CS13N50FA9H

Silicon N-Channel Power MOSFET R ○ CS13N50F A9H General Description： CS13N50F A9H, the silicon N-channel Enhanced VDMOSFETs, is obtained by the self-aligned planar Technology which reduce the conduction loss, improve VDSS 500 V ID 13 A PD (TC=25℃) 60 W 0.34 Ω RDS(ON)Typ switching performance and enhance the avalanche energy. The transistor can be used in various power switching circuit for system miniaturization and higher efficiency. The package form is TO-220F, which accords with the RoHS standard. Features： l Fast Switching l Low ON Resistance(Rdson≤0.45Ω) l Low Gate Charge (Typical Data:45nC) l Low Reverse transfer capacitances(Typical:23pF) l 100% Single Pulse avalanche energy Test Applications： Power switch circuit of adaptor and charger. Absolute（Tc= 25℃ unless otherwise specified）： Symbol Parameter VDSS ID IDM Units Drain-to-Source Voltage 500 V Continuous Drain Current 13 A Continuous Drain Current T C = 100 °C a1 a2 EAS EAR a1 a1 dv/dt 10 a3 A Gate-to-Source Voltage ±30 V Single Pulse Avalanche Energy 1100 mJ Avalanche Energy ,Repetitive 78 mJ Avalanche Current 4.0 A 5 V/ns 60 W 0.48 W/℃ 150，–55 to 150 ℃ 300 ℃ Peak Diode Recovery dv/dt Power Dissipation PD A 52 Pulsed Drain Current VGS IAR Rating Derating Factor above 25°C TJ，T stg Operating Junction and Storage Temperature Range TL Maximum Temperature for Soldering W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 1 of 1 0 2 0 1 5 V0 1 CS13N50F A9H R ○ Electrical Characteristics（Tc= 25℃ unless otherwise specified）： OFF Characteristics Symbol Parameter Test Conditions VDSS Drain to Source Breakdown Voltage VGS=0V, ID =250µA ΔBVDSS/ΔT J Bvdss Temperature Coefficient ID=250uA,Reference25℃ Drain to Source Leakage Current VDS =500V, V GS= 0V, Ta = 25℃ VDS =400V, V GS= 0V, IDSS Rating Units Min. Typ. Max. 500 -- -- V -- 0.54 -- V/℃ -- -- 1 Ta = 125℃ -- -- 100 µA IGSS(F) Gate to Source Forward Leakage VGS =+30V -- -- 100 nA IGSS(R) Gate to Source Reverse Leakage VGS =-30V -- -- -100 nA ON Characteristics Symbol Parameter Test Conditions R DS(ON) Drain-to-Source On-Resistance VGS=10V,ID =6.5A VGS(TH) Gate Threshold Voltage VDS = V GS , ID = 250µA Rating Units Min. Typ. Max. -- 0.34 0.45 Ω 4.0 V 2.0 Pulse width tp≤300µs,δ≤2% Dynamic Characteristics Symbol Parameter Test Conditions g fs Forward Trans conductance VDS=15V, ID =6.5A C iss Input Capacitance C oss Output Capacitance C rss Reverse Transfer Capacitance VGS = 0V V DS = 25V f = 1.0MHz Rating Min. Typ. Max. -- 12 -- -- 2130 -- -- 210 -- -- 23 -- Units S pF Resistive Switching Characteristics Symbol Parameter td(ON) Turn-on Delay Time tr Rise Time td(OFF) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qgs Gate to Source Charge Qgd Gate to Drain (“Miller”)Charge Test Conditions ID =13A VDD =250V VGS = 10V RG = 6.1Ω ID =13A V DD =250V VGS = 10V W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Rating Min. Typ. Max. -- 14 -- -- 27 -- -- 45 -- -- 36 -- -- 45 -- 10 -- -- 18 -- Pag e 2 of 1 0 Units ns nC 2 0 1 5 V0 1 CS13N50F A9H R ○ Source-Drain Diode Characteristics Symbol Parameter IS Test Conditions Rating Typ. Continuous Source Current (Body Diode) -- -- 13 A ISM Maximum Pulsed Current (Body Diode) -- -- 52 A VSD Diode Forward Voltage IS =13A,V GS=0V -- -- 1.5 V trr Reverse Recovery Time IS =13.0A,Tj =150°C -- 506 -- ns Reverse Recovery Charge dIF /dt=100A/us, -- 4.2 Qrr Max. Units Min. uC Pulse width tp≤300µs,δ≤2% Symbol Parameter R θ JC Junction-to-Case R θ JA Junction-to-Ambient Typ. Units 2.08 ℃/W 62 ℃/W a1 ：Repetitive rating; pulse width limited by maximum junction temperature ：L=6.5mH, ID=14.8A, Start T J =25℃ a3 ：ISD =13A,di/dt ≤100A/us,V DD≤BV DS, Start T J=25℃ a2 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 3 of 1 0 2 0 1 5 V0 1 CS13N50F A9H R ○ Characteristics Curve： 100 75 10 100μs 1 1ms 10ms DC 0.1 OPERATION IN THIS AREA MAY BE LIMITED BY RDS(ON) TJ=150℃ TC=25℃ Single Pulse Pd , Power Dissipation ,Watts Id,Drain Current,Amps 10μs 60 45 30 15 0.01 1 10 100 Vds,Drain Source Voltage,Volts Figure 1 Maximum Forward Bias Safe Operating Area 18 21 15 18 12 9 6 3 25 50 75 100 125 T c , C a s e T e m p e ra tu r e , C 150 Figure 2 Maximum Power Dissipation vs Case Temperature Id , Drain Current , Amps Id , Drain Current ,Amps 0 0 1000 VGS=9V VGS=8V 15 12 9 VGS=6V VGS=7V 6 VGS=5V 3 0 0 0 25 50 75 100 Tc , Case Temperature ,C 125 150 Figure 3 Maximum Continuous Drain Current vs Case Temperature 0 5 10 15 25 30 20 Vds , Drain-to-Source Voltage , Volts 35 Figure 4 Typical Output Characteristics Thermal Impedance, Normalized 1 50% 20% 10% PDM 0.1 0.01 0.00001 5% t1 t2 2% NOTES： DUTY FACTOR ：D=t1/ t2 PEAK Tj=PDM*ZthJC*RthJC+TC 1% Single pulse 0.0001 0.001 0.01 Rectangular Pulse Duration,Seconds 0.1 1 Figure 5 Maximum Effective Thermal Impendance , Junction to Case W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 4 of 1 0 2 0 1 5 V0 1 CS13N50F A9H Idm , Peak Current , Amps 100 R ○ TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION FOR TEMPERATURES ABOVE 25℃ DERATE PEAK CURRENT AS FOLLOWS:  150 − TC  I = I 25   125   10 VGS=10V 1 1.00E-05 1.00E-04 1.00E-03 t 1.00E-02 1.00E-01 Pulse W idth , Seconds 1.00E+00 1.00E+01 Figure 6 Maximum Peak Current Capability 1.5 Rds(on), Drain to Source ON Resistance , Ohms Id , Drain Current ,Amps 14 PULSED TEST VDS=30V 12 10 8 6 4 2 ID= 13A 1 ID= 6.5A ID= 3.25A 0.75 0.5 0.25 0 0 0 1 2 3 4 5 Vgs , Gate to Source Voltage ， Volts 4 12 8 10 14 Vgs , Gate to Source Voltage，Volts Figure 8 Typical Drain to Source ON Resistance vs Gate Voltage and Drain Current 3 6 Figure 7 Typical Transfer Characteristics 0.8 Rds(on), Drain to Source ON Resistance, Nomalized PULSED TEST Tc =25 ℃ Rds(on), Drain to Source ON Resistance , Ohms PULSE DURATION = 10μs DUTY FACTOR = 0.5%MAX Tc =25 ℃ 1.25 0.7 VGS=10V 0.6 0.5 0.4 0.3 0 10 20 30 40 Id , Drain Current , Amps 50 Figure 9 Typical Drain to Source ON Resistance vs Drain Current 60 2.5 6 PULSED TEST VGS=10V ID=6.5A 2 1.5 1 0.5 0 -100 -50 0 50 100 Tj, Junction temperature ,C 150 Figure 10 Typical Drian to Source on Resistance vs Junction Temperature W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 5 of 1 0 2 0 1 5 V0 1 200 1.2 1.1 1 0.9 0.8 VGS=0V ID=250μA 1.1 1.05 1 VGS=0V ID=250μA 0.95 0.9 0.7 -100 -50 0 50 100 Tj, Junction temperature , C 150 200 Figure 11 Typical Theshold Voltage vs Junction Temperature -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction temperature , C Figure 12 Typical Breakdown Voltage vs Junction Temperature 10000 15 Vgs , Gate to Source Voltage ,Volts VGS=0V , f=1MHz Ciss=Cgs+Cgd Coss=Cds+Cgd Crss=Cgd 8000 6000 4000 Ciss 2000 Coss 12 VDS=400V ID=13A 9 6 3 Crss 0 0 0 10 20 30 40 50 Vds , Drain - Source Voltage , Volts 0 60 Figure 13 Typical Capacitance vs Drain to Source Voltage 6 25 50 75 100 Qg , Total Gate Charge , nC 125 Figure 14 Typical Gate Charge vs Gate to Source Voltage 100 5 Id , Drain Current , Amps Isd, Reverse Drain Current , Amps Capacitance , pF R ○ 1.15 Bvdss,Drain to Source Breakdown Voltage, Normalized Vgs(th),Threshold Voltage, Nomalized CS13N50F A9H 4 3 +150℃ +25℃ 2 -55℃ 1 0 0.5 0.6 0.7 0.8 0.9 1 Vsd , Source - Drain Voltage , Volts Figure 15 Typical Body Diode Transfer Characteristics STARTING Tj = 150℃ 10 1 If R=0: tAV=(L* IAS) / (1.38VDSS-VDD) If R≠0: tAV=(L/R) In[IAS*R/ (1.38VDSS-VDD)+1] R equals total Series resistance of Drain circuit VGS=0V 0.4 STARTING Tj = 25℃ 1.1 0.1 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 tav , Time in Avalanche , Seconds Figure 16 Unclamped Inductive Switching Capability W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 6 of 1 0 2 0 1 5 V0 1 CS13N50F A9H R ○ Test Circuit and Waveform W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 7 of 1 0 2 0 1 5 V0 1 CS13N50F A9H W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . R ○ Pag e 8 of 1 0 2 0 1 5 V0 1 CS13N50F A9H R ○ Package Information Items Values(mm) MIN MAX A 9.60 10.40 B 15.40 16.20 B1 8.90 9.50 C 4.30 4.90 C1 2.10 3.00 D 2.40 3.00 E 0.60 1.00 F 0.30 0.60 G 1.12 1.42 3.40 3.80 2.00 2.40 12.00 14.00 6.30 7.70 N 2.34 2.74 Q 3.15 3.55 3.00 3.30 H L TO-220F Package W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 9 of 1 0 2 0 1 5 V0 1 CS13N50F A9H R ○ The name and content of poisonous and harmful material in products Hazardous Substance Part’s Name Limit Pb Hg Cd Cr(VI) PBB PBDE ≤0.1% ≤0.1% ≤0.01% ≤0.1% ≤0.1% ≤0.1% Lead Frame ○ ○ ○ ○ ○ ○ Molding Compound ○ ○ ○ ○ ○ ○ Chip ○ ○ ○ ○ ○ ○ Wire Bonding ○ ○ ○ ○ ○ ○ Solder × ○ ○ ○ ○ ○ ○：means the hazardous material is under the criterion of SJ/T11363-2006. Note ×：means the hazardous material exceeds the criterion of SJ/T11363-2006. The plumbum element of solder exist in products presently, but within the allowed range of Eurogroup’s RoHS. Warnings 1. 2. 3. 4. Exceeding the maximum ratings of the device in performance may cause damage to the device, even the permanent failure, which may affect the dependability of the machine. It is suggested to be used under 80 percent of the maximum ratings of the device. When installing the heatsink, please pay attention to the torsional moment and the smoothness of the heatsink. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect the device from being damaged by the static electricity when using it. This publication is made by Huajing Microelectronics and subject to regular change without notice. WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Add： No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061 http://www. crhj.com.cn Tel: +86 0510-85807228 Fax: +86- 0510-85800864 HTU Marketing Part： Post：214061 UTH Tel： +86 0510-81805277/81805336 Fax: +86 0510-85800360/85803016 E-mail：sales@hj.crmicro.com Application and Service：Post：214061 Tel / Fax：+86- 0510-81805243/81805110 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Page 10 of 10 2 0 1 5 V0 1