08A
5
330µF
20%
10V
131-4353-00
TP1
2N7002-7-F
Power
Package
Type
JEDEC Type
Manufacturer
Description
CAP_7343_149
SANYOPOSCAP
Standard solid electrolytic chip tantalum
SMD capacitor
1
CONN
TEK131-4353-00
Tektronix
Scope probe test point PCB mount
Q1
1
SOT23
SOT23
Fairchild
N-Channel EMF effect transistor (Pb-free)
TP2-TP11
10
THOLE
MTP500X
Keystone
Miniature white test point 0.100 pad 0.040
Thole
CINA, CINB
2
470µF
20%
35V
RADIAL
CAPR_708X1398_300_P
Panasonic
Radial capacitor Pb-free
C1-C3
3
4.7µF
10%
16V
805
CAP_0805
Murata
Ceramic capacitor
C0, C02, C05,
C010, C013, C014,
C018
7
47µF
10%
10V
1210
CAP_1210
Murata
Ceramic chip capacitor
CIN1-CIN12
12
22µF
10%
25V
1210
CAP_1210
Murata
Ceramic chip capacitor
H1045-00101-50V10
C6, C7, C13, C14,
C20, C21
6
100pF
10%
50V
603
CAP_0603
Generic
Multilayer capacitor
H1045-00102-16V10
C8
1
1000pF 10%
16V
603
CAP_0603
Generic
Multilayer capacitor
H1045-00102-50V10
C4, C5, C9, C11,
C16-C19, C23C31, C40
18
1000pF 10%
50V
603
CAP_0603
Generic
Multilayer capacitor
H1045-00103-50V10
C35
1
0.01µF
10%
50V
603
CAP_0603
Generic
Multilayer capacitor
H1045-OPEN
C10, C12, C15,
C22, C32-C34,
C36, C37, C39,
C42, C44, C47
13
OPEN
5%
OPEN
603
CAP_0603
Generic
Multilayer capacitor
H1082-OPEN
C01, C03, C06,
C07, C09, C011,
C012, C015, C017,
C019, C021, C023
12
OPEN
10%
OPEN
1210
CAP_1210
Generic
Ceramic chip capacitor
R3, R4, R13-R17,
R20, R21,R24,
R25, R28-R31,
R37, R48, R50,
R51, R56-R58,
R86, R87, R10B,
RFSET
26
DNP
1%
603
RES_0603
Generic
Metal film chip resistor (do not populate)
5002
ECA-1VM471
GRM21BR71C475KA73L
GRM32ER70A476K
GRM32ER71E226KE15L
H2505-DNP-DNP-1
DNP
Page 13 of 18
2. PCB Layout Guidelines
SMD
ISL8225MEVAL2Z
AN1789 Rev.2.00
Jun.25.19
2.3
Package
Type
1%
1/16W
603
RES_0603
Generic
Thick film chip resistor
1kΩ
1%
1/16W
603
RES_0603
Generic
Thick film chip resistor
2
3.32kΩ
1%
1/16W
603
RES_0603
Generic
Thick film chip resistor
R64, R82
2
499Ω
1%
1/16W
603
RES_0603
Generic
Thick film chip resistor
R38-R40, R53,
R59-R62, R65-R80
24
0Ω
5%
1/2W
2010
RES_2010
Generic
Thick film chip resistor
ISL8225MIRZ
M1-M3
3
QFN
QFN26_670X670_ISL8225
M
Intersil
Dual 15A DC/DC power module
JUMPER-3-100
J7, J8
2
THOLE
JUMPER-3
Generic
Three pin jumper
JUMPER2_100
JP4, JP8
2
THOLE
JUMPER-1
Generic
Two pin jumper
J1-J6
6
CONN
KPA8CTP
Burndy
Wire connector lug
R5
1
603
RES_0603
ROHM
Metal film chip resistor
LED1
1
SMD
LED_3X2_5MM
Lumex
3mmx2.5mm surface mount red/green
LED
Ref Des
Qty.
Value
Tol.
H2511-00R00-1/16W1
R7-R10, R18, R19,
R22, R23, R26,
R27, R33, R35,
R36, R42-R47,
R49, R52, R54,
R55, R81, R9B,
R20B, R28B,
R37B, R44B
29
0Ω
H2511-01001-1/16W1
R1, R2, R6
3
H2511-03321-1/16W1
R11, R12
H2511-04990-1/16W1
H2520-00R00-1/2W5
KPA8CTP
MCR03EZPFX3001
SSL-LXA3025IGC
3kΩ
1%
Voltage
1/10W
JEDEC Type
Manufacturer
Description
ISL8225MEVAL2Z
AN1789 Rev.2.00
Jun.25.19
Power
Part Number
Note:
2. Resistance accuracy of the feedback resistor divider R1/R2 can affect the output voltage accuracy. Please use high accuracy resistance (0.5% or 0.1%) to meet the output accuracy requirement.
2. PCB Layout Guidelines
Page 14 of 18
ISL8225MEVAL2Z
3.
3. ISL8225MEVAL2Z Efficiency Curves
ISL8225MEVAL2Z Efficiency Curves
3.1
Efficiency Curves with 0Ω Resistance on the Output
Test conditions at +25°C and no air flow.
95
3.3VOUT
100
2.5VOUT
90
1.5VOUT
Efficiency (%)
Efficiency (%)
85
1.2VOUT
75
1VOUT
65
55
3.3VOUT 2.5VOUT
1.2VOUT
1VOUT
80
70
0
10
20
30
40
50
60
70
80
90
60
100
0
10
20
30
Load Current (A)
40
50
60
70
80
90
100
Load Current (A)
Figure 16. 12V Input
3.2
1.5VOUT
Figure 17. 5V Input
Efficiency Curves by Replacing 0Ω Resistance with Thick Copper Strap
Test conditions at +25°C and no air flow.
95
3.3VOUT
100
2.5VOUT
2.5VOUT
90
85
1.2VOUT
75
Efficiency (%)
Efficiency (%)
1.5VOUT
1VOUT
1VOUT
80
70
65
55
1.2VOUT 1.5VOUT
0
10
20
30
40
50
60
Load Current (A)
Figure 18. 12V Input
AN1789 Rev.2.00
Jun.25.19
70
80
90
100
60
0
10
20
30
40
50
60
70
80
90
100
Load Current (A)
Figure 19. 5V Input
Page 15 of 18
ISL8225MEVAL2Z
4.
4. Revision History
Revision History
Rev.
Date
2.00
Jun.25.19
AN1789 Rev.2.00
Jun.25.19
Description
Applied new formatting throughout.
Replaced QR code with link to video on page 1.
Updated Schematics with Orchad version.
Added Revision History section.
Page 16 of 18
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