DATASHEET
X5328, X5329
FN8132
Rev 3.00
Nov 11, 2021
CPU Supervisor with 32Kbit SPI EEPROM
The X5328 and X5329 devices combine three popular
functions, Power-on Reset Control, Supply Voltage
Supervision, and Block Lock Protect Serial EEPROM
Memory in one package. This combination lowers
system cost, reduces board space requirements, and
increases reliability.
Applying power to the device activates the power-on
reset circuit which holds RESET/RESET active for a
period of time. This allows the power supply and
oscillator to stabilize before the processor can execute
code.
The device’s low VCC detection circuitry protects the
user’s system from low voltage conditions by holding
RESET/RESET active when VCC falls below a
minimum VCC trip point. RESET/RESET remains
asserted until VCC returns to proper operating level
and stabilizes. Five industry standard VTRIP thresholds
are available, however, the unique circuits allow the
threshold to be reprogrammed to meet custom
requirements or to fine-tune the threshold in
applications requiring higher precision.
FEATURES
• Low VCC detection and reset assertion
—Five standard reset threshold voltages
—Re-program low VCC reset threshold voltage
using special programming sequence
—Reset signal valid to VCC = 1V
• Long battery life with low power consumption
— 3.3V, IOL = 2.1mA
VOL2
Output LOW Voltage
0.4
V
2V < VCC 3.3V, IOL = 1mA
VOL3
Output LOW Voltage
0.4
V
VCC 2V, IOL = 0.5mA
VOH1
Output HIGH Voltage
VCC - 0.8
V
VCC > 3.3V, IOH = -1.0mA
VOH2
Output HIGH Voltage
VCC - 0.4
V
2V < VCC 3.3V, IOH = -0.4mA
VOH3
Output HIGH Voltage
VCC - 0.2
V
VCC 2V, IOH = -0.25mA
VOLS
Reset Output LOW Voltage
V
IOL = 1mA
0.4
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
Symbol
COUT(2)
CIN(2)
Test
Max.
Unit
Conditions
Output Capacitance (SO, RESET, RESET)
8
pF
VOUT = 0V
Input Capacitance (SCK, SI, CS, WP)
6
pF
VIN = 0V
Notes: (1) VIL min. and VIH max. are for reference only and are not tested.
(2) This parameter is periodically sampled and not 100% tested.
FN8132 Rev 3.00
Nov 11, 2021
Page 11 of 18
X5328, X5329
EQUIVALENT A.C. LOAD CIRCUIT AT 5V VCC
5V
5V
4.6k
2.06k
Output
A.C. TEST CONDITIONS
Input pulse levels
VCC x 0.1 to VCC x 0.9
Input rise and fall times
10ns
Input and output timing level
VCC x0.5
RESET/RESET
3.03k
100pF
30pF
A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)
Serial Input Timing
2.7-5.5V
Symbol
Parameter
Min.
Max.
Unit
0
2
MHz
fSCK
Clock Frequency
tCYC
Cycle Time
500
ns
tLEAD
CS Lead Time
250
ns
tLAG
CS Lag Time
250
ns
tWH
Clock HIGH Time
200
ns
tWL
Clock LOW Time
250
ns
tSU
Data Setup Time
50
ns
tH
Data Hold Time
50
ns
tRI(3)
Input Rise Time
100
ns
tFI(3)
Input Fall Time
100
ns
tCS
CS Deselect Time
tWC
(4)
Write Cycle Time
FN8132 Rev 3.00
Nov 11, 2021
500
ns
10
ms
Page 12 of 18
X5328, X5329
Serial Input Timing
tCS
CS
tLEAD
tLAG
SCK
tSU
tH
SI
tRI
tFI
MSB IN
LSB IN
High Impedance
SO
Serial Output Timing
2.7-5.5V
Symbol
Parameter
Min.
Max.
Unit
0
2
MHz
fSCK
Clock Frequency
tDIS
Output Disable Time
250
ns
Output Valid from Clock Low
250
ns
tV
tHO
Output Hold Time
tRO(3)
Output Rise Time
100
ns
Output Fall Time
100
ns
tFO
(3)
0
ns
Notes: (3) This parameter is periodically sampled and not 100% tested.
(4) tWC is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile
write cycle.
Serial Output Timing
CS
tCYC
tWH
tLAG
SCK
tV
SO
SI
MSB Out
tHO
MSB–1 Out
tWL
tDIS
LSB Out
ADDR
LSB IN
FN8132 Rev 3.00
Nov 11, 2021
Page 13 of 18
X5328, X5329
Power-Up and Power-Down Timing
VCC
VTRIP
VTRIP
tPURST
0 Volts
tF
tPURST
tRPD
tR
RESET (X5328)
RESET (X5329)
RESET Output Timing
Symbol
VTRIP
VTH
Parameter
Reset Trip Point Voltage, X5328-4.5A, X5328-4.5A
Reset Trip Point Voltage, X5328, X5329
Reset Trip Point Voltage, X5328-2.7A, X5329-2.7A
Reset Trip Point Voltage, X5328-2.7, X5329-2.7
Power-up Reset Time Out
tRPD(5)
VCC Detect to Reset/Output
tF
tR(5)
VRVALID
Note:
Typ.
Max.
Unit
4.5
4.25
2.85
2.55
4.63
4.38
2.93
2.63
4.75
4.5
3.0
2.7
V
VTRIP Hysteresis (HIGH to LOW vs. LOW to HIGH VTRIP voltage)
tPURST
(5)
Min.
20
100
200
mV
280
ms
500
ns
VCC Fall Time
100
µs
VCC Rise Time
100
µs
1
V
Reset Valid VCC
(5) This parameter is periodically sampled and not 100% tested.
FN8132 Rev 3.00
Nov 11, 2021
Page 14 of 18
X5328, X5329
VTRIP Set Conditions
tTHD
VCC
VTRIP
tTSU
tVPS
CS
tRP
tP
tVPH
tVPH
tVPS
tVPO
VP
SCK
VP
tVPO
SI
VTRIP Reset Conditions
VCC*
tRP
tVPS
CS
SCK
tVPS
tP
tVP1
tVPH
tVPO
VCC
VP
tVPO
SI
*VCC > Programmed VTRIP
FN8132 Rev 3.00
Nov 11, 2021
Page 15 of 18
X5328, X5329
VTRIP Programming Specifications VCC = 1.7-5.5V; Temperature = 0°C to 70°C
Parameter
Description
Min.
Max.
Unit
tVPS
SCK VTRIP Program Voltage Setup time
1
µs
tVPH
SCK VTRIP Program Voltage Hold time
1
µs
VTRIP Program Pulse Width
1
µs
tTSU
VTRIP Level Setup time
10
µs
tTHD
VTRIP Level Hold (stable) time
10
ms
tWC
VTRIP Write Cycle Time
tRP
VTRIP Program Cycle Recovery Period (Between successive programming cycles)
10
ms
tVPO
SCK VTRIP Program Voltage Off time before next cycle
0
ms
Programming Voltage
15
18
V
VTRIP Programed Voltage Range
1.7
5.0
V
Vta1
Initial VTRIP Program Voltage accuracy (VCC applied-VTRIP) (Programmed at 25°C.)
-0.1
+0.4
V
Vta2
Subsequent VTRIP Program Voltage accuracy [(VCC applied-Vta1)-VTRIP]
(Programmed at 25°C.)
-25
+25
mV
Vtr
VTRIP Program Voltage repeatability (Successive program operations.) (programmed at
25°C)
-25
+25
mV
Vtv
VTRIP Program variation after programming (0-75°C). (programmed at 25°C)
-25
+25
mV
tP
VP
VTRAN
10
ms
VTRIP programming parameters are periodically sampled and are not 100% tested.
FN8132 Rev 3.00
Nov 11, 2021
Page 16 of 18
X5328, X5329
TYPICAL PERFORMANCE
tPURST vs. Temperature
VCC Supply Current vs. Temperature (ISB)
205
2
200
195
Time (ms)
Isb (µA)
190
(VCC = 3V, 5V)
1
185
180
175
170
165
160
-40
0
-40C
25C
Temp°C
90C
25
Degrees °C
90
VTRIP vs. Temperature (programmed at 25°C)
5.025
VTRIP = 5V
5.000
4.975
Voltage
3.525
VTRIP = 3.5V
3.500
3.475
2.525
VTRIP = 2.5V
2.500
2.475
0
25
Temperature
85
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
Nov 11, 2021
3.00
Removed About Intersil section.
Removed TSSOP and PDIP information from document.
Updated Pin Configuration.
Updated Ordering information table formatting.
Oct16, 2015
2.00
Updated the Ordering Information table on page 2.
Added Revision History and About Intersil sections.
Replaced all Package Outline drawings with the most recent versions.
FN8132 Rev 3.00
Nov 11, 2021
CHANGE
Page 17 of 18
X5328, X5329
Package Outline Drawing
For the most recent package outline drawing, see M8.15E.
M8.15E
8 Lead Narrow Body Small Outline Plastic Package
Rev 0, 08/09
4
4.90 ± 0.10
A
DETAIL "A"
0.22 ± 0.03
B
6.0 ± 0.20
3.90 ± 0.10
4
PIN NO.1
ID MARK
5
(0.35) x 45°
4° ± 4°
0.43 ± 0.076
1.27
0.25 M C A B
SIDE VIEW “B”
TOP VIEW
1.75 MAX
1.45 ± 0.1
0.25
GAUGE PLANE
C
SEATING PLANE
0.10 C
0.175 ± 0.075
SIDE VIEW “A
0.63 ±0.23
DETAIL "A"
(1.27)
(0.60)
NOTES:
(1.50)
(5.40)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5.
The pin #1 identifier may be either a mold or mark feature.
6.
Reference to JEDEC MS-012.
TYPICAL RECOMMENDED LAND PATTERN
FN8132 Rev 3.00
Nov 11, 2021
Page 18 of 18
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