M24.173B

Plastic Packages for Integrated Circuits Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP) N INDEX AREA E E1 -B1 2 3 TOP VIEW 0.05(0.002) -AD -CSEATING PLANE A L 0.25 0.010 GAUGE PLANE 0.25(0.010) M BM M24.173B 24 LEAD THIN SHRINK SMALL OUTLINE EXPOSED PAD PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.000 0.031 0.0075 0.0035 0.303 0.169 0.246 0.0177 24 0o 8o 0.197 0.126 0o MAX 0.047 0.006 0.051 0.0118 0.0079 0.311 0.177 0.256 0.0295 MILLIMETERS MIN 0.00 0.80 0.19 0.09 7.70 4.30 6.25 0.45 24 8o 5.00 3.20 MAX 1.20 0.15 1.05 0.30 0.20 7.90 4.50 6.50 0.75 NOTES 9 3 4 6 7 11 11 Rev. 1 11/03 α A2 c A1 0.10(0.004) E1 e E L N 0.026 BSC 0.65 BSC e b 0.10(0.004) M C AM BS α 1 2 3 P P1 P1 NOTES: N P BOTTOM VIEW 1. These package dimensions are within allowable dimensions of JEDEC MO-153-ADT, Issue F. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 11. Dimensions “P” and “P1” are thermal and/or electrical enhanced variations. Values shown are maximum size of exposed pad within lead count and body size. 1