CS5N60A4H

Silicon N-Channel Power MOSFET R ○ CS5N60 A4H General Description： 600 V ID 5 A VDMOSFETs, is obtained by the self-aligned planar Technology PD(TC=25℃) 85 W which reduce the conduction loss, improve switching RDS(ON)Typ 1.4 Ω CS5N60 A4H, the silicon VDSS N-channel Enhanced performance and enhance the avalanche energy. The transistor can be used in various power switching circuit for system miniaturization and higher efficiency. The package form is TO-252, which accords with the RoHS standard. Features： l Fast Switching l Low ON Resistance(Rdson≤1.7Ω) l Low Gate Charge (Typical Data:19.5nC) l Low Reverse transfer capacitances(Typical: 7.5pF) l 100% Single Pulse avalanche energy Test Applications： Power switch circuit of adaptor and charger. Absolute（Tc= 25℃ unless otherwise specified）： Symbol Parameter VDSS Drain-to-Source Voltage Rating Units 600 V 5 A 3.6 A 20 A Gate-to-Source Voltage ±30 V Single Pulse Avalanche Energy 270 mJ Avalanche Energy ,Repetitive 31 mJ Avalanche Current 2.5 A Peak Diode Recovery dv/dt 5.0 V/ns Power Dissipation 85 W 0.68 W/℃ 150，–55 to 150 ℃ 300 ℃ Continuous Drain Current ID IDM Continuous Drain Current T C = 100 °C a1 Pulsed Drain Current VGS a2 EAS EAR IAR a1 a1 dv/dt a3 PD Derating Factor above 25°C TJ，T stg Operating Junction and Storage Temperature Range TL Maximum Temperature for Soldering W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 1 of 1 0 2 0 1 5 V0 1 CS5N60 A4H R ○ Electrical Characteristics（Tc= 25℃ unless otherwise specified）： OFF Characteristics Symbol Parameter VDSS Drain to Source Breakdown Voltage VGS=0V, ID =250µA ΔBVDSS/ΔT J Bvdss Temperature Coefficient ID=250uA,Reference25℃ IDSS Drain to Source Leakage Current VDS =600V, V GS= 0V, Ta = 25℃ VDS =480V, V GS= 0V, Ta = 125℃ IGSS(F) Gate to Source Forward Leakage IGSS(R) Gate to Source Reverse Leakage Rating Test Conditions Unit s Min. Typ. Max. 600 -- -- V -- 0.67 -- V/℃ -- -- 1 µA -- -- 100 µA VGS= 30V -- -- 100 nA VGS =-30V -- -- -100 nA ON Characteristics Symbol Parameter Test Conditions R DS(ON) Drain-to-Source On-Resistance VGS=10V,ID =2.5A VGS(TH) Gate Threshold Voltage VDS = V GS , ID = 250µA Rating Units Min. Typ. Max. -- 1.4 1.7 Ω 4.0 V 2.0 Pulse width tp≤300µs,δ≤2% Dynamic Characteristics Symbol Parameter Test Conditions g fs Forward Trans conductance VDS=30V, ID =5A C iss Input Capacitance C oss Output Capacitance C rss Reverse Transfer Capacitance VGS = 0V V DS = 25V f = 1.0MHz Rating Min. Typ. Max. 10 -- -- 720 -- 75 -- 7.5 Units S pF Resistive Switching Characteristics Symbol Parameter td(ON) Turn-on Delay Time tr Rise Time td(OFF) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qgs Gate to Source Charge Qgd Gate to Drain (“Miller”)Charge Test Conditions ID =5A VDD = 300V RG =9.1Ω ID =5A V DD =300V VGS = 10V W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Rating Min. Typ. Max. -- 9.5 -- -- 11 -- -- 34 -- -- 16 -- -- 19.5 -- 4 -- 7.5 Pag e 2 of 1 0 Units ns nC 2 0 1 5 V0 1 CS5N60 A4H R ○ Source-Drain Diode Characteristics Symbol Parameter IS Test Conditions Rating Units Min. Typ. Max. Continuous Source Current (Body Diode) -- -- 5 A ISM Maximum Pulsed Current (Body Diode) -- -- 20 A VSD Diode Forward Voltage IS =5.0A,VGS =0V -- -- 1.5 V trr Reverse Recovery Time IS =5.0A,Tj = 25°C -- 203 -- ns Reverse Recovery Charge dIF /dt=100A/us, VGS=0V -- 943 -- nC Qrr Pulse width tp≤300µs,δ≤2% Symbol Parameter Typ. Units R θ JC Junction-to-Case 1.47 ℃/W R θ JA Junction-to-Ambient 62.5 ℃/W a1 ：Repetitive rating; pulse width limited by maximum junction temperature ：L=10mH, ID=7.4A, Start TJ=25℃ a3 ：ISD =5A,di/dt ≤100A/us,VDD≤BVDS, Start T J=25℃ a2 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 3 of 1 0 2 0 1 5 V0 1 CS5N60 A4H R ○ Characteristics Curve： 100 90 10 1ms 1 10ms 0 .1 OPERATION IN THIS AREA MAY BE LIMITED BY RDS(ON) TJ=MAX RATED TC=25℃ Single Pulse 0 .0 1 1 100ms DC Pd , Power Dissipation ,Watts Id , Drain Current , Amps 80 60 50 40 30 20 10 0 10 100 V d s , D r a in - to - S o u r c e V o lta g e , V o lts 1000 0 50 25 75 100 125 150 Tc , Case Tem perature , C Figure 1 Maximum Forward Bias Safe Operating Area Figure 2 Maximum Power Dissipation vs Case Temperature 6 6 PULSE DURATION=10μs DUTY FACTOR=0.5%MAX Tc = 25℃ 5 Id , Drain Current , Amps Id , Drain Current , Amps 70 4 3 2 VGS=15V 4.5 VGS=7V 3 VGS=6V VGS=6.5V 1.5 VGS=4.5V VGS=5.5V 1 0 0 0 25 75 100 125 50 TC , Case Temperature , C 150 Figure 3 Maximum Continuous Drain Current vs Case Temperature 0 5 10 15 20 Vds , Drain-to-Source Voltage , Volts 25 Figure 4 Typical Output Characteristics Thermal Impedance, Normalized 1 50% 20% 0.1 10% 5% PDM 2% 0.01 Single pulse 0.001 0.00001 t1 t2 1% NOTES： DUTY FACTOR ：D=t1/ t2 PEAK Tj=PDM*ZthJC*RthJC+TC 0.0001 0.001 0.01 Rectangular Pulse Duration,Seconds 0.1 1 Figure 5 Maximum Effective Thermal Impendance , Junction to Case W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 4 of 1 0 2 0 1 5 V0 1 CS5N60 A4H R ○ 100 FOR TEMPERATURES ABOVE 25℃ DERATE PEAK CURRENT AS FOLLOWS: Idm , Peak Current , Amps TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION  150 − TC  I = I 25   125   10 1 1.00E-05 1.00E-04 1.00E-03 7.5 Rds(on), Drain to Source ON Resistance , Ohms PULSE DURATION = 10μs DUTY CYCLE = 0.5%MAX VDS=30V 6 4.5 3 -55℃ +25℃ 1.5 +150℃ 0 1.00E+00 1.00E+01 PULSE DURATION = 10μs DUTY FACTOR = 0.5%MAX Tc =25 ℃ 5 4 ID= 5A ID= 2.5A 3 ID= 1.25A 2 1 0 2 3 4 5 Vgs , Gate to Source Voltage , Volts 6 Figure 7 Typical Transfer Characteristics PULSE DURATION = 10μs DUTY CYCLE= 0.5%MAX Tc =25 ℃ 2.5 VGS=20V 2 4 8 10 12 14 Vgs , Gate to Source Voltage，Volts Figure 8 Typical Drain to Source ON Resistance vs Gate Voltage and Drain Current Rds(on), Drain to Source ON Resistance, Nomalized 3 Rds(on), Drain to Source ON Resistance, Ohms 1.00E-01 Figure 6 Maximum Peak Current Capability 6 9 Id , Drain Current , Amps 1.00E-02 t ，Pulse Width , Seconds 1.5 6 2.5 2.25 2 PULSE DURATION = 10μs DUTY CYCLE= 0.5%MAX VGS=10V ID=.2.5A 1.75 1.5 1.25 1 0.75 0.5 1 0 5 10 15 Id , Drain Current , Amps Figure 9 Typical Drain to Source ON Resistance vs Drain Current 20 -50 0 50 100 Tj, Junction temperature , C Figure 10 Typical Drian to Source on Resistance vs Junction Temperature W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 5 of 1 0 2 0 1 5 V0 1 150 CS5N60 A4H 1.1 1.1 Bvdss,Drain to Source Breakdown Voltage, Normalized Vgs(th),Threshold Voltage, Nomalized 1.15 1.05 1 0.95 0.9 0.85 0.8 0.75 VGS=0V ID=250μA 0.7 0.65 -75 1.05 1 0.95 -25 -55 0 25 50 75 100 125 150 175 Tj, Junction temperature , C -30 -5 20 45 70 95 120 Tj, Junction temperature , C 145 170 Figure 12 Typical Breakdown Voltage vs Junction Temperature 12 1000 Vgs , Gate to Source Voltage ,Volts 10000 Capacitance , pF VGS=0V ID=250μA 0.9 -50 Figure 11 Typical Theshold Voltage vs Junction Temperature Ciss Coss 100 10 VGS=0V , f=1MHz Ciss=Cgs+Cgd Coss=Cds+Cgd Crss=Cgd Crss 1 VDS=150V 10 VDS=300V VDS=400V 8 6 4 2 ID=5A 0 0.1 1 10 Vds , Drain - Source Voltage , Volts 100 0 Figure 13 Typical Capacitance vs Drain to Source Voltage 8 2 4 6 8 10 12 14 Qg , Total Gate Charge , nC 16 18 20 Figure 14 Typical Gate Charge vs Gate to Source Voltage 100 7 Id , Drain Current , Amps Isd, Reverse Drain Current , Amps R ○ 6 5 4 3 +150℃ 2 +25℃ 0 0 0.2 10 STARTING Tj = 150℃ 1 If R=0: tAV=(L* IAS) / (1.38VDSS-VDD) If R≠0: tAV=(L/R) In[IAS*R/ (1.38VDSS-VDD)+1] R equals total Series resistance of Drain circuit -55℃ 1 STARTING Tj = 25℃ 0.4 0.6 0.8 1 Vsd , Source - Drain Voltage , Volts 1.2 Figure 15 Typical Body Diode Transfer Characteristics 0.1 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 tav,Time in Avalanche,Seconds Figure 16 Unclamped Inductive Switching Capability W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Pag e 6 of 1 0 2 0 1 5 V0 1 CS5N60 A4H R ○ Test Circuit and Waveform W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 7 of 1 0 2 0 1 5 V0 1 CS5N60 A4H W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . R ○ Pag e 8 of 1 0 2 0 1 5 V0 1 CS5N60 A4H R ○ Package Information Items Values(mm) MIN MAX A 6.30 6.90 A1 0 0.13 B 5.70 6.30 C 2.10 2.50 D 0.30 0.60 E1 0.60 0.90 E2 0.70 1.00 F 0.30 0.60 G 0.70 1.00 L1 9.60 10.30 L2 2.70 3.10 H 0.60 1.00 M 5.10 5.50 N 2.09 2.49 R 0.3 T 1.40 1.60 Y 5.10 6.30 TO-252 Package W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 9 of 1 0 2 0 1 5 V0 1 CS5N60 A4H R ○ The name and content of poisonous and harmful material in products Hazardous Substance Part’s Name Pb ≤0.1% Limit Hg Cd Cr(VI) PBB PBDE ≤0.1% ≤0.01% ≤0.1% ≤0.1% ≤0.1% Lead Frame ○ ○ ○ ○ ○ ○ Molding Compound ○ ○ ○ ○ ○ ○ Chip ○ ○ ○ ○ ○ ○ Wire Bonding ○ ○ ○ ○ ○ ○ Solder × ○ ○ ○ ○ ○ ○：means the hazardous material is under the criterion of SJ/T11363-2006. Note ×：means the hazardous material exceeds the criterion of SJ/T11363-2006. The plumbum element of solder exist in products presently, but within the allowed range of Eurogroup’s RoHS. Warnings 1. 2. 3. 4. Exceeding the maximum ratings of the device in performance may cause damage to the device, even the permanent failure, which may affect the dependability of the machine. It is suggested to be used under 80 percent of the maximum ratings of the device. When installing the heatsink, please pay attention to the torsional moment and the smoothness of the heatsink. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect the device from being damaged by the static electricity when using it. This publication is made by Huajing Microelectronics and subject to regular change without notice. WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Add： No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061 http://www. crhj.com.cn Tel: +86 0510-85807228 Fax: +86- 0510-85800864 HTU Marketing Part： Post：214061 UTH Tel： +86 0510-81805277/81805336 Fax: +86 0510-85800360/85803016 E-mail：sales@hj.crmicro.com Application and Service：Post：214061 Tel / Fax：+86- 0510-81805243/81805110 W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Page 10 of 10 2 0 1 5 V0 1