Silicon
N-Channel
Power MOSFET
R
○
CS12N65F A9R
General Description:
VDSS
650
V
ID
12
A
VDMOSFETs, is obtained by the self-aligned planar Technology
PD(TC=25℃)
42
W
which reduce the conduction loss, improve switching
RDS(ON)Typ
0.66
Ω
CS12N65F A9R, the silicon N-channel Enhanced
performance and enhance the avalanche energy. The transistor
can be used in various power switching circuit for system
miniaturization and higher efficiency. The package form is
TO-220F, which accords with the RoHS standard.
Features:
l Fast Switching
l Low ON Resistance(Rdson≤0.8Ω)
l Low Gate Charge
(Typical Data:40nC)
l Low Reverse transfer capacitances(Typical:9.5pF)
l 100% Single Pulse avalanche energy Test
Applications:
Power switch circuit of adaptor and charger.
Absolute(Tc= 25℃ unless otherwise specified):
Symbol
Parameter
VDSS
ID
IDM
a1
VGS
EAS
a2
dv/dt
a3
PD
Rating
Units
Drain-to-Source Voltage
650
V
Continuous Drain Current
12
A
Continuous Drain Current T C = 100 °C
7.5
A
Pulsed Drain Current
48
A
Gate-to-Source Voltage
±30
V
Single Pulse Avalanche Energy
550
mJ
Peak Diode Recovery dv/dt
5.0
V/ns
Power Dissipation
42
W
0.34
W/℃
150,–55 to 150
℃
300
℃
Derating Factor above 25°C
TJ,T stg
Operating Junction and Storage Temperature Range
TL
Maximum Temperature for Soldering
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
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CS12N65F A9R
R
○
Electrical Characteristics(Tc= 25℃ unless otherwise specified):
OFF Characteristics
Symbol
Parameter
Test Conditions
VDSS
Drain to Source Breakdown Voltage
VGS=0V, ID =250µA
ΔBVDSS/ΔT J
Bvdss Temperature Coefficient
ID=250uA,Reference25℃
IDSS
Drain to Source Leakage Current
VDS =650V, V GS= 0V,
Ta = 25℃
VDS =520V, V GS= 0V,
Ta = 125℃
IGSS(F)
Gate to Source Forward Leakage
IGSS(R)
Gate to Source Reverse Leakage
Rating
Unit
s
Min.
Typ.
Max.
650
--
--
V
--
0.7
--
V/℃
--
--
1
µA
--
--
100
µA
VGS =+30V
--
--
100
nA
VGS =-30V
--
--
-100
nA
ON Characteristics
Symbol
Parameter
Test Conditions
R DS(ON)
Drain-to-Source On-Resistance
VGS=10V,ID =6A
VGS(TH)
Gate Threshold Voltage
VDS = V GS , ID = 250µA
Rating
Units
Min.
Typ.
Max.
--
0.66
0.8
Ω
2.0
--
4.0
V
Pulse width tp≤300µs,δ≤2%
Dynamic Characteristics
Symbol
Parameter
Test Conditions
g fs
Forward Transconductance
VDS=15V, ID =6A
C iss
Input Capacitance
C oss
Output Capacitance
C rss
Reverse Transfer Capacitance
VGS = 0V V DS = 25V
f = 1.0MHz
Rating
Min.
Typ.
Max.
--
12
--
--
1993
--
--
160
--
--
9.5
--
Units
S
pF
Resistive Switching Characteristics
Symbol
Parameter
td(ON)
Turn-on Delay Time
tr
Rise Time
td(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qgs
Gate to Source Charge
Qgd
Gate to Drain (“Miller”)Charge
Test Conditions
ID =12A VDD = 325V
RG =10Ω
ID =12A V DD =520V
VGS = 10V
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
Rating
Min.
Typ.
Max.
--
28
--
--
26
--
--
64
--
--
45
--
--
40
--
--
10
--
--
14
--
Pag e 2 of 1 0
Units
2 0 1 5 V0 1
ns
nC
CS12N65F A9R
R
○
Source-Drain Diode Characteristics
Symbol
Parameter
IS
Test Conditions
Rating
Units
Min.
Typ.
Max.
Continuous Source Current (Body Diode)
--
--
12
A
ISM
Maximum Pulsed Current (Body Diode)
--
--
48
A
VSD
Diode Forward Voltage
--
--
1.5
V
trr
Reverse Recovery Time
--
651
--
ns
Qrr
Reverse Recovery Charge
--
4297
--
nC
IRRM
Reverse Recovery Current
--
13.2
--
A
IS =12A,VGS=0V
IS =12A,Tj = 25℃
dIF /dt=100A/us,
VGS=0V
Pulse width tp≤300µs,δ≤2%
Symbol
Parameter
Typ.
Units
R θ JC
Junction-to-Case
2.98
℃/W
R θ JA
Junction-to-Ambient
62.5
℃/W
a1
:Repetitive rating; pulse width limited by maximum junction temperature
:L=10mH, ID=10.5A, Start T J=25℃
a3
:ISD =12A,di/dt ≤100A/us,V DD≤BV DS, Start T J=25℃
a2
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
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CS12N65F A9R
R
○
Characteristics Curve:
48
10
100us
1ms
1
OPERATION IN THIS AREA
MAY BE LIMITED BY RDS(ON)
TJ=MAX RATED
TC=25℃ Single Pulse
0 .1
0 .0 1
1
10ms
PD , Power Dissipation ,Watts
Id , Drain Current , Amps
100
24
12
DC
0
10
100
V d s , D r a in - t o - S o u r c e V o lta g e , V o lts
0
1000
Figure 1 Maximum Forward Bias Safe Operating Area
25
50
100
75
TC , Case Temperature , C
Id , Drain Current , Amps
24
12
6
125
150
Figure 2 Maximum Power Dissipation vs Case Temperature
18
Id , Drain Current , Amps
36
250us Pluse Test
Tc = 25℃
VGS=10V
18
VGS=7V
12
VGS=5V
VGS=6V
6
VGS=4.5V
0
0
0
25
75
100
125
50
TC , Case Tem perature , C
150
Figure 3 Maximum Continuous Drain Current vs Case Temperature
0
5
10
15
20
Vds , Drain-to-Source Voltage , Volts
Figure 4 Typical Output Characteristics
Figure 5 Maximum Effective Thermal Impendance , Junction to Case
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
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25
CS12N65F A9R
16
Isd, Reverse Drain Current , Amps
Id , Drain Current , Amps
30
250us Pulse Test
VDS=20V
25
20
15
+25℃
10
+150℃
5
0
12
8
+150℃
+25℃
4
0
2
4
6
8
Vgs , Gate to Source Voltage , Volts
10
0
Rds(on), Drain to Source ON Resistance,
Nomalized
1.0
PULSE DURATION = 10μs
DUTY CYCLE= 0.5%MAX
Tc =25 ℃
0.9
VGS=10V
0.8
0.7
0.6
0
0.2
0.4
0.6
0.8
1
Vsd , Source - Drain Voltage , Volts
1.2
Figure 7 Typical Body Diode Transfer Characteristics
Figure 6 Typical Transfer Characteristics
Rds(on), Drain to Source ON
Resistance, Ohms
R
○
2.5
2.25
PULSE DURATION = 10μs
DUTY CYCLE= 0.5%MAX
VGS=10V ID=3.5A
2
1.75
1.5
1.25
1
0.75
0.5
3
6
9
Id , Drain Current , Amps
Figure 8 Typical Drain to Source ON Resistance
vs Drain Current
12
-50
0
50
100
Tj, Junction temperature , C
Figure 9 Typical Drian to Source on Resistance
vs Junction Temperature
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
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150
CS12N65F A9R
1.15
1.15
1.1
Bvdss,Drain to Source
Breakdown Voltage, Normalized
1.05
1
0.95
0.9
VGS=0V
ID=250μA
0.85
0.8
0.75
1.05
VGS=0V
ID=250μA
0.95
0.85
0.7
0.65
-75
-50
-25
0.75
-55
0
25 50 75 100 125 150 175
Tj, Junction temperature , C
-30
-5
20
45
70
95
120
Tj, Junction temperature , C
145
170
Figure 11 Typical Breakdown Voltage vs Junction Temperature
Figure 10 Typical Theshold Voltage vs Junction Temperature
12
Ciss
Coss
VGS=0V , f=1MHz
Ciss=Cgs+Cgd
Coss=Cds+Cgd
Crss=Cgd
Crss
Vgs , Gate to Source Voltage ,Volts
Vgs(th),Threshold Voltage, Nomalized
R
○
VDS=520V
VDS=325V
VDS=130V
10
8
6
4
2
ID=12A
0
0
Figure 12 Typical Capacitance vs Drain to Source Voltage
10
20
30
Qg , Total Gate Charge , nC
40
50
Figure 13 Typical Gate Charge vs Gate to Source Voltage
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
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CS12N65F A9R
R
○
Test Circuit and Waveform
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
Pag e 7 of 1 0
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CS12N65F A9R
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
R
○
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CS12N65F A9R
R
○
Package Information
Items
Values(mm)
MIN
MAX
A
9.60
10.40
B
15.40
16.20
B1
8.15
8.75
C
4.30
4.90
C1
2.10
3.00
D
2.40
3.00
E
0.60
1.00
F
0.30
0.60
G
1.12
1.42
3.40
3.80
2.00
2.40
12.00
14.00
6.30
7.70
N
2.34
2.74
Q
3.15
3.55
3.00
3.30
H
L
TO-220F Package
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D .
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CS12N65F A9R
R
○
The name and content of poisonous and harmful material in products
Hazardous Substance
Part’s Name
Pb
≤0.1%
Limit
Hg
Cd
Cr(VI)
PBB
PBDE
≤0.1%
≤0.01%
≤0.1%
≤0.1%
≤0.1%
Lead Frame
○
○
○
○
○
○
Molding Compound
○
○
○
○
○
○
Chip
○
○
○
○
○
○
Wire Bonding
○
○
○
○
○
○
Solder
×
○
○
○
○
○
○:means the hazardous material is under the criterion of SJ/T11363-2006.
Note
×:means the hazardous material exceeds the criterion of SJ/T11363-2006.
The plumbum element of solder exist in products presently, but within the allowed
range of Eurogroup’s RoHS.
Warnings
1.
2.
3.
4.
Exceeding the maximum ratings of the device in performance may cause damage to the device,
even the permanent failure, which may affect the dependability of the machine. It is suggested
to be used under 80 percent of the maximum ratings of the device.
When installing the heatsink, please pay attention to the torsional moment and the smoothness
of the heatsink.
VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect
the device from being damaged by the static electricity when using it.
This publication is made by Huajing Microelectronics and subject to regular change without
notice.
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
Add: No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061
http://www. crhj.com.cn
Tel: +86 0510-85807228 Fax: +86- 0510-85800864
HTU
Marketing Part:
Post:214061
UTH
Tel: +86 0510-81805277/81805336
Fax: +86 0510-85800360/85803016
E-mail:sales@hj.crmicro.com
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