ISL8225MEVAL3Z

User’s Manual ISL8225MEVAL3Z User’s Manual: Evaluation Board Industrial Analog and Power All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com). Renesas Electronics Corporation www.renesas.com Rev.2.00 Jun.10.19 User’s Manual ISL8225MEVAL3Z Evaluation Board The ISL8225M is a complete, dual step-down switching mode DC/DC module. The dual outputs can easily be paralleled for single-output, high-current use. It is easy to apply this high-power, current-sharing DC/DC power module to power-hungry datacom, telecom, and FPGA applications. All that is needed in order to have a complete, 30A design ready for use are the ISL8225M, a few passive components, and VOUT setting resistors. The ease of use virtually eliminates design and manufacturing risks while dramatically improving time to market. The simplicity of the ISL8225M is its off-the-shelf, unassisted implementation. The module structure allows for higher power density and better efficiency than competing solutions. The current sharing in multiphase operation greatly reduces ripple currents, BOM costs, and complexity. The ISL8225MEVAL3Z evaluation board enables a single output by paralleling two phases to deliver 30A continuous load current. The ISL8225M supports input voltages from 4.5V to 20V and output voltages from 0.6V to 7.5V. With the single resistor modification, the output voltage can be easily adjusted to different voltages. Key Features • Up to 100W output • Single 30A output • 4.5V to 20V input range • 0.6V to 7.5V output range • 1.5% output voltage accuracy • Up to 95% conversion efficiency • Lower output ripple and input ripple due to 180° phase shift Specifications This board is configured and optimized for the following operating conditions: • VIN = 4.5V to 20V, VO = 1.2V • IO = 30A • fSW = 500kHz • 180° phase shift between phases Ordering Information Part Number ISL8225MEVAL3Z Description 30A, Single Output Evaluation Board Related Literature For a full list of related documents, visit our website: • ISL8225M device page Related Resources • Evaluation Board Video AN1790 Rev.2.00 Jun.10.19 Page 2 of 13 ISL8225MEVAL3Z + VIN V - 4.5V to 20V + LOAD (0A~30A) - + V VOUT - Figure 1. ISL8225MEVAL3Z Board AN1790 Rev.2.00 Jun.10.19 Page 3 of 13 ISL8225MEVAL3Z 1. 1.1 1. Functional Description Functional Description Recommended Equipment • 0V to 20V power supply with at least 10A source current capability • Electronic load capable of sinking current up to 30A • Digital Multimeters (DMMs) • 100MHz quad-trace oscilloscope 1.2 High Output Voltage Operation The evaluation board is designed for output voltage below 5.5V. For output voltage higher than 6V, capacitors with 10V rating must be used for C10 to C14. See the “ISL8225M Design Guide Matrix” table in the ISL8225M datasheet for selections of output capacitors, input capacitors, and switching frequency. The maximum load capability is 20A for 6.5V output and 14A for 7.5V output. 1.3 Quick Start The inputs are J1 (VIN) and J2 (GND). The outputs are J3 (VOUT) and J4 (GND). See Figure 1 on page 3 for connections. 1. Connect a power supply capable of sourcing at least 10A to the ISL8225MEVAL3Z’s input (VIN J1 and GND J2), with a voltage between 4.5V to 20V. Connect an electronic load or the device to be powered to the board’s output (VOUT J3 and GND J4). All connections, especially the low voltage, high current VOUT lines, should be able to carry the desired load current and should be made as short as possible. 2. Turn on the power supply. Measure the output voltage, VOUT, which should be at 1.2V if the board is working properly. 3. The ISL8225MEVAL3Z is manufactured with a default VOUT value of 1.2V. If different output voltages are needed, board resistors can be exchanged to provide the required VOUT. See the table printed on the backside of the evaluation board or Table 1 for RVSET resistor values, which can be used to produce different output voltages. For 12V VIN, and VOUT more than 1.5V, the switching frequency needs to be adjusted, as shown in Table 1; no frequency adjustments are necessary for VOUT below 1.5V. For 5V VIN, the frequency does not need to be adjusted and the module default frequency can be used at any allowed VOUT. If the output voltage is set to more than 1.8V, the output current needs to be derated to allow for safe operation at elevated ambient temperatures. See the derating curves in the ISL8225M datasheet. For VIN < 5.5V, tie VIN directly to VCC for best efficiency. Also, Renesas recommends that the EN/FF voltage is over 1.5V to achieve better stability. Table 1. Resistance Setting for Different Output Voltages and Operating Frequency (R3 = 1k) VOUT (V) RVSET (Ω) Frequency (kHz) RFSET (Ω) (VIN = 12V) 1.0 1500 Default Default 1.2 Default Default Default 1.5 665 Default Default 2.5 316 650 249k 3.3 221 800 124k 5.0 137 950 82.5k 5.5 121 950 82.5k 6.5 102 750 147k 7.5 86.6 750 147k AN1790 Rev.2.00 Jun.10.19 Page 4 of 13 ISL8225MEVAL3Z 2. 2. PCB Layout Guidelines PCB Layout Guidelines The evaluation board size is 3 inch x 3 inch. It is a 4-layer board, containing 2-ounce copper on the top and bottom layers and 1-ounce copper on all internal layers. The board can be used as a 30A reference design. See “Layout” on page 8. The board is made up of FR4 material and all components, including the solder attachment, are Pb-free. 2.1 Thermal Considerations and Current Derating For high current applications, board layout is very critical to make the module operate safely and deliver maximum allowable power. To carry large currents, the board layout needs to be carefully designed to maximize thermal performance. To achieve this, select enough trace width, copper weight, and the proper connectors. The ISL8225MEVAL3Z is designed for running 30A at 1.2V at room temperature without additional cooling systems needed. However, if the output voltage is increased or the board is operated at elevated temperatures, then the available current is derated. See the derated current curves in the ISL8225M datasheet to determine the output current available. For layout of designs using the ISL8225M, the thermal performance can be improved by adhering to the following design tips: • Use the top and bottom layers to carry the large current. VOUT1, VOUT2, Phase 1, Phase 2, PGND, VIN1, and VIN2 should have large, solid planes. Place enough thermal vias to connect the power planes in different layers under and around the module. • The Phase 1 and Phase 2 pads are switching nodes that generate switching noise. Keep these pads under the module. For noise-sensitive applications, Renesas recommends keeping the phase pads only on the top and inner layers of the PCB; do not place the phase pads exposed to the outside on the bottom layer of the PCB. To improve the thermal performance, the phase pads can be extended in the inner layer, as shown in Phase 1 and Phase 2 pads on Layer 3 (see Figure 6) for this 30A evaluation board. Make sure that Layer 2 and Layer 4 have the GND layers cover the extended areas of phase pads at Layer 3 to avoid noise coupling. • To avoid noise coupling, Renesas recommends adding 470pF capacitors on all the COMP pins of each module for multiple module operations. • If the ambient temperature is high or the board space is limited, airflow is needed to dissipate more heat from the modules. A heat sink can also be applied to the top side of the module to further improve the thermal performance (heat sink recommendation: Aavid Thermalloy, part number 375424B00034G, www.aavid.com). AN1790 Rev.2.00 Jun.10.19 Page 5 of 13 ISL8225MEVAL3Z Board Schematic VCC ISL8225M SYNC TP4 C6 SINGLE OUTPUT DUAL PHASE 30A DNP RFSET TP3 ISL8225MEVAL3Z 4.7UF E TP1 4.5V TO 20V S1 C16 VIN 470PF AN1790 Rev.2.00 Jun.10.19 2.2 J1 SGND S1 2 3 4 5 6 7 8 9 C5 22UF C4 22UF C3 22UF C2 22UF C1 470UF TP5 E VCC VSEN2- PHASE2 10 TP2 VSEN2+ M1 R4 1 3.3K PHASE2 IN COMP2 MODE VMON2 VIN2 SYNC J2 SGND PGND VCC GND PGOOD 26 1.2V @ 30A TP6 TP10 25 VOUT2 C15 330UF C14 100UF C13 100UF C12 100UF 1K 21 1K GND 20 19 18 17 16 15 14 R3 COMP1 VMON1 13 OPEN 22 RVSET ISHARE VIN1 CLKOUT PGND E EN/FF1 S1 EN/FF2 SGND 23 C11 VSEN1- J3 C9 DNP VSEN1+ VOUT 24 47UF 12 PHASE1 PGOOD VOUT1 EGND ISL8225MIRZ N/C PHASE1 GND_S1 11 C10 E J4 EN TP7 470PF 6.04K R1 C8 E E S1 2.05K R2 C7 1000PF TP8 DRAWN BY: SGND TP9 TIM KLEMANN DATE: RELEASED BY: DATE: UPDATED BY: DATE: Figure 2. ISL8225MEVAL3Z Board Schematic TITLE: JIAN YIN DATE: ISL8225M EVALUATION BOARD Page 6 of 13 2. PCB Layout Guidelines S1 ENGINEER: 10/18/2012 Bill of Materials Part Number Ref Des Qty. Value Tol. Voltage 108-0740-001 J1-J4 4 10TPB330M C15 1 TP1-TP10 10 C1 1 470µF 20% 25V C2-C5 4 22µF 10% C7 1 C8, C16 H1045-00475-6R3V10-T Power Package Type Manufacturer Description BAN-JACK Johnson Components Standard type banana jack CAP_7343_149 SANYOPOSCAP Standard solid electrolytic chip tantalum SMD capacitor MTP500X Keystone Miniature white test point 0.100 pad 0.040 Thole SMD CAPAE_393X402 Panasonic Aluminum electrolytic S series type V capacitor (RoHS compliant) 25V 1210 CAP_1210 Murata Ceramic chip capacitor 1000pF 10% 50V 603 CAP_0603 Generic Multilayer capacitor 2 470pF 10% 50V 603 CAP_0603 Generic Multilayer capacitor C6 1 4.7µF 10% 6.3V 603 CAP_0603 Generic Multilayer capacitor H1045-OPEN C9 1 OPEN 5% OPEN 603 CAP_0603 Generic Multilayer capacitor H1046-00476-6R3V20-T C10 1 47µF 20% 6.3V 805 CAP_0805 Generic Multilayer capacitor H1065-00107-6R3V20-T C12-C14 3 100µF 20% 6.3V 1206 CAP_1206 Generic Multilayer capacitor C11 1 OPEN 5% OPEN 1206 CAP_1206 Generic Multilayer capacitor RFSET 1 DNP 1% DNP 603 RES_0603 Generic Metal film chip resistor (do not populate) R2 1 2.05kΩ 1% 1/10W 603 RES_0603 Generic Thick filmchip resistor H2511-01001-1/16W1 R3, RVSET 2 1kΩ 1% 1/16W 603 RES_0603 Generic Thick filmchip resistor H2511-03301-1/16W5 R4 1 3.3kΩ 5% 1/16W 603 RES_0603 Generic Thick filmchip resistor H2511-06041-1/16W1 R1 1 6.04kΩ 1% 1/10W 603 RES_0603 Generic Thick filmchip resistor ISL8225MIRZ M1 1 QFN QFN26_670X670_ISL8225M Renesas Dual 15A DC/DC power module 5002 EEE1EA471P GRM32ER71E226KE15L H1045-00102-50V10-T H1045-00471-50V10 H1065-OPEN H2505-DNP-DNP-1 H2511-02051-1/10W1-T CONN Jedec Type 330µF 20% 10V SMD THOLE Page 7 of 13 2. PCB Layout Guidelines Note: Resistance accuracy of feedback resistor divider R1/R2 can affect the output accuracy. Please use high accuracy resistance (0.5% or 0.1%) to meet the output accuracy requirement. ISL8225MEVAL3Z AN1790 Rev.2.00 Jun.10.19 2.3 ISL8225MEVAL3Z 2.4 2. PCB Layout Guidelines Layout Figure 3. Top Components Figure 4. Top Layer Figure 5. Layer 2 Figure 6. Layer 3 AN1790 Rev.2.00 Jun.10.19 Page 8 of 13 ISL8225MEVAL3Z Figure 7. Bottom Layer AN1790 Rev.2.00 Jun.10.19 2. PCB Layout Guidelines Figure 8. Bottom Components Page 9 of 13 ISL8225MEVAL3Z 3. 3. ISL8225MEVAL3Z Efficiency Curves ISL8225MEVAL3Z Efficiency Curves Test conditions at +25°C and no air flow. 95 100 1.8VOUT 2.5VOUT 90 1.5VOUT Efficiency (%) Efficiency (%) 1.8VOUT 95 85 1.2VOUT 80 1VOUT 75 70 90 1.2VOUT 85 1.5VOUT 1VOUT 80 75 65 60 2.5VOUT 0 5 10 15 20 Load Current (A) Figure 9. 12V Input AN1790 Rev.2.00 Jun.10.19 25 30 70 0 5 10 15 20 25 30 Load Current (A) Figure 10. 5V Input Page 10 of 13 ISL8225MEVAL3Z 4. 4. Revision History Revision History Rev. Date 2.00 Jun.10.19 AN1790 Rev.2.00 Jun.10.19 Description Applied new formatting throughout document. Replaced QR code with link to video on page 1. Added Revision History section. Page 11 of 13 1RWLFH  'HVFULSWLRQVRIFLUFXLWVVRIWZDUHDQGRWKHUUHODWHGLQIRUPDWLRQLQWKLVGRFXPHQWDUHSURYLGHGRQO\WRLOOXVWUDWHWKHRSHUDWLRQRIVHPLFRQGXFWRUSURGXFWV DQGDSSOLFDWLRQH[DPSOHV