CS2N60A3H

Silicon N-Channel Power MOSFET R ○ CS2N60 A3H General Description： 600 V ID 2 A VDMOSFETs, is obtained by the self-aligned planar Technology PD (T C=25℃) 35 W which reduce the conduction loss, improve switching RDS(ON)Typ 3.6 Ω CS2N60 A3H, the silicon VDSS N-channel Enhanced performance and enhance the avalanche energy. The transistor can be used in various power switching circuit for system miniaturization and higher efficiency. The package form is TO-251, which accords with the RoHS standard.. Features： l Fast Switching l Low ON Resistance(Rdson≤4.5Ω) l Low Gate Charge (Typical Data:8.5nC) l Low Reverse transfer capacitances(Typical:5.4pF) l 100% Single Pulse avalanche energy Test Applications： Power switch circuit of adaptor and charger. Absolute（Tc= 25℃ unless otherwise specified）： Symbol Parameter VDSS ID IDM a1 VGS EAR IAR Units Drain-to-Source Voltage 600 V Continuous Drain Current 2.0 A Continuous Drain Current T C = 100 °C 1.45 A Pulsed Drain Current 8.0 A ±30 V Single Pulse Avalanche Energy 80 mJ Avalanche Energy ,Repetitive 6.4 mJ Avalanche Current 1.1 A 5 V/ns 35 W 0.28 W/℃ 150，–55 to 150 ℃ 300 ℃ Gate-to-Source Voltage a2 EAS Rating a1 a1 dv/dt a3 Peak Diode Recovery dv/dt Power Dissipation PD Derating Factor above 25°C TJ，T stg Operating Junction and Storage Temperature Range TL MaximumTemperature for Soldering W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 1 of 1 0 2 0 1 5 V0 1 CS2N60 A3H R ○ Electrical Characteristics（Tc= 25℃ unless otherwise specified）： OFF Characteristics Rating Symbol Parameter Test Conditions VDSS Drain to Source Breakdown Voltage VGS=0V, ID =250µA ΔBVDSS/ΔT J Bvdss Temperature Coefficient ID=250uA,Reference25℃ IDSS Drain to Source Leakage Current VDS = 600V, V GS= 0V, Ta = 25℃ VDS =600V, V GS= 0V, Ta = 125℃ IGSS(F) Gate to Source Forward Leakage VGS= 30V -- -- 100 nA IGSS(R) Gate to Source Reverse Leakage VGS =-30V -- -- -100 nA Min. Typ. Max. 600 -- -- -- 0.6 -- -- -- 1 Units V V/℃ µA 250 ON Characteristics Symbol Parameter Test Conditions R DS(ON) Drain-to-Source On-Resistance VGS=10V,ID =1.0A VGS(TH) Gate Threshold Voltage VDS = V GS , ID = 250µA Rating Units Min. Typ. Max. -- 3.6 4.5 Ω 4.0 V 2.0 Pulse width tp≤380µs,δ≤2% Dynamic Characteristics Symbol Parameter Test Conditions g fs Forward Transconductance VDS=15V, ID =1.0A C iss Input Capacitance C oss Output Capacitance C rss Reverse Transfer Capacitance VGS = 0V V DS = 25V f = 1.0MHz Rating Min. Typ. Max. 1.8 -- -- 280 -- 31 -- 5.4 Units S pF Resistive Switching Characteristics Symbol Parameter td(ON) Test Conditions Rating Min. Typ. Max. Turn-on Delay Time -- 7 -- tr Rise Time -- 5 -- td(OFF) Turn-Off Delay Time -- 26 -- tf Fall Time -- 10.5 -- Qg Total Gate Charge -- 8.5 -- 1.5 -- 4.0 Qgs Gate to Source Charge Qgd Gate to Drain (“Miller”)Charge ID =2.0A VDD = 300V VGS = 10V RG = 9.1Ω ID =2.0A V DD =300V VGS = 10V W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 2 of 1 0 Units ns nC 2 0 1 5 V0 1 CS2N60 A3H R ○ Source-Drain Diode Characteristics Symbol Parameter IS Test Conditions Rating Units Min. Typ. Max. Continuous Source Current (Body Diode) -- -- 2 A ISM Maximum Pulsed Current (Body Diode) -- -- 8 A VSD Diode Forward Voltage IS =2.0A,VGS =0V -- -- 1.5 V trr Reverse Recovery Time IS =2.0A,Tj = 25°C -- 407 -- ns Reverse Recovery Charge dIF /dt=100A/us, VGS=0V -- 1152 -- nC Qrr Pulse width tp≤380µs,δ≤2% Symbol Parameter Typ. Units R θ JC Junction-to-Case 3.57 ℃/W R θ JA Junction-to-Ambient 62 ℃/W a1 ：Repetitive rating; pulse width limited by maximum junction temperature ：L=10.0mH, ID=4A, Start TJ=25℃ a3 ：ISD =2A,di/dt ≤100A/us,VDD≤BVDS, Start T J=25℃ a2 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 3 of 1 0 2 0 1 5 V0 1 CS2N60 A3H R ○ Characteristics Curve： 40 100μs 1 1 ms 10ms OPERATION IN THIS AREA MAY BE LIMITED BY RDS(ON) TJ=MAX RATED TC=25℃ Single Pulse 0.1 DC PD , Power Dissipation ，Watts Id , Drain Current , Amps 10 20 10 0 0.01 1 10 100 Vds , Drain-to-Source Voltage , Volts 0 1000 Figure 1 Maximun Forward Bias Safe Operating Area 25 50 75 100 TC , Case Temperature , C 125 150 Figure 2 Maximun Power Dissipation vs Case Temperature 2.5 4 PULSE DURATION=10μs DUTY FACTOR=0.5%MAX Tc = 25℃ 2.0 Id , Drain Current , Amps Id , Drain Current , Amps 30 1.5 1.0 0.5 0 0 25 75 100 50 TC , Case Temperature , C 125 150 Figure 3 Maximum Continuous Drain Current vs Case Temperature VGS=15V 3 VGS=7V 2 VGS=6.5V VGS=6V 1 VGS=5.5V VGS=4.5V 0 0 5 10 15 20 Vds , Drain-to-Source Voltage , Volts 25 Figure 4 Typical Output Characteristics Thermal Impedance, Normalized 1 50% 20% 0.1 10% 5% PDM 2% 0.01 Single pulse 0.001 0.00001 t1 t2 1% NOTES： DUTY FACTOR ：D=t1/ t2 PEAK Tj=PDM*ZthJC*RthJC+TC 0.0001 0.001 0.01 Rectangular Pulse Duration,Seconds 0.1 1 Figure 5 Maximum Effective Thermal Impendance , Junction to Case W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 4 of 1 0 2 0 1 5 V0 1 CS2N60 A3H R ○ Idm , Peak Current , Amps 100 FOR TEMPERATURES ABOVE 25℃ DERATE PEAK CURRENT AS FOLLOWS: TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION  150 − TC  I = I 25   125   10 1 1.00E-05 1.00E-04 1.00E-03 1.00E-02 t ，Pulse Width , Seconds 1.00E-01 1.00E+00 1.00E+01 Figure 6 Maximun Peak Current Capability 8 PULSE DURATION = 10μs DUTY CYCLE = 0.5%MAX VDS=30V 5 Rds(on), Drain to Source ON Id , Drain Current , Amps 6 4 3 2 +150℃ +25℃ 1 ID=2A 6 ID=1A ID=0.5A ID=0.25A 4 -55℃ 2 0 2 3 4 5 Vgs , Gate to Source Voltage , Volts 4 6 6 8 10 12 Vgs , Gate to Source Voltage , Volts 14 Figure 8 Typical Drain to Source ON Resistance vs Gate Voltage and Drain Current Figure 7 Typical Transfer Characteristics Rds(on), Drain to Source ON Resistance, Nomalized 8 Rds(on), Drain to Source ON Resistance, Ohms PULSE DURATION = 10μs DUTY FACTOR = 0.5%MAX Tc =25 ℃ PULSE DURATION = 10μs DUTY CYCLE= 0.5%MAX Tc =25 ℃ 7 6 VGS=20V 5 2.5 2.25 PULSE DURATION = 10μs DUTY CYCLE= 0.5%MAX VGS=10V ID=1A 2 1.75 1.5 1.25 1 0.75 0.5 4 0 1 2 3 Id , Drain Current , Amps Figure 9 Typical Drain to Source ON Resistance vs Drain Current 4 -50 0 50 100 Tj, Junction temperature , C Figure 10 Typical Drian to Source on Resistance vs Junction Temperature W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 5 of 1 0 2 0 1 5 V0 1 150 CS2N60 A3H 1.1 1.1 Bvdss,Drain to Source Breakdown Voltage, Normalized Vgs(th),Threshold Voltage, Nomalized 1.15 1.05 1 0.95 0.9 0.85 0.8 0.75 VGS=0V ID=250μA 0.7 0.65 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction temperature , C Figure 11 Typical Theshold Voltage vs Junction Temperature 1.05 1 0.95 -30 -5 20 45 70 95 120 Tj, Junction temperature , C 145 170 Figure 12 Typical Breakdown Voltage vs Junction Temperature Vgs , Gate to Source Voltage ,Volts 12 1000 Capacitance , pF VGS=0V ID=250μA 0.9 -55 10000 Ciss 100 Coss Crss 10 VGS=0V , f=1MHz Ciss=Cgs+Cgd Coss=Cds+Cgd Crss=Cgd 1 VDS=180V 10 VDS=360V VDS=480V 8 6 4 2 ID=2A 0 0.1 1 10 Vds , Drain - Source Voltage , Volts 100 0 Figure 13 Typical Capacitance vs Drain to Source Voltage 8 2 4 6 8 10 12 14 Qg , Total Gate Charge , nC 16 18 20 Figure 14 Typical Gate Charge vs Gate to Source Voltage 100 If R=0: tAV=(L* IAS) / (1.38VDSS-VDD) If R≠0: tAV=(L/R) In[IAS*R/ (1.38VDSS-VDD)+1] R equals total Series resistance of Drain circuit 7 Id , Drain Current , Amps Isd, Reverse Drain Current , Amps R ○ 6 5 4 3 +150℃ 2 +25℃ 10 STARTING Tj = 25℃ STARTING Tj = 150℃ 1 -55℃ 1 0 0 0.2 0.4 0.6 0.8 1 Vsd , Source - Drain Voltage , Volts 1.2 Figure 15 Typical Body Diode Transfer Characteristics 0.1 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 tav,Time in Avalanche,Seconds Figure 16 Unclamped Inductive Switching Capability W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 6 of 1 0 2 0 1 5 V0 1 CS2N60 A3H R ○ TestCircuitandWaveform W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 7 of 1 0 2 0 1 5 V0 1 CS2N60 A3H W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . R ○ Pag e 8 of 1 0 2 0 1 5 V0 1 CS2N60 A3H R ○ Package Information： Values(mm) Items MIN MAX A 6.30 6.80 B 5.20 6.20 C 2.10 2.50 D 0.30 0.60 E 0.50 0.70 F 0.30 0.60 G 0.70 1.00 H 1.40 2.40 L 7.50 9.80 M 5.10 5.50 N 2.09 2.49 TO-251 Package W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 9 of 1 0 2 0 1 5 V0 1 CS2N60 A3H R ○ The name and content of poisonous and harmful material in products Hazardous Substance Part’s Name Pb ≤0.1% Limit Hg Cd Cr(VI) PBB PBDE ≤0.1% ≤0.01% ≤0.1% ≤0.1% ≤0.1% Lead Frame ○ ○ ○ ○ ○ ○ Molding Compound ○ ○ ○ ○ ○ ○ Chip ○ ○ ○ ○ ○ ○ Wire Bonding ○ ○ ○ ○ ○ ○ Solder × ○ ○ ○ ○ ○ ○：means the hazardous material is under the criterion of SJ/T11363-2006. Note ×：means the hazardous material exceeds the criterion of SJ/T11363-2006. The plumbum element of solder exist in products presently, but within the allowed range of Eurogroup’s RoHS. Warnings 1. 2. 3. 4. Exceeding the maximun ratings of the device in performance may cause damage to the device, even the permanent failure, which may affect the dependability of the machine. It is suggested to be used under 80 percent of the maximun ratings of the device. When installing the heatsink, please pay attention to the torsional moment and the smoothness of the heatsink. VDMOSFETs is the device which is sensitive to the static electricity, it is necessory to protect the device from being damaged by the static electricity when using it. This publication is made by Huajing Microelectronics and subject to regular change without notice. WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Add： No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061 http://www. crhj.com.cn Tel: +86 0510-85807228 Fax: +86- 0510-85800864 HTU Marketing Part： Post：214061 UTH Tel： +86 0510-81805277/81805336 Fax: +86 0510-85800360/85803016 E-mail：sales@hj.crmicro.com Application and Service：Post：214061 Tel / Fax：+86- 0510-81805243/81805110 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Page 10 of 10 2 0 1 5 V0 1