X9258_11

X9258 Low Noise/Low Power/2-Wire Bus/256 Taps Data Sheet April 14, 2011 FN8168.5 Quad Digital Controlled Potentiometers (XDCP™) The X9258 integrates 4 digitally controlled potentiometers (XDCP™) on a monolithic CMOS integrated circuit. The digitally controlled potentiometer is implemented using 255 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the 2-wire bus interface. Each potentiometer has associated with it a volatile Wiper Counter Register (WCR) and 4 non-volatile Data Registers (DR0:DR3) that can be directly written to and read by the user. The contents of the WCR controls the position of the wiper on the resistor array though the switches. Power-up recalls the contents of DR0 to the WCR. The XDCP™ can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. Features • Four potentiometers in one package • 256 resistor taps/potentiometer................. 0.4% resolution • 2-wire serial interface • Wiper resistance, 40Ω typical @ V+ = 5V, V- = -5V • Four nonvolatile data registers for each potentiometer • Nonvolatile storage of wiper position • Standby current > R2 FIGURE 17. INVERTING AMPLIFIER FIGURE 18. EQUIVALENT L-R CIRCUIT C – + } RA } RB R2 R1 – + FREQUENCY ∝ R1, R2, C AMPLITUDE ∝ RA, RB FIGURE 19. FUNCTION GENERATOR 18 FN8168.5 April 14, 2011 X9258 Thin Shrink Small Outline Package Family (TSSOP) 0.25 M C A B D N (N/2)+1 A MDP0044 THIN SHRINK SMALL OUTLINE PACKAGE FAMILY MILLIMETERS SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE PIN #1 I.D. A A1 A2 b c D E E1 e L L1 1.20 0.10 0.90 0.25 0.15 5.00 6.40 4.40 0.65 0.60 1.00 1.20 0.10 0.90 0.25 0.15 5.00 6.40 4.40 0.65 0.60 1.00 1.20 0.10 0.90 0.25 0.15 6.50 6.40 4.40 0.65 0.60 1.00 1.20 0.10 0.90 0.25 0.15 7.80 6.40 4.40 0.65 0.60 1.00 1.20 0.10 0.90 0.25 0.15 9.70 6.40 4.40 0.65 0.60 1.00 Max ±0.05 ±0.05 +0.05/-0.06 +0.05/-0.06 ±0.10 Basic ±0.10 Basic ±0.15 Reference Rev. F 2/07 E E1 1 B TOP VIEW (N/2) 0.20 C B A 2X N/2 LEAD TIPS C SEATING PLANE e 0.05 H b 0.10 C N LEADS SIDE VIEW 0.10 M C A B NOTES: 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. 3. Dimensions “D” and “E1” are measured at dAtum Plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SEE DETAIL “X” c END VIEW L1 A2 GAUGE PLANE 0.25 A1 DETAIL X L 0° - 8° A 19 FN8168.5 April 14, 2011 X9258 Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45° 0.25(0.010) M BM M24.3 (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 2.35 0.10 0.33 0.23 15.20 7.40 10.00 0.25 0.40 24 8° 0° 8° MAX 2.65 0.30 0.51 0.32 15.60 7.60 10.65 0.75 1.27 NOTES 9 3 4 5 6 7 Rev. 1 4/06 MIN 0.0926 0.0040 0.013 0.0091 0.5985 0.2914 0.394 0.010 0.016 24 0° MAX 0.1043 0.0118 0.020 0.0125 0.6141 0.2992 0.419 0.029 0.050 A1 B C D E e H C α A1 0.10(0.004) 0.05 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 20 FN8168.5 April 14, 2011