DATASHEET
X5323, X5325 (Replaces X25323, X25325)
FN8131
Rev 3.00
December 9, 2015
CPU Supervisor with 32kBit SPI EEPROM
These devices combine four popular functions, Power-on
Reset Control, Watchdog Timer, Supply Voltage Supervision,
and Block Lock Protect Serial EEPROM Memory in one
package. This combination lowers system cost, reduces
board space requirements, and increases reliability.
Applying power to the device activates the power-on reset
circuit which holds RESET/RESET active for a period of
time. This allows the power supply and oscillator to stabilize
before the processor can execute code.
The Watchdog Timer provides an independent protection
mechanism for microcontrollers. When the microcontroller
fails to restart a timer within a selectable time out interval,
the device activates the RESET/RESET signal. The user
selects the interval from three preset values. Once selected,
the interval does not change, even after cycling the power.
Features
• Selectable watchdog timer
• Low VCC detection and reset assertion
- Five standard reset threshold voltages
- Re-program low VCC reset threshold voltage using
special programming sequence
- Reset signal valid to VCC = 1V
• Determine watchdog or low voltage reset with a volatile
flag bit
• Long battery life with low power consumption
- PROGRAMMED VTRIP
VTRIP Programming Specifications VCC = 1.7 to 5.5V; Temperature = 0°C to +70°C.
PARAMETER
DESCRIPTION
MIN
MAX
UNIT
tVPS
SCK VTRIP Program Voltage Set-up Time
1
µs
tVPH
SCK VTRIP Program Voltage Hold Time
1
µs
VTRIP Program Pulse Width
1
µs
tTSU
VTRIP Level Set-up Time
10
µs
tTHD
VTRIP Level Hold (Stable) Time
10
ms
tP
FN8131 Rev 3.00
December 9, 2015
Page 14 of 19
X5323, X5325 (Replaces X25323, X25325)
VTRIP Programming Specifications VCC = 1.7 to 5.5V; Temperature = 0°C to +70°C. (Continued)
PARAMETER
DESCRIPTION
MIN
MAX
UNIT
10
ms
tWC
VTRIP Write Cycle Time
tRP
VTRIP Program Cycle Recovery Period (Between Successive Programming Cycles)
10
ms
tVPO
SCK VTRIP Program Voltage Off-Time Before Next Cycle
0
ms
Programming Voltage
15
18
V
VTRIP Programed Voltage Range
1.7
5.0
V
Vta1
Initial VTRIP Program Voltage Accuracy (VCC Applied-VTRIP) (Programmed at +25°C)
-0.1
+0.4
V
Vta2
Subsequent VTRIP Program Voltage Accuracy [(VCC Applied-Vta1)-VTRIP] (Programmed at +25°C)
-25
+25
mV
Vtr
VTRIP Program Voltage Repeatability (Successive Program Operations; Programmed at +25°C)
-25
+25
mV
Vtv
VTRIP Program Variation After Programming (0°C to +75°C; Programmed at +25°C)
-25
+25
mV
4.5
5.2
VP
VTRAN
NOTE:
6. VTRIP programming parameters are periodically sampled and are not 100% tested.
Typical Performance Curves
18
16
1.8
14
1.7
12
1.6
WATCHDOG TIMER ON (VCC = 5V)
10
RESET (s)
ISB (µA)
1.9
WATCHDOG TIMER ON (VCC = 5V)
8
6
-40°C
+25°C
1.5
+90°C
1.4
1.3
1.2
4
2
1.1
WATCHDOG TIMER OFF (VCC = 3V, 5V)
0
-40
1.0
25
90
1.7
2.4
TEMPERATURE (°C)
FIGURE 11. TWDO vs VOLTAGE/TEMPERATURE (WD1, 0 = 1, 1)
0.80
5.025
5.000
3.500
VTRIP = 3.5V
2.475
+25°C
0.65
+90°C
0.60
0.55
2.525
2.500
-40°C
0.70
RESET (s)
VOLTAGE (V)
0.75
VTRIP = 5V
3.525
3.475
3.8
VOLTAGE (V)
FIGURE 10. VCC SUPPLY CURRENT vs TEMPERATURE (ISB)
4.975
3.1
0.50
VTRIP = 2.5V
0.45
0
25
85
TEMPERATURE (°C)
FIGURE 12. VTRIP vs TEMPERATURE (PROGRAMMED AT +25°C)
FN8131 Rev 3.00
December 9, 2015
1.7
2.4
3.1
3.8
4.5
5.2
VOLTAGE (V)
FIGURE 13. TWDO vs VOLTAGE/TEMPERATURE (WD1, 0 = 1, 0)
Page 15 of 19
X5323, X5325 (Replaces X25323, X25325)
205
205
200
200
195
195
190
190
RESET (s)
TIME (ms)
Typical Performance Curves
185
180
175
185
-40°C
+25°C
+90°C
180
175
170
170
165
165
160
160
-40
25
90
1.7
2.4
FIGURE 14. TPURST vs TEMPERATURE
3.1
3.8
4.5
5.2
VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 15. TWDO vs VOLTAGE/TEMPERATURE (WD1, 0 0 = 0, 1)
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
December 9, 2015
FN8131.3
CHANGE
Updated Ordering Information Table on page 2.
Added Revision History and About Intersil sections.
Replaced POD MDP0027 with M8.15E
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
FN8131 Rev 3.00
December 9, 2015
Page 16 of 19
X5323, X5325 (Replaces X25323, X25325)
Plastic Dual-In-Line Packages (PDIP)
E
D
A2
SEATING
PLANE
L
N
A
PIN #1
INDEX
E1
c
e
b
A1
NOTE 5
1
eA
eB
2
N/2
b2
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
INCHES
SYMBOL
PDIP8
PDIP14
PDIP16
PDIP18
PDIP20
TOLERANCE
A
0.210
0.210
0.210
0.210
0.210
MAX
A1
0.015
0.015
0.015
0.015
0.015
MIN
A2
0.130
0.130
0.130
0.130
0.130
±0.005
b
0.018
0.018
0.018
0.018
0.018
±0.002
b2
0.060
0.060
0.060
0.060
0.060
+0.010/-0.015
c
0.010
0.010
0.010
0.010
0.010
+0.004/-0.002
D
0.375
0.750
0.750
0.890
1.020
±0.010
E
0.310
0.310
0.310
0.310
0.310
+0.015/-0.010
E1
0.250
0.250
0.250
0.250
0.250
±0.005
e
0.100
0.100
0.100
0.100
0.100
Basic
eA
0.300
0.300
0.300
0.300
0.300
Basic
eB
0.345
0.345
0.345
0.345
0.345
±0.025
L
0.125
0.125
0.125
0.125
0.125
±0.010
N
8
14
16
18
20
Reference
NOTES
1
2
Rev. C 2/07
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
FN8131 Rev 3.00
December 9, 2015
Page 17 of 19
X5323, X5325 (Replaces X25323, X25325)
Package Outline Drawing
M8.15E
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 0, 08/09
4
4.90 ± 0.10
A
DETAIL "A"
0.22 ± 0.03
B
6.0 ± 0.20
3.90 ± 0.10
4
PIN NO.1
ID MARK
5
(0.35) x 45°
4° ± 4°
0.43 ± 0.076
1.27
0.25 M C A B
SIDE VIEW “B”
TOP VIEW
1.75 MAX
1.45 ± 0.1
0.25
GAUGE PLANE
C
SEATING PLANE
0.10 C
0.175 ± 0.075
SIDE VIEW “A
0.63 ±0.23
DETAIL "A"
(1.27)
(0.60)
NOTES:
(1.50)
(5.40)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5.
The pin #1 identifier may be either a mold or mark feature.
6.
Reference to JEDEC MS-012.
TYPICAL RECOMMENDED LAND PATTERN
FN8131 Rev 3.00
December 9, 2015
Page 18 of 19
X5323, X5325 (Replaces X25323, X25325)
Thin Shrink Small Outline Plastic Packages (TSSOP)
M14.173
N
INDEX
AREA
E
0.25(0.010) M
E1
2
SYMBOL
3
0.05(0.002)
-A-
INCHES
GAUGE
PLANE
-B1
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
B M
L
A
D
-C-
e
A2
A1
b
0.10(0.004) M
0.25
0.010
SEATING PLANE
c
0.10(0.004)
C A M
B S
MIN
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
MILLIMETERS
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.041
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.195
0.199
4.95
5.05
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
8o
0o
N
NOTES:
MAX
14
0o
14
7
8o
Rev. 2 4/06
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
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FN8131 Rev 3.00
December 9, 2015
Page 19 of 19