CS4N60A7HD

Silicon N-Channel Power MOSFET R ○ CS4N60 A7HD General Description： 600 V ID 4 A VDMOSFETs, is obtained by the self-aligned planar Technology PD(TC=25℃) 30 W which reduce the conduction loss, improve switching RDS(ON)Typ 1.8 Ω CS4N60 A7HD, the silicon N-channel Enhanced VDSS performance and enhance the avalanche energy. The transistor can be used in various power switching circuit for system miniaturization and higher efficiency. The package form is TO-126F,which accords with the RoHS standard. Features： l Fast Switching l ESD Improved Capability l Low Gate Charge (Typical Data: 14.5nC) l Low Reverse transfer capacitances(Typical: 8.5pF) l 100% Single Pulse avalanche energy Test Applications： Power switch circuit of adaptor and charger. Absolute（Tc= 25℃ unless otherwise specified）： Symbol Parameter VDSS Drain-to-Source Voltage Rating Units 600 V 4 A 3.2 A 16 A Gate-to-Source Voltage ±30 V Single Pulse Avalanche Energy 200 mJ Avalanche Energy ,Repetitive 30 mJ Avalanche Current 2.5 A Peak Diode Recovery dv/dt 5.0 V/ns Power Dissipation 30 W Derating Factor above 25°C 0.24 W/℃ VESD(G-S) Gate source ESD (HBM-C= 100pF, R=1.5kΩ) 3000 V TJ，T stg Operating Junction and Storage Temperature Range 150，–55 to 150 ℃ TL Maximum Temperature for Soldering 300 ℃ Continuous Drain Current ID IDM Continuous Drain Current T C = 100 °C a1 Pulsed Drain Current VGS a2 EAS EAR IAR a1 a1 dv/dt a3 PD W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 1 of 1 0 2015V01 CS4N60 A7HD R ○ Electrical Characteristics（Tc= 25℃ unless otherwise specified）： OFF Characteristics Symbol Parameter VDSS Drain to Source Breakdown Voltage VGS=0V, ID =250µA ΔBVDSS/ΔT J Bvdss Temperature Coefficient ID=250uA,Reference25℃ IDSS Drain to Source Leakage Current VDS =600V, V GS= 0V, Ta = 25℃ VDS =480V, V GS= 0V, Ta = 125℃ IGSS(F) Gate to Source Forward Leakage IGSS(R) Gate to Source Reverse Leakage Rating Test Conditions Unit s Min. Typ. Max. 600 -- -- V -- 0.67 -- V/℃ -- -- 1 µA -- -- 100 µA VGS =+20V -- -- 10 µA VGS =-20V -- -- -10 µA ON Characteristics Symbol Parameter Test Conditions R DS(ON) Drain-to-Source On-Resistance VGS=10V,ID =2A VGS(TH) Gate Threshold Voltage VDS = V GS , ID = 250µA Rating Units Min. Typ. Max. -- 1.8 2.3 Ω 4.0 V 2.0 Pulse width tp≤300µs,δ≤2% Dynamic Characteristics Symbol Parameter Test Conditions g fs Forward Trans conductance VDS=15V, ID =2A C iss Input Capacitance C oss Output Capacitance C rss Reverse Transfer Capacitance VGS = 0V V DS = 25V f = 1.0MHz Rating Min. Typ. Max. 3.5 -- -- 544 -- 55 -- 8.5 Units S pF Resistive Switching Characteristics Symbol Parameter td(ON) Turn-on Delay Time tr Rise Time td(OFF) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qgs Gate to Source Charge Qgd Gate to Drain (“Miller”)Charge Test Conditions ID =4A VDD = 300V RG =4.7Ω ID =4A V DD =300V VGS = 10V W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Rating Min. Typ. Max. -- 8.5 -- -- 6.5 -- -- 31 -- -- 8.5 -- -- 14.5 -- 2.8 -- 6.3 Pag e 2 of 1 0 Units ns nC 2015V01 CS4N60 A7HD R ○ Source-Drain Diode Characteristics Symbol Parameter IS Test Conditions Rating Units Min. Typ. Max. Continuous Source Current (Body Diode) -- -- 4 A ISM Maximum Pulsed Current (Body Diode) -- -- 16 A VSD Diode Forward Voltage IS =4.0A,VGS =0V -- -- 1.5 V trr Reverse Recovery Time IS =4.0A,Tj = 25°C -- 430 -- ns Reverse Recovery Charge dIF /dt=100A/us, VGS=0V -- 1270 -- nC Qrr Pulse width tp≤300µs,δ≤2% Symbol Parameter Typ. Units R θ JC Junction-to-Case 4.17 ℃/W R θ JA Junction-to-Ambient 100 ℃/W Gate-source Zener diode Symbol Parameter V GSO Gate-source breakdown voltage Test Conditions I GS = ±1mA(Open Drain) Rating Min. Typ. Max. Units 30 V The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. a1 ：Repetitive rating; pulse width limited by maximum junction temperature ：L=10mH, ID=6.3A, Start TJ=25℃ a3 ：ISD =4A,di/dt ≤100A/us,VDD≤BVDS, Start T J=25℃ a2 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 3 of 1 0 2015V01 CS4N60 A7HD R ○ Characteristics Curve： 40 PD , Power Dissipation ，Watts Id , Drain Current , Amps 100 10 10us 100us 1ms 1 10ms OPERATION IN THIS AREA MAY BE LIMITED BY RDS(ON) TJ=MAX RATED TC=25℃ Single Pulse 0 .1 100ms DC 20 10 0 0 .0 1 1 1000 10 100 V d s , D r a i n -to - S o u rc e V o lta g e , V o lts 0 Figure 1 Maximum Forward Bias Safe Operating Area 25 50 75 100 TC , Case Temperature , C 6 Id , Drain Current , Amps 5 4 3 2 125 150 Figure 2 Maximum Power Dissipation vs Case Temperature 6 Id , Drain Current , Amps 30 PULSE DURATION=10μs DUTY FACTOR=0.5%MAX Tc = 25℃ VGS=15V 4.5 VGS=7V 3 VGS=6V VGS=6.5V 1.5 VGS=4.5V VGS=5.5V 1 0 0 0 25 75 100 125 50 TC , Case Tem perature , C 150 Figure 3 Maximum Continuous Drain Current vs Case Temperature 0 5 10 15 20 Vds , Drain-to-Source Voltage , Volts 25 Figure 4 Typical Output Characteristics Thermal Impedance, Normalized 1 50% 20% 0.1 10% 5% PDM 2% 0.01 Single pulse 0.001 0.00001 t1 t2 1% NOTES： DUTY FACTOR ：D=t1/ t2 PEAK Tj=PDM*ZthJC*RthJC+TC 0.0001 0.001 0.01 Rectangular Pulse Duration,Seconds 0.1 1 Figure 5 Maximum Effective Thermal Impendance , Junction to Case W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 4 of 1 0 2015V01 CS4N60 A7HD R ○ 100 FOR TEMPERATURES ABOVE 25℃ DERATE PEAK CURRENT AS FOLLOWS: Idm , Peak Current , Amps TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION  150 − TC  I = I 25   125   10 1 1.00E-05 1.00E-04 1.00E-03 7.5 Rds(on), Drain to Source ON Resistance , Ohms PULSE DURATION = 10μs DUTY CYCLE = 0.5%MAX VDS=30V 6 4.5 3 -55℃ +25℃ 1.5 +150℃ 0 1.00E+00 1.00E+01 PULSE DURATION = 10μs DUTY FACTOR = 0.5%MAX Tc =25 ℃ 5 4 ID= 4A ID= 2A 3 ID= 1A 2 1 0 2 3 4 5 Vgs , Gate to Source Voltage , Volts 6 Figure 7 Typical Transfer Characteristics PULSE DURATION = 10μs DUTY CYCLE= 0.5%MAX Tc =25 ℃ 2.5 VGS=20V 2 4 8 10 12 14 Vgs , Gate to Source Voltage，Volts Figure 8 Typical Drain to Source ON Resistance vs Gate Voltage and Drain Current Rds(on), Drain to Source ON Resistance, Nomalized 3 Rds(on), Drain to Source ON Resistance, Ohms 1.00E-01 Figure 6 Maximum Peak Current Capability 6 9 Id , Drain Current , Amps 1.00E-02 t ，Pulse Width , Seconds 1.5 6 2.5 2.25 2 PULSE DURATION = 10μs DUTY CYCLE= 0.5%MAX VGS=10V ID=2A 1.75 1.5 1.25 1 0.75 0.5 1 0 1 2 3 Id , Drain Current , Amps Figure 9 Typical Drain to Source ON Resistance vs Drain Current 4 -50 0 50 100 Tj, Junction temperature , C Figure 10 Typical Drian to Source on Resistance vs Junction Temperature W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 5 of 1 0 2015V01 150 CS4N60 A7HD 1.1 1.1 Bvdss,Drain to Source Breakdown Voltage, Normalized Vgs(th),Threshold Voltage, Nomalized 1.15 1.05 1 0.95 0.9 0.85 0.8 0.75 VGS=0V ID=250μA 0.7 0.65 -75 1.05 1 0.95 -25 -55 0 25 50 75 100 125 150 175 Tj, Junction temperature , C -30 -5 20 45 70 95 120 Tj, Junction temperature , C 145 170 Figure 12 Typical Breakdown Voltage vs Junction Temperature 10000 Vgs , Gate to Source Voltage ,Volts 12 1000 Capacitance , pF VGS=0V ID=250μA 0.9 -50 Figure 11 Typical Theshold Voltage vs Junction Temperature Ciss 100 Coss Crss 10 VGS=0V , f=1MHz Ciss=Cgs+Cgd Coss=Cds+Cgd Crss=Cgd 1 VDS=180V 10 VDS=360V VDS=480V 8 6 4 2 ID=2A 0 0.1 1 10 Vds , Drain - Source Voltage , Volts 100 0 Figure 13 Typical Capacitance vs Drain to Source Voltage 8 2 4 6 8 10 12 14 Qg , Total Gate Charge , nC 16 18 20 Figure 14 Typical Gate Charge vs Gate to Source Voltage 100 7 Id , Drain Current , Amps Isd, Reverse Drain Current , Amps R ○ 6 5 4 3 +150℃ 2 +25℃ 0 0 0.2 10 STARTING Tj = 150℃ 1 If R=0: tAV=(L* IAS) / (1.38VDSS-VDD) If R≠0: tAV=(L/R) In[IAS*R/ (1.38VDSS-VDD)+1] R equals total Series resistance of Drain circuit -55℃ 1 STARTING Tj = 25℃ 0.4 0.6 0.8 1 Vsd , Source - Drain Voltage , Volts 1.2 Figure 15 Typical Body Diode Transfer Characteristics 0.1 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 tav,Time in Avalanche,Seconds Figure 16 Unclamped Inductive Switching Capability W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 6 of 1 0 2015V01 CS4N60 A7HD R ○ Test Circuit and Waveform W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 7 of 1 0 2015V01 CS4N60 A7HD W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . R ○ Pag e 8 of 1 0 2015V01 CS4N60 A7HD R ○ Package Information Items Values(mm) MIN MAX A 7.70 8.30 B 10.50 11.30 C 3.10 3.60 C1 1.70 2.20 E 0.60 0.80 F 0.30 0.60 G 1.17 1.37 H 1.90 2.30 K 3.50 3.90 15.00 17.00 8.50 9.50 4.70 6.50 2.09 2.49 2.90 3.10 L N TO-126F Package W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 9 of 1 0 2015V01 CS4N60 A7HD R ○ The name and content of poisonous and harmful material in products Hazardous Substance Part’s Name Pb ≤0.1% Limit Hg Cd Cr(VI) PBB PBDE ≤0.1% ≤0.01% ≤0.1% ≤0.1% ≤0.1% Lead Frame ○ ○ ○ ○ ○ ○ Molding Compound ○ ○ ○ ○ ○ ○ Chip ○ ○ ○ ○ ○ ○ Wire Bonding ○ ○ ○ ○ ○ ○ Solder × ○ ○ ○ ○ ○ ○：means the hazardous material is under the criterion of SJ/T11363-2006. Note ×：means the hazardous material exceeds the criterion of SJ/T11363-2006. The plumbum element of solder exist in products presently, but within the allowed range of Eurogroup’s RoHS. Warnings 1. 2. 3. 4. Exceeding the maximum ratings of the device in performance may cause damage to the device, even the permanent failure, which may affect the dependability of the machine. It is suggested to be used under 80 percent of the maximum ratings of the device. When installing the heatsink, please pay attention to the torsional moment and the smoothness of the heatsink. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect the device from being damaged by the static electricity when using it. This publication is made by Huajing Microelectronics and subject to regular change without notice. WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Add： No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061 http://www. crhj.com.cn Tel: +86 0510-85807228 Fax: +86- 0510-85800864 HTU Marketing Part： Post：214061 UTH Tel： +86 0510-81805277/81805336 Fax: +86 0510-85800360/85803016 E-mail：sales@hj.crmicro.com Application and Service：Post：214061 Tel / Fax：+86- 0510-81805243/81805110 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Page 10 of 10 2 0 1 5 V0 1